JPH1120161A - Printer head and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the overall size of a head by forming a jetting part driving circuit integrally with a head board provided with ink jet through holes. SOLUTION: The printer head comprises an ink containing part 42, a head board 41 provided with orifice holes 41b for jetting ink and disposed contiguously to the ink containing part 42, and counter electrodes 41e, 41f for urging ink to be jetted from the orifice holes 41b wherein a circuit 41g for driving the counter electrodes 41e, 41f is formed integrally with the head board 41.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a printer head that can be miniaturized and a method for manufacturing a printer head.

[0002]

2. Description of the Related Art Along with the development of information equipment, there is a demand for a printer capable of outputting image data and documents with high definition and high speed. As a driving method of an ink-jet printer that performs printing by discharging ink, an electrostatic method, a method using a heating element, and the like have been put to practical use.

An electrostatic printer head 10 is shown in FIG.
As shown in FIG. 14, a head substrate 11, an ink storage chamber 12, a wiring substrate 13, and a drive IC 14 are provided.

[0004] The head substrate 11 comprises a thin plate-shaped substrate main body 11.
a. A fine orifice hole (through hole) 11b is formed in the substrate body 11a, and a counter electrode 11 is formed on one surface 11c and the other surface 11d, respectively.
e, 11f are formed.

In such a printer head 10, the opposing electrodes 11 e,
By applying a voltage to 11f, a potential difference is generated in the fine holes, and the ink K can be discharged from the ink storage chamber 4 to the surface of the orifice hole 11b by electrostatic force. The ink K discharged to the surface of the orifice hole 11b can form an image image by adhering to a transfer paper (not shown) disposed to face the head substrate 11.

The piezoelectric printer head 20 is shown in FIG.
As shown in FIG. 1, a head substrate 21, a piezoelectric substrate 22, a wiring substrate 23, and a driving IC 24 are provided. In addition, 25 in FIG. 15 has shown the top plate.

The head substrate 21 has a thin plate-shaped substrate body 21.
a. A fine orifice hole 21b is formed in the substrate body 21a. The piezoelectric substrate 22 includes an ink storage chamber 22a, a wiring 22b, and a top plate 22c.
Are provided.

In such a printer head 20, a voltage is applied to the piezoelectric substrate 22 by the drive circuit 24 via the wiring substrate 23 and the wiring 22b. Since the piezoelectric substrate 22 is distorted when a voltage is applied, the ink K in the ink storage chamber 22a is extruded and discharged.

The printer head 30 of the heating type is shown in FIG.
As shown in FIG. 3, a wiring 3 for connecting the head unit 31, the driving circuit 32, and the heating element 31d to be described later.
3 is provided.

The head portion 31 has a head body 31a and an orifice hole 31b provided in the head body 31a.
And the ink storage chamber 3 communicating with the orifice hole 31b.
1c and a heating element 31 provided in the orifice hole 31b.
d and a top plate 31e.

[0011]

The following problems have been encountered when attempting to reduce the size of the printer head having the above-described structure. That is, since the drive circuit is separated from the head substrate in which the ink through-hole is formed, there is a problem in that it is necessary to mount each of them separately and the wiring becomes long.

Further, since hundreds of orifice holes and discharge portions are formed in the head substrate, it is necessary to mount many pins and narrow pins in order to connect the discharge portion and the drive circuit. Therefore, there is a problem that the connection part becomes large. Therefore, there is a limit to the size reduction of the entire printer head.

On the other hand, when a through hole is provided in the head substrate and a drive circuit is formed by a semiconductor process to integrate the drive circuit to reduce the size and simplify the manufacturing process, the following problems arise. That is, the thickness of the head substrate made of the Si material forming the through hole is 0.5 to 0.6 mm.
Therefore, in the case of wet etching with a solution of KOH or NaOH, dry etching such as plasma etching or RIE, or a processing method using X-rays or the like, processing time is extremely long.

Further, if a drive circuit is formed in a semiconductor process after a through hole is formed in the head substrate in advance, the head substrate may be warped or the mechanical strength may be reduced due to the influence of the through hole. Occurs. Further, when elements and wirings are formed in a later step by, for example, a photolithographic method or the like, a resist material or the like enters the above-mentioned through-holes and causes a manufacturing inconvenience such as soiling the back surface of the head substrate.

Conversely, if an attempt is made to form a through hole after the formation of the element, there is a risk that etching or X-rays may damage the element constituting the drive circuit formed earlier. On the other hand, in a type in which a pressing force is applied to ink, such as a piezoelectric method, there is a certain limit in improving the accuracy because the machining accuracy directly affects the ink ejection accuracy.

Accordingly, it is an object of the present invention to provide a printer head and a printer head manufacturing method that can be downsized. Another object of the present invention is to provide a printer head capable of stably ejecting ink with high accuracy.

[0017]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems and to achieve the object, the invention according to claim 1 is provided with an ink storing section for storing ink, and an ink storing section provided adjacent to the ink storing section. A head substrate provided with a through hole for discharging the ink, and a discharge unit for urging the ink to discharge the ink from the through hole, wherein the head substrate drives the discharge unit The drive circuit is formed integrally.

According to a second aspect of the present invention, in the first aspect of the present invention, the discharge unit includes a counter electrode formed on the front and back surfaces of the head substrate and around the through hole. And a drive circuit for applying a voltage to the counter electrode and the electrode.

According to a third aspect of the present invention, in the first aspect of the present invention, the ink has magnetism, and the ejection portion includes a coil disposed around the through hole. The drive circuit is configured to supply a current to the coil to generate a magnetic field in the through hole.

According to a fourth aspect of the present invention, in the first aspect of the invention, at least a part of the ink containing portion is formed of a piezoelectric substrate, and the driving circuit applies a voltage to the piezoelectric substrate. Thus, the above-mentioned ink storage portion is narrowed.

According to a fifth aspect of the present invention, in the first aspect of the present invention, the discharge unit includes a heating element provided in the through hole, and the driving circuit supplies a current to the heating element. To cause the ink to boil.

According to a sixth aspect of the present invention, there is provided a printer head manufacturing method for manufacturing a printer head having a head substrate having a through hole for ejecting ink and a driving circuit, wherein the ink through hole is formed in the head substrate. A hole forming step of forming a part of the plate thickness from one surface side, a drive circuit forming step of integrally forming a drive circuit on the one surface side of the head substrate, and the head substrate from the other surface side A thinning step of exposing the through hole by thinning.

According to a seventh aspect of the present invention, there is provided a printer head manufacturing method for manufacturing a printer head having a head substrate having a through-hole for discharging ink and a drive circuit, wherein the through-hole is formed on one side of the head substrate. Forming a drive circuit on the one side of the head substrate, forming a drive circuit integrally with the one side of the head substrate, and electrically connecting the through hole and the drive circuit to each other. A wiring forming step of forming connection wiring, a filling step of filling the through hole with a conductive material, and thinning the head substrate from the other surface side to expose the conductive material and connect the drive circuit to the drive circuit. A thinning step of conducting to the other surface side of the head substrate via the wiring and the conductive material.

According to another aspect of the present invention, there is provided a head having an ink storage portion for storing magnetic ink, and a through hole provided adjacent to the ink storage portion for discharging the ink. A substrate, a coil disposed around the through hole, and a drive circuit for discharging the ink from the through hole by applying a current to the coil and generating a magnetic field in the through hole. .

[0025] As a result of taking the above measures, the following effects occur. That is, in the first aspect of the present invention, since the drive circuit for driving the discharge unit is integrally formed on the head substrate provided with the through hole for discharging the ink, the drive circuit is provided as a separate component. The size of the entire head can be reduced as compared with the case of FIG. In addition, wiring and other steps can be simplified, and productivity is improved. Further, since the distance between the ejection unit and the drive circuit is shortened, the inductance can be reduced, and the electrical characteristics are improved. Further, it is possible to increase the speed of a signal and reduce noise.

According to the second aspect of the present invention, the discharge section includes a counter electrode formed on the front and back surfaces of the head substrate and around the through hole, and an electrode formed on the ink storage section. Since the drive circuit applies a voltage to the counter electrode and the electrode, the charged ink can be ejected by a potential difference generated in the counter electrode.

According to the third aspect of the present invention, the ink has magnetism, the ejection unit includes a coil disposed around the through hole, and the drive circuit supplies a current to the coil to cause the coil to enter the through hole. Since the magnetic field is generated, the magnetic ink can be ejected by the magnetic field generated by the coil.

According to the fourth aspect of the invention, at least a part of the ink storage chamber is formed of a piezoelectric substrate, and the drive circuit applies a voltage to the piezoelectric substrate to narrow the ink storage section. It can be extruded and ejected.

According to the fifth aspect of the present invention, the discharge section includes a heating element provided in the through hole, and the driving circuit includes:
Since the ink is boiled by applying a current to the heating element, the ink can be pushed out and ejected.

In the invention described in claim 6, the ink through hole is formed from one side of the head substrate to the middle of the plate thickness in the hole forming step, and the one side of the head substrate is formed in the driving circuit forming step. The drive circuit is integrally formed on the side, and the through hole is exposed by thinning the head substrate from the other surface side in the thinning process,
Since the through-hole is not formed before the formation of the drive circuit, it is possible to prevent a decrease in strength and to prevent the other surface of the head substrate from being soiled in the drive circuit formation step.

In the invention described in claim 7, the ink through hole is formed from one surface side of the head substrate to the middle of the plate thickness in the hole forming step, and is formed on the one surface side of the head substrate in the driving circuit forming step. A drive circuit is formed integrally, a wiring for electrically connecting the through hole and the drive circuit is formed in a wiring forming step, the through hole is filled with a conductive material in a filling step, and a head substrate is formed in the other side in a thinning step. Since the conductive material is exposed by thinning from the surface side and the drive circuit is conducted to the other surface side of the head substrate via the connection wiring and the conductive material, a through hole is not formed before forming the drive circuit. Therefore, it is possible to prevent the strength from being reduced and to prevent the other surface of the head substrate from being stained in the driving circuit forming step.

According to the eighth aspect of the present invention, a current is caused to flow through the coil disposed around the through hole by the drive circuit, and the magnetic ink generated at this time repels magnetic ink, and is ejected from the through hole. Can be done. on the other hand,
The discharge accuracy depends on the control accuracy of the current value by the drive circuit,
Since it is irrelevant to the machining accuracy of the through holes and the like, stable and highly accurate ejection can be performed.

[0033]

FIG. 1 is a perspective view showing an electrostatic discharge type printer head according to a first embodiment of the present invention, FIG. 2 is a longitudinal sectional view showing the printer head, and FIG. FIG. 4 is a perspective view showing a head substrate incorporated in the printer head, and FIGS. 4 and 5 are cross-sectional views showing manufacturing steps of the head substrate.

As shown in FIGS. 1 and 2, the electrostatic printer head 40 includes a head substrate 41, an ink storage chamber 42, and a wiring substrate for supplying power and input / output signals to a drive circuit 41g described later. 43.

The size of the head substrate 41 is, for example, about 0.2 to 0.6 mm in thickness, about 10 to 30 mm in height, and about 10 to 30 cm in width. The head substrate 41 includes a thin plate-shaped substrate main body 41a made of a silicon material. For example, an orifice hole (through hole) 41b having a diameter of about several tens to 100 μm and a pitch of about 100 μm is formed in the substrate main body 41a, and a counter electrode is formed on one surface 41c and the other surface 41d, respectively. 41e and 41f are formed. In addition, as shown in FIG.
On the 1c side, the driving circuit 41g and the wirings 41h and 41 for separately connecting the driving circuit 41g and the counter electrodes 41e and 41f, respectively.
i (see FIG. 5 for 41i). The counter electrode 41f is formed as a solid layer for applying a common potential to all the orifice holes 41b.

In FIGS. 1 and 2, reference numeral 42a indicates a top plate. The head substrate 41 is manufactured by processes shown in FIGS. FIG. 4 shows a portion of the orifice hole 41b, and FIG. 5 shows a portion of both sides of the substrate main body 41a that establishes electrical conduction.

As shown in FIG. 4A, the substrate body 41
The hole a is formed from one surface 41c side to half of the plate thickness. As a processing method, wet etching with a solution of KOH or NaOH, dry etching such as plasma etching / RIE, or X-ray can be used. This substrate processing can be performed within an aspect ratio of about 1 to 10, which is a processing scale in the processing depth direction.

Next, as shown in FIG.
In a semiconductor forming process such as a process, the counter electrode 41e,
A drive circuit 41g and wirings 41h and 41i (41i is not shown) are formed. At this time, a conventional semiconductor processing process such as a photolithography method can be used as it is.

Next, as shown in FIG. 4C, the other surface 41d side of the substrate main body 41a is polished by machining, etching, or the like, and is passed through the orifice hole 41b. Next, as shown in FIG. 4D, a counter electrode 41f is formed on the other surface 41d side. Insulation treatment of the substrate main body 41a is necessary to form an element and a wiring layer, but as a means for this, it can be relatively easily realized by forming a thermal oxide film or forming a polyimide insulation film.

Finally, in order to prevent the opposing electrode 41f from being worn out due to friction of the ink transfer paper, and to prevent the drive circuit 41g and the wirings 41h and 41i from being insulated or corroded by the ink, a protective film is formed together. Form.

On the other hand, in order to electrically connect the driving circuit 41g to the opposing electrode 41f on the opposite surface via the wiring 41i, as shown in FIG.
In the same manner as described above, a hole is formed in the substrate main body 41a from one surface 41c side to half of the plate thickness.

Next, as shown in FIG.
The drive circuit 41g and the wiring 41i are formed by a semiconductor forming process such as a process (the wiring 41h is also formed at this time).

Next, as shown in FIG. 5C, the processing hole is filled with a conductive material 44 such as an aluminum material. Next, as shown in FIG. 5D, the other surface 41d of the substrate main body 41a
The side is polished by machining or etching to expose the conductive material 44.

Next, as shown in FIG. 5E, a counter electrode 41f is formed on the other surface 41d side and connected to the conductive material 44. Thereby, the driving circuit 41g and the counter electrode 41f
Are conducted through the conductive material 44.

In such a printer head 40, a potential difference is generated in the orifice hole 41b by applying a voltage to the opposing electrodes 41e and 41f via the wirings 41h and 41i by the driving circuit 41g (see FIG. 3B). Then, the ink K is supplied from the ink storage chamber 42 by electrostatic force to the orifice hole 41b.
Can be discharged onto the surface of the substrate. The orifice hole 4
The ink K discharged on the surface of 1b adheres to a transfer paper (not shown) arranged to face the head substrate 41, so that an image can be formed.

As described above, in the printer head 40 according to the first embodiment, the counter electrode 41 is provided on the head substrate 41 provided with the orifice hole 41b for discharging the ink K.
Since the drive circuit 41g for generating a potential difference is formed between e and 41f, the size of the entire head can be reduced as compared with the case where the drive circuit 41g is provided as a separate component. Further, the process of forming the wirings 41h and 41i can be simplified, and the productivity is improved. Further, the counter electrodes 41e, 41
Since the distance between f and the drive circuit 41g is reduced, the inductance can be reduced, and the electrical characteristics are improved. Further, it is possible to increase the speed of a signal and reduce noise.

FIG. 6 shows the first printer head 4 described above.
FIG. 9 is a view showing a modification of the head substrate 41 of No. 0; In the head substrate 41 described above, inside the orifice hole 41b,
The counter electrode 41e is not formed. This is because it is simple to form the counter electrode 41e around the orifice hole 41b.

As shown in FIG. 6, in the head substrate 41A according to this modification, the gap between the opposed electrodes can be narrowed by forming the electrode 45 on the inner wall surface of the orifice hole 41b by a thin film or a plating process. it can. For this reason, a high electrostatic force can be obtained, and voltage control becomes easy.

FIG. 7 is a longitudinal sectional view showing a magnetic discharge type printer head according to a second embodiment of the present invention, and FIGS. 8 and 9 show a manufacturing process of a head substrate incorporated in the printer head. FIG.

The printer head 50 includes a head substrate 51 and an ink chamber 52 as shown in FIG. In FIG. 7, K 'indicates magnetic ink. The head substrate 51 includes a thin plate-shaped substrate main body 51a made of a silicon material. The substrate body 51a has, for example, a diameter of about several tens to 100 μm and a pitch of 100 μm.
An orifice hole (through hole) 51b of about m is formed, and coils 51e and 51f are formed on one surface 51c and the other surface 51d, respectively. Also, on one side 51c side, a driving circuit 51g and wirings 51h, 51i connecting the driving circuit 51g and the coils 51e, 51f.
(51i is not shown, but FIG. 5 is a reference.). In addition, the counter electrode 51f is provided with all the orifice holes 51.
b is formed as a solid layer for applying a common potential.

The head substrate 51 is also the same as the head substrate 41 described above.
It is formed by the same process as described above. The orifice hole 51b and the coils 51e and 51f are formed by steps as shown in FIGS. That is, FIG.
As shown in (a), a conductor 54 such as copper or aluminum is formed on the substrate main body 51a by using a mask 53 by an evaporation method or a sputtering method. Here, FIG.
FIG. 9A is a plan view of FIG.
It corresponds to the shape of a. As described above, the conductor 54 includes the circular portions 54a juxtaposed and the coupling portions 54b for electrically connecting these circular portions 54a.

Next, as shown in FIG.
An orifice hole 51b is formed in the center of the fourth circular portion 54a by a drill. Thereby, a coil is formed around the orifice hole 51b. By doing so, FIG.
As shown in (b), when the current I flows, a magnetic field is generated in the orifice hole 51b. Note that the conductor 54 may be formed by a lithography method using a resist without being limited to the vapor deposition method and the sputtering method.

In such a printer head 50, the driving circuit 51g drives the coil 5 via the wirings 51h and 51i.
1e, 51f, the orifice hole 51b
A magnetic field is generated, and the ink K 'supplied from the ink storage chamber 52 into the orifice hole 51b can be ejected to the surface of the orifice hole 51b by the repulsive force of magnetism.

As described above, in the printer head 50 according to the second embodiment, the coil 51 is provided on the head substrate 51 provided with the orifice hole 51b for discharging the ink K.
Since the drive circuit 51g for supplying a current to the elements e and 51f is formed, the entire head can be made smaller than when the drive circuit 51g is provided as a separate component. Also, the wiring 51
h, 51i can be simplified, and productivity is improved. Further, since the distance between the opposing electrodes 51e and 51f and the driving circuit 51g is shortened, the inductance can be reduced, and the electric characteristics are improved. Further, it is possible to increase the speed of a signal and reduce noise.

On the other hand, the discharge accuracy of the printer head 50 depends on the control accuracy of the current value by the drive circuit 51g and is not related to the machining accuracy of the orifice hole 51b and the like, so that stable and high-precision discharge can be performed.

FIG. 10 is a view showing a modification of the head substrate incorporated in the printer head according to the second embodiment described above. In this modified example, the single coils 51e, 51
A coil 55 wound a plurality of times is used instead of f.
In FIG. 10, 55a indicates a jumper line, and 55b indicates a resist. By doing so, the ink K '
Can be greatly increased.

FIG. 11 is a longitudinal sectional view showing a piezoelectric printer head according to a third embodiment of the present invention. As shown in FIG. 11, the printer head 60 includes a head substrate 61 made of a silicon (Si) substrate and a piezoelectric substrate 62.
And a wiring board 63. Note that 64 in FIG.
Denotes a control IC for supplying a power supply / input / output signal and the like to a drive circuit 61c described later. These control ICs 64 are mounted on a control board 64a. The control board 64a is connected to the wiring board 63 by, for example, soldering.

The wiring board 63 is provided with connection pads (not shown), and is connected to the connection pads (not shown) of the head substrate 61 by, for example, soldering. The head substrate 61 includes a thin plate-shaped substrate main body 61a. The substrate main body 61a has fine orifice holes (through holes) 61b, a driving circuit 61c, a piezoelectric substrate, and a control IC.
A wiring 61d electrically connected to C64 is formed. Further, the piezoelectric substrate 62 is provided with the above-described orifice 61b.
, A piezoelectric portion 62b forming a wall surface of the ink discharge chamber 62a, and a top plate 62.
c.

The piezoelectric substrate 62 and the head substrate 61 are connected to connection pads provided separately for each of the bonding locations of the orifice holes 61b and the ink discharge chambers 62a. Note that a conductive adhesive, an anisotropic conductive film, an anisotropic conductive adhesive, or the like is used for the connection at this time.

The head substrate 61 is the same as the head substrate 41 described above.
It is formed by the same process as that described above. That is, the driving circuit 61
c is also integrally formed with the head substrate 61 made of silicon. In such a printer head 60, the control IC 64
Wiring 61 by the drive circuit 61c based on the control signal
A voltage is applied to the piezoelectric section 62b via the line d. Piezoelectric section 62
When the voltage b is applied, the ink discharge chamber 62a is distorted by applying a voltage, and the ink K in the ink discharge chamber 62a is pushed out and discharged through the orifice hole 61b.

As described above, in the printer head 60 according to the third embodiment, the piezoelectric portion 62b is provided on the head substrate 61 provided with the orifice hole 61b for discharging the ink K.
Drive circuit 61c for driving the
The entire head can be reduced in size as compared with the case where the drive circuit 61c is provided as a separate component. Further, the step of forming the wiring 61d can be simplified, and the productivity is improved. Further, since the distance between the piezoelectric portion 62b and the drive circuit 61c is shortened, the inductance can be reduced, and the electrical characteristics are improved. Further, it is possible to increase the speed of a signal and reduce noise.

FIGS. 12A and 12B show the fourth embodiment of the present invention.
FIG. 2 is a diagram showing a bubble jet type printer head according to the embodiment. The printer head 70 includes a head substrate 71 and an ink storage chamber 72 as shown in FIG.

The head substrate 71 includes a substrate body 71a made of silicon (Si), an orifice hole 71b provided in the substrate body 71a, a heating element 71d provided in the inner wall of the orifice hole 71b, and a substrate body 71a. An integrated drive circuit 71e, a heating element 71d and a drive circuit 7
1e.

The head substrate 71 is the same as the head substrate 41 described above.
It is formed by the same process as described above. At this time, the heating element 71d is formed on the inner wall surface of the orifice hole 71b. In the printer head 70 configured as described above, a current is applied to the heating element 71d by the driving circuit 71e to heat the heating element 71d.
As a result, the ink K in the orifice hole 71b is boiled, and bubbles L are generated. This bubble L causes the ink K
Is extruded.

As described above, in the printer head 70 according to the first embodiment, the heating element 71 is provided on the head substrate 71 provided with the orifice hole 71b for discharging the ink K.
Since the drive circuit 71e for supplying a current to d is formed integrally, the size of the entire head can be reduced as compared with the case where the drive circuit 71e is provided as a separate component. Further, the step of forming the wiring 71f can be simplified, and the productivity is improved. Further, since the distance between the heating element 71d and the driving circuit 71e is shortened, the inductance can be reduced, and the electric characteristics are improved. Further, it is possible to increase the speed of a signal and reduce noise.

The present invention is not limited to the above embodiments. That is, in each of the above-described embodiments, a silicon substrate is used as the head substrate, but a substrate in which polycrystalline silicon is formed on a glass substrate may be used. Further, although the drive circuit is formed directly on the head substrate, a bare chip having a built-in drive circuit may be mounted on the head substrate. Further, the drive circuit may be provided on either side of the substrate. Further, the orifice holes may be arranged in two stages and staggered as shown in FIG. 12B, for example, so that the minimum pitch is about 50 μm and the definition is increased. In addition, it goes without saying that various modifications can be made without departing from the spirit of the present invention.

[0067]

According to the first aspect of the present invention, the drive circuit for driving the discharge section is integrally formed on the head substrate provided with the through hole for discharging the ink. The entire head can be reduced in size as compared with the case where it is provided as a component. In addition, wiring and other steps can be simplified, and productivity is improved. Further, since the distance between the ejection unit and the drive circuit is shortened, the inductance can be reduced, and the electrical characteristics are improved. Further, it is possible to increase the speed of a signal and reduce noise.

According to the second aspect of the invention, the charged ink can be ejected by the potential difference generated at the counter electrode. According to the third aspect of the present invention, the magnetic ink can be ejected by the magnetic field generated by the coil.

According to the fourth aspect of the present invention, since a voltage is applied to the piezoelectric substrate to narrow the ink containing portion, the ink can be pushed out and discharged. According to the invention described in claim 5, the ink can be pushed out and ejected.

According to the sixth aspect of the present invention, since the through-hole is not formed before the formation of the drive circuit, it is possible to prevent a reduction in strength and to reduce the other surface of the head substrate in the drive circuit formation step. Stain can be prevented.

According to the seventh aspect of the present invention, since the through-hole is not formed before the formation of the drive circuit, it is possible to prevent the strength from being reduced, and to reduce the other surface of the head substrate in the drive circuit formation step. Stain can be prevented.

According to the eighth aspect of the present invention, a current is caused to flow through the coil disposed around the through hole by the drive circuit, and the magnetic ink generated at this time repels the magnetic ink, thereby causing the through hole. Can be discharged. On the other hand, the ejection accuracy depends on the control accuracy of the current value by the drive circuit, and is not related to the machining accuracy of the through-hole or the like, so that stable and highly accurate ejection can be performed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a printer head according to a first embodiment of the present invention.

FIG. 2 is a longitudinal sectional view showing the printer head.

FIG. 3 is a perspective view showing a head substrate incorporated in the printer head.

FIG. 4 is a sectional view showing the manufacturing process of the head substrate.

FIG. 5 is a sectional view showing the manufacturing process of the head substrate.

FIG. 6 is a sectional view showing a modification of the head substrate.

FIG. 7 is a longitudinal sectional view showing a printer head according to a second embodiment of the present invention.

FIG. 8 is a diagram showing a manufacturing process of a head substrate incorporated in the printer head.

FIG. 9 is a view showing a manufacturing process of the head substrate.

FIG. 10 is a diagram showing a main part of a modification of the head substrate.

FIG. 11 is a longitudinal sectional view showing a printer head according to a third embodiment of the present invention.

FIG. 12 is a view showing a printer head according to a fourth embodiment of the present invention.

FIG. 13 is an exploded perspective view showing a conventional electrostatic printer head.

FIG. 14 is a vertical sectional view showing the printer head.

FIG. 15 is a longitudinal sectional view showing a conventional piezoelectric printer head.

FIG. 16 is a diagram showing a conventional heat generating type printer head.

[Explanation of symbols]

 40, 50, 60, 70 printer heads 41, 41A, 51, 61, 71 head substrates 41b, 51b, 61b, 71b orifice holes 41g, 51g, 61c, 71e drive circuit

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Koji Yamabe 33, Shinisogo-cho, Isogo-ku, Yokohama-shi, Kanagawa Pref.

Claims (8)

[Claims] An ink container for accommodating ink; a head substrate provided adjacent to the ink container and having a through hole for discharging the ink; A printer for discharging the ink from a hole, wherein a drive circuit for driving the discharger is integrally formed on the head substrate. 2. The discharge section includes a counter electrode formed on the front and back surfaces of the head substrate and around the through hole, and a drive circuit for applying a voltage to the counter electrode and the electrode. The printer head according to claim 1, wherein: 3. The ink has magnetism, the discharge unit includes a coil disposed around the through hole, and the drive circuit supplies a current to the coil to generate a magnetic field in the through hole. The printer head according to claim 1, wherein the printer head is generated. 4. The apparatus according to claim 1, wherein at least a part of the ink storage section is formed of a piezoelectric substrate, and the driving circuit applies a voltage to the piezoelectric substrate to narrow the ink storage section. Printer head. 5. The discharge unit includes a heating element provided in the through-hole, and the drive circuit causes a current to flow through the heating element to cause the ink to boil. 2. The printer head according to 1. 6. A printer head manufacturing method for manufacturing a printer head having a head substrate having a through hole for discharging ink and a drive circuit, wherein the ink through hole has a thickness from one surface side of the head substrate. A hole forming step of forming partway, a drive circuit forming step of integrally forming a drive circuit on the one surface side of the head substrate, and the through hole by thinning the head substrate from the other surface side. A method of manufacturing a printer head, comprising: 7. A printer head manufacturing method for manufacturing a printer head having a head substrate having a through-hole for discharging ink and a drive circuit, wherein the through-hole is formed from one surface side of the head substrate to an intermediate portion of the plate thickness. A hole forming step for forming; a driving circuit forming step for integrally forming a driving circuit on the one surface side of the head substrate; and a wiring forming for forming connection wiring for electrically connecting the through hole and the driving circuit. A filling step of filling the through hole with a conductive material; and thinning the head substrate from the other surface side to expose the through hole and the conductive material to connect the drive circuit to the connection wiring and the A thinning step of conducting to the other surface of the head substrate via a conductive material. 8. A head substrate provided with an ink storage portion for storing magnetic ink, a through hole provided adjacent to the ink storage portion for discharging the ink, and a periphery of the through hole. And a drive circuit for discharging current from the through-hole by applying a current to the coil to generate a magnetic field in the through-hole.