JPH10270495A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device which can solve a problem of the need for re-manufacturing a printed circuit board as an external circuit due to changes in the order or position of outer leads caused by a change in the order position of bump electrodes in a DRAM chip in a memory module using a tape automated bonding(TAB) technique, and which can share the external circuit. SOLUTION: Even when the array order of bump electrodes of a semiconductor chip 1 is changed to 3a, 3c, 3b and 3d for the order 5a, 5b, 5c and 5d of outer leads corresponding to the order 6a, 6b, 6c and 6d of terminals in an external circuit, that is, when the bump electrodes 3b and 3c are changed in order; the inner lead 4b is extended as to bypass the inner lead 4c within an opening 2a of a base film, pass between the inner leads 4a and 4c and reach the outer lead 5b. Thereby the need for a design change of the external circuit such as a printed circuit board can be eliminated and thus the external circuit can be shared.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device such as a memory module or a multi-chip module in which a semiconductor chip such as a DRAM or a flash memory is mounted using a tape carrier.

[0002]

2. Description of the Related Art In recent years, semiconductor chips such as DRAMs and flash memories are stacked and mounted using a tape carrier in response to a growing demand for large capacity of memory modules and PC cards for personal computers and portable information devices. As a result, a TAB mounting type memory module and a PC card realizing a small size and a large capacity have been put to practical use.

[0003] A DRAM chip mounting structure in a memory module using a conventional TAB mounting method will be described below.

[0004] FIG. 3 shows a DRA using a conventional TAB mounting method.
It is a top view of the mounting part for one chip of M.

[0005] In the conventional DRAM mounting by TAB mounting method, Cu openings are formed in openings 2a and 2b of base film 2 made of polyimide resin, glass epoxy resin or the like.
Leads 14a, 14b, 14c, which are conductor wirings obtained by plating Sn, Au, solder, or the like on the surface of Cu or Cu alloy.
14d is projected, and the protruding electrodes 13a, 13b, 13 of the semiconductor chip made of the inner lead and Au, solder, etc.
c and 13d are joined by thermocompression bonding, and then the joint is sealed with epoxy resin. After further electrical inspection,
The outer leads 15a, 15b,
Portions 15c and 15d are connected to bonding terminal portions 6a, 6b, 6c and 6d of an external circuit such as a printed circuit board.

[0006]

However, in the above-mentioned conventional structure of the DRAM mounting part, the bump electrode arrangements 13a, 13b, 13b, 13b, 13b, and 13b of the DRAM chip are changed due to different manufacturers of the DRAM chip and different versions of the DRAM chip.
When the order and position of 13c and 13d are changed, the order of the inner leads 14a, 14b, 14c and 14d and the outer leads 15a, 15b, 15c and 15d must be changed in the same manner. However, since the order of the bonding terminals 6a, 6b, 6c, 6d must be changed, there is a problem that the components cannot be shared due to a change in the printed circuit board.

The present invention solves such a conventional problem,
Uses a tape carrier that can be shared without changing external circuits such as printed circuit boards even if the order or position of the bump electrode arrangement on the DRAM chip changes due to a different DRAM chip manufacturer or a different DRAM chip version. It is intended to provide a semiconductor device on which a DRAM chip is mounted.

[0008]

In order to solve this problem, a semiconductor device according to the present invention has a semiconductor chip having a protruding electrode formed thereon and a tape carrier, and a base film of the tape carrier connected to the protruding electrode. An inner lead extended into the opening is connected to the protruding electrode of the semiconductor chip while bypassing another inner lead in the opening of the base film.

According to this configuration, even if the order or position of the protruding electrodes of the DRAM chip is changed, the order or position of the outer leads does not change, so that there is no need to recreate an external circuit such as a printed circuit board and to share parts. Thus, a semiconductor device which can be manufactured can be obtained.

[0010]

DETAILED DESCRIPTION OF THE INVENTION The invention according to claim 1 of the present invention comprises a semiconductor chip having a protruding electrode and a tape carrier, and extends into an opening of a base film of the tape carrier connected to the protruding electrode. The inner leads are connected to the protruding electrodes of the semiconductor chip by bypassing the other inner leads in the opening of the base film. Even if the order or position of the protruding electrodes on the DRAM chip changes due to a change in the version of the device, the order and position of the outer leads do not change, so there is no need to recreate external circuits such as printed circuit boards and components can be shared. This has the effect that it becomes possible.

According to a second aspect of the present invention, there is provided an inner lead having a semiconductor chip on which a protruding electrode is formed and a tape carrier, the inner lead extending into an opening of a base film of the tape carrier connected to the protruding electrode. However, since it has a configuration in which it is not connected to the protruding electrode and straddles the opening of the base film, the manufacturer of the DRAM chip differs or the version of the DRAM chip changes, so that D
Even if the order and position of the protruding electrode arrangement on the RAM chip are changed so that the inner lead cannot bypass other inner leads inside the opening of the base film, detour by wiring on the base film is possible so,
Since there is no change in the order or position of the outer leads, there is no need to recreate an external circuit such as a printed circuit board, and an effect is achieved that components can be shared.

According to a third aspect of the present invention, in the second aspect of the present invention, since a part of the inner lead straddling the opening of the base film has a configuration having a curved portion, the projecting electrode is provided. It has an effect of absorbing thermal and mechanical stress due to lead deformation at the time of thermocompression bonding by a bonding tool when connecting the inner lead and the inner lead, thereby preventing the inner lead from breaking or cracking.

An embodiment of the present invention will be described below with reference to FIGS. (First Embodiment) FIG. 1 is a plan view of a DRAM mounting portion of a semiconductor device according to a first embodiment of the present invention. FIG.
Reference numerals 3a, 3b, 3c, and 3d denote projecting electrodes formed on the surface of the semiconductor chip 1 and made of Au, solder, conductive resin, indium alloy, or the like. 4a, 4b, 4c, 4
d, 5a, 5b, 5c and 5d are tape carrier Cu,
Conductive wiring made of Cu alloy or the like, with Au, S
n, plated with solder or the like. 4a-4d
Are inner lead portions connected to the protruding electrodes 3a to 3d of the semiconductor chip 1 by thermocompression bonding or the like, and 5a to 5d are outer lead portions connected to an external circuit. Reference numeral 2 denotes a base film of a tape carrier made of polyimide, glass epoxy, polyester, or the like. It is an opening.

Hereinafter, the structure of the present invention will be described along the manufacturing process. In FIG. 1, the base film 2 at the portions of the inner leads 3a to 3d and the outer leads 5a to 5d of the tape carrier is previously opened by a mold or the like, and a conductor such as a copper foil as a source of conductor wiring is formed on the base film. Glue. The thickness of the conductor is about 18 to 35 microns.

Thereafter, the conductor is processed into a required pattern shape by photo-etching or the like. At this time, the inner leads 4a to 4d in the openings 2a and 2b of the base film are formed.
The pattern shape is made to correspond to the arrangement of the protruding electrodes of the semiconductor chip. For example, terminal arrangements 6a, 6 of the external circuit
b, 6c, 6d, the order of the outer leads 5a,
In the case where the arrangement of the protruding electrodes of the semiconductor chip 1 with respect to 5b, 5c, and 5d is in the order in which 3b and 3c are interchanged as in 3a, 3c, 3b, and 3d, the inner leads 4b are connected to the inner leads 4c by opening the base film. The shape is such that it is detoured in the portion 2a and is led out to the outer lead 5b through the space between the inner leads 4a and 4c.

Next, after the surface of the conductor is plated with Au, Sn, solder or the like, the bump electrodes 3a to 3a on the semiconductor chip 1 are plated.
d and the positions of the inner leads 4a to 4d are aligned and connected by thermocompression bonding using a bonding tool.

When the connection of the semiconductor chip is completed, an electrical inspection is performed. Thereafter, the outer lead portion is cut to a required length by a mold or the like, and the outer leads 5a, 5b, 5c, and 5 are cut.
In part d, bonding terminal portions 6a, 6b,
6c and 6d are connected by soldering or the like, and the mounting is completed.

As described above, according to the first embodiment, the inner lead 4b bypasses the inner lead 4c within the opening 2a of the base film.
4c, the outer leads 5b are led out to the outer leads 5b, so that the order and positions of the outer leads 5a to 5d and the bonding terminal portions 6a to 6d of the external circuit can be the same. Even if the order or position of the protruding electrode arrangement changes, the order and position of the outer leads do not change, so that there is no need to recreate an external circuit such as a printed circuit board, and the effect that components can be shared can be obtained. Things.

(Embodiment 2) FIG. 2 is a plan view of a DRAM mounting portion of a semiconductor device according to a second embodiment of the present invention. FIG. 2 shows terminal arrangements 6a, 6b, 6 of the external circuit.
Outer lead order 5a, 5b, corresponding to c, 6d
The arrangement of the protruding electrodes of the semiconductor chip 1 is 3 with respect to 5c and 5d.
As shown in a, 3c, 3d, and 3b, the pattern shape is shown in the case where 3b is replaced by a distance of 2 to 3 mm or more, which is the limit of the extension distance of the inner lead. In FIG. 2, the inner lead 4b is formed so as to pass over the central base film, bypass the inner leads 4c and 4d, pass between the inner leads 4a and 4c, and be led out to the outer leads 5b. The order and position of the leads 5a to 5d and the bonding terminal portions 6a to 6d of the external circuit can be the same.

As described above, according to the second embodiment, since the order and position of the outer leads do not change even if the order or position of the protruding electrodes on the semiconductor chip 1 changes, external circuits such as a printed circuit board are not changed. It is possible to obtain the effect that the components can be shared without having to re-create the components.

Further, in this case, the inner lead 4b has a shape crossing the opening 2a of the base film between the inner leads 4a and 4c, but a curved portion 4b 'such as a ring portion or a curved portion is provided in the middle. Therefore, there is an effect that the curved portion 4b 'can absorb mechanical stress and thermal stress such as pulling of the lead caused by fixing both ends of the lead during thermocompression bonding by a bonding tool. It is obtained.

In this embodiment, an example has been described in which the base film in the portions of the outer leads 5a to 5d is open. However, there is no opening in the base film in place of the outer leads. Also in a so-called CSP or BGA package using tape carriers arranged in a shape, the effects of sharing components and absorbing stress can be obtained.

[0023]

As described above, in the semiconductor device according to the present invention, the manufacturer of the DRAM chip to be mounted on the TAB is different or the version of the DRAM chip is changed.
Even if the order and position of the projection electrodes on the RAM chip are changed, the order and position of the outer leads do not change, so that there is no need to recreate an external circuit such as a printed circuit board, and the components can be shared. The effect is obtained.

[Brief description of the drawings]

FIG. 1 is a plan view of a DRAM mounting portion of a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a plan view of a DRAM mounting part of a semiconductor device according to a second embodiment of the present invention;

FIG. 3 is a plan view of a DRAM mounting unit using a conventional TAB mounting method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Semiconductor chip 2 Base film of tape carrier 2a, 2b Opening of base film of tape carrier 3a-3d Projecting electrode of semiconductor chip 4a-4d Inner lead part of conductor wiring of tape carrier 4b 'Inner lead of conductor wiring of tape carrier 5a-5d Outer lead part of conductor wiring of tape carrier 6a-6d Bonding terminal part of external circuit

Claims (3)

[Claims] 1. A tape carrier having a semiconductor chip on which a protruding electrode is formed and an inner lead extending into an opening of a base film of the tape carrier connected to the protruding electrode, wherein an inner lead extends inside the opening of the base film. A semiconductor device configured to bypass the inner leads and to be connected to the protruding electrodes of the semiconductor chip. 2. A semiconductor chip having a projecting electrode formed thereon and a tape carrier, wherein an inner lead extending into an opening of a base film of the tape carrier connected to the projecting electrode is not connected to the projecting electrode. A semiconductor device having a configuration that straddles an opening of a base film. 3. The semiconductor device according to claim 2, wherein a part of the inner lead straddling the opening of the base film has a curved portion.