JPH1093871A - High resolution image pickup method and its device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase relatively the number of picture elements to be picked up and to easily realize high resolution by dividing each light receiving picture element of the image pickup element into small areas and assigning the area to an object part to be checked of a check object. SOLUTION: The device is provided with an image pickup element 1 whose aperture rate is about 100% and an exposure control board 2 where a part transmits a light smaller than that of the image pickup element 1 by number of picture elements of the image pickup element placed in front of the image pickup element 1 and moved very slightly is an aperture 2a. The exposure control board 2 is moved for a very small distance at each end of exposure of the image pickup element and the exposure is finished for each area of the image pickup picture element for a plurality of number of times to improve the resolution. Since the resolution is doubled in horizontal and vertical directions, a hole with a size of 1/2 in the horizontal direction and a size of 1/2 in the vertical direction with respect to each size of a light receiving picture element 1a of the image pickup element 1 is made as a light transmission part to the image pickup element 1 to form the aperture 2a. Thus, 9 sets of the apertures 2a are formed to the exposure control board 2 corresponding to 9 light receiving elements 1a of the image pickup element 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-resolution imaging method and an apparatus therefor, and more particularly, to a display such as a liquid crystal panel, a shadow mask, a CRT panel, or a plasma display used in the field of electronic equipment. The present invention relates to a high-resolution imaging method and an apparatus for increasing the resolution of an imaging system used for automatically inspecting the quality of a device including a point defect on a manufacturing line.

[0002]

2. Description of the Related Art As a method of reading a screen displayed on a display element, a main method is to use a CC which is a two-dimensional sensor.
There is a method using a D area sensor. In this method, pixels arranged in rows and columns of a two-dimensional sensor and pixels arranged in rows and columns of a display element (hereinafter, unless otherwise specified, a pixel of a display element is referred to as a "display pixel" A pixel of an element is referred to as a “sensor pixel”), and a plurality of sensor pixels are generally arranged corresponding to one display pixel. For example, 3000 × 1
A description will be given of a display element having 000 pixels. In a liquid crystal panel, there are a display portion and a non-display portion of a pixel. The point defect in the lighting inspection of the display portion includes a dark spot which is a group of display pixels which are not displayed in a display state of the liquid crystal panel,
It is divided into bright points, which are groups of display pixels that are displayed in the non-display state. In an automatic inspection apparatus for inspecting this point defect, it is required to find an accurate position of the point defect on the display element. In this case, if two sensor pixels are assigned to one display pixel, 6000 pixels are required in the row direction. However, it is not easy to increase the number of sensor pixels required for increasing the number of pixels in a liquid crystal panel that continues to increase. This is due to an increase in the defect probability of each sensor pixel itself in a semiconductor manufacturing process accompanying an increase in the number of sensor pixels. For this reason, a CCD area sensor having a low number of sensor pixels is used. However, such a method cannot constitute a required automatic inspection device. As a method of using a CCD area sensor having a low sensor pixel number, conventionally, for example, first, a plurality of C area sensors are used.
There is a method using a CD area sensor, and secondly, a method of minutely moving the relative position between the CCD area sensor and the object to be inspected (for example, “Monthly LCD intelligence”).
(Refer to the paper "LCD Display Image Quality Automatic Inspection Technology", pages 66 to 75, issued in March 1996).

[0003]

However, the above two conventional examples have the following problems. First, the first C
In the method using a plurality of CD area sensors, it is difficult to position the imaging optical system of the inspection apparatus, and the handling of the overlapped part of the imaging part of the display pixel, which is the object to be inspected, of each other becomes complicated. Therefore, it is not a method that is used very often. When the CCD area sensor is very expensive, the use of a plurality of CCD area sensors results in an extremely expensive imaging system as a whole. Further, in the second method for minutely moving the relative position between the CCD area sensor and the object to be inspected, CC
Since this is not a method of increasing the number of pixels of the D area sensor, it cannot be expected that the resolution will be dramatically improved. For example, the magnification may be set so that the number of display pixels increases and the display pixel 51 becomes smaller than the sensor pixel 50 as shown in FIG. 7, and the display pixel may be assigned to the sensor pixel. This is a case where the number of imaging elements is 1000 pixels in the row direction and the number of display pixels is 2000 pixels in the row direction.
In this case, even if the relative position between the CCD area sensor and the object to be inspected is slightly moved, only one image sensor is assigned to two display pixels, so that it is impossible to obtain information on the display pixels alone. SUMMARY OF THE INVENTION An object of the present invention is to provide a high-resolution imaging method and a high-resolution imaging method that can solve the above-described problems and can easily realize high-resolution.

[0004]

In order to solve the above problems, the present invention is configured as follows. A high-resolution imaging method according to the present invention divides each of a plurality of light receiving pixels that capture image information of a test object into a plurality of regions, and captures image information from the test object for each divided region. Finally, the image information of the object to be inspected is taken in the entire area of each of the light receiving elements. In the above-described configuration, a light-receiving pixel area dividing unit is provided between the object to be inspected and the imaging element, the light-receiving pixel area dividing unit being arranged corresponding to each light-receiving pixel of the imaging element and having an area smaller than the area of one light-receiving pixel. In addition, it is also possible to adopt a configuration in which only the light that has passed through the light receiving pixel region dividing unit out of the light from the inspection object is captured as image information by the light receiving pixels of the imaging device.

[0005] A high-resolution imaging apparatus according to another aspect of the present invention is provided with an imaging element having a plurality of light receiving pixels for capturing image information of an inspection object, and disposed between the imaging element and the inspection object. A light receiving pixel region dividing member having a light receiving pixel region dividing portion having an area smaller than the area of one light receiving pixel, the light receiving pixel region dividing member being arranged corresponding to each light receiving pixel of the image sensor; Move
Only light that has passed through the light-receiving pixel area dividing portion out of the light from the object to be inspected is captured as image information by the light-receiving pixels of the imaging device. In the above configuration, the light receiving pixel region dividing member may be a plate member having a light blocking function, and the light receiving pixel region dividing portion may be an opening. In the above configuration, the size of the light receiving pixel area dividing section is half the length of each of the light receiving pixels of the image sensor in the horizontal and vertical directions. It is also possible to adopt a configuration in which the image information of the object to be inspected is taken into the image pickup element for each quarter area of the element. In the above configuration, the light receiving pixel region dividing member is an exposure control plate having a pinhole provided on the light shielding material plate so as to correspond to each light receiving pixel of the imaging device in a one-to-one correspondence. It may be configured to further include a lens installed so as to form the light passing through the pinhole into the light receiving image of the image sensor. In the above configuration, the light receiving pixel region dividing member moves every time the exposure of the image sensor is completed, and the exposure for the area of each light receiving pixel of the image sensor is completed a plurality of times.
It can be configured to improve the resolution. In the above configuration, the image sensor may be configured to use an image sensor having an aperture ratio of 100%. In the above configuration, the light-receiving pixel area dividing member may include a light-receiving pixel area dividing unit including elements capable of controlling a position and a size of transmitting light from the inspection object for the number of light-receiving pixels of the imaging element. It is also possible to use a plate member having the above configuration. Further, a high-resolution imaging apparatus according to the present invention is provided with an imaging element having a plurality of light receiving pixels for capturing image information of the inspection object, and disposed between the imaging element and the inspection object, and A light receiving pixel region dividing member having a light receiving pixel region dividing portion having an area smaller than the area of one light receiving pixel, each light receiving pixel region dividing member being arranged corresponding to each light receiving pixel of the image sensor; By moving the light transmitting portion of the light receiving pixel region dividing portion, only the light that has passed through the light transmitting portion of the light receiving pixel region dividing portion among the light from the object to be inspected is image information by the light receiving pixels of the image sensor. It is characterized by being taken in as. In the above configuration, the light receiving pixel region dividing member is a liquid crystal shutter having a light blocking function, the light receiving pixel region dividing portion is a liquid crystal element of the liquid crystal shutter, and the light transmitting portion is a light transmitting pixel. You can also.

[0006]

In the case of the high-resolution image pickup apparatus according to the above aspect of the present invention, the number of pixels to be imaged is relatively increased, so that the number of sensor pixels required for the display pixels to be inspected can be realized. It is. In this case, it is possible to select a CCD area sensor having no defect and having a small number of image pickup devices, and configure the optical system according to the embodiment of the present invention to realize high resolution. Here, the effect of increasing the resolution of the above aspect of the present invention will be described. FIG. 8 shows an image of a part where holes are regularly formed in a portion which does not transmit light indicated by a hatched portion. It is assumed that a portion with a hole is imaged brightly. Here, when one sensor pixel is assigned to four holes, the size of the sensor pixel is 6
0 and 61. The sensor pixel 61 is one sensor pixel 60.
It is moved by the pitch. On the other hand, when one sensor pixel is assigned to one hole, the size of the sensor pixel is 63.

Here, for example, for a normal hole 65,
It is assumed that it is necessary to detect an abnormal hole 64 in which there is a portion that transmits only 50% of light. At this time, the amount of light received when the normal hole 65 is imaged is assumed to be 100, and the amount of light received in the abnormal hole 64 where there is a portion that transmits only 50% of the light is assumed to be 50. Then, in the following two cases (a),
Consider (b). The case (a) corresponds to the conventional method, and the case (b) corresponds to one specific example of the present invention. (A) In the sensor pixel 61, the total amount of light received from the four normal holes 65 is 400, and in the sensor pixel 60, 3
The total amount of light received from one normal hole 65 and one abnormal hole 64 is 350. As a result, the sensor pixel 6
The difference between the light receiving amounts of 1, 60 is [400: 350] =
[1.0: 0.875], and the light reception amount of the sensor pixel 61 is 1.14 times the light reception amount of the sensor pixel 60. (B) When the resolution is set for the sensor pixel 63, the light reception amount of the sensor pixel 63 corresponding to the normal hole 65 is 100, and the light reception amount of the sensor pixel 63 corresponding to the abnormal hole 64 is 50. As a result, the sensor pixel 6 in the case of hitting the normal hole 65 and the sensor pixel 6 in the case of hitting the abnormal hole 64
The difference between the three received light amounts is [100: 50] = [1.0:
0.5], the received light amount of the sensor pixel 63 that hits the normal hole 65 is twice the received light amount of the sensor pixel 63 that hits the abnormal hole 64.

Here, comparing the above two cases (a) and (b), the sensitivity for detecting an abnormal hole 64 is [(b) sensitivity: (a) sensitivity] = [2: 1. 1
4], a difference of 1.75 times appears. As a result, (a)
It can be seen that the detection sensitivity is higher when the size of the sensor pixel is reduced as in the case of (b) than in the case of (b), in other words, when the resolution is higher. In order to increase the detection sensitivity to the sensitivity in the case of (b), even if the method of slightly moving the relative position of the pixel shown in the conventional example is applied, it cannot be solved. That is, FIG. 8 shows the case where the sensor pixel 62 is moved by the half pitch of the sensor pixel 60, but the light reception amount of the sensor pixel 62 is also This is 350, which is the same as the amount of light received by the sensor pixel 60, which is the same as in the case of (a), and the sensitivity is clearly 1.75 times the difference as compared with the case of (b). become.

On the other hand, in the above embodiment of the present invention, the detection sensitivity as in the case (b) can be obtained. That is, by dividing each light receiving pixel of the image sensor into small areas and allocating the plurality of divided areas to the display pixels as the object to be inspected, the number of pixels to be imaged is relatively increased, and It is possible to realize the required number of sensor pixels assigned to the display pixels that are the body. Explaining with reference to the example of FIG. 8, the conventional configuration in which image information of one display pixel is captured in the entire area of the sensor pixel 60 is divided into one light-receiving pixel, for example, into four in the above-described embodiment of the present invention. That is, by dividing the entire area of the sensor pixel 60 into, for example, four sensor pixels 63, four pieces of image information can be captured for one display pixel, and the resolution is increased. That can be enhanced. According to the above aspect of the present invention, for example, it is possible to select a CCD area sensor having no defect and having a small number of image pickup devices, and realize the high resolution by configuring the optical system of the above aspect of the present invention.

[0010]

According to the high-resolution imaging method and apparatus according to the above aspect of the present invention, each light receiving pixel of the imaging device is divided into small areas, and the plurality of divided areas are inspected by one inspection object. By assigning to the target part to be
The number of pixels to be imaged can be relatively increased, and high resolution can be easily realized. In addition, if a CCD area sensor that is relatively inexpensive and has a small number of imaging elements with a low probability of pixel defects is used, it is possible to dramatically increase the resolution. Further, a desired resolution can be easily obtained by adjusting the size of the light receiving pixel area dividing portion with respect to the size of the imaging element.

[0011]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a configuration diagram of a high-resolution imaging apparatus for performing a high-resolution imaging method according to an embodiment of the present invention. In this FIG.
Image sensor 1 having an aperture ratio of about 100%, and an area opening functioning as a light-receiving pixel area dividing unit disposed in front of the image sensor 1 between the image sensor 1 and the device 4 to be inspected. An exposure control plate 2 having a portion 2a and functioning as a light receiving pixel area dividing member, and a lens 3 arranged on the inspection object 4 side of the exposure control plate 2 are shown. Here, for simplicity, it is assumed that the image sensor 1 has a total of nine 3 × 3 light receiving pixels 1a as shown in FIG. That is, the above-described device is almost 1
An image sensor 1 having an aperture ratio of 00% and an image sensor 1 for the number of pixels of a micro-movable image sensor installed in front of the image sensor 1
An exposure control plate 2 having an opening 2a in which a portion for transmitting smaller light is vacated, and the exposure control plate 2 having the opening 2a is slightly moved every time the image sensor exposure is completed, The exposure is completed for each area of the image sensor pixel, thereby improving the resolution.

The exposure control plate 2 has the opening 2a as a through-hole through which the hatched portion 2a in FIG. 3 transmits light. In this embodiment, in order to double the resolution in the horizontal and vertical directions, as a light transmitting portion to the image sensor 1, the size of each light receiving pixel 1a of the image sensor 1 is set in the horizontal direction. 1/2 size and 1/2 vertically
A hole having a size of is formed, and this is used as the opening 2a. Accordingly, nine openings 2a are formed in the exposure control plate 2 as shown in FIG. 3 corresponding to the nine light receiving pixels 1a of the image sensor 1 as shown in FIG. The exposure control plate 2 having the opening 2a is, for example, an x-direction substantially parallel to a direction along a lower edge or an upper edge of the exposure control plate 2 and a y-direction substantially parallel to a right edge or a left edge. In one direction, the plate can be finely moved by a plate position moving device 7 having a pair of pulse motors or linear motors that can be driven independently so as to be independently movable, respectively.
It is assumed that the pixel moves four times in the horizontal and vertical directions, each for a half pixel. The imaging device 1 obtains a gray-scale signal for each pixel, which is sent to the computer 5 in a digitized form. In the computer 5, the image data is stored, for example, as 8-bit density data in the image memory 6 in a form corresponding to the rows and columns of the pixels. A program in which a pixel processing algorithm for performing defect detection is described is stored in the computer 5. A typical example of this image processing algorithm is to compare the image data of a pixel of interest with the image data of peripheral pixels and detect a portion exceeding an arbitrary threshold density.

FIG. 4 shows a flow of processing when image data is captured by the high-resolution imaging apparatus of the present embodiment.
FIGS. 5A to 5D show positions where the exposure control plate 2 stops after a minute movement in front of the image sensor 1. The processing flow is as follows. First, in step # 1 of FIG.
Is moved to the upper left position as shown in FIG. In the position shown in FIG. 5A, the lower edge and the right edge of the exposure control plate 2 indicated by a dotted line coincide with the lower edge and the right edge of the image sensor 1 indicated by a solid line. ing. Next, in step # 2, the image pickup device 1 is exposed to the test object 4 in the state of FIG. 5A, so that the pixel data of the test object 4 is taken into the computer 5 by the image pickup device 1, and On the image memory 6 shown in FIG.
Image data _g11LU , _g12LU , _g13LU , _g21LU , _g22LU ,
_g23LU , _g31LU , _g32LU , and _g33LU are stored. Here, the subscript "LU" means that this image data is image data when the exposure control plate 2 is at the upper left position. Next, in Step # 3, after the exposure is completed, FIG.
Is moved to the upper right position as shown in FIG. 5B with respect to the image sensor 1. At the position shown in FIG. 5B, the lower edge and the left edge of the exposure control plate 2 indicated by the dotted line coincide with the lower edge and the left edge of the image sensor 1 indicated by the solid line. ing. Next, in step # 4, the image pickup device 1 is exposed to the test object 4 in the state shown in FIG. 5 (b), so that the image data of the test object 4 is taken into the computer 5 by the image pickup device 1. The image data _g11RU , _g12RU , _g13RU , _g21RU , _g22RU , g
_23RU , _g31RU , _g32RU and _g33RU are stored. Here, the subscript "RU" means that this image data is image data at the upper right position of the exposure control plate 2.

Next, in step # 5, after the exposure is completed, the exposure control plate 2 located in FIG. 5B is moved to the lower left position with respect to the image pickup device 1 as shown in FIG. Move. At the position shown in FIG. 5C, the upper edge and the right edge of the exposure control plate 2 indicated by the dotted line coincide with the upper edge and the right edge of the image sensor 1 indicated by the solid line. ing. Next, in step # 6, the image pickup device 1 is exposed to the object 4 in the state shown in FIG. 5C, so that the image data of the object 4 is taken into the computer 5 by the image pickup device 1. Image memory 6 shown in
Above, the image data _{g 11LD, g 12LD, g 13LD} , g 21LD, g
_22LD , _g23LD , _g31LD , _g32LD , and _g33LD are stored.
Here, the subscript "LD" means that this image data is image data when the exposure control plate 2 is at the lower left position. Next, in Step # 7, after the exposure is completed, FIG.
The exposure control plate 2 located at (c) is moved to the lower right position with respect to the image sensor 1 as shown in FIG. At the position shown in FIG. 5D, the upper edge and the left edge of the exposure control plate 2 indicated by a dotted line coincide with the upper edge and the left edge of the image sensor 1 indicated by a solid line. ing. Next, in step # 8, the image pickup device 1 is exposed to the image pickup device 4 in the state of FIG. The image data g _11RD , g _12RD , g _13RD , g _21RD , g
_22RD , _g23RD , _g31RD , _g32RD , and _g33RD are stored.
Here, the subscript “RD” means that this image data is image data when the exposure control plate 2 is at the lower right position. Note that, for example, g _11LU , g _11RU , g _11LD , g
Collectively four image data _11RD, referred to as an image data g _11. Similarly, g _12, ···, the image memory 6 the image data up to g ₃₃ is stored.

As a result of the above processing, FIG.
As shown in (d), only a part of each light receiving pixel 1a of the image sensor 1, that is, only the upper left, upper right, lower left, and lower right portions is exposed to light in order. In other words, the light receiving pixels 1a of the image sensor 1 are not provided with the exposure control plate 2 having the above-mentioned opening 2a, whereas the light receiving pixels 1a of the image pickup device 1 in FIG. 5 (b), similarly, only the upper left image information, FIG. 5 (c), similarly the lower left image information, and FIG. 5 (d), similarly the right image information. Only the lower image information is exposed to the image sensor 1, and each image information is stored in a corresponding location of the image memory 6 as shown in FIG. As a result, as shown in FIG. 6, as the entire image data, the inspection object 4 is obtained by equally dividing the object to be inspected 4 in the horizontal and vertical directions. In other words, the resolution is doubled in the horizontal and vertical directions by the above-described minute movement of the exposure control plate 2 having the opening 2a in the vertical and horizontal directions. Then, for the image density data captured at high resolution,
What is necessary is just to perform the same defect detection processing as before.

Obviously, the resolution can be increased by changing the size of the exposure control plate 2 having the opening 2a and changing the minute movement amount according to the size. . For example, a CCD area sensor having the number of pixels of 2000 × 2000 is prepared as the image pickup device 1, and the exposure control plate 2 having the opening 2 a is aligned with the image pickup device 1 so that the horizontal and vertical positions of each light receiving pixel 1 a are adjusted. An aperture 2a having holes each having a size of 1/3 in the vertical direction is prepared, and the exposure control plate 2 having the opening 2a is moved by 1/3 pixel in the horizontal and vertical directions. It shall move nine times. In this case, the resolution is equivalently increased 9 times, and the CC having 6000 × 6000 pixels is equivalent.
The same resolution as when using the D area sensor is obtained.
For example, when a 21-inch CRT display having a large number of 200 μm display pixels is set as an inspection object,
When an image sensor having 00 × 2000 pixels is used, only 200 μm sensor pixels can be allocated in terms of the field of view.
That is, only one sensor pixel can be assigned to a display pixel. As a result, when the inspection is performed at the same resolution, the above-described conventional problem occurs. To solve this problem, the above embodiment of the present invention performs the following. A CCD area sensor having 2000 × 2000 pixels is prepared as an image sensor, and a plate having an opening is provided with holes each having a size of に each in the horizontal and vertical directions of each pixel according to the image sensor. Is prepared, and the plate having the opening is halved in the horizontal and vertical directions.
It is assumed to move four times for each pixel. In this case, the resolution is equivalently increased by a factor of four, and the same resolution as in the case of using a CCD area sensor having 4000 × 4000 pixels is obtained. In this example, the effects described in the operation of the present invention can be obtained. By increasing the resolution by a factor of four compared to the prior art, abnormal holes 64 can be detected with a sensitivity of 1.75 times.

According to the high-resolution imaging method and apparatus according to the above embodiment of the present invention, each light receiving pixel 1a of the imaging device 1 is divided into small regions, and the plurality of divided regions are defined as one region of the object to be inspected. By allocating one target portion to be inspected, the number of pixels to be imaged can be relatively increased, and high resolution can be easily realized. In addition, if a CCD area sensor with a relatively low cost and a small number of imaging elements with a low probability of pixel defects is used,
It is possible to dramatically increase the resolution. Further, a desired resolution can be easily obtained by adjusting the size of the light receiving pixel area dividing portion with respect to the size of the imaging element. Note that the present invention is not limited to the above embodiment, and can be implemented in other various aspects. For example,
The exposure control plate 2 having the opening 2a as the light receiving pixel region dividing member is not limited to the one provided with a hole previously prepared and moved as described above. For example, the liquid crystal shutter 2 as shown in FIGS.
A method is also conceivable in which a part that transmits light from the outside and a part that does not transmit the light are automatically controlled by using something like 0. That is, the light-receiving pixel area dividing member includes a light-receiving pixel area provided with an element such as a liquid crystal capable of controlling a position and a size of transmitting light from the object to be inspected 4 from the outside of the member by the number of light-receiving pixels of the imaging element 1. A plate member having a divided portion, for example, a liquid crystal shutter 20 may be used. Specifically, the liquid crystal shutter 20 shown in FIG. 9E includes a plurality of liquid crystal pixels, and each light transmitting pixel 20a of the liquid crystal pixel transmits light from the inspection object 4 and each light shielding pixel of the liquid crystal pixel. Reference numeral 20b shields light from the inspection object 4. Therefore, without moving the shutter 20 itself, FIG.
As shown in (a) to (d), the liquid crystal pixel can be controlled so that the light transmitting pixel 20a of the liquid crystal pixel can be switched to the light blocking pixel 20b as if the light transmitting pixel moves. Further, in the above embodiment, the flow of the processing is performed in the order of upper left, upper right, lower left, and lower right. However, the order is not limited as long as the entire pixel area can be finally exposed. The arrangement of the pixel data taken into the pixel memory 6 is not limited. Further, in the above-described embodiment, the exposure control plate 2 having the opening is disposed behind the lens 3. However, the present invention is not limited to this position. Good.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a high-resolution imaging apparatus for performing a high-resolution imaging method according to an embodiment of the present invention.

FIG. 2 is a diagram showing an image sensor used in the apparatus of FIG.

FIG. 3 is a view showing an exposure control plate having an opening used in the apparatus shown in FIG. 1;

FIG. 4 is a diagram showing a procedure of image capture in the embodiment.

5A and 5B are diagrams illustrating a portion where a plate having an opening moves in front of an image sensor and transmits light to the left in the embodiment, FIG. 5A illustrates a case where an upper left pixel is exposed, and FIG. FIG. 7C is a diagram illustrating a case where the upper right of a pixel is exposed, FIG. 7C illustrates a case where the lower left of the pixel is exposed, and FIG.

FIG. 6 is a diagram showing pixel data taken into an image memory in the embodiment.

FIG. 7 is a diagram showing an assignment relationship between display pixels and sensor pixels used for explaining a conventional technique.

FIG. 8 is a diagram showing an assignment relationship between display pixels and sensor pixels for explaining the operation and effect of the present invention in comparison with a conventional technique.

9A and 9B are diagrams showing a liquid crystal shutter having a light transmitting pixel and a light shielding pixel according to another embodiment of the present invention, wherein FIG. 9A corresponds to FIG. FIG. 5B shows a case where light is transmitted through the light transmitting pixel 20a and the upper left of each light receiving pixel of the image sensor is exposed.
FIG. 5C shows a case corresponding to FIG. 5B in which light is transmitted through the light transmitting pixel 20a at the upper right of the liquid crystal pixel of the shutter and the upper right of each light receiving pixel of the image sensor is exposed. )
, And a light transmitting pixel 20 at the lower left of the liquid crystal pixel of the shutter.
FIG. 5D shows a case where light passes through a light-transmitting pixel and the lower left of each light receiving pixel of the image sensor is exposed. FIG. 5D corresponds to FIG. Shows a case where light passes through and the lower right of each light receiving pixel of the image sensor is exposed, and (e) shows all the light receiving pixels of the image sensor being shaded to show light-shielded pixels. FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Image sensor 2 Plate with opening (exposure control plate) 2a Opening 3 Lens 4 Inspection object 5 Computer 6 Image memory 7 Board position moving device # 1 Upper left movement of plate with opening # 2 Pixel data acquisition # 3 Move the upper right of the plate with the opening # 4 Move the pixel data # 5 Move the lower left of the plate with the opening # 6 Move the pixel data # 7 Move the lower right of the plate showing the opening # 8 Pixel Data capture

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takeshi Shimono 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (11)

[Claims] A plurality of light receiving pixels (1a) of an image pickup device (1) for capturing image information of an object to be inspected (4) are divided into a plurality of regions, and each of the divided regions is separated from the object to be inspected. A high-resolution imaging method, wherein the image information of the object to be inspected is finally taken in all regions of each of the light receiving elements while taking in the image information. 2. The method according to claim 1, wherein the object to be inspected and the imaging device are
Each of the light receiving pixels of the image sensor is arranged corresponding to each light receiving pixel, and each light receiving pixel region dividing portion (2a) having an area smaller than the area of one light receiving pixel. 2. The high-resolution imaging method according to claim 1, wherein, out of the light from the inspection object, only the light that has passed through the light receiving pixel area dividing unit is captured as image information by the light receiving pixels of the image sensor. 3. An image sensor (1) having a plurality of light receiving pixels (1a) for capturing image information of an object (4) to be inspected, disposed between the image sensor and the object to be inspected, and
A light-receiving pixel area dividing member (2) each having a light-receiving pixel area dividing portion (2a) having an area smaller than the area of one light-receiving pixel, each of which is arranged corresponding to each light-receiving pixel of the image sensor; By moving the light-receiving pixel area dividing member, only the light that has passed through the light-receiving pixel area dividing section out of the light from the test object is captured as image information by the light-receiving pixels of the imaging device. A high-resolution imaging device characterized by the above-mentioned. 4. The light-receiving pixel area dividing member is a plate member having a light-shielding function, and the light-receiving pixel area dividing section (2a) is provided.
4. The high-resolution imaging device according to claim 3, wherein the reference numeral denotes an opening of the plate member. 5. The size of the light receiving pixel area dividing portion is half the length of each of the light receiving pixels of the image sensor in the horizontal and vertical directions, respectively. 5. The high-resolution imaging apparatus according to claim 3, wherein the image information of the object to be inspected is taken into the imaging element for each quarter area of the element. 6. The exposure control plate (2) having a pinhole (2a) provided in the light-shielding material plate so as to correspond to each light-receiving pixel of the image sensor on a one-to-one basis. The lens according to any one of claims 3 to 5, further comprising a lens (3) installed so as to form an image of the light passing through the pinhole on the light receiving pixel of the image sensor. Resolution imaging device. 7. The light-receiving pixel area dividing member (2) moves every time the exposure of the image pickup device is completed, and the exposure to the area of each light-receiving pixel of the image pickup device is completed a plurality of times to improve the resolution. The high-resolution imaging device according to any one of claims 3 to 6, wherein the high-resolution imaging device is configured to: 8. The high-resolution image pickup device according to claim 3, wherein said image pickup device uses an image pickup device having an aperture ratio of 100%. 9. The light-receiving pixel area dividing member includes a light-receiving pixel area dividing section provided with elements capable of controlling a position and a size of transmitting light from the object to be inspected by the number of light-receiving pixels of an image sensor. The high-resolution imaging device according to any one of claims 3 to 8, wherein the high-resolution imaging device is configured by a plate member formed as described above. 10. An image sensor (1) having a plurality of light receiving pixels (1a) for capturing image information of an object (4) to be inspected, disposed between the image sensor and the object to be inspected, and Each of the light receiving pixel region dividing sections (2) is arranged corresponding to each light receiving pixel of the image sensor and has an area smaller than the area of one light receiving pixel.
0a, 20b) and light-receiving pixel region dividing member (20)
And moving the light transmitting portion (20a) of the light receiving pixel region dividing portion of the light receiving pixel region dividing member so that the light transmitting portion of the light receiving pixel region dividing portion out of the light from the object to be inspected. A high-resolution imaging apparatus, wherein only light that has passed through is captured as image information by the light receiving pixels of the imaging element. 11. The light receiving pixel area dividing member is a liquid crystal shutter having a light blocking function, the light receiving pixel area dividing section (20a, 20b) is a liquid crystal element of the liquid crystal shutter, and the light transmitting section (20a) is The high-resolution imaging device according to claim 10, wherein the high-resolution imaging device is a light transmission pixel.