JPH10290102A - Dielectric resonator device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the peeling or damage of joint part by relaxing thermal stress, which is generated by the linear expansion difference of ground plate and dielectric resonator and operated in orthogonal biaxial direction, by providing a distortion plastic deforming part in curved shape at the part of ground plate, where a load is applied, and providing a hole at the part where that distortion plastic deforming part crosses. SOLUTION: On a ground plate 20, a distortion plastic deforming part 30a and a distortion plastic deforming part 30b are formed so as to cross. Along with the outer peripheral part of ground plate 20, plural notched parts 40 for soldering are provided and at a crossing part 30 of distortion plastic deforming parts, a hole 30c is provided. When operating the thermal stress upon the ground plate 20 and a dielectric resonator 10 because of a temperature change, the hole 30c at the crossing part 30 of distortion plastic deforming parts 30a and 30b facilitates the elongating/ contracting deformation of distortion plastic deforming parts 30a and 30b on the ground plate 20 and simultaneously relaxes the thermal stress operated in the orthogonal biaxial direction. Therefore, no load is applied to the ground plate 20 and the dielectric resonator 10, and the peeling in the joint part for brazing such as soldering or the damage of dielectric resonator is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric resonator device in which a ground plate is joined by brazing.

[0002]

2. Description of the Related Art A dielectric resonator device A shown in FIG.
It is. This is because a plurality of dielectric resonators 3, 4, etc., which are arranged in a metal case 7 with a certain distance therebetween, are connected to a ground plate 5.
Are electrically connected to each other to form a multi-stage structure.

[0003] The dielectric resonators 3, 4, etc. are each formed by disposing one internal dielectric 2 in a cavity case 1 having conductivity. The cavity case 1 is formed by applying and baking a silver paste on the outer surface of a rectangular cylindrical ceramic body that is opened at the front and back, thereby forming a conductive film serving as an actual current path. The internal dielectric 2 is formed of a dielectric ceramic having a high dielectric constant such as a titanium oxide-based material, and has an upper end and a lower end fixed to the inner wall surface of the cavity case 1.

The earth plate 5 connects the dielectric resonators 3, 4 and the like, and is formed of a thin metal plate having elasticity. It is provided over the entire width. When a load is applied to the ground plate 5, the flexible plastic deformation portion 6 is easily elastically deformed, so that the load is reduced.

[0005] Such a dielectric resonator device A is configured so as to obtain desired resonator characteristics by generating magnetic field coupling between adjacent dielectric resonators 3, 4, and the like.

[0006]

However, the ground plate of the conventional dielectric resonator device has the following problems.

That is, when the dielectric resonators 3, 4 and the like are arranged in one line, the bending plastic deformation portion 6 can be easily elastically deformed to reduce the load. The plastically deformed portions crossed, and the load could not be reduced at the crossing portions.

Also, when the earth case is soldered to the dielectric resonator 10 having the window 15 in a part of the cavity case 50 as shown in FIG. Thermal stress is generated due to a difference in linear expansion between the cavity case 50 made of ceramics and the earth plate made of metal, and the solder joints and the corners 5 of the dielectric resonator 10 are generated.
There was a problem that a load was applied to 0a and it was damaged. Therefore, as a method of alleviating the load, when a ground plate 20 provided with a buffer portion by a flexural plastic deformation portion as in the related art is attached, the result is as shown in FIG. However, as in the case where the dielectric resonators are arranged in a plurality of rows, the buffering property is impaired even at the intersecting portion 30 of the bending plastic deformation portion, and the soldering portion provided with the soldering notch 40 is provided. Load. That is, the prior art is not effective against thermal stress simultaneously acting in two orthogonal directions.

Therefore, in the present invention, thermal stress acting in two orthogonal directions generated by a linear expansion difference between the earth plate and the dielectric resonator joined to the dielectric resonator is relaxed, and solder or the like is brazed. An object of the present invention is to provide a dielectric resonator device having a structure for preventing peeling of a joint portion and damage of a dielectric resonator.

[0010]

The dielectric resonator device according to the present invention is a dielectric resonator device in which a ground plate is brazed to a dielectric resonator having a dielectric column disposed in a conductive case. The ground plate is provided with a bent plastically deformable portion in a portion where a load is applied, and a hole is provided in a portion where the bent plastically deformable portion intersects.

A dielectric resonator device having a ground plate for brazing and joining dielectric resonators each having a dielectric column disposed in a conductive case to each other, wherein the ground plate has a curved shape. A bending plastic deformation portion is provided, and a hole is provided at a portion where the bending plastic deformation portion intersects.

Further, the conductive case has an opening, and a plurality of dielectric resonators are arranged so that the opening of the conductive case is on the same plane. An earth plate provided with a hole at a portion where the flexible plastic deformation portions intersect is brazed to cover the opening.

Thus, the thermal stress acting in two orthogonal directions generated by the difference in linear expansion between the ground plate and the resonator joined to the resonator can be reduced.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A dielectric resonator according to the present invention will be described below with reference to the drawings. The same parts as those in the related art are denoted by the same reference numerals, and detailed description is omitted.

FIG. 1 shows a first embodiment,
FIG. 2 is a partially enlarged view of a dielectric resonator 10 having a cavity case 50 and an earth plate 20 soldered to the dielectric resonator 10. The ground plastic plate 20 is formed so that a bending plastic deformation portion 30a and a bending plastic deformation portion 30b intersect. A plurality of notches 40 for soldering are provided along the outer peripheral portion of the ground plate 20. As shown in FIG. 1, a hole 30c is provided in a portion 30 where the bending plastic deformation portion intersects. When a thermal stress acts on the ground plate 20 and the dielectric resonator 10 due to a temperature change, the hole 30c of the intersection portion 30 of the flexible plastic deformation portions 30a and 30b causes the flexible plastic deformation portions 30a and 30b of the ground plate 20 to expand and contract. In this case, thermal stresses acting in two orthogonal directions are alleviated simultaneously. Therefore, the earth plate 20
Also, no load is applied to the dielectric resonator 10.

Next, a second embodiment of the present invention will be described with reference to FIG. In FIG. 2, the dielectric resonator 11
Are connected side by side, and the adjacent dielectric resonators 11 are bent to form an earth plate 2 having plastic deformation portions 30e and 30f.
1 and soldered. Bending plastic deformation part 30
e and 30f are formed so as to correspond between the dielectric resonators 11, and a hole 30d is formed at the intersection. For example, when the distance between the dielectric resonators 11 is widened due to a positional shift when each of the dielectric resonators 11 is incorporated in a metal case or due to thermal expansion due to a temperature change, the curved shape is changed. Bending plastic deformation portion 30e having
The extension 30f absorbs the load applied to the dielectric resonator 11, and prevents the occurrence of breakage in the soldered portion between the ground plate 21 and the surface of the cavity case 50. Conversely, even when the distance between the dielectric resonators 11 is reduced, the bent plastically deformed portions 30e and 30f having a curved shape are narrowed to absorb the load. Prevents the occurrence of breakage in the soldered portion with the surface. Further, when the space between the dielectric resonators 11 expands and contracts, the hole 30 provided at the intersection of the bending plastic deformation portions 30e and 30f is formed.
d promotes the relaxation of the load.

FIG. 3 shows a third embodiment of the present invention, in which the dielectric resonator 11 and the earth plate 31 are viewed from above.

An earth plate 31 is soldered to the plurality of dielectric resonators 11. The plastically deformed portions 30a and 30b of the ground plate 31 intersect on one dielectric resonator 11, and a hole 30c is formed at the intersection. Also,
The flexible plastic deformation portions 30e and 30f of the ground plate 31 intersect between the dielectric resonators 11, and a hole 30d is formed at the intersection. Further, the bending plastic deformation portion 30
a, 30f and the flexural plastic deformation portions 30b, 3b
A hole 30d is also formed at the intersection of 0e. The thermal stress of the entire dielectric resonator device can be reduced by the holes and the flexural plastic deformation portions provided in this manner.

FIG. 4 shows a modification of FIG. 3, in which the dielectric resonator 11 and the earth plate 41 are viewed from above. FIG.
, The earth plate 41 has one dielectric resonator 11
Flexible plastic deformation portions 30a and 30b that cross each other are formed, and a hole 30c is formed at the crossing portion. The ground plate 41 is formed with plastically deformed portions 30e and 30f which are bent so as to surround the respective dielectric resonators 11, and a hole 30d is formed at the intersection thereof. In this example, stress is more effectively relieved at a portion where thermal stress is applied between the dielectric resonators 11 than in the above-described embodiment. At this time, the bending plastic deformation portions 30e and 30f are formed so as not to intersect with the bending plastic deformation portions 30a and 30b.

[0020]

According to the present invention, the thermal stress acting in two orthogonal directions generated by the linear expansion difference between the earth plate brazed to the dielectric resonator and the cavity case of the resonator is deformed by plastic deformation. Can be mitigated by the intersection of the parts.

Therefore, it is possible to prevent a large load from being applied to the soldered portion between the ground plate and the surface of the cavity case, thereby preventing the ground portion from being damaged.

[Brief description of the drawings]

FIG. 1 is an enlarged detailed view showing a dielectric resonator and a ground plate according to a first embodiment of the present invention.

FIG. 2 is a partial cutaway view showing a dielectric resonator and an earth plate according to a second embodiment of the present invention.

FIG. 3 is a top view of a dielectric resonator and a ground plate according to a third embodiment of the present invention.

FIG. 4 is a top view of a dielectric resonator and a ground plate according to a fourth embodiment of the present invention.

FIG. 5 is a partial perspective view showing a conventional dielectric resonator device.

FIG. 6 is a perspective view showing a conventional dielectric resonator.

FIG. 7 is an enlarged detailed view showing a conventional dielectric resonator and a ground plate.

[Brief description of reference numerals]

 Reference Signs List A dielectric resonator device 1 cavity case 2 internal dielectric 3, 4 dielectric resonator 5 ground plate 6 flexible plastic deformation part 7 metal case 10, 11 dielectric resonator 15 window 20, 21, 31, 41 ground plate 25 Opening portion 30 Intersection of flexible plastic deformation portions 30a, 30b, 30e, 30f Flexible plastic deformation portion 30c, 30d Hole 40 Notch 50 Cavity case 50a Corner portion

Claims (3)

[Claims] 1. A dielectric resonator device comprising a dielectric resonator having a dielectric column disposed in a conductive case and a ground plate joined to a dielectric resonator by brazing, wherein the ground plate is curved at a portion to which a load is applied. A dielectric resonator device comprising: a deformable plastic deformation portion having a shape; and a hole provided at a portion where the deformable plastic deformation portion intersects. 2. A dielectric resonator device having an earth plate for brazing and joining dielectric resonators each having a dielectric column disposed in a conductive case to each other, wherein the earth plate has a curved shape. A dielectric resonator device having a flexural plastic deformation portion, wherein a hole is provided at a portion where the flexural plastic deformation portion intersects. 3. The conductive case has an opening,
A plurality of dielectric resonators are arranged so that the opening of the conductive case is on the same plane, and a ground plate having a hole at a portion where a plurality of curved plastically deforming portions intersect is formed by the opening. The dielectric resonator device according to claim 1, wherein the dielectric resonator device is brazed to cover the dielectric resonator.