JPH11186704A - Method and apparatus for mounting solder ball - Google Patents

Abstract

PROBLEM TO BE SOLVED: To softly handle solder balls, without damaging or deforming them by dropping the balls from feed holes disposed in a specified pattern, and sucking the balls to suction holes facing to the feed holes upwardly from below. SOLUTION: A stock part 6 has a container 9 which is closed with a cover 12 after housing many solder balls 5, and evacuated by an evacuator. A gas is fed therein to drop the balls 5 from the container 9 into feed holes and received at recesses. With a pin 7 released a motor 22 rotates forwards and backwards with sort time duration to vibrate the container 9 through a temporary support base 16 to accelerate dropping of the solder balls 5. At the temporary support base 16, the outside air is sucked through the suction holes to suck the balls 5 in the recesses, thus sucking balls to the suction holes, without exerting external force, such as excessive pressing force on the balls 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an operation in which a solder ball is sucked and mounted on a workpiece continuously, and the solder ball is handled softly and the mounting operation is performed efficiently. The present invention relates to a solder ball mounting method and a solder ball mounting device.

[0002]

2. Description of the Related Art Heretofore, for example, a semiconductor package provided with a number of solder ball contacts on the back surface has been used. However, flux is applied to a plurality of electrode surfaces provided on the back surface of the package. After that, the solder ball is mounted, or the flux is applied to the solder ball itself, then mounted, and the solder ball is welded to the electrode surface. In recent years, packages with a large number of contacts have emerged in proportion to the size of the package, and it has become necessary to use extremely fine solder balls to be mounted on such clogged electrode surfaces. And several mounting technologies have been proposed.

FIGS. 6A and 6B show a procedure for mounting a solder ball by a conventional solder ball mounting apparatus.
This conventional device is mainly divided into a suction unit 70 and a mounting unit 71,
The suction part 70 is provided with a stock part 73 in which a large number of solder balls 72 are accommodated in a container having an open top surface. Also,
The mounting section 71 is disposed substantially side by side with respect to the suction section 70, and is provided with a positioning device 75 having an X-axis motor and a Y-axis motor for positioning the work 74 fixed on the upper surface of the table. A moving means 76 including a guide rail, a screw shaft, and the like is disposed so as to straddle the adsorbing section 70 and the mounting section 71.
7 is mounted so as to be able to move laterally. The suction head device 77 is provided with a suction head 78 in which a number of fine suction holes communicating with the suction device 81 are drilled on the lower surface side so that the suction head 78 can be moved up and down by a lifting means 79.

In this conventional solder ball mounting apparatus, first, at the position of the suction section 70, the suction head 78 is lowered into the stock section 73 by the lifting / lowering means 79, and the solder ball 72 is sucked into each suction hole. Further, at the time of the solder ball suction, the suction head 78 is relatively moved with respect to the stock portion 73 to separate excess solder balls adhered to the lower surface of the suction head 78. After sucking the solder ball 72 into the suction hole, the suction head 78 is raised by the elevating means 79 and the suction head device 77 is moved by the moving means 76.
Is moved to the mounting section 71 side. Since the work 74 is positioned at a predetermined position by the positioning device 75 on the mounting portion 71, the suction head 78 is lowered above the work 74, and the solder ball 72 of the suction head 78 is placed on the electrode surface 80 of the work. By releasing the suction at the stage where the contact is made, the solder ball 72 of the suction head is mounted on the work 74.

[0005] Then, the suction head 7 is moved by the elevating means 79.
By moving the suction head device 77 from the current position of the mounting portion 71 to the position of the suction portion 70 again by the moving means 76, one cycle of mounting the solder ball 72 on the work 74 is completed. .

[0006]

However, the prior art has the following problems. 1) In order to adsorb the solder ball 72 on the lower surface side of the suction head 78, the suction head 78 must be pressed against the solder ball 72 in the stock portion 73, so that a large pressing force is applied to the fine solder ball. This may cause the solder ball itself to be damaged or deformed. 2) Further, since the suction head 78 is pressed against the group of solder balls randomly stored in this manner, extra fine solder balls may be adsorbed. When you move it,
An extra pressing force is applied. 3) In addition, since the suction state is not always the same during the suction step, it is difficult to understand that the wafer has been laterally moved and thus only one piece has been adsorbed at a predetermined position. Extra time consuming, inefficient. 4) While the amount of the solder balls gradually decreases, the best suction position of the suction head and the position at the time of supplying the solder balls must be adjusted. 5) Further, since the stock portion 73 must be opened, the oxidation of the solder ball cannot be prevented efficiently. 6) Since the suction head 78 moves all the way from the suction of the solder ball at the suction part 70 to the mounting yard to the mounting of the solder ball on the work 74, the suction head 78 is mounted when the solder ball is mounted on the work 74. Is empty, and while the suction head 78 is sucking the solder ball by the suction portion 70, the solder ball is not mounted on the work, and the work is wasted in the mounting process.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to be able to handle solder balls in a soft manner so as not to damage or deform them. A solder ball mounting method that can supply solder balls one by one to a predetermined position with certainty, and can further efficiently mount the solder balls by eliminating unnecessary idle time in the suction section and the mounting yard for mounting the solder balls on the work; and An object of the present invention is to provide a solder ball mounting device.

[0008]

According to a first aspect of the present invention, there is provided a method for mounting a solder ball, comprising the steps of:
In a solder ball mounting method for mounting a solder ball sucked in a solder ball stock yard on a work positioned in a mounting yard, the solder ball is dropped and supplied from a supply port arranged in a predetermined pattern. After sucking the solder balls at the suction ports aligned upward from the lower side, the inside of the supply port is set to a negative pressure, and the remaining solder balls are pulled up.Then, the solder balls sucked upward at the suction ports are turned downward. After switching to the suction state, it was decided to mount it on the work.

According to a second aspect of the present invention, there is provided a method of mounting a solder ball according to the first aspect.
A relay yard for solder balls is set between the stock yard and the mounting yard, and a temporary receiving means for the solder balls is reciprocated between the stock yard and the relay yard. The mounting means of the solder balls is reciprocated between the mounting yard and the relay yard so that the solder balls falling in a restricted manner in the stock yard during each reciprocating movement of the solder balls fall on the upper surface of the temporary receiving means. Then, the required number of pieces are sucked one by one, and then the solder balls are re-adsorbed to the lower surface of the mounting means in the relay yard to transfer the solder balls, and the solder balls sucked by the mounting means are mounted on the work in the mounting yard.

According to a third aspect of the present invention, there is provided a solder ball mounting apparatus for mounting a solder ball sucked in a solder ball stock yard on a work positioned at the mounting yard. Supply means for dropping and supplying the solder ball from a supply hole formed in a predetermined pattern to the surface of the stock yard and adsorbing the solder ball on an upward surface so as to be set between the stock yard and the mounting yard. Temporary receiving means for reciprocating to the relay yard; receiving the solder balls of the temporary receiving means in the relay yard on the downward surface in the pattern again, receiving the solder balls, and reciprocating to the mounting yard, and forcing the solder balls upward in the mounting yard. Mounting means mounted on a surface; temporary supply means for dropping and supplying a solder ball from the supply means to the temporary reception means Upwardly facing surface and a suction means for applying a suction force to the solder ball supply hole from the stock portion of the solder ball after adsorption; was configured with a.

According to a fourth aspect of the present invention, there is provided a solder ball mounting apparatus for mounting a solder ball adsorbed in a solder ball stock yard on a work positioned in the mounting yard. Suction means for providing a solder ball storage portion in which a predetermined number of supply holes are drilled to the bottom surface side, and the storage portion pulls up unnecessary solder balls in the supply hole to the storage portion side; and A stock portion communicated with the stock yard and; vibrating means for the stock portion; and a suction hole corresponding to a supply hole position opened on the bottom surface of the stock portion is arranged on the upper surface side, and the upper end of the suction hole is A temporary receiving base formed in a concave part for sucking the solder ball; and a suction hole corresponding to the position of the concave part opened on the upper surface of the temporary receiving base is arranged on the lower surface side, and An adsorbing block having an end formed in a concave portion for adsorbing a solder ball; positioning means for the stock portion and the temporary receiving tables and between the temporary receiving table and the suction blocks; elevating means for the temporary receiving table and the temporary receiving table; Transition means for reciprocating between the stock yard and a relay yard set halfway from the stock yard to the mounting yard; positioning / elevating means for positioning the suction block with respect to the temporary receiving table and the work; and the relay yard and the mounting yard And a transition means for reciprocating between the two.

According to a fifth aspect of the present invention, there is provided a solder ball mounting apparatus according to the fourth aspect.
An antioxidant gas supply means is provided in the solder ball storage section of the stock section.

According to a sixth aspect of the present invention, there is provided the solder ball mounting apparatus according to the fourth or fifth aspect of the present invention, wherein the stock part elevating means is provided in place of the temporary holder elevating means. And

According to a seventh aspect of the present invention, there is provided a solder ball mounting apparatus according to any one of the fourth to sixth aspects, wherein the stock portion is provided with a static electricity preventing means. And

[0015]

In the method for mounting a solder ball according to the first aspect,
First, since the solder balls are dropped and supplied, the solder balls themselves can be sucked to the respective suction ports without applying an external force such as an excessive pressing force. In addition, since the solder ball lifts the solder ball in the supply port after the suction port has sucked the suction port, the suction port can be detached from the supply port so as not to drop the solder ball from the supply port. After that, since the solder balls are converted into the downward suction state, the solder balls can be supplied in a predetermined pattern so as to be placed on the work from above.

In the method and the apparatus for mounting a solder ball according to the second and third aspects, the solder ball is adsorbed on the upper surface of the temporary receiving means in the stock yard, but is re-adsorbed on the lower surface of the mounting means in the relay yard. Therefore, in the mounting yard, the solder ball can be mounted so as to be directly mounted on the work with the electrode surface facing upward. Therefore, in the stock yard, it is only necessary to drop the solder ball group from the lowermost surface of the solder ball group to the temporary receiving means side in accordance with gravity, and it is not necessary to apply a pressing force to the solder ball group.
Since the temporary receiving can be performed irrespective of the amount of the solder ball group in the stock yard, that is, regardless of the upper surface position of the solder ball group, it is not necessary to adjust the best temporary receiving position each time. Since the temporary receiving of the solder balls and the mounting of the solder balls of the mounting means can be performed irrespective of the mutual positional relationship, even if it takes time to temporarily receive the solder balls in the work, it is necessary to transfer the solder balls to the mounting means. By performing the operation during the mounting time, the time in the entire cycle can be reduced.

According to a fourth aspect of the present invention, in the stock yard, in the stock yard, the temporary receiving table faces the stock portion in a positioning state from the lower surface side and receives the drop supply of the solder ball in the concave portion. At this time, if the stock portion is vibrated, the solder balls in the storage portion can be quickly dropped into the supply hole even if the solder balls are in a state of competition at the upper end opening of the supply hole. Then, when the inside of the storage section is made negative pressure after the dropped solder balls are attracted to the concave portions, unnecessary solder balls remaining in the supply holes are sucked into the storage section. By setting the stock portion and the temporary receiving portion in the suction state, the temporary receiving table side fixes the solder ball at a predetermined position, and the temporary receiving table can be lowered without spilling the solder ball from the stock portion.

After lowering the temporary receiving table, the temporary receiving table is moved to the relay yard, and a gap is provided between the temporary receiving table and the suction block so that the temporary receiving table is positioned and positioned. After the meeting, when the suction of the temporary holder is released and suction force is applied to the suction block, the solder balls of the temporary holder can be re-adsorbed to the concave portion of the suction block. While receiving the supply of the solder ball from the stock portion again, the suction block was transferred to the mounting yard while the temporary cradle was being transferred to the stock yard and receiving the supply of the solder ball, and the positioning was performed at the mounting yard. By lowering the suction force on the work surface and releasing the suction force, the solder ball can be mounted on the electrode surface. Immediately thereafter, the suction block is moved to the relay yard, thereby completing one cycle.

In the solder ball mounting apparatus according to the fifth aspect, an antioxidant gas is supplied into the storage section in a negative pressure state, thereby preventing oxidation of the solder ball and releasing the negative pressure in the storage section to release the solder ball. Can be allowed to fall.

In the solder ball mounting device according to the sixth aspect, the structure of the temporary receiving table side is simplified and the mass of the temporary receiving table side can be reduced, so that the load on the transfer means can be reduced.
Even a compact one can be positioned accurately.

According to the solder ball mounting device of the present invention, the suction action between the solder balls or the stock portion in the storage portion due to static electricity is prevented, and the solder balls are smoothly dropped so that the mounting operation can be efficiently performed. Can be performed.

[0022]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a side sectional view showing a solder ball mounting device according to an embodiment of the present invention, and FIG.
FIG. 3 is an explanatory view showing a moving state of the solder ball according to the first embodiment, and FIG. In the figure, 1 is a base, 2 is a stock yard arranged on one end side of the base, 3 is a mounting yard arranged on the other end side of the base 1, 4 is a stock yard 2 and a mounting yard 5 It is a relay yard located between the two. In this embodiment, the X-axis extends from the stockyard 2 to the loading yard 3 and the relay yard 4, the Y-axis extends perpendicular to the X-axis on a horizontal plane, and the Z-axis perpendicular to the X-axis.

The stock yard 2 has a stock portion 6 for supplying solder balls 5, a pin 7 for detachably connecting the stock portion 6 to a temporary receiving table 16 to be described later to transmit vibrations, and A slide rail 8 is provided to enable sliding in the direction without resistance. The stock portion 6 serves as a supply means for the solder balls 5, and has a storage portion 9 for storing a large amount of the solder balls 5 in a sealed state. 10 is, as shown in FIGS.
A supply hole having a diameter that allows the solder balls 5 to be smoothly inserted one by one, penetrates from the inner bottom surface of the storage unit 9 to the lower surface of the stock unit 6, and is arranged by the number of electrode surfaces of the work 11 (for example, a semiconductor substrate). Drilled to match the pattern. 12 is a closed lid of the storage section 9;
Reference numeral 13 denotes a suction pipe for connecting the storage section 9 to an external suction device (not shown), reference numeral 14 denotes an antioxidant gas supply pipe for supplying an antioxidant gas to the storage section 9 only when instructed from the outside, and reference numeral 15.
Are positioning pins protruding vertically from both sides of the lower surface of the stock portion 6. Although not shown, an antistatic device is provided near the stock section.

Next, reference numeral 16 denotes a temporary holder as temporary solder ball receiving means, and the solder ball 5 is provided on the upper surface thereof.
A concave portion 17 for adsorbing the solder ball 5 is arranged in accordance with the supply hole pattern of the stock portion 6.
And a suction hole 18 having a diameter smaller than the diameter of the solder ball 5 and communicating with a suction device (not shown) at the bottom thereof. 19 is a suction pipe. The outer periphery of the pattern portion formed by the concave portion of the temporary receiving table 16 is provided one step lower so that air can be uniformly and favorably introduced into the pattern portion. Reference numeral 20 denotes a fitting hole for the pin 15 protruding from the bottom surface of the stock portion 6, and the concave portion 17 matches the supply hole 10 of the solder ball 5 at the time of fitting.

Numeral 21 denotes a means for shifting the temporary receiving table 16, wherein a screw shaft 23 and a slide rail 24 driven by a motor 22 are arranged along the X axis from a position below the stock portion 6 to a position of the relay yard 4. Have been. Reference numeral 25 denotes a table which slides on the slide rail 24, has a female screw portion 26 which is screwed to the screw shaft 23, and is provided with elevating means 27 for the temporary receiving table 16 on the table. The elevating means 27 has an elevating portion mainly formed by a first wedge portion 29 and a second wedge portion 33, and the first wedge portion 29 is fixed to the lower surface of the temporary receiving table 16 and the vertical side is a sliding table 25. Guide 28
The second wedge portion 33 has the inclined surface 31 opposed to the inclined surface 30 of the first wedge portion 29,
It is held on the slide table 25 by a screw shaft motor 32 so as to be able to move laterally. 34 is a guide for slidably holding the inclined surface 30, 35 is a guide for laterally moving the second wedge portion 33, and 36 is a screw shaft driven by the screw shaft motor 32. The elevating means 27 stops the lower surface of the stock portion 6 so that the upper surface of the temporary receiving table 16 has a gap G as appropriate during the ascent operation.

A suction block 37 has a recess 38 for sucking the solder balls 5 on the lower surface, similarly to the stock portion 6 of the temporary holder 16. The concave portion 38 is arranged in accordance with the arrangement pattern, and has a shape (for example, a tapered shape or a radius larger than that of the solder ball 5) capable of easily attracting the solder ball 5, and has a bottom portion smaller than the diameter of the solder ball 5. A suction hole 39 having a diameter and communicating with a suction device (not shown) is connected. 40 is a pipe for the suction,
Reference numeral 41 denotes a pin to be inserted into the fitting holes 20 provided on both sides of the temporary receiving table 16, and the concave section 17 of the temporary receiving table is marked with the concave section 38 of the suction block 37 at the time of fitting.

Reference numeral 42 denotes a means for elevating and lowering the position of the suction block 37; First, the transition means 43 will be described. A screw shaft 46 driven by a slide rail 44 and an X-axis motor 45 is provided on a portion of the base 1 along the X-axis.
Are arranged from the mounting yard 3 position to the relay yard 4 position. Reference numeral 47 denotes an X-axis table mounted on the slide rail 44. The X-axis table 47 has a female screw portion 48 to be screwed to a screw shaft 46, and has a positioning vertical moving means 42 for positioning the suction block 37 on a table vertical surface. Reference numeral 49 denotes a slide rail provided in the Y-axis direction on the table vertical surface, 50 denotes a screw shaft, and 51 denotes a Y-axis motor. 52 is a slide rail 49
The Y-axis base 53 of the positioning elevating means 42, which is slidably mounted on the, is an internal thread 53.

Numeral 54 denotes a Z-axis screw shaft suspended from the Y-axis table 52, 55 denotes the same slide rail, and 56 denotes a Z-axis table which is mounted on the slide rail 55 and has a female screw portion 57 formed by the screw shaft 54.
Is screwed into. Reference numeral 59 denotes a Z-axis motor. The Z
The suction block 37 is rotatably supported on the shaft base 56 so as to be rotatable in the horizontal direction. 60 is a female thread for controlling rotation, 61
Is a screw shaft, and 62 is an angle control motor. 63 is a conveyor arranged in the Y-axis direction of the mounting yard 3.

Although not shown, in the solder ball mounting apparatus according to the present embodiment, the electrode surface of the work 11 carried into the mounting yard 3 by the conveyor 63 is subjected to image processing to perform X-axis and Y-axis.
A CCD camera and a control unit are provided for judging an error between the shaft and the rotation angle, outputting a correction amount thereof, and driving each shaft motor to correct the axial direction of the suction block.

Next, the operation of the present embodiment will be described with reference to FIG. First, as shown in FIGS. 2 (a) and 4 (a), the storage portion 9 of the stock portion 6 is sealed with the lid 12 in a state where a large number of solder balls 5 are stored, and the suction device is further used to suck the inside of the storage portion. Thus, the solder balls 5 are prevented from falling from the supply holes 10.

Next, as shown in FIGS. 2 (b) and 4 (b), when the temporary receiving table 16 is raised from a position below the stock portion 6, the pins 15 are fitted into the fitting holes 20 and the concave portions are formed. Reference numeral 17 precisely matches the supply hole 10. At this time, a gap G is set between the lower surface of the stock portion 6 and the upper surface of the temporary receiving table 16 so that outside air can be easily introduced into the surface. After setting the gap G, the suction device is stopped, and an antioxidant gas is supplied from the supply pipe 14 so that the inside of the storage unit 9 is at or above the atmospheric pressure. In this case, dry air may be supplied instead of the antioxidant gas. By introducing the gas, the solder balls 5 in the storage section 9 are formed.
Falls into the supply hole 10 and is received by the recess 17. At this time, the motor 22 is operated in the normal / reverse direction for a short time with the pin 7 released to vibrate the storage unit 9 via the temporary receiving table 16 to promote the falling of the solder balls 5. On the temporary receiving table 16 side, the outside air side is sucked by the suction holes 18, so that the solder balls 5 are sucked into the concave portions 17.

Next, as shown in FIGS. 2 (C) and 4 (C), after the inside of the storage section 9 is again set to the negative pressure, the temporary receiving table 16 is lowered and moved to the relay yard 4. Since the suction block 37 is already waiting in this relay yard,
At this position, the temporary support 16 is raised. As shown in FIG. 2 (d), a gap G is set between the lower surface of the suction block 37 and the upper surface of the temporary holder 16 so that outside air can be easily introduced into the surface. Thereafter, the suction of the temporary receiving table 16 is released, and the outside air side is sucked by the suction holes 39 of the suction block 37, so that the solder balls 5 are received from the recess 17 and sucked into the recess 38.

As shown in FIG. 4D, the solder balls 5
After the temporary receiving table 16 is lowered, the temporary receiving table 16 is immediately returned to the stock yard 2 to suck the solder balls, and the suction block 37 is moved to the mounting yard 3. On the other hand, in the mounting yard 3, image processing of the electrode surface in a fixed state of the work 11 already carried in is performed, and a precise correction amount is output. The output of the suction block 37 causes the X-axis motor 45 and the Y-axis motor 5 during the transition.
1 and the angle control motor 62 to drive the work 11
The position of the concave pattern of the suction block 37 is corrected in the same direction as the position of the electrode surface. After reaching the predetermined position of the mounting yard of the suction block 37, as shown in FIG.
The suction is released while the solder ball 5 in the lower concave portion is in contact with the electrode surface, and the solder ball 5 is mounted on the electrode surface. After mounting the solder balls 5, the suction block 37 immediately returns to the relay yard and waits. One cycle is completed in this step.

As described above, according to the solder ball mounting apparatus of the present embodiment, the stock unit 6
It is only necessary to drop the solder ball group from the lowermost surface of the solder ball group to the temporary receiving table 16 side according to gravity, so that it is not necessary to apply a pressing force to this solder ball group. Since the provisional receiving can be performed irrespective of the position of the upper surface of the solder ball group in the stock unit 6, it is not necessary to adjust the best temporary receiving position every time. Since the temporary receiving of the solder balls on the temporary receiving table 16 and the mounting of the solder balls on the suction block 37 can be performed irrespective of the mutual positional relationship, the position of the temporary receiving of the solder balls or the concave pattern of the suction block 37 is corrected and the solder is removed. Even if it takes time to mount the ball, it is possible to reduce the time in the entire cycle by performing the operation during the mutual working time.

Further, the solder balls in the storage section can be quickly dropped into the supply hole even if the solder balls are in opposition at the opening at the upper end of the supply hole by the motor 22. Unnecessary solder balls remaining in the supply holes are sucked into the storage section by applying a negative pressure to the storage section, thereby lowering the temporary support table without dropping the solder balls from the stock section 6. Can be done.

Since the positioning pins 15 and the fitting holes 20 are provided, the stock portion 6 and the temporary receiving table 16 can always be accurately faced. Further, since the gap G is provided when the stock unit 6 and the temporary receiving table 16 or the suction block 37 and the temporary receiving table 16 are mated with each other, the supply, the temporary receiving, and the suction of the solder ball can be performed smoothly.

By supplying the antioxidant gas into the storage section in the negative pressure state, the oxidation of the solder balls can be prevented, and the negative pressure in the storage section can be released to allow the solder balls to fall.

Since the antistatic device is provided, the suction action between the solder balls or the stock portion in the storage portion due to static electricity is prevented, so that the solder balls can be smoothly dropped and the mounting operation can be performed efficiently. be able to.

Although the embodiment of the present invention has been described above, the specific configuration of the present invention is not limited to this embodiment, and a design change or the like may be made without departing from the gist of the present invention. If so, they are included in the present invention.

For example, instead of the wedge-type elevating means provided on the temporary receiving table 16, as shown in FIG.
An elevating means 65 similar to the elevating means of the headstock 56 may be provided in the stock unit 6 (64 is a drive motor). In this case, the configuration of the temporary receiving table 16 is simplified, and the mass of the temporary receiving table 16 can be reduced. Therefore, the load on the transfer means can be reduced, and accurate positioning can be achieved even with a compact device.

The positioning elevating means 42 and the shifting means 2
Configurations such as 1, 43 can be arbitrarily set. Also, not only the combination of the temporary receiving table and the suction block, but only one of the temporary receiving table and the suction block is used, and a means for reversing the solder ball suction surface is added thereto (for example, the suction block is rotatable about a horizontal axis). It may be mounted by pivoting and changing the direction.

[0042]

As described above, the first aspect of the present invention is as follows.
In the solder ball mounting method described above, since the above configuration is adopted, the solder ball is dropped and supplied, so that an external force such as an excessive pressing force is not applied to the solder ball itself, and each suction port is provided. Can be adsorbed. In addition, since the solder ball lifts the solder ball in the supply port after the suction port has sucked the suction port, the suction port can be detached from the supply port so as not to drop the solder ball from the supply port. In addition, since the solder balls are converted into the downward suction state, the solder balls can be placed on the work from above and supplied in a predetermined pattern.

A method for mounting a solder ball according to claim 2,
In the solder ball mounting device according to the third aspect, the solder ball is suctioned to the upper surface of the temporary receiving means in the stock yard because of the above configuration, but is re-adsorbed to the lower surface of the mounting means in the relay yard. In the mounting yard, solder balls can be easily mounted on a workpiece with the electrode surface facing upward. Also, in the stock yard, it is only necessary to drop the solder ball group from the bottom surface of the solder ball group to the temporary receiving means side according to gravity, so that the solder ball group can be handled softly without forcibly applying a pressing force. It does not damage or deform the solder balls. Since the temporary receiving can be performed irrespective of the position of the upper surface of the solder ball group in the stock yard, it is not necessary to adjust the best temporary receiving position each time. Since the temporary receiving of the solder balls and the mounting of the solder balls of the mounting means can be performed irrespective of the mutual positional relationship, even if it takes time to temporarily receive the solder balls in the work, it is necessary to transfer the solder balls to the mounting means. By performing the operation during the mounting time, effects such as shortening of the time in the entire cycle can be obtained.

According to the fourth aspect of the present invention, in addition to the above-described effects, when the stock portion is vibrated, even if the solder balls conflict with each other at the upper end opening of the supply hole. Thus, the solder balls in the storage section can be quickly dropped into the supply holes. In addition, with a simple configuration to create a negative pressure in the storage section, unnecessary solder balls remaining in the supply holes can be sucked into the storage section, and the temporary holder can be lowered without spilling the solder balls from the stock section. it can. Since the solder balls of the temporary support are re-adsorbed to the concave portions of the suction block, the temporary support is moved to the stock yard to receive the supply of the solder balls from the stock portion again. While the suction block is being supplied, the suction block can be moved to the mounting yard, and the solder ball can be mounted on the electrode surface, and the overall time can be shortened.

According to the fifth aspect of the present invention, the solder ball mounting apparatus is configured as described above, so that oxidation of the solder balls is prevented by supplying an antioxidant gas.
The effect is obtained that the falling of the solder ball can be allowed by releasing the negative pressure in the storage section.

In the solder ball mounting device according to the sixth aspect of the present invention, since the above configuration is adopted, the configuration of the temporary receiving table side is simplified, and the mass of the temporary receiving table side can be reduced.
It is possible to reduce the load on the transfer means, and to achieve an effect such that accurate positioning can be achieved even with a compact device.

According to the solder ball mounting device of the present invention, since the above configuration is adopted, the electrostatic adsorption between the solder balls or the stock portion in the storage portion is prevented, and the fall of the solder balls is prevented. The effect is obtained such that the mounting work can be performed smoothly and efficiently.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing a solder ball mounting device according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a movement state of a solder ball according to the first embodiment.

FIG. 3 is a side view showing a temporary cradle elevating means of the same.

FIG. 4 is an explanatory view showing a solder ball mounting step of the above.

FIG. 5 is a side sectional view showing a solder ball mounting device according to another embodiment.

FIG. 6 is an explanatory view showing a main part of a conventional solder ball mounting device.

[Explanation of symbols]

 2 Stock yard 3 Mounting yard 4 Relay yard 5 Solder ball 6 Stock section 9 Solder ball storage section 10 Supply section supply hole 11 Work 15 Pin (positioning means) 16 Temporary support (temporary receiving means) 17, 38 Recess 18, 39 suction hole 20 fitting hole (positioning means) 21, 43 transfer means 22 motor (also serves as vibration means) 27 elevating means 37 suction block 42 positioning elevating means

Claims (7)

[Claims] 1. A solder ball mounting method for mounting a solder ball sucked in a solder ball stock yard on a work positioned in a mounting yard, wherein the solder ball is dropped and supplied from a supply port arranged in a predetermined pattern. Then, the solder balls are respectively sucked at the suction ports aligned upward from the lower side of the supply port, and then the inside of the supply port is set to a negative pressure so that the remaining solder balls are pulled up. A method of mounting a solder ball, comprising: converting a solder ball that has been drawn into a downward suction state before mounting the work on a work. 2. A relay yard for solder balls is set between the stock yard and the mounting yard, and a temporary receiving means for the solder balls is reciprocated between the stock yard and the relay yard. The mounting means of the solder ball is reciprocated between the mounting yard and the relay yard so as to meet the temporary receiving means, and the solder ball whose position is regulated and falls at the stock yard during each reciprocating movement is formed by the solder ball. After the required number of pieces are sucked at a rate of one piece on the upper surface of the temporary receiving means, the solder balls are re-adsorbed to the lower surface of the mounting means in the relay yard, and the solder balls are transferred. 2. The method for mounting a solder ball according to claim 1, wherein: 3. A solder ball mounting apparatus for mounting a solder ball sucked in a solder ball stock yard on a work positioned in a mounting yard, wherein a supply hole formed in a predetermined pattern on a lower surface of the solder ball stock portion. Supply means for dropping and supplying the solder balls from the stock yard; temporary receiving means for meeting the lower surface of the stock portion, adsorbing the solder balls on the upward surface, and reciprocating to a relay yard set between the stock yard and the mounting yard; Loading means for re-adsorbing the solder balls of the temporary receiving means on the downward surface in the relay yard and receiving the solder balls on the downward surface in the relay yard, reciprocating to the mounting yard, and mounting the solder balls on the upward surface of the work in the mounting yard; Means for supplying solder balls from the means to the temporary receiving means, and the upwardly facing surface of the temporary receiving means adsorbs the solder balls. A suction means for applying a suction force to the supply hole from within the stocker portion of the solder ball. 4. A solder ball mounting apparatus for mounting solder balls sucked in a solder ball stock yard on a work positioned in a mounting yard, wherein a supply hole having a size capable of inserting solder balls one by one is provided on a bottom side. A storage portion for solder balls perforated up to a predetermined number, and the storage portion is disposed in the stock yard in communication with suction means for pulling up unnecessary solder balls in the supply holes to the storage portion side. A stock portion; vibrating means of the stock portion; and a suction hole corresponding to a supply hole position opened on the bottom surface of the stock portion, which is disposed on the upper surface side, and an upper end of the suction hole is formed in a concave portion for attracting a solder ball. A temporary receiving base; a suction hole corresponding to a concave position opened on the upper surface of the temporary receiving base is arranged on a lower surface side; and a lower end of the suction hole is formed in a concave part for attracting a solder ball. Positioning means for positioning the stock portion and the temporary cradle; elevating means for the temporary cradle; and a relay yard set between the stock yard and the mounting yard from the stock yard. And a moving means for reciprocating between the temporary holding table and the work of the suction block and a moving means for reciprocating between the relay yard and the mounting yard. Solder ball mounting device. 5. The solder ball mounting apparatus according to claim 4, wherein a means for supplying an antioxidant gas is provided in the solder ball storage section of said stock section. 6. The solder ball mounting apparatus according to claim 4, further comprising means for raising and lowering said stock portion in place of said means for raising and lowering said temporary holder. 7. The solder ball mounting device according to claim 4, wherein said stock portion is provided with means for preventing static electricity from being charged.