JPH11121929A - Multilayer printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a connecting plug terminal and the pin of a connector from contacting when fitted to the connector, by wiring an electrode-leading line that is required for performing electrical plating to an upper connecting plug terminal being arranged in two stages via an inner layer connection hole. SOLUTION: An electrode-leading line of a connecting plug terminal upper stage 3 is not led between connecting plug terminal lower stages 2 being located on a surface layer, an inner layer connection hole 4 is provided in the connecting plug terminal upper stage 3, and an electrode-leading wire 6 of an inner layer is provided. An electrode-leading line 6 of the inner layer is connected at an electrode part 7 of a disposal substrate 10 by a via hole 4, and the inner layer may be a power supply, a ground, or any layer of a signal logic layer. Also, the via hole 4 is preferably provided at the connecting plug terminal effective part being fitted to a connector, thus preventing a thin electrode-leading line for plating from being peeled on insertion and extraction and touching other terminals.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board having two or more insertion type plug terminals.

[0002]

2. Description of the Related Art A conventional electroplating method for a plug terminal will be described with reference to FIG. FIG. 3 shows a plug portion of a printed wiring board for explaining a conventional plug terminal portion plating method.

In FIG. 3, 1 is a printed wiring board, 2 is a plug terminal lower stage, 3 is a plug terminal upper stage, 5 is an electrode lead wire, 7 is a plating electrode, 8 is a signal pattern, and 9 is a plating prevention mask. Reference numeral 10 indicates a discarded substrate, and reference numeral 11 indicates a cut portion.

[0004] In order to stabilize the electrical connection of the mating portion with the connector, the connection terminals 2 and 3 shown in FIG.
Usually, electrogold plating is applied to a nickel base. An electrode lead wire 5 is provided for each of the plug terminals 2 and 3, and is connected to an external power source for plating by the electrode 7 for electroplating of the discarded substrate 10 at the lead-out destination. Attach the plug terminal to the plating tank,
By supplying a current to the plating electrode 7, the plug terminals 2, 3
Plating. After plating and cutting at the cutting section 11 to give an end face treatment, an insertion type plug terminal of the printed wiring board is formed.

[0005]

As a result of studying the above prior art, the following problems were found.

That is, in the above-mentioned prior art, it is necessary to provide the electrode lead wire 5 and the electrode 7 for electroplating in order to apply plating to the plug terminals 2 and 3.

However, in the case of a two-stage arrangement like the plug terminals 2, 3, the electrode lead wire 5 of the plug terminal upper stage 3 must be provided between the plug terminal lower stages 2. In this case, as the terminal interval of the lower part 2 of the plug terminal becomes narrower, it is necessary to make the electrode lead wire 5 thinner in order to secure a creeping distance between the electrode lead wire 5 and the terminal.

For example, the plug terminal pitch of the plug terminal 2 is 1.
In the case of 27 mm, the line width of the electrode lead wire 5 is 0.1
０．１0.15 mm. 0.1-0.1
The peeling strength of the electrode lead wire of 5 mm from the substrate is about 14 to 21 g · f in terms of 1.4 kg / cm according to JIS regulations.

As a result, there has been a problem that, by repeatedly inserting and removing the connector, the electrode lead wire 5 comes off the substrate of the printed wiring board and comes into contact with other terminals.

[0010] An object of the present invention is to provide a technique capable of applying electroplating to the plug-in terminals arranged in two stages and preventing contact with the plug-in terminals and the pins of the connector when mated with the connector. Is to do.

[0011]

Means for Solving the Problems An upper layer (inside) plug terminal having a two-stage arrangement is provided with an inner layer connection hole provided with an electrode lead wire required for performing electroplating in the upper plug terminal. It is not necessary to wire between the lower (outer) plug terminals on the surface layer by wiring through the inner layer through the intermediary.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for electroplating a plug terminal according to an embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a view for explaining a method of plating a plug terminal arranged in two stages. In FIG. 1, 1 is a printed wiring board, 2 is a plug terminal lower stage, 3 is a plug terminal upper stage, 4 is an inner layer connection hole, 5 is an electrode lead wire, 6
Denotes an electrode lead wire of an inner layer, 7 denotes an electrode for electroplating, 8 denotes a signal wiring pattern, 9 denotes a mask for preventing plating, 10 denotes a discarded substrate, and 11 denotes a cut portion.

FIG. 2 is a view for explaining the position of the inner layer connection hole in the inner plug terminal. In FIG. 2, 1 is a printed wiring board, 2 is a plug terminal lower stage, 3 is a plug terminal upper stage, 4 is an inner layer connection hole, 6 is an inner layer electrode lead, 12
Indicates a connector terminal, 13 indicates a plug terminal effective portion, and 14 indicates a plug terminal ineffective portion.

The specifications of the printed wiring board of this embodiment are shown in FIG.
As shown in the figure, the electrode lead wire of the upper terminal 3 of the plug terminal is not drawn out between the lower terminal 2 of the plug terminal on the surface layer, the inner layer connection hole 4 is provided in the upper terminal 3 of the plug terminal, and the electrode lead wire 6 of the inner layer
Is provided. The electrode lead lines 6 of the inner layer are connected by the via holes 4 at the electrode portions 7 of the waste substrate 10. The inner layer can be any of the power supply, ground, and signal logic layers. In addition, as shown in FIG. 2, the inner layer connection hole is a non-effective portion 1 which is separated from the plug terminal effective portion 13 which is engaged with the connector.
4 is desirable.

After the printed wiring board is formed by the above-described wiring, a mask 9 for preventing electroplating is applied to the signal wiring pattern 8 and electroplating is performed in the same manner as in the prior art. After the electroplating is applied, the cut portion 11 is cut and subjected to an end face treatment, and then an insertion type plug terminal of the printed wiring board is formed.

It should be noted that the present invention is not limited to the above-described embodiment, but can be variously modified without departing from the gist of the invention.

[0018]

【The invention's effect】

1) Some high-density plugs have a narrow pitch such as 1.27 mm. There is a lead wire for plating the upper plug terminal between the lower plug terminals.

[0019] The thin plating electrode lead wire has problems such as peeling at the time of insertion and removal and contact with other terminals. This problem was solved by providing an inner layer connection hole in the plug terminal and forming an inner layer of the electrode lead for plating.

2) Rather than providing an inner layer connection hole by drawing out a signal line from the plug terminal pad and providing an inner layer connection hole in the plug terminal pad, the area of the power / ground layer up to the board edge of the printed wiring board is provided. Can be secured, and the characteristic impedance control of the plug terminal portion becomes good.

[Brief description of the drawings]

FIG. 1 is a perspective view for explaining specifications of a printed wiring board in a method for plating a plug terminal according to an embodiment of the present invention.

FIG. 2 is a view for explaining the position of an inner layer connection hole of the plug terminal according to the embodiment of the present invention.

FIG. 3 is a perspective view for explaining a conventional method of plating a plug terminal.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Printed wiring board, 2 ... Lower part of plug terminal, 3 ... Upper part of plug terminal, 4 ... Via hole, 5 ... Lead wire of outer layer electrode, 6
... Inner electrode lead wire, 7 ... Electroplating electrode part, 8 ...
Signal wiring pattern, 9: mask for preventing electroplating, 10
... Discard substrate, 11 ... Cutting part, 12 ... Connector terminal, 13
... Effective part of plug terminal, 14 ... Non-effective part of plug terminal

Claims (2)

[Claims] 1. A printed wiring board having two or more insertion type plug-in terminals, wherein an electrode lead wire for electroplating of the plug-in terminal located inside the wiring board is taken out to the outside via an inner layer, and the inner layer A multilayer printed wiring board, wherein a connection hole is provided in a plug terminal. 2. The multilayer printed wiring board according to claim 1, wherein an inner layer connection hole is provided in a non-effective portion of the plug terminal.