JPH1079458A - Semiconductor mounting substrate and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor mounting substrate and manufacturing method thereof which has semiconductor mounting parts with out dirt and superior advantage in adhesion between the base and heat sink. SOLUTION: A base 2 of the semiconductor mounting substrate 21 has hole 5 at semiconductor mounting parts, and a heat sink 3 is bonded to a heat sink bonding plane of the base 2 through adhesives 4. The heat sink 3 has protrusions 22 having nearly equal sizes to that of the hole 5, and equal heights an steps 23 formed at the edges of the holes 5 on the heat sink bonding plane, so that the protrusions 22 about on the heads of the steps 23.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for mounting a semiconductor, and more particularly to a substrate for mounting a semiconductor characterized by a structure for joining a radiator and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a semiconductor mounting substrate for mounting an IC chip, an LSI chip or the like has been known.

As shown in FIGS. 9 and 10, a printed wiring board 72 constituting a semiconductor mounting board 71 of this type is used.
Has an opening 73 at a position to be a semiconductor mounting portion. A metal heat radiating plate 75 is joined to one side surface of the printed wiring board 72 via an adhesive 74 made of a thermosetting resin.

In manufacturing the semiconductor mounting substrate 71 as described above, the joining of the heat sink 75 is performed, for example, by the following method. The first method is B, which is very close to the C stage.
This is a method using a stage (semi-cured) film adhesive. In this method, the film adhesive is cut into a predetermined shape, and the cut adhesive is printed on the printed wiring board 72 and the heat sink 7.
And 5 between them. Then, by applying pressure and heating in this state, the adhesive is thermally cured, and the printed wiring board 72 and the heat radiating plate 75 are integrated.

[0005] A second method is a method by printing. In this method, after the ink-like adhesive is printed on the printed wiring board 72, a heat sink 75 is laminated on the printed wiring board 72. Then, by heating in this state, the printed wiring board 72 and the heat radiating plate 75 are integrated.

The third method is a method using a dispenser. In this method, after applying an ink-like adhesive in a predetermined shape using a dispenser, the printed wiring board 7 is applied.
The heat radiating plate 75 is laminated on 2. Then, by heating in this state, the printed wiring board 72 and the heat radiating plate 75 are integrated.

[0007]

However, the above prior art has the following problems. The first method using a semi-cured film adhesive is as follows: 1) The cured state is C
Adhesive strength is weak because it is close to the stage. 2) The film adhesive is expensive. 3) It is difficult to control the semi-cured state, so that the resin flow amount is not stable. FIG. 9 shows that the adhesive 74
Is excessively leaked out and the semiconductor mounting portion is dirty. Conversely, FIG. 10 shows a state in which voids 76 are formed in the adhesive 74 and the adhesion between the printed wiring board 72 and the heat sink 75 is deteriorated.

[0008] In the second method by printing, the applied temperature of the adhesive 74 tends to be unstable due to the influence of the outside air temperature. For this reason, it is difficult to control the flow amount of the adhesive 74, and it is not possible to obtain sufficient adhesion.

The third method using a dispenser requires a longer time than other methods, and thus is inferior in production efficiency. The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a semiconductor mounting substrate which is free from contamination of a semiconductor mounting portion and has excellent adhesion between a base material and a radiator. It is in.

Another object of the present invention is to provide a method capable of efficiently manufacturing the above-mentioned excellent semiconductor mounting substrate at low cost.

[0011]

According to the first aspect of the present invention, there is provided a semiconductor mounting substrate in which a radiator is bonded to a base material via an adhesive. The semiconductor mounting substrate is characterized in that a convex structure having a uniform thickness protrudes from the radiator and is arranged such that the head thereof is in contact with the radiator bonding surface of the base material. Make a summary.

According to the second aspect of the present invention, there is provided a semiconductor mounting substrate in which a radiator is bonded to a base material having an opening at a position to be a semiconductor mounting portion via an adhesive.
A projecting structure having a uniform height and a size substantially equal to the size of the opening is projected from the radiator, and a step is formed at the edge of the opening on the radiator joining surface side of the base material. And a semiconductor mounting substrate characterized by being arranged so that the head of the convex structure is brought into contact with the bottom surface of the same step by engaging the convex structure with the step. This is the gist.

According to the third aspect of the present invention, there is provided a semiconductor mounting substrate in which a radiator is bonded to a base material having an opening at a position to be a semiconductor mounting portion via an adhesive.
A plurality of convex structures having a uniform height are protruded from the heat radiator at a plurality of positions, and a plurality of fitting concave portions are formed around the opening on the heat radiator joining surface side of the base material. A semiconductor mounting substrate characterized in that the convex structure is fitted into the mating recess so that the head of the convex structure is arranged to abut against the bottom surface of the fitting recess. And

According to a fourth aspect of the present invention, in the second or third aspect, the step and the fitting recess are formed by etching a conductor layer on a side of the base member where the radiator is joined. It was assumed to be.

[0015] The invention according to claim 5 provides the invention according to claims 1 to 4.
The method of manufacturing a substrate for mounting a semiconductor according to any one of the above, wherein a step of forming the convex structure by printing a thermosetting resin on the radiator and thermally curing it. After performing the step of printing and applying the adhesive on the radiator bonding surface of the base material, performing the step of bonding the radiator to the base material via the adhesive to perform the radiator and the base. The gist of the present invention is a method of manufacturing a substrate for mounting a semiconductor, characterized by integrating materials.

Hereinafter, the "action" of the present invention will be described. According to the first aspect of the present invention, the convex structure having a uniform height protruding from the heat radiator is brought into contact with the base material by bringing its own head into contact with the heat radiator joint surface of the base material. The gap with the heat radiator is kept at a certain distance. Therefore, the adhesive does not flow out excessively, and the semiconductor mounting portion is prevented from being stained. Also, voids are not formed in the adhesive,
High adhesion between the base material and the radiator is ensured.

According to the second aspect of the present invention, the convex structure having a uniform height protruding from the heat radiator is provided by bringing its own head into contact with a step on the base material side. The gap between the heat sink and the heat sink is kept at a certain distance. Therefore, the adhesive does not flow out excessively, and the semiconductor mounting portion is prevented from being stained. Also, voids are not formed in the adhesive,
High adhesion between the base material and the radiator is ensured. In addition to the above, since the convex structure functions like a dam, it also prevents the adhesive from flowing out excessively to the semiconductor mounting portion. Furthermore, with this configuration, the convex structure can be engaged with the step formed on the heat radiator joint surface side, so that the positioning accuracy of the heat radiator with respect to the base material is increased, and the production efficiency is indirectly increased. improves.

According to the third aspect of the present invention, the plurality of convex structures having a uniform height protruding from the heat radiator abut their heads against the bottom surface of the fitting concave portion on the base material side. By letting
The gap between the base material and the radiator is kept at a certain distance. Therefore,
The adhesive does not flow out excessively, thereby preventing the semiconductor mounting portion from being stained. Further, voids are not formed in the adhesive, and high adhesion between the base material and the heat radiator is ensured. Furthermore, with this configuration, since each convex structure can be fitted into each fitting concave portion formed on the radiator joining surface side, the positioning accuracy of the radiator with respect to the base material is increased, and indirectly. The production efficiency is also improved.

According to the fourth aspect of the present invention, the step and the fitting concave portion can be formed at an accurate position in the base material by etching the conductor layer, so that the positioning accuracy of the radiator with respect to the base material is improved. Get higher. Of course, in this case, the steps and the depths of the fitting concave portions are also uniform.

According to the fifth aspect of the present invention, since the formation of the convex structure and the application of the adhesive are both performed by printing, it is not necessary to use an expensive film adhesive, and the semiconductor mounting substrate is not required. Cost is reduced. Also,
Since the work is completed in a shorter time than when a dispenser is used, a semiconductor mounting substrate can be efficiently produced. In addition, according to the method of the present invention for forming a convex structure, the flow rate can be easily controlled because the applied thickness of the adhesive does not become unstable.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION

[First Embodiment] FIGS. 1 and 2 show an embodiment of a semiconductor mounting substrate and a method of manufacturing the same according to the present invention.
This will be described in detail based on FIG.

The semiconductor mounting board 1 includes a printed wiring board 2 as a base material and a metal slag 3 as a heat radiator joined to the printed wiring board 2 via an epoxy adhesive 4. I have. The printed wiring board 2
It is a four-layer plate having a substantially square opening 5 at a position to be a semiconductor mounting portion. In the present embodiment, the printed wiring board 2
Is 50 mm x 50 mm and the size of aperture 5 is 13 mm
× 13 mm.

A large number of bonding pads 6 (so-called second pads) are provided on the upper surface of the pad forming step formed on the inner wall surface of the opening 5. These bonding pads 6 and the L
A bonding pad (not shown) (not shown) on the SI chip 7 is electrically connected via a bonding wire 8. Around the opening 5, a large number of plated through holes (not shown) are formed. In these plated through holes, I / O pins 10 as external connection terminals are fitted. Same I / O
One end of the pin 10 is in a state of protruding from the upper surface of the printed wiring board 2 (that is, the non-bonding surface of the radiator). Each of the bonding pads 6 and each of the I / O pins 10 are electrically connected by a wiring pattern 11 in an inner layer of the printed wiring board 2.

On the lower surface of the printed wiring board 2 (that is, the radiator bonding surface), a radiator bonding pattern 12 is formed so as to surround the opening 5. In the case of the present embodiment, the dimensions of the radiator bonding pattern 12 are 26 mm × 26 mm × 3.
It is set to 5 μm. The radiator bonding pattern 12 can be formed by, for example, etching a conductor layer that is an outer layer in the printed wiring board 2. The metal slag 3 is joined to the radiator joining pattern 12 by the solder 13.

In this embodiment, a square copper plate (2
4 mm × 24 mm × 1 mm) is used as the metal slag 3. In addition, other than such a copper plate, for example, using a high heat conductive metal plate made of phosphor bronze, Kovar, or the like,
A high heat conductive ceramic plate such as aluminum nitride or alumina may be used. The portion of the metal slag 3 exposed from the opening 5 is a semiconductor mounting portion for mounting an LSI chip 7 as a semiconductor. And the LSI chip 7 mounted here
Is entirely sealed with a sealing resin 14 in order to improve moisture resistance and the like.

Here, on one surface of the metal slag 3, at a position corresponding to the opening 5, an inner peripheral side frame 15 as a convex structure is protruded. The inner peripheral side frame 15 of the present embodiment has a size (13 mm × 1 mm) substantially equal to the size of the opening 5.
3 mm). Therefore, the inner peripheral side frame 15 is fitted to the opening 5. The inner frame 15 has a width of 0.8 mm and a uniform height of 100 μm. Here, the inner peripheral side frame 15 is formed by printing and thermosetting a thermosetting resin.

On one side of the metal slag 3, around the inner peripheral frame 15, the outer peripheral frame 1 as a convex structure having a uniform height and slightly larger than the size of the opening 5.
6 are protrudingly provided. The height of the outer peripheral side frame 16 is preferably 40 μm to 200 μm. In the present embodiment, this height is set to 60 μm. The dimensions of the outer peripheral frame 16 are 20 mm × 20 mm, and the width thereof is 0.8 mm. Here, similarly to the inner peripheral frame 15, the outer peripheral frame 1 is formed by printing and thermosetting a thermosetting resin.
6 is formed. The outer frame 16
Is arranged so as to abut the radiator bonding pattern 12 on the radiator bonding surface.

Next, an example of a procedure for manufacturing the semiconductor mounting substrate 1 will be introduced. First, the printed wiring board 2 is manufactured according to a conventionally known subtractive process. That is, copper foils are adhered to both surfaces of the inner layer substrate on which the inner layer wiring patterns 11 are formed in advance via prepregs. Then, the copper foil in such a laminate is etched to form the radiator bonding pattern 12 at a predetermined portion. Thereafter, steps such as drilling of the holes 5 and pin setting are performed.

Next, an inner peripheral frame 15 and an outer peripheral frame 16 are formed by printing a thermosetting resin on one side of the metal slag 3 and thermally curing it. The inner frame 15 and the outer frame 16 may be formed separately or simultaneously.

Next, a thermosetting epoxy-based adhesive 4 having a thickness of 150 μm is applied to the lower surface of the printed wiring board 2 in advance, and the inner peripheral side frame 15 is
And the adhesive 4 is thermally cured by heating. As a result, the metal slug 3 is temporarily fixed to the printed wiring board 2 by the adhesive force of the adhesive 4. At this time, the inner peripheral side frame 15 functions as a guide when positioning the metal slug 3 with respect to the printed wiring board 2 and
It also functions as a dam for preventing the adhesive 4 from flowing out to the semiconductor mounting portion. Further, the outer peripheral frame 16 having its head in contact with the heat dissipating body joining surface maintains the gap between the printed wiring board 2 and the metal slag 3 at a fixed distance so that the thickness of the adhesive 4 can be properly adjusted. Functions as a spacer for securing. The outer peripheral frame 16 also contributes to preventing the adhesive 4 from flowing out to some extent.

Thereafter, the metal slag 3 is completely fixed to the printed wiring board 2 by performing soldering on the outer peripheral portion of the metal slag 3. Next, the LSI chip 7
Is mounted on the semiconductor mounting portion, wire bonding is performed, and resin sealing with the sealing resin 14 is performed. As a result, a desired semiconductor mounting substrate 1 can be obtained.

Now, the characteristic effects of this embodiment will be enumerated. (A) In the present embodiment, the outer peripheral side frame 16 as a convex structure having a uniform height is projected from the metal slag 3 which is a heat radiator, and the head of the metal slag 3 is attached to the printed wiring board 2.
Are arranged so as to be in contact with the heat radiator joining surface.
For this reason, the head of the outer peripheral side frame 16 abuts on the radiator joining surface, so that the gap between the printed wiring board 2 and the metal slug 3 is maintained at a fixed distance. Accordingly, the adhesive 4 does not flow out excessively, and the contamination of the semiconductor mounting portion can be prevented. Further, voids are not formed in the adhesive 4, and the printed wiring board 2 and the metal slag 3
And high adhesiveness can be secured. According to the present embodiment for forming the outer frame 16, the adhesive 4
Since the thickness of the coating does not become unstable, the flow amount can be easily controlled as compared with the conventional method.

(B) In the present embodiment, the formation of the outer frame 16 and the inner frame 15 and the application of the adhesive 4 are both performed by printing. Therefore, it is not necessary to use an expensive film adhesive, and the cost of the semiconductor mounting substrate 1 can be reduced as compared with the related art. Further, in the case of the printing method, the work can be completed in a shorter time than in the case of using a dispenser, for example, so that the semiconductor mounting substrate 1 can be efficiently produced. [Second Embodiment] Next, a second embodiment will be described with reference to FIG.
The semiconductor mounting substrate 21 will be described. Here, differences from the first embodiment will be mainly described, and common points will be assigned the same member numbers only.

The semiconductor mounting substrate 21 is the same as that of the first embodiment.
An inner frame 22 slightly different from the inner frame 15 as in the case of (1) is projected as a convex structure. The inner peripheral side frame 22 has a uniform height and a size (13.5 mm × 13.5 mm) substantially equal to the size of the opening 5.
The inner peripheral frame 22 has a width of 0.8 mm and a uniform height of 60 μm. The inner peripheral frame 22 is formed by printing and thermosetting a thermosetting resin as in the first embodiment.

On the other hand, a step 23 (having a height of 35 μm in the present embodiment) with which the inner peripheral frame 22 can be engaged is entirely provided at the edge of the opening 5 on the heat radiator joining surface side of the printed wiring board 2. It is formed over the circumference. The inner peripheral frame 22 is arranged such that its head comes into contact with the bottom surface of the step 23. As a result, the printed wiring board 2 and the metal slag 3
Is maintained at a fixed distance.

Next, an example of a procedure for manufacturing the semiconductor mounting substrate 21 will be described. First, the printed wiring board 2 is manufactured according to a conventionally known subtractive process.
That is, copper foils are adhered to both surfaces of the inner layer substrate on which the inner layer wiring patterns 11 are formed in advance via prepregs. Then, the copper foil in such a laminate is etched to form the radiator bonding pattern 12 at a predetermined portion. At this time, the heat radiator bonding pattern 12
Is formed in a part of. Thereafter, steps such as drilling of the holes 5 and pin setting are performed.

Next, the inner peripheral frame 22 and the outer peripheral frame 16 are formed by printing a thermosetting resin on one surface of the metal slag 3 and thermally curing it. After performing such a printing process, the semiconductor mounting substrate 21 is manufactured according to the procedure of the first embodiment.

Now, the characteristic effects of this embodiment will be listed. (A) Since the semiconductor mounting substrate 21 of the present embodiment includes the outer peripheral side frame body 16 as in the first embodiment, it goes without saying that the effect (a) described in the first embodiment can be obtained. In particular, in the present embodiment, not only the outer peripheral frame 16 but also a suitable inner peripheral frame 22 is protruded, so that a synergistic effect can be expected in preventing contamination of the semiconductor mounting portion and ensuring adhesion. can do. That is, the inner frame 22 which is a convex structure acts like a dam, so to speak.
This is because the adhesive 4 is prevented from flowing out excessively to the semiconductor mounting portion.

(B) Further, according to the configuration of the present embodiment, the inner peripheral side frame 22 can be engaged with the step 23 formed on the radiator joining surface side. For this reason, the positioning accuracy of the metal slug 3 with respect to the printed wiring board 2 is increased, and the production efficiency is indirectly improved. Also, since the step 23 is formed by etching the conductor layer, the step 2
3 can be formed at an accurate position on the printed wiring board 2. This also contributes to the improvement of the positioning accuracy.

(C) In the present embodiment, the formation of the outer frame 16 and the inner frame 22 and the application of the adhesive 4 are both performed by printing. Therefore, it is not necessary to use an expensive film adhesive, and the cost of the semiconductor mounting substrate 21 can be reduced as compared with the conventional case. Also,
With the printing method, the work can be completed in a shorter time than in the case of using a dispenser, for example.
1 can be produced efficiently. Third Embodiment Next, a semiconductor mounting substrate 31 according to a third embodiment will be described with reference to FIGS. Here, the differences from the second embodiment will be mainly described, and the common points will only be assigned the same member numbers.

In the semiconductor mounting substrate 31, the shape of the convex structure around the inner peripheral frame 22 is greatly different. That is, a columnar projection 32 (having a height of 6 in this embodiment) near each corner on one side of the metal slag 3.
0 μm and a little less than 1 mm in diameter) are respectively protruded as convex structures. The four projections 32 are formed by printing and thermosetting a thermosetting resin.

On the other hand, at a position corresponding to each of the projections 32 on the heat radiator joining surface side of the printed wiring board 2, a fitting recess 33 having a circular cross section to which the projection 32 can be fitted (35 μm in depth in this embodiment). Are formed. These projections 32
It is arranged such that its own head comes into contact with the bottom surface of the fitting recess 33. As a result, the gap between the printed wiring board 2 and the metal slag 3 is maintained at a fixed distance.

Next, an example of a procedure for manufacturing the semiconductor mounting substrate 31 will be described. First, the printed wiring board 2 is manufactured according to a conventionally known subtractive process.
That is, copper foils are adhered to both surfaces of the inner layer substrate on which the inner layer wiring patterns 11 are formed in advance via prepregs. Then, the copper foil in such a laminate is etched to form the radiator bonding pattern 12 at a predetermined portion. At this time, the heat radiator bonding pattern 12
Is formed with a step 23 and a fitting concave portion 33 in a part thereof. Thereafter, steps such as drilling of the holes 5 and pin setting are performed.

Next, a thermosetting resin is printed on one surface of the metal slag 3 and is thermoset to form the inner peripheral frame 22 and the projections 32. After performing such a printing process, the semiconductor mounting substrate 31 is manufactured according to the procedure of the first embodiment.

(A) Semiconductor mounting substrate 31 of the present embodiment
Is provided with the suitable inner peripheral frame 22 described in the second embodiment. Therefore, contamination of the semiconductor mounting portion can be prevented, and the adhesion between the printed wiring board 2 and the metal slag 3 can be ensured. In addition, the semiconductor mounting substrate 31 includes a projection 32 which functions as a spacer and a positioning means. Therefore, a synergistic effect can be expected with respect to prevention of contamination of the semiconductor mounting portion and securing of adhesion.

(B) Further, according to the configuration of the present embodiment, not only can the inner peripheral frame 22 be engaged with the step 23, but also each projection 32 is fitted into each fitting recess 33. be able to. For this reason, the positioning accuracy of the metal slug 3 with respect to the printed wiring board 2 is increased, and the production efficiency is indirectly improved. In addition, since the steps 23 and the fitting recesses 33 are formed by etching the conductive layer, the steps 23 and 33 can be formed at accurate positions on the printed wiring board 2. This also contributes to the improvement of the positioning accuracy.

(C) In the present embodiment, the formation of the projections 32 and the inner peripheral side frame 22 and the application of the adhesive 4 are both performed by printing. Therefore, it is not necessary to use an expensive film adhesive, and the cost of the semiconductor mounting substrate 31 can be reduced as compared with the related art. In addition, in the case of the printing method, the work can be performed in a shorter time than in the case of using a dispenser, for example, so that the semiconductor mounting substrate 31 can be efficiently produced. In particular, in the present embodiment, since the heights of the inner peripheral frame 22 and the projections 32 are set to be equal, there is an advantage that both can be formed simultaneously by one printing.

The present invention can be modified, for example, as follows. (1) As in the semiconductor mounting substrate 41 of another example 1 shown in FIG. 6, the inner peripheral side frame may be omitted and only the outer peripheral side frame 16 may be protruded. Conversely, as in a semiconductor mounting substrate 51 of another example 2 shown in FIG. 7, the outer frame may be omitted and only the inner frame 22 may be protruded.

(2) In a semiconductor mounting substrate 61 of another example 3 shown in FIG. 8, solder balls 62 are arranged in advance on the entire outer peripheral portion of one surface of the metal slag 3, and are heated and melted in this state for printing. The wiring board 2 and the metal slag 3 are soldered. In this case, the solder balls 62
Are preferably uniform. According to such a method,
The gap between the printed wiring board 2 and the metal slug 3 is maintained at a fixed distance by the solder ball 62 acting as a spacer. Accordingly, the adhesive 4 does not flow out excessively, and the contamination of the semiconductor mounting portion can be prevented. Further, voids are not formed in the adhesive 4, and high adhesion between the printed wiring board 2 and the metal slag 3 can be secured.

(3) The convex structure shown in the embodiment (inner peripheral frames 15, 22, outer peripheral frame 16, projection 32)
May be formed by a method other than the printing method, for example, transfer.

(4) The resin material for forming the convex structure is not necessarily a thermosetting resin, but may be, for example, a photocurable resin. Further, the formation of the convex structure using a material other than the resin, for example, ceramics or metal, is also permitted.

(5) The inner peripheral frame 15 and the outer peripheral frame 16 are formed on the base material 2 side instead of the radiator 3 side, and the adhesive 4 is printed on the radiator 3 side instead of the base 2 side. It is also possible to apply.

Here, in addition to the technical ideas described in the claims, the technical ideas grasped by the above-described embodiments are listed below together with their effects. (1) The radiator joining surface of the base material according to claim 1 or 3, wherein a convex structure having a uniform height and a size substantially equal to the size of the opening is projected from the radiator. A step is formed at the edge of the opening on the side, and the convex structure is engaged with the step to arrange the head of the convex structure so as to contact the bottom surface of the step. A substrate for mounting a semiconductor, comprising: With this configuration, it is possible to further prevent contamination of the semiconductor mounting portion and improve adhesion due to a synergistic effect.

(2) A method of manufacturing a semiconductor mounting substrate in which a heat radiator is bonded to a base material having an opening at a position to be a semiconductor mounting portion via an adhesive, and has a uniform particle size. After arranging the solder balls on the outer peripheral surface of one side of the radiator and printing and applying the adhesive on the radiator joint surface of the base material, the radiator is attached to the base via the adhesive. A step of bonding the heat sink and the base material by performing a step of joining to the material, further curing the adhesive completely by heating and melting the solder balls, Production method. Even with this method, a semiconductor mounting substrate free from contamination of the semiconductor mounting portion and having excellent adhesion can be efficiently manufactured at low cost.

The technical terms used in this specification are defined as follows. "Thermosetting resin: a resin having a property of being cured by heating, for example, epoxy resin, phenol resin, melamine resin, polyester resin, silicone resin, xylene resin, etc."

[0056]

As described above in detail, according to the first to fourth aspects of the present invention, the semiconductor mounting portion is free from contamination of the semiconductor mounting portion and has excellent adhesion between the substrate and the heat radiator. Substrate can be provided.

In particular, according to the second and third aspects of the present invention, it is possible to improve the positioning accuracy of the radiator with respect to the base material. According to the invention described in claim 4, the positioning accuracy can be further improved.

According to the fifth aspect of the present invention, it is possible to provide a method capable of manufacturing the above-described excellent semiconductor mounting substrate efficiently at low cost.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a semiconductor mounting substrate according to a first embodiment.

FIG. 2 is an enlarged sectional view of a main part of the semiconductor mounting substrate.

FIG. 3 is an enlarged cross-sectional view of a main part of a semiconductor mounting substrate according to a second embodiment.

FIG. 4 is an exploded perspective view of a semiconductor mounting substrate according to a third embodiment.

FIG. 5 is an enlarged sectional view of a main part of the semiconductor mounting substrate.

FIG. 6 is an enlarged cross-sectional view of a main part of a semiconductor mounting substrate of another example 1;

FIG. 7 is an enlarged sectional view of a main part of a semiconductor mounting substrate according to another embodiment 2;

FIG. 8 is an enlarged cross-sectional view of a main part of a semiconductor mounting substrate of another example 3;

FIG. 9 is an enlarged sectional view of a main part of a conventional semiconductor mounting substrate.

FIG. 10 is an enlarged sectional view of a main part of a conventional semiconductor mounting substrate.

[Explanation of symbols]

1, 21, 31, 41, 51, 61: semiconductor mounting substrate, 2: printed wiring board as base material, 3: metal slag as heat radiator, 4: adhesive, 5: aperture, 15, 22
... inner peripheral side frame as a convex structure, 16 ... outer peripheral side frame as a convex structure, 23 ... step, 32 ... projection as a convex structure, 33 ... fitting concave part.

Claims (5)

[Claims] 1. A semiconductor mounting substrate in which a heat radiator is bonded to a base material via an adhesive, wherein a convex structure having a uniform height is protruded from the heat radiator, and its head is attached to the heat radiator. A substrate for mounting a semiconductor, wherein the substrate is arranged so as to be in contact with a radiator joining surface of the base material. 2. A semiconductor mounting substrate in which a heat radiator is bonded via an adhesive to a base material having an opening at a position to be a semiconductor mounting portion, wherein the height of the opening is uniform. A projecting structure having a size substantially equal to the size is projected from the radiator, and a step is formed at the edge of the opening on the radiator joining surface side of the base material, and the projecting structure is formed at the step. A semiconductor mounting substrate, wherein a head of a convex structure is brought into contact with a bottom surface of the step by engaging an object. 3. A semiconductor mounting substrate in which a heat radiator is bonded via an adhesive to a base material having an opening at a position to be a semiconductor mounting portion, wherein the convex structure having a uniform height is formed. A plurality of fitting recesses are formed at a plurality of locations in the heat radiator, and a plurality of fitting recesses are formed around the openings on the heat sink bonding surface side of the base material, and the convex structures are fitted into the fitting recesses. A semiconductor mounting board, wherein the head of the convex structure is arranged so as to contact the bottom of the fitting recess. 4. The method according to claim 2, wherein the step and the fitting recess are formed by etching a conductor layer on the heat radiator joining surface side of the base material. Semiconductor mounting substrate. 5. The method for manufacturing a semiconductor mounting substrate according to claim 1, wherein a thermosetting resin is printed on the radiator and the thermosetting resin is thermoset. After performing the step of forming the convex structure and the step of printing and applying the adhesive on the heat sink joining surface of the base material,
A method for manufacturing a substrate for mounting a semiconductor, wherein the step of bonding the heat radiator to the base material via the adhesive is performed to integrate the heat radiator and the base material.