JPH10253654A - Acceleration sensor packaging structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the cost for packaging an acceleration sensor by mounting and fixing adhesively the sensor to a bulking pattern formed such that a position of the sensor except for the inertia part abuts against the mounting position is packaging the acceleration sensor. SOLUTION: An acceleration sensor is packaged and fixed to a ceramic substrate 15 with an adhesive bond on a bulking pattern 20 of the ceramic substrate 15. When the acceleration is applied to the sensor 10 by an impact or the like in the direction G, the inertia part 11 is moved in the opposite direction to G. Since the resistance value of the sensor 10 is varied by the movement, the variation amount is taken out to be converted to the acceleration. The sensor 10 is packaged on the pattern 20 and the inertia part 11 is bulked from the packaging surface of the substrate 15 so that the inertia part 11 can be moved in both directions and the acceleration of the sensor 10 from both direction can be measured. Also, since the pattern 20 blocks the bond 18 from flowing into a slit 12, the inertia part 11 is fixed by the bond 18 to prevent troubles of defective operation. Thus, the bulking parts are not needed to reduce the cost for packaging.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a mounting structure of an acceleration sensor mounted on an electronic circuit board of a safety device such as an automobile.

[0002]

2. Description of the Related Art A mounting structure of an acceleration sensor mounted on an electronic circuit board (hereinafter, referred to as a board) such as a safety device of an automobile will be described with reference to FIG. FIG. 10 is a sectional view showing a mounting structure of a conventional acceleration sensor. An acceleration sensor 80 has a rectangular cube shape, and has a key-shaped slit 82 penetrating in the thickness direction from the outer periphery toward the center, thereby forming an inertia portion 81 that is elastically supported. When acceleration is applied to the acceleration sensor 80, the inertia unit 81 moves in a direction opposite to the direction in which the acceleration is applied. When the inertia portion 81 moves, the resistance value of the acceleration sensor 80 changes according to the amount of movement (the magnitude of the distortion due to the movement). The changed resistance value is converted into a take-out acceleration from a terminal portion (not shown). Let it.

An acceleration sensor 80 is used so that an inertia portion 81 acts in a direction in which acceleration is to be detected.
In the normal state, the upper and lower surfaces of the inertia portion 81 and the upper and lower surfaces of the holding portion (outer peripheral portion) of the inertia portion 81 are flush with each other.
When mounted directly on the ceramic substrate 89, the lower surface of the inertial portion 81 comes into close contact with the surface of the ceramic substrate 89, and the inertial portion 81 cannot move in the direction of the ceramic substrate 89. The outer lower surface 83 needs to be raised.

[0004] 90 is a raised part of the acceleration sensor 80,
The inertia portion 81 of the acceleration sensor 80 has a rectangular cube shape.
Are formed. Glass or the like is used as the material. The raised component 90 is bonded to the outer peripheral lower surface 83 of the acceleration sensor 80, and the acceleration sensor 80 is bonded to the ceramic substrate 89 via the raised component 90.
It is adhered by.

The ceramic substrate 89 has a circuit pattern 55 of a conductor, a resistor and the like formed on a ceramic plate by thick-film printing, and electronic components and the like are mounted thereon. Next, the operation will be described. When acceleration is applied to the acceleration sensor 80 mounted on the ceramic substrate 89 in the direction of arrow F due to impact or the like, the inertia portion 81 moves in the direction opposite to the direction of arrow F. And
Since the resistance value of the acceleration sensor 80 changes according to the movement amount of the inertia part 81, the change amount of the resistance value is extracted and converted into acceleration.

[0006]

However, in the above-described acceleration sensor mounting structure 80, the inertia portion 8 of the acceleration sensor 80 is used.
There is a problem that it is expensive in price because the raised part 90 made of glass with a concave portion is used so that the lower part of the inertia part 81 does not contact the surface of the ceramic substrate 89 when the element 1 moves in the vertical direction.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problem, and an object of the present invention is to provide a highly reliable mounting structure of an acceleration sensor which has a low cost for mounting the acceleration sensor.

[0008]

SUMMARY OF THE INVENTION The present invention attains the above-mentioned object, and comprises an acceleration sensor for detecting acceleration by movement of an elastically supported inertial portion, and a moving direction of the inertial portion, the direction of movement of the surface of the electronic circuit board. In the mounting structure of the acceleration sensor mounted so as to be perpendicular to the mounting pattern, a lift pattern formed so that a part other than an inertia part of the acceleration sensor abuts on the mounting position, and an outer portion of the lift pattern is applied. Wherein the acceleration sensor is mounted on the pattern for raising and is fixed by the adhesive bond.

[0009] Further, the present invention is characterized in that a glass member is melt-stacked on the raising pattern to form a rising portion of the acceleration sensor. Further, a glass member is welded to the mounting position to form a bulky portion of the acceleration sensor. Further, a solder resist member is printed on the raising pattern to form a rising portion of the acceleration sensor.

In other words, the acceleration sensor for detecting the acceleration by the movement of the elastically supported inertia portion is provided with the acceleration sensor so that the direction of movement of the inertia portion is perpendicular to the surface of the electronic circuit board. In the mounting structure of the acceleration sensor to be mounted on, the double-sided adhesive tape for raising formed so as to be adhered to a portion other than the inertia part of the acceleration sensor is attached to the mounting position, and the acceleration sensor is mounted on the double-sided adhesive tape. It is characterized by doing so.

Further, an ultraviolet curable resin film is attached to the mounting position, and only the raised portion is irradiated with ultraviolet light to form the raised portion.
Further, an ultraviolet curing resin member is printed on the mounting position, and the printed portion is irradiated with ultraviolet rays to form a raised portion. Further, in the mounting structure of the acceleration sensor, wherein an acceleration sensor for detecting acceleration by movement of the elastically supported inertia part is mounted so that the direction of movement of the inertia part is perpendicular to the surface of the electronic circuit board, The acceleration sensor comprises a convex portion formed to correspond to a portion excluding an inertia portion, and an adhesive bond applied to an outer portion of the convex portion, and the acceleration sensor is mounted on the adhesive bond. It is characterized in that it is adhered and fixed by using.

[0012] Further, a raised convex portion formed at the mounting position so as to abut on a portion other than an inertia portion of the acceleration sensor, a concave portion connected to an outer peripheral direction of the convex portion, and a concave portion formed on the concave portion. The acceleration sensor is made of an adhesive bond applied, and is mounted on the raised protrusion.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a mounting structure diagram of an acceleration sensor according to a first embodiment of the present invention. FIG. 1A is a plan view (before mounting the acceleration sensor).
(B) is an AA cross-sectional view (after mounting the acceleration sensor).

Numeral 10 denotes an acceleration sensor which has a rectangular cube shape and has a key-shaped slit 12 extending from the outer periphery toward the center.
Are penetrated in the thickness direction, and an inertia portion 11 elastically supported by the beam portion 13 is formed. When acceleration is applied to the acceleration sensor 10, the inertia unit 11 moves in a direction opposite to the direction in which the acceleration is applied. When the inertia portion 11 moves, the beam portion 13 is distorted according to the amount of movement, and the resistance value of the beam portion 13,
That is, since the resistance value of the acceleration sensor 10 changes, the changed resistance value is extracted from a terminal (not shown) and converted into acceleration.

The acceleration sensor 10 is used so that the inertia portion 11 acts in a direction in which acceleration is to be detected.
In the normal state, the upper and lower surfaces of the inertia portion 11 and the upper and lower surfaces of the holding portion (outer peripheral portion) of the inertia portion 11 are flush with each other.
When mounted directly on the ceramic substrate 15, the lower surface of the inertial portion 11 comes into close contact with the mounting surface of the ceramic substrate 15, and the inertial portion 11 cannot move in the direction of the ceramic substrate 15. It is necessary to raise the outer peripheral lower surface excluding.

The ceramic substrate 15 has a circuit pattern (not shown) of a conductor, a raised pattern 20, a resistor, and the like formed on a ceramic plate by thick-film printing, and electronic components and the like are mounted thereon. The raised pattern 20 prevents the lower surface of the inertial portion 11 from being in close contact with the mounting surface of the ceramic substrate 15 when the acceleration sensor 10 is mounted on the ceramic substrate 15 and, at the same time, uses an adhesive bond when the acceleration sensor 10 is bonded and fixed. 18 flows into the slit 12 to prevent the inertia part 11 from being fixed. In the present embodiment, the raised pattern 20 is provided only on the application portion (four corners) of the adhesive bond 18, but may be provided on the entire outer peripheral portion (square ring) of the acceleration sensor 10 except for the inertia portion 11. .

Next, the operation will be described. Ceramic substrate 15
An adhesive bond 18 is applied to the outside of the raised pattern 20. Then, the acceleration sensor 10 is mounted on the raised pattern 20 and fixed to the ceramic substrate 15 by the adhesive bond 18. When acceleration is applied to the acceleration sensor 10 mounted on the raised pattern 20 in the direction of arrow G due to impact or the like, the inertia portion 11 moves in the direction opposite to the direction of arrow G. Since the resistance value of the acceleration sensor 10 changes due to the movement at that time, the amount of change in the resistance value is extracted and converted into acceleration.

As described above, according to this embodiment, since the acceleration sensor 10 is mounted on the raised pattern 20, the inertial portion 11 is raised from the mounting surface of the ceramic substrate 15, and the inertial portion 11 is (Up and down direction), and the acceleration of the acceleration sensor 10 from both directions can be measured. In addition, since the adhesive bond 18 is prevented from flowing into the slit 12 by the raised pattern 20, a problem that the inertia portion 11 is fixed by the adhesive bond 18 and operation failure is prevented is prevented. In addition, since the raised pattern 20 is formed in the process of manufacturing the substrate, a raised part necessary only for mounting the acceleration sensor 10 is not required, and the mounting quality can be improved and the mounting cost can be reduced.

Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a sectional view showing a mounting structure of an acceleration sensor according to a second embodiment of the present invention. In the second embodiment, the raised portion of the first embodiment is changed.
Since the configuration is substantially the same as that of the embodiment, the same components are denoted by the same reference numerals and description thereof will be omitted. Reference numerals 22 and 23 denote raised portions (patterns) for maintaining a predetermined interval between the lower surface of the inertia portion 11 of the acceleration sensor 10 and the mounting surface of the ceramic substrate 15 and preventing excessive spread of the adhesive bond. is there. The raised portions 22 and 23 are raised on the mounting surface of the ceramic substrate 15 substantially equal to the portion of the acceleration sensor 10 excluding the inertia portion 11. The raised portions 22 and 23 are accelerated in a process of repeatedly printing a thick film on a mounting surface of the ceramic substrate 15 in a process of manufacturing the ceramic substrate 15, for example, welding a circuit pattern, a resistor, and glass for surface protection. The raised portion 22 of the sensor 10 is formed of a thick film, and glass for surface protection is stacked on the raised portion 22 to form the raised portions 22 and 23. And the raising part 2
The acceleration sensor 10 is mounted on 2 and 23.

Next, the operation will be described. Raising portions 22, 23
When acceleration is applied in the direction of arrow G due to impact or the like on the acceleration sensor 10 mounted thereon, the inertia unit 11 moves in the direction opposite to the direction of arrow G. The movement at that time causes the acceleration sensor 10
Is changed, the change amount of the resistance value is extracted and converted into acceleration.

As described above, according to the present embodiment, since the acceleration sensor 10 is mounted on the raised patterns 22 and 23, the inertial portion 11 is raised from the mounting surface of the ceramic substrate 15 and the inertial portion 11 is moved in both directions. , And the acceleration from both directions of the acceleration sensor 10 can be measured. In addition, since the adhesive bonds 18 are prevented from flowing into the slits 12 by the raised patterns 22 and 23, the problem that the inertia portion 11 is fixed by the adhesive bonds 18 and malfunctions are prevented is prevented. In addition, since the raised patterns 22 and 23 are formed in the process of manufacturing the substrate, raised parts necessary only for mounting the acceleration sensor 10 are not required, so that the mounting quality can be improved and the mounting cost can be reduced.

Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 3 is a sectional view showing a mounting structure of an acceleration sensor according to a third embodiment of the present invention. In the third embodiment, the raised portion of the first embodiment is changed.
Since the configuration is substantially the same as that of the embodiment, the same components are denoted by the same reference numerals and description thereof will be omitted. Reference numeral 25 denotes a raised portion of the acceleration sensor 10 for keeping a predetermined interval between the lower surface of the inertia portion 11 of the acceleration sensor 10 and the mounting surface of the ceramic substrate 15 and preventing the adhesive bond from spreading too much. . The raised portion 25 is formed on the mounting surface of the ceramic substrate 15 to be substantially equal to a portion of the acceleration sensor 10 except for the inertia portion 11. The raising portion 25 is required to be raised in a process of repeatedly printing a thick film on a mounting surface of the ceramic substrate 15 in a process of manufacturing the ceramic substrate 15, for example, welding a circuit pattern, a resistor, and glass for surface protection. Glass is welded to the location to form a raised portion 25 of the acceleration sensor 10. Then, the acceleration sensor 10 is mounted on the raised portion 25.

Next, the operation will be described. Ceramic substrate 15
The adhesive bond 18 is applied to the outside of the raised portion 25 of FIG. Then, the acceleration sensor 10 is mounted on the raised portion 25 and fixed to the ceramic substrate 15 by the adhesive bond 18. When acceleration is applied to the acceleration sensor 10 mounted on the raised portion 25 in the direction of arrow G due to impact or the like, the inertia portion 11 moves in the direction opposite to the direction of arrow G. Since the resistance value of the acceleration sensor 10 changes due to the movement at that time, the amount of change in the resistance value is extracted and converted into acceleration.

As described above, also in this embodiment,
As in the first embodiment, the inertia portion 11 of the acceleration sensor 10
Can move in both directions, and the acceleration of the acceleration sensor 10 from both directions can be measured. In addition, since the adhesive bond 18 is prevented from flowing into the slit 12 by the raised pattern 25, the problem that the inertia portion 11 is fixed by the adhesive bond 18 and the operation failure occurs is prevented. In addition, since the raised pattern 25 is formed in the process of manufacturing the substrate, raised parts necessary only for mounting the acceleration sensor 10 are not required, so that the mounting quality can be improved and the mounting cost can be reduced.

Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 4 is a sectional view showing a mounting structure of an acceleration sensor according to a fourth embodiment of the present invention. In the fourth embodiment, a part of the first embodiment is changed, and the others are substantially the same as those of the first embodiment. Reference numeral 16 denotes a resin substrate, which is formed by forming a conductor circuit pattern (not shown), a raised portion (conductor pattern) 27, and printing a solder resist on a resin base material, on which electronic components and the like are mounted. The raised portions 27 and 28 prevent the lower surface of the inertial portion 11 from being in close contact with the surface of the resin substrate 16 when the acceleration sensor 10 is mounted on the resin substrate 16, and at the same time, adhere when fixing the acceleration sensor 10. The bond 18 flows into the slit 12 to prevent the inertia portion 11 from being fixed. The raised portion 27 is formed by forming a circuit pattern (such as an etching method or a generating method), and a solder resist is printed on the raised portion 27 to form the raised portion 28. In addition, the raised portions 27 and 2
8 is a coating portion of the adhesive bond 18 (for example, the acceleration sensor 10
Corners of the acceleration sensor 10) or the entire outer peripheral portion (square ring) of the acceleration sensor 10 excluding the inertial portion 11.

Next, the operation will be described. An adhesive bond 18 is applied to the outside of the raised portions 27 and 28 of the resin substrate 16. Then, the acceleration sensor 10 is mounted on the raised portions 27 and 28 and fixed to the ceramic substrate 15 by the adhesive bond 18. When acceleration is applied to the acceleration sensor 10 mounted on the raised portions 27 and 28 in the direction of arrow G due to impact or the like,
The inertia part 11 moves in the direction opposite to the arrow G. Since the resistance value of the acceleration sensor 10 changes due to the movement at that time, the amount of change in the resistance value is extracted and converted into acceleration.

As described above, also in this embodiment,
As in the first embodiment, the inertia portion 11 of the acceleration sensor 10
Can move in both directions, and the acceleration of the acceleration sensor 10 from both directions can be measured. In addition, since the adhesive bonds 18 are prevented from flowing into the slits 12 by the raised portions 27 and 28, the problem that the inertia portion 11 is fixed by the adhesive bonds 18 and malfunctions are prevented is prevented. In addition, since the raised portions 27 and 28 are formed in the process of manufacturing the substrate, no raised components necessary only for mounting the acceleration sensor 10 are required, and the mounting quality can be improved and the mounting cost can be reduced.

A fifth embodiment of the present invention will be described with reference to FIG. 5A and 5B are mounting structure diagrams of an acceleration sensor according to a fifth embodiment of the present invention. FIG. 5A is a plan view (before mounting the acceleration sensor).
(B) is a BB cross-sectional view (after mounting the acceleration sensor).
The fifth embodiment is a partial modification of the first embodiment.
The other parts are substantially the same as those of the first embodiment.

Reference numeral 30 denotes a sensor adhesive tape, which is formed by punching a double-sided adhesive tape into a shape (square ring) of an outer peripheral portion of the inertial portion 11 of the acceleration sensor 10 in order to adhesively fix the acceleration sensor 10 to the ceramic substrate 15. The sensor adhesive tape 30 is provided between the mounting surface of the ceramic substrate 15 and the inertia portion 11.
Select the plate thickness in accordance with the set size of the gap with the lower surface of.

Next, the operation will be described. A sensor adhesive tape 30 is attached to the mounting position of the acceleration sensor 10 on the substrate 15. Then, the acceleration sensor 10 is mounted on the sensor adhesive tape 30 and fixed by adhesion. This sensor adhesive tape 30
When acceleration is applied in the direction of arrow G due to impact or the like on the acceleration sensor 10 mounted thereon, the inertia unit 11 moves in the direction opposite to the direction of arrow G. The movement at that time causes the acceleration sensor 10
Is changed, the change amount of the resistance value is extracted and converted into acceleration.

As described above, according to the present embodiment, since the sensor adhesive tape 30 is used for mounting the acceleration sensor 10, the thickness of the sensor adhesive tape 30 is selected so that the mounting surface of the ceramic substrate 15 can be reduced. The space between the inertial portion 11 and the lower surface can be set to a desired size. In addition, since the sensor adhesive tape 30 is processed with high precision in thickness, the acceleration sensor 10 can be adhered and fixed with high accuracy. In addition, since an adhesive bond is not used for mounting the acceleration sensor 10, it is possible to prevent the adhesive bond from flowing into the slits 12, fixing the inertial portion 11 and causing malfunction, and the like. Therefore, it is possible to improve the mounting quality and reduce the mounting cost. In this embodiment, the ceramic substrate 15 is used, but the same effect can be obtained by using a resin substrate instead.

Next, a sixth embodiment of the present invention will be described with reference to FIG. 6A and 6B are mounting structure diagrams of an acceleration sensor according to a sixth embodiment of the present invention. FIG. 6A is a plan view (before mounting the acceleration sensor), FIG.
(C) is a raised part forming step 1, (d) is a raised part forming step 2, and (e) is a raised part forming step 3. In the sixth embodiment, a part of the first embodiment is modified, and the others are substantially the same as those of the first embodiment.

Numeral 32 denotes a raised portion for keeping the interval between the lower surface of the inertia portion 11 of the acceleration sensor 10 and the mounting surface of the ceramic substrate 15 at a predetermined interval and preventing the adhesive bond from spreading too much. The raised portion 32 is provided on the mounting surface of the ceramic substrate
A raised portion 32 substantially equal to the portion excluding 1 is formed. In order to form the raised portion 32, an ultraviolet curing film 33 is attached to the mounting surface of the ceramic substrate 15, and a raised portion forming cover 35 having a photosensitive window 36 formed thereon is placed thereon,
After irradiating ultraviolet rays from above the raised portion forming cover 35 to cure the portion of the photosensitive window 36, the ultraviolet curing film 33 and the raised portion forming cover 35 are removed to remove the raised portion 3.
2 are formed. The cover 35 for raising the raised portion has a photosensitive window 36 formed at a position corresponding to the raised portion 32 using a member that blocks transmission of ultraviolet light. In addition, by selecting the thickness of the ultraviolet curing film 33, the raising portion 32
Can be formed to a desired size.

Next, the operation will be described. Ceramic substrate 15
The adhesive bond 18 is applied to the outside of the raised portion 32 of FIG. Then, the acceleration sensor 10 is mounted on the raised portion 32 and fixed to the ceramic substrate 15 by the adhesive bond 18. When acceleration is applied to the acceleration sensor 10 mounted on the ceramic substrate 15 in the direction of arrow G due to impact or the like, the inertia portion 11
Moves in the direction opposite to arrow G. Since the resistance value of the acceleration sensor 10 changes due to the movement at that time, the amount of change in the resistance value is extracted and converted into acceleration.

As described above, according to this embodiment, the space between the mounting surface of the ceramic substrate 15 and the lower surface of the inertia portion 11 is set to a desired size by using the ultraviolet curing film 33 for forming the raised portion 32. Can be set.
In addition, since the thickness of the ultraviolet curing film 33 is processed with high precision, the acceleration sensor 10 can be bonded and fixed with high accuracy. In addition, it is possible to prevent problems such as the adhesive bond 18 flowing into the slit 12 and the inertia portion 11 being fixed, resulting in malfunction. Therefore, it is possible to improve the mounting quality and reduce the mounting cost. In this embodiment, the ceramic substrate 15 is used, but the same effect can be obtained by using a resin substrate instead.

Next, a seventh embodiment of the present invention will be described with reference to FIG. 7A and 7B are mounting structure diagrams of an acceleration sensor according to a seventh embodiment of the present invention. FIG. 7A is a plan view (before mounting the acceleration sensor), FIG.
(C) is a raised part forming step 1, (d) is a raised part forming step 2, and (e) is a raised part forming step 3. The seventh embodiment is a partial modification of the first embodiment, and the other components are substantially the same as those of the first embodiment. Therefore, the same components are denoted by the same reference numerals and description thereof is omitted.

Numeral 40 denotes a raised portion for keeping the interval between the lower surface of the inertia portion 11 of the acceleration sensor 10 and the mounting surface of the ceramic substrate 15 at a predetermined interval and preventing the adhesive bond from spreading too much. The raised portion 40 is provided on the mounting surface of the ceramic substrate
A raised portion 40 substantially equal to the portion except 1 is formed. In order to form the raised portion 40, an ultraviolet curing resin is printed on the mounting surface of the ceramic substrate 15, and the printed raised portion 40 is printed.
UV light is irradiated from above to cure. The height of the raised portion 40 can be set to a desired height by selecting the thickness of the printing plate.

Next, the operation will be described. Ceramic substrate 15
The adhesive bond 18 is applied to the outside of the raised portion 40. Then, the acceleration sensor 10 is mounted on the raised portion 40 and fixed to the ceramic substrate 15 by the adhesive bond 18. When acceleration is applied to the acceleration sensor 10 mounted on the ceramic substrate 15 in the direction of arrow G due to impact or the like, the inertia portion 11
Moves in the direction opposite to arrow G. Since the resistance value of the acceleration sensor 10 changes due to the movement at that time, the amount of change in the resistance value is extracted and converted into acceleration.

As described above, according to this embodiment, since the raised portion 40 is formed by printing of the ultraviolet curable resin, the distance between the mounting surface of the ceramic substrate 15 and the lower surface of the inertia portion 11 is set to a desired size. Can be set. Also,
Since the UV curable resin is processed with high precision in thickness,
The acceleration sensor 10 can be accurately bonded and fixed. In addition, it is possible to prevent problems such as the adhesive bond 18 flowing into the slit 12 and the inertia portion 11 being fixed, resulting in malfunction. Therefore, it is possible to improve the mounting quality and reduce the mounting cost. In this embodiment, the ceramic substrate 15 is used, but the same effect can be obtained by using a resin substrate instead.

Next, an eighth embodiment of the present invention will be described with reference to FIG. FIG. 8 is a sectional view showing a mounting structure of an acceleration sensor according to an eighth embodiment of the present invention. The eighth embodiment is a partial modification of the first embodiment, and the other parts are substantially the same as those of the first embodiment. Reference numeral 50 denotes a substrate. A flexible substrate 5 is provided on a reinforcing plate 51 formed of a metal plate (for example, an aluminum steel plate).
5 are bonded together, and electronic components and the like are mounted on the flexible substrate 55. A projection 52 is formed on the substrate 50 to prevent the adhesive bond 18 from flowing into the slit 12 and fixing the inertial portion 11 when the acceleration sensor 10 is bonded. The projection 52 is formed so as to project toward the mounting surface of the acceleration sensor 10.
In addition, the convex part 52 is a coating part of the adhesive bond 18 (for example, the corner part 4).
), Or may be provided so as to be in contact with the entire outer peripheral portion of the acceleration sensor 10 except for the inertia portion 11.

Next, the operation will be described. Convex part 52 of substrate 50
An adhesive bond 18 is applied to the outside. Then, the acceleration sensor 10 is mounted on the adhesive bond 18 and
To the substrate 50. When acceleration is applied to the acceleration sensor 10 mounted on the substrate 50 in the direction of arrow G due to impact or the like, the inertia unit 11 moves in the direction opposite to the direction of arrow G. Since the resistance value of the acceleration sensor 10 changes due to the movement at that time, the amount of change in the resistance value is extracted and converted into acceleration.

As described above, according to the present embodiment, the adhesive bond 18 is formed by
It is possible to prevent a problem that the inertia portion 11 flows into the fixing portion and is fixed, resulting in malfunction. Therefore, it is possible to improve the mounting quality and reduce the mounting cost. Next, a ninth embodiment of the present invention will be described with reference to FIG.

FIG. 9 is a sectional view showing a mounting structure of an acceleration sensor according to a ninth embodiment of the present invention. The ninth embodiment is a partial modification of the first embodiment, and the other components are substantially the same as those in the first embodiment. Reference numeral 60 denotes a substrate, and a flexible substrate 65 is bonded to a reinforcing plate 61 formed of a metal plate (for example, an aluminum steel plate), and electronic components (not shown) and the like are mounted on the flexible substrate 65. A raised portion 62 for bonding the acceleration sensor 10 and a concave portion 63 serving as an application portion of the adhesive bond 18 are continuously formed on the substrate 60 outside the raised portion 62. The raised portion 62 is for keeping the interval between the lower surface of the inertia portion 11 of the acceleration sensor 10 and the mounting surface of the substrate 60 at a predetermined interval and preventing the adhesive bond from spreading too much. In addition, the raised portion 62
The concave portion 63 may be provided only in the application portion (for example, four corner portions) of the adhesive bond 18 or may be provided in the acceleration sensor 10.
May be provided so as to be in contact with the entire outer peripheral portion excluding the inertia portion 11 of FIG.

Next, the operation will be described. The adhesive bond 18 is applied to the concave portion 63 formed outside the raised portion 62 of the substrate 60. Then, the acceleration sensor 10 is mounted on the raised portion 62 (adhesive bond 18) and fixed to the substrate 60 by the adhesive bond 18. Acceleration sensor 1 mounted on substrate 60
When acceleration is applied to arrow 0 in the direction of arrow G due to impact or the like, inertia portion 11 moves in the direction opposite to arrow G. Since the resistance value of the acceleration sensor 10 changes due to the movement at that time, the amount of change in the resistance value is extracted and converted into acceleration.

As described above, according to this embodiment, since the adhesive bond 18 is prevented from spreading too much by the raised portion 62 and the concave portion 63 of the substrate 60, the adhesive bond 18 flows into the slit 12 and the inertia portion 11 is fixed. It is possible to prevent a malfunction such as a malfunction. Therefore, it is possible to improve the mounting quality and reduce the mounting cost.

[0046]

As described above, according to the present invention, the acceleration sensor is mounted on the raised portion formed on the mounting surface of the substrate, so that the inertia portion of the acceleration sensor is mounted on the substrate when the substrate is moved. The contact between the surface and the lower surface of the inertial portion can be prevented. Further, since the raised portion prevents the adhesive bond from spreading too much when the acceleration sensor is mounted, it is possible to prevent a problem such that the adhesive bond flows into the slit portion of the acceleration sensor, the inertial portion is fixed, and the operation failure is caused. Can be. Further, since the raised portion is formed integrally with the substrate, it is possible to provide a mounting structure of the acceleration sensor which has a low mounting cost and a high reliability.

[Brief description of the drawings]

FIG. 1 is a mounting structure diagram of an acceleration sensor according to a first embodiment of the present invention, in which (a) is a plan view (before mounting the acceleration sensor);
(B) is an AA cross-sectional view (after mounting the acceleration sensor).

FIG. 2 is a sectional view showing a mounting structure of an acceleration sensor according to a second embodiment of the present invention.

FIG. 3 is a sectional view showing a mounting structure of an acceleration sensor according to a third embodiment of the present invention.

FIG. 4 is a sectional view showing a mounting structure of an acceleration sensor according to a fourth embodiment of the present invention.

5A and 5B are mounting structure diagrams of an acceleration sensor showing a fifth embodiment of the present invention, wherein FIG. 5A is a plan view (before mounting the acceleration sensor),
(B) is a BB cross-sectional view (after mounting the acceleration sensor).

6A and 6B are mounting structure diagrams of an acceleration sensor according to a sixth embodiment of the present invention, wherein FIG. 6A is a plan view (before mounting the acceleration sensor);
(B) is a CC cross-sectional view (after mounting the acceleration sensor), (c)
Is a raised portion forming step 1, (d) is a raised portion forming step 2,
(E) is a raised portion forming step 3.

7A and 7B are mounting structure diagrams of an acceleration sensor showing a seventh embodiment of the present invention, wherein FIG. 7A is a plan view (before mounting the acceleration sensor),
(B) is a cross-sectional view of the DD (after mounting the acceleration sensor), (c)
Is a raised portion forming step 1, and (d) is a raised portion forming step 2.

FIG. 8 is a sectional view showing a mounting structure of an acceleration sensor according to an eighth embodiment of the present invention.

FIG. 9 is a sectional view showing a mounting structure of an acceleration sensor according to a ninth embodiment of the present invention.

FIG. 10 is a cross-sectional view showing a mounting structure of a conventional acceleration sensor.

[Explanation of symbols]

10 Acceleration sensor 11 Inertia part 12 Slit 13 Beam part 15 Ceramic substrate 16 Resin substrate 18 ... Adhesive bond 20 ... Bump-up pattern 22,23,25,27,28,32,40,62 ...
Raised portion 30 ··· Sensor adhesive tape 33 ···· Ultraviolet curable film 35 ··· Lifted portion forming cover 36 ··· Photosensitive window 38 ···· Ultraviolet 50, 60 · Boards 51 and 61 · · · Reinforcement plate 52 · · · · Projections 55 and 65 · · · Film substrate 63 ... · · · Concave

Claims (9)

[Claims] 1. A mounting structure for an acceleration sensor, comprising: an acceleration sensor for detecting acceleration by movement of an elastically supported inertia portion such that a movement direction of the inertia portion is perpendicular to a surface of the electronic circuit board. A raising pattern formed so that a portion of the acceleration sensor other than the inertia portion abuts on the mounting position; and an adhesive bond applied to an outer portion of the raising pattern, wherein the acceleration sensor is provided on the raising pattern. A mounting structure of the acceleration sensor, wherein the acceleration sensor is mounted and fixed by the adhesive bond. 2. The mounting structure for an acceleration sensor according to claim 1, wherein a glass member is melt-stacked on the raising pattern to form a raised portion of the acceleration sensor. 3. A mounting structure for an acceleration sensor according to claim 1, wherein a glass member is welded to said mounting position to form a bulky portion of said acceleration sensor. 4. The mounting structure for an acceleration sensor according to claim 1, wherein a solder resist member is printed on the raising pattern to form a raised portion of the acceleration sensor. 5. An acceleration sensor for detecting acceleration by movement of an elastically supported inertial portion, wherein the acceleration sensor is mounted on a surface of the electronic circuit board such that a direction of movement of the inertial portion is perpendicular to a surface of the electronic circuit board. In the mounting structure of the acceleration sensor to be mounted on the double-sided adhesive tape, a double-sided adhesive tape for raising is formed so as to be bonded to a portion other than an inertia portion of the acceleration sensor at the mounting position, and the acceleration sensor is mounted on the double-sided adhesive tape. A mounting structure of an acceleration sensor, characterized in that: 6. The mounting structure for an acceleration sensor according to claim 1, wherein an ultraviolet curable resin film is attached to the mounting position, and only the raised portion is irradiated with ultraviolet rays to form the raised portion. 7. The mounting structure for an acceleration sensor according to claim 1, wherein an ultraviolet-curable resin member is printed on the mounting position, and the printed portion is irradiated with ultraviolet light to form a raised portion. 8. The mounting structure of an acceleration sensor, wherein an acceleration sensor for detecting acceleration by movement of an elastically supported inertia part is mounted such that a direction of movement of the inertia part is perpendicular to a surface of the electronic circuit board. A convex portion formed at a mounting position to correspond to a portion excluding an inertia portion of the acceleration sensor; and an adhesive bond applied to an outer portion of the convex portion, wherein the acceleration sensor is mounted on the adhesive bond. A mounting structure for an acceleration sensor, wherein the mounting structure is adhered and fixed by the adhesive bond. 9. A raised protrusion formed at the mounting position so as to contact a part other than an inertia part of the acceleration sensor; a recess formed by being connected to an outer peripheral direction of the protrusion; 9. The mounting structure for an acceleration sensor according to claim 8, wherein said acceleration sensor is formed of an applied adhesive bond, and said acceleration sensor is mounted on said raised protrusion.