JPH1051193A - Mounting apparatus for flectronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a mounting apparatus by which an electronic component with a bent lead is excluded as a defective component by a method wherein the posture of an electronic component is compared with the bend of a lead, whether the electronic component is defective or not is judged and only the electronic component which is judged to be a nondefective component is mounted. SOLUTION: The image of an electronic component 15 which is situated on a recognition carfare 22 is fetched by the recognition camera 22, the suction posture of the electronic component by using a suction nozzle 14 is judged, whether the electronic component 15 by a shape as viewed from the lower part is good or not is judged, and a camera result is transferred to a control part 32. The control part 32 feeds, to a disposal unit, the component 15 which is judged to be a defective component by an image processor 31. The electronic component 15 which is judged to be a nondefective component is moved onto a laser displacement meter 23 by using the suction nozzle 14, all leads 36 are irradiated sequentially with a laser beam by using the laser displacement meter 23, and, especially, the bend in the vertical direction, i.e., the height direction, of every lead 36 is detected by a detecting unit 30. Thereby, only the nondefective component can be mounted correctly on a circuit board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus, and more particularly to an electronic component mounting apparatus in which an electronic component having leads is held by a mount head, moved to a predetermined mounting position, and mounted. .

[0002]

2. Description of the Related Art As an automatic mounting apparatus, a mounting apparatus using an orthogonal robot is used. Such a mounting device moves a mount head to an arbitrary position by an X-axis moving rail and a Y-axis moving rail, and moves a component from a component supply tray or a component supply cassette by a suction nozzle attached to the mount head. And the components are mounted on a circuit board disposed at a predetermined position.

The components held by the mount head are recognized by an image recognition camera, and particularly, it is detected whether the leads of the components are bent.
Unbent components are mounted on a circuit board. On the other hand, if the lead is bent, it cannot be correctly connected by soldering, so that it is excluded as a defective component.

[0004]

However, in the lead measuring method used in the conventional automatic mounting apparatus, only the leading end of the lead of a component to be joined by solder is used as a measurement target portion. Accordingly, in a component such as a signal connector having a lead in only one direction on the component, if all the leads have a uniform bend, the component cannot be determined as a defective component despite a solder failure. There was a problem.

Further, in the case of a component having a bend in which the amount of bending of the lead of the component increases by a fixed amount, it cannot be determined whether the component is defective or the transport component itself is tilted. Therefore, there is a risk of determining a defective part as a non-defective part or a risk of determining a non-defective part as a defective part.

The present invention has been made in view of such a problem, and when all leads have a tentative bend, the lead is judged to be defective and the amount of bend of the lead is determined by a fixed amount. It is an object of the present invention to provide a mounting device for an electronic component that reliably eliminates an electronic component having an increasing bending.

[0007]

SUMMARY OF THE INVENTION The present invention relates to an electronic component mounting apparatus in which an electronic component having a lead is held by a mount head and moved to a predetermined mounting position for mounting. Detecting means for detecting bending of the electronic component, detecting means for detecting the attitude of the electronic component held by the mount head, detecting output of the detecting means for detecting bending of the lead, and detecting the attitude of the electronic component. A determination means for comparing the detection output of the detection means with the electronic component to determine the quality of the electronic component, wherein only the electronic component determined to be good by the determination means is mounted. The present invention relates to a component mounting device.

[0008] The detecting means for detecting the bending of the lead may detect the bending of the lead in a direction substantially perpendicular to the mounting surface.

The detecting means for detecting the bending of the lead sequentially detects corresponding positions of the plurality of leads,
The angle formed by a line connecting the corresponding positions of the plurality of leads with respect to a predetermined direction is determined, and the offset amount of the corresponding position of the lead shifted from the line connecting the corresponding positions of the plurality of leads is determined. May be detected.

[0010] The apparatus further comprises image recognizing means for retrieving an entire image from the lower surface of the electronic component held by the mount head. The quality of the electronic component may be determined based on the presence or absence of lead defects other than bending.

[0011]

FIG. 1 shows the overall structure of an electronic component mounting apparatus according to an embodiment of the present invention. This electronic component mounting apparatus comprises a pair of left and right Y-axis direction moving rails 11 and And an X-axis direction moving rail 12 that is moved in the Y-axis direction by the Y-axis direction moving rail 11. A mount head 13 is movable on the X-axis direction moving rail 12 in the X-axis direction. Supported.
The mount head 13 includes a suction nozzle 14, and the electronic component 15 is suction-held by the suction nozzle 14. The electronic component 15 held by the suction nozzle 14 is mounted at a mounting position on a circuit board 16 arranged at a predetermined position.

In order to supply the electronic components 15 sucked and held by the suction nozzle 14, a component supply tray 20 and a component supply cassette 21 are arranged at predetermined positions. A recognition camera 22 for recognizing the electronic component 15 sucked and held by the suction nozzle 14 of the mount head 13 is provided, and a laser displacement meter 23 is arranged on a side of the recognition camera 22. Further, a recognition camera 24 is arranged on the side of the laser displacement meter 23. The apparatus also has a disposal unit 25 for receiving defective parts.

As described above, the electronic component mounting apparatus according to the present embodiment has a component supply tray 2 for supplying components.
0 or the electronic component 15 supplied by the component supply cassette 21 is sucked and held by the suction nozzle 14 of the mount head 13 on the orthogonal robots 11 and 12 moving on the apparatus,
The electronic component 15 held by suction is recognized by the recognition camera 22. The bending of the lead 36 of the electronic component 15 is measured by the laser displacement meter 23 that measures the height of the lead 36 of the electronic component 15 held by the suction nozzle 14. When measuring the amount of bending of the lead 36, an image from the side of the electronic component 15 is captured using the recognition camera 24. Shape inspection by recognition camera 22 and laser displacement meter 23
Only the electronic component 15 determined to be non-defective in the bending inspection of the lead 36 by the camera 36 and the recognition camera 24 is mounted on the circuit board 16. On the other hand, components determined to be defective are disposed of in the disposal unit 25.

The detailed configuration of the inspection unit for the bending of the lead 36 of the electronic component 15 is shown in FIG. The recognition cameras 22 and 24 are both connected to the image processing device 31. On the other hand, the laser displacement meter 23 is
0 and emits a laser beam for distance measurement. The control unit 32 controls the entire mounting machine.

Next, the operation of detecting the electronic component 15 by the recognition cameras 22 and 24 and the laser displacement meter 23 will be described. The image of the electronic component 15 located on the recognition camera 22 is captured by the recognition camera 22, and the image processing device 31 determines whether the electronic component 15 is good or bad based on the suction posture of the electronic component 15 and the shape of the component viewed from below. The result of the determination is transferred to the control unit 32. The control unit 32 controls the mount head 13 so as to supply a component determined to be defective in the image processing apparatus 31 to the disposal unit 25.

The determination of the defect based on the image obtained by the recognition camera 22 is performed by determining whether the lead 36 of the electronic component 15 is bent not in the vertical direction but in the horizontal direction.
Determining whether one or more of the plurality of leads 36 are missing; determining whether there are longer leads in the plurality of leads 36 than in the plurality of leads 36; Also determines whether there is a short lead. The position of the mount head 13 is corrected in accordance with the position of the suction by the suction nozzle 14 based on the image captured by the recognition camera 22.

The electronic component 15 determined to be non-defective in the pass / fail judgment by the recognition camera 22 is moved from the position indicated by the dashed line to the position indicated by the solid line in FIG.
3 located at the top. That is, it is moved above the laser displacement meter 23 by the suction nozzle 14 so that the laser type displacement meter 23 shines light on the lead 36 of the electronic component 15.

At this position, all the leads 36 are sequentially irradiated with laser light by the laser displacement meter 23, and particularly, the bending of the leads 36 in the vertical direction, that is, the height direction is detected by the detection unit 30. Here, as shown in FIG. 4, the detection unit 30 sequentially detects the corresponding positions of the plurality of leads 36 and forms a line connecting the corresponding positions of the plurality of leads 36 in a predetermined direction, for example, a horizontal direction. The angle θ ₂ is determined. Further, the offset amount e of the corresponding position of the lead 36 which is shifted with respect to the line segment connecting the corresponding positions of the plurality of leads is detected, whereby the specific lead 36 is detected.
Is detected.

At this position, another recognition camera 2
4 recognizes an image of the edge of the package of the component 15 from the side, and captures such an image into the image processing device 31. By taking in the image of the electronic component 15 from the side, the inclination angle θ ₁ of the posture of the electronic component 15 held by suction is obtained as shown in FIG.

In this manner, a horizontal line and a line segment connecting the information on the inclination angle θ ₁ of the component obtained by the second recognition camera 24 and the corresponding position of the lead 36 obtained by the laser displacement meter 23 are formed. In comparison with the angle θ ₂ ,
The bending of the lead 36 is determined.

The determination of the bending is performed based on, for example, a flowchart shown in FIG. That is, first, each lead 36
Is determined, and it is determined whether or not the offset amount e of each lead is within an allowable range. And in the case of the allowable range, it performs an absolute value of whether tolerance determination theta ₁ and theta ₂ difference is determined to be nondefective when the allowable range.
On the other hand, if it is out of the allowable range, it is determined to be defective. The electronic component 15 determined to be non-defective is the circuit board 1
Although the electronic component 15 is mounted on the electronic component 6 and is determined to be defective, the electronic component 15 is reconfirmed as necessary, or is discarded by the discard unit 25.

As described above, the electronic component mounting apparatus according to the present embodiment detects the bending of the leads 36 of the electronic component 15 in the height direction and detects the bent electronic component 15.
Of the lead 36 is detected at the same time, whereby the bending of the lead 36 is increased such that the bending amount of the component whose direction of the lead 36 is one direction increases by a constant amount. This makes it possible to determine the bend.

Therefore, according to such an electronic component mounting apparatus, the vertical leads 3 of the electronic component 15 to be mounted are provided.
By detecting the vertical inclination of the suction posture of the electronic component 15 when the bending of the electronic component 15 is detected, the quality of the electronic component 15 can be determined even in the component 15 in which the lead 36 of the electronic component 15 is in only one direction. Thus, only such non-defective parts can be correctly mounted on the circuit board 16.

In general, in the case of a component 15 provided with leads 36 in a plurality of directions, it is possible to detect the bending of the leads 36 in comparison with leads in other directions. However, in a component in which the lead 36 exists only in one direction, the image of the reference lead to be targeted cannot be obtained by the lead in the other direction. Did not. However, according to the present embodiment, electronic component 15
By detecting the suction posture of the lead 36 by the recognition camera 24 and detecting the posture, particularly the inclination angle θ ₁ , it is possible to detect the bending of the lead 36 based on the inclination angle θ ₁ .

Next, another embodiment will be described with reference to FIG. In the above embodiment, the bending of the lead 36 of the electronic component 15 is detected using the laser displacement meter 23. However, the bending of the lead 36 may be performed by image recognition using a camera. Here, a recognition camera 37 for that purpose is used, and such a camera 37 is connected to the image processing device 31. That is, here, the laser displacement meter 23 and the inspection unit 30 are replaced with a recognition camera 37 and an image processing device 31.

Also in this case, the bending of the lead 36 in the vertical direction, that is, the height direction is correctly detected by the recognition camera 37, and the electronic component 15 is compared with the image of the electronic component 15 taken in by the recognition camera 24. Is more reliably determined.

FIG. 6 shows still another embodiment. Here, the second image recognition camera 24 is omitted, and the bending of the lead 36 is detected by the laser displacement meter 23 and the posture of the electronic component 15 is held by suction. The laser displacement meter 23 performs the above two operations sequentially.

As described above, in the electronic component mounting apparatus in which the second recognition camera 24 is omitted and the function is performed by the laser displacement meter 23, the height of the lower surface of the package of the electronic component 15 and the height of the leads 36 are also reduced. By comparing the height with the height, when all the leads 36 are uniformly bent upward or downward from the lower surface of the electronic component 15, it is easy to determine that the component is defective.

In all of the above embodiments,
Although the electronic component 15 in which the leads 36 are arranged only in one direction is targeted, the electronic component 15 to bend the lead 36 may be an electronic component having the leads 36 in a plurality of directions.

[0030]

According to the present invention, the detecting means for detecting the bending of the lead of the electronic component, the detecting means for detecting the attitude of the electronic component held by the mount head, and the detecting means for detecting the bending of the lead are provided. Determining means for comparing the output with the detection output of the detecting means for detecting the attitude of the electronic component, and determining whether the electronic component is good or bad. It was made.

Therefore, according to the present invention, it is prevented that the lead is determined to be bent by the posture of the component held by the mount head, and the lead is bent by the posture of the component even though the lead is bent. It is prevented from being determined that the component is not present, and it is possible to determine the quality of the component even when the component has only one lead.

According to the structure in which the detecting means for detecting the bending of the lead detects the bending of the lead in a direction substantially perpendicular to the mounting surface, the electronic component whose lead is bent in the direction perpendicular to the mounting surface can be reliably detected. Can be eliminated.

The detecting means for detecting the bending of the lead sequentially detects the corresponding positions of the plurality of leads, obtains the angle formed by a line connecting the corresponding positions of the plurality of leads with respect to a predetermined direction, and obtains a plurality of angles. According to the configuration that detects the offset amount of the corresponding position of the lead that is shifted from the line connecting the corresponding position of the lead, both the change in the attitude of the suction position and the deformation of the specific lead are detected. become able to.

[0034] The apparatus further comprises image recognizing means for retrieving the entire image from the lower surface of the electronic component held by the mount head. According to the configuration in which the quality of the electronic component is determined based on the presence or absence of the lead defect, it is possible to reliably eliminate in advance the electronic component having the lead defect other than the almost vertical deformation of the lead. Become.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing the overall configuration of an electronic component mounting device.

FIG. 2 is a block diagram showing a configuration for detecting lead bending.

FIG. 3 is a flowchart illustrating an operation of detecting a bend.

FIG. 4 is a side view of the component showing lead bending detection.

FIG. 5 is a block diagram showing a configuration for detecting lead bending according to another embodiment.

FIG. 6 is a block diagram showing a configuration of lead bending detection according to still another embodiment.

[Explanation of symbols]

11 ‥‥ Y-axis moving rail, 12 ‥‥ X-axis moving rail, 13 ‥‥ Mount head, 14 ‥‥ Suction nozzle,
15 ‥‥ electronic parts, 16 ‥‥ circuit board, 20 ‥‥ parts supply tray, 21 ‥‥ parts supply cassette, 22 ‥‥ recognition camera, 23 ‥‥ laser displacement meter, 24 ‥‥ recognition camera,
25 ‥‥ disposal unit, 30 ‥‥ inspection unit, 31 ‥
{Image processing device, 32} Control unit, 36} Lead, 3
7 ‥‥ Recognition camera

Claims (4)

[Claims] 1. An electronic component mounting apparatus in which an electronic component having a lead is held by a mount head, moved to a predetermined mounting position, and mounted, a detecting means for detecting a bending of the lead of the electronic component. A detection unit that detects a posture of the electronic component held by the mount head; and a detection output of a detection unit that detects bending of the lead and a detection output of a detection unit that detects a posture of the electronic component. A determination means for determining whether the electronic component is good or not, and mounting only the electronic component determined to be good by the determination means. 2. The electronic component mounting apparatus according to claim 1, wherein said detecting means for detecting the bending of the lead detects the bending of the lead in a direction substantially perpendicular to the mounting surface. 3. A detecting means for detecting the bending of the lead sequentially detects corresponding positions of a plurality of leads,
The angle formed by a line connecting the corresponding positions of the plurality of leads with respect to a predetermined direction is determined, and the offset amount of the corresponding position of the lead shifted from the line connecting the corresponding positions of the plurality of leads is determined. The electronic component mounting device according to claim 1, wherein the electronic component mounting device detects the electronic component. 4. An image recognizing means for capturing an entire image from the lower surface of the electronic component held by the mount head, wherein the image is substantially perpendicular to the lead from the entire image captured by the image recognizing means. The electronic component mounting apparatus according to claim 1, wherein the quality of the electronic component is determined based on the presence or absence of a lead defect other than the bending of the direction.