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JPH10242690A - Board transfer system in electronic part mounting line and endless belt replacing method therefor - Google Patents

Board transfer system in electronic part mounting line and endless belt replacing method therefor

Info

Publication number
JPH10242690A
JPH10242690A JP9047511A JP4751197A JPH10242690A JP H10242690 A JPH10242690 A JP H10242690A JP 9047511 A JP9047511 A JP 9047511A JP 4751197 A JP4751197 A JP 4751197A JP H10242690 A JPH10242690 A JP H10242690A
Authority
JP
Japan
Prior art keywords
endless belt
belt
guide member
projection row
mounting line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9047511A
Other languages
Japanese (ja)
Other versions
JP3555375B2 (en
Inventor
Keisuke Fujishiro
惠介 藤代
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP04751197A priority Critical patent/JP3555375B2/en
Publication of JPH10242690A publication Critical patent/JPH10242690A/en
Application granted granted Critical
Publication of JP3555375B2 publication Critical patent/JP3555375B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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  • Structure Of Belt Conveyors (AREA)
  • Belt Conveyors (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a board transfer system in an electronic part mounting line where an endless belt can be replaced quickly and easily, and a method for replacing an endless belt. SOLUTION: A protrusion for guiding an endless belt 1 is removed partially to obtain a removed part A. At the time of replacing the belt 1, the removed part A of the belt 1 is aligned with any one end part of a guide member 3. After the belt 1 is loosened, the removed part A is bent in a horizontal plane and a row of following protrusion 1A are moved to the opposite end part along the guide member 3 while being guided by a row of protrusions 1A contiguous to the removed part A. Subsequently, the row of protrusions 1A is separated entirely from a guide groove 3a and the belt 1 is removed from the guide member 3. According to the method, the belt 1 can be replaced quickly and easily while mounting a pressing member as it is.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子部品実装装
置、クリームハンダのスクリーン印刷装置、電子部品の
外観検査装置などの電子部品実装ラインにおける基板の
搬送装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for transferring substrates on an electronic component mounting line, such as an electronic component mounting device, a screen printing device for cream solder, and a visual inspection device for electronic components.

【0002】[0002]

【従来の技術】電子部品実装装置、クリームハンダのス
クリーン印刷装置、電子部品の外観検査装置などの電子
部品の実装ラインでは、コンベア上を搬送される基板に
対して電子部品の実装や、外観検査など各種の作業が行
われる。コンベアとしてはベルトコンベアが広く用いら
れている。以下、従来の電子部品実装ラインにおける基
板の搬送装置を図面を参照して説明する。
2. Description of the Related Art Electronic component mounting lines such as an electronic component mounting device, a screen printing device for cream solder, and a visual inspection device for electronic components are used to mount electronic components on a substrate conveyed on a conveyor and to perform a visual inspection. Various operations are performed. Belt conveyors are widely used as conveyors. Hereinafter, a substrate transfer device in a conventional electronic component mounting line will be described with reference to the drawings.

【0003】図8は、従来の電子部品実装ラインにおけ
る基板の搬送装置の部分斜視図である。図8において、
1は無端のベルトであり、その下面中央には突起1aが
突設されている。この突起1aは、ベルト1の長手方向
に沿って突起列として多数形成されている。ベルト1
は、フレーム2と一体のガイド部材3の上面を走行す
る。ガイド部材3の上面には長手方向に沿ってガイド溝
3aが設けられており、ガイド溝3aには突起1aが嵌
合する。4は押さえ部材であり、フレーム2上にボルト
5により着脱自在に装着される。押さえ部材4はベルト
1の走行時にベルト1の上面をガイドする。
FIG. 8 is a partial perspective view of a substrate transfer device in a conventional electronic component mounting line. In FIG.
Reference numeral 1 denotes an endless belt, and a projection 1a is provided at the center of the lower surface thereof. The projections 1 a are formed in a large number as a projection row along the longitudinal direction of the belt 1. Belt 1
Travels on the upper surface of the guide member 3 integrated with the frame 2. A guide groove 3a is provided on the upper surface of the guide member 3 along the longitudinal direction, and the projection 1a is fitted into the guide groove 3a. Reference numeral 4 denotes a holding member, which is detachably mounted on the frame 2 by bolts 5. The pressing member 4 guides the upper surface of the belt 1 when the belt 1 runs.

【0004】ベルト1は図示しない駆動プーリや従動プ
ーリに掛け回されている。駆動プーリが回転することに
より、ベルト1はガイド部材3上を走行する。突起1a
がガイド溝3aに嵌合しているため、ベルト1は走行時
にプーリからはずれたり、ガイド部材3上で横方向にず
れることがない。
The belt 1 is wound around a driving pulley or a driven pulley (not shown). As the driving pulley rotates, the belt 1 runs on the guide member 3. Protrusion 1a
Are fitted in the guide grooves 3a, so that the belt 1 does not slip off from the pulleys during running and does not shift laterally on the guide member 3.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、この案
内用の突起1aを設けたベルトは、走行時のベルトはず
れや位置ずれを発生しない反面、ベルト交換時にベルト
の取り外し、取り付けに不便である。すなわち、ベルト
1は、ガイド部材3と押さえ部材4とで挟まれており、
上下方向に規制されている。また、突起1aがガイド溝
3aに嵌合することにより水平方向に規制されている。
従って、ベルト1を交換するためには、押さえ部材4を
取り外したうえで突起1aをガイド溝3aから脱出させ
ねばならず、交換作業に多大な手間を要するという問題
点があった。
However, the belt provided with the guide protrusions 1a does not cause the belt to be displaced or displaced during running, but is inconvenient for removing and attaching the belt when replacing the belt. That is, the belt 1 is sandwiched between the guide member 3 and the holding member 4,
It is regulated in the vertical direction. The protrusion 1a is restricted in the horizontal direction by fitting into the guide groove 3a.
Therefore, in order to replace the belt 1, it is necessary to remove the pressing member 4 and then to release the projection 1a from the guide groove 3a.

【0006】そこで本発明は、無端ベルトの交換を容易
に行える電子部品実装ラインにおける基板の搬送装置お
よびその無端ベルトの交換方法を提供することを目的と
する。
SUMMARY OF THE INVENTION It is an object of the present invention to provide an apparatus for transferring a substrate in an electronic component mounting line and a method for replacing the endless belt, which can easily replace the endless belt.

【0007】[0007]

【課題を解決するための手段】本発明による電子部品実
装ラインにおける基板の搬送装置は、基板を搬送する無
端ベルトと、この無端ベルトの下面側にあってこの無端
ベルトの走行を案内するガイド部材と、この無端ベルト
の上面側にあってこの無端ベルトの上面側を押さえる押
さえ部材とを備え、無端ベルトの下面にその長手方向に
沿って突起列を突設し、またガイド部材の上面にこの突
起列が嵌入するガイド溝をその長手方向に沿って形成
し、かつ突起列を部分的に除去して、この除去部を無端
ベルトをガイド溝から取り外す先導部とした。
According to the present invention, there is provided an apparatus for transporting a substrate in an electronic component mounting line, comprising: an endless belt for transporting the substrate; and a guide member on the lower surface side of the endless belt for guiding the traveling of the endless belt. And a pressing member on the upper surface side of the endless belt for pressing the upper surface side of the endless belt, a projection row is provided on the lower surface of the endless belt along the longitudinal direction thereof, and A guide groove into which the projection row is fitted is formed along the longitudinal direction, and the projection row is partially removed. The removed portion is used as a leading section for removing the endless belt from the guide groove.

【0008】また、本発明による電子部品実装ラインに
おける基板の搬送装置の無端ベルトの交換方法は、基板
を搬送する無端ベルトと、この無端ベルトの下面側にあ
ってこの無端ベルトの走行を案内するガイド部材と、こ
の無端ベルトの上面側にあってこの無端ベルトの上面側
を押さえる押さえ部材とを備え、無端ベルトの下面にそ
の長手方向に沿って突起列を突設し、またガイド部材の
上面にこの突起列が嵌入するガイド溝をその長手方向に
沿って形成した電子部品実装ラインにおける基板の搬送
装置の無端ベルトの交換方法であって、突起列を部分的
に除去した除去部をガイド部材の一方の端部に位置させ
る工程と、無端ベルトを緩める工程と、除去部を水平面
内で屈曲させてガイド部材の端部から張り出した部分の
突起列をガイド部材の内方まで変位させる工程と、この
ガイド部材の内方まで変位させた突起列を先導部とし
て、後続する突起列をガイド部材の側面に沿って反対側
の端部まで移動させ突起列全体をガイド溝から離脱させ
ることにより無端ベルトをガイド部材から取り外す工程
と、を含む。
Further, according to the present invention, there is provided a method of exchanging an endless belt of an apparatus for transporting a substrate in an electronic component mounting line, wherein the endless belt for transporting a substrate and the traveling of the endless belt on the lower surface side of the endless belt are guided. A guide member, and a pressing member on the upper surface side of the endless belt for pressing the upper surface side of the endless belt, a projection row is provided on the lower surface of the endless belt along the longitudinal direction thereof, and the upper surface of the guide member A method of exchanging an endless belt of a substrate transport device in an electronic component mounting line in which a guide groove in which the projection row is fitted is formed along the longitudinal direction thereof, wherein a removal portion in which the projection row is partially removed is provided as a guide member. A step of loosening the endless belt, a step of bending the removing section in a horizontal plane, and projecting a projection row of a portion protruding from an end of the guide member to the guide section. The step of displacing inward of the guide member, and using the projection row displaced inward of the guide member as a leading portion, moving the succeeding projection row along the side surface of the guide member to the opposite end to move the entire projection row. Removing the endless belt from the guide member by detaching from the guide groove.

【0009】[0009]

【発明の実施の形態】本発明において、無端ベルトを交
換するときは、まず除去部をガイド部材の一方の端部に
位置させ、無端ベルトを緩めて除去部を水平面内で屈曲
させガイド部材の端部から張り出した部分の突起列をガ
イド部材の内方へ変位させる。次いでこの突起列を先導
部として後続の突起列をガイド部材の側面に沿って反対
側の端部まで移動させることにより突起列はガイド溝か
ら離脱し、無端ベルトをガイド部材から取り外すことが
できる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, when exchanging an endless belt, first, the removing section is located at one end of the guide member, the endless belt is loosened, and the removing section is bent in a horizontal plane to thereby remove the guide member. The projection row at the portion protruding from the end is displaced inward of the guide member. Next, the projection row is moved to the opposite end along the side surface of the guide member using the projection row as a leading portion, whereby the projection row is separated from the guide groove, and the endless belt can be removed from the guide member.

【0010】以下、本発明の一実施の形態を図面を参照
して説明する。図1は本発明の一実施の形態の電子部品
実装ラインにおける基板の搬送装置の側断面図、図2は
同電子部品実装ラインにおける基板の搬送装置の正面
図、図3は同電子部品実装ラインにおける基板の搬送装
置の部分斜視図、図4は同電子部品実装ラインにおける
基板の搬送装置の部分平面図、図5は同電子部品実装ラ
インにおける基板の搬送装置のベルトの側面図、図6は
同電子部品実装ラインにおける基板の搬送装置のベルト
の拡大断面図、図7(a)、(b)、(c)、(d)、
(e)は同電子部品実装ラインにおける基板の搬送装置
の部分平面図である。
An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view of a board transfer device in an electronic component mounting line according to an embodiment of the present invention, FIG. 2 is a front view of the board transfer device in the electronic component mounting line, and FIG. , FIG. 4 is a partial plan view of the board transfer device in the electronic component mounting line, FIG. 5 is a side view of a belt of the board transfer device in the electronic component mounting line, and FIG. 7 (a), 7 (b), 7 (c), 7 (d), and 7 (a), 7 (b), 7 (d), and 7 (c) are enlarged sectional views of a belt of a substrate transfer device in the electronic component mounting line.
(E) is a partial plan view of the board transfer device in the electronic component mounting line.

【0011】まず、図1および図2を参照して電子部品
実装ラインにおける基板の搬送装置の全体構造を説明す
る。図1において1は無端のベルトであり、後述するよ
うに中央にガイド用の突起列を有している。ベルト1は
ガイド部材3の上面を走行する。ガイド部材3はフレー
ム2と一体となっている。またベルト1の上面は押さえ
部材4によりガイドされている。押さえ部材4は、ボル
ト5によってフレーム2に装着される。図2に示すよう
に、ベルト1は駆動プーリ10、および従動プーリ11
に掛け回されている。駆動プーリ10は図示しないモー
タにより駆動される。従動プーリ11は図示しないテン
ションボルトにより水平方向にスライド可能となってい
る。
First, referring to FIGS. 1 and 2, the overall structure of a board transfer device in an electronic component mounting line will be described. In FIG. 1, reference numeral 1 denotes an endless belt, which has a guide row at the center as described later. The belt 1 runs on the upper surface of the guide member 3. The guide member 3 is integrated with the frame 2. The upper surface of the belt 1 is guided by a pressing member 4. The holding member 4 is mounted on the frame 2 by bolts 5. As shown in FIG. 2, the belt 1 includes a driving pulley 10 and a driven pulley 11.
Has been hung around. The driving pulley 10 is driven by a motor (not shown). The driven pulley 11 can be slid horizontally by a tension bolt (not shown).

【0012】図1,図2に示すように、ベルト1の上面
には基板6が載置される。従ってモータが駆動してベル
ト1が回動することにより基板6は搬送される。基板6
の上方には、移載ヘッド7が設けられている。移載ヘッ
ド7には吸着ノズル8が装着されている。吸着ノズル8
は、基板6に搭載される電子部品9を真空吸着する。移
載ヘッド7は図示しない可動テーブルによりX方向やY
方向へ水平移動し、基板6の所定位置に電子部品を搭載
する。
As shown in FIGS. 1 and 2, a substrate 6 is placed on the upper surface of the belt 1. Accordingly, the substrate 6 is conveyed by driving the motor and rotating the belt 1. Substrate 6
A transfer head 7 is provided above. A suction nozzle 8 is mounted on the transfer head 7. Suction nozzle 8
Vacuum sucks the electronic component 9 mounted on the substrate 6. The transfer head 7 is moved in the X direction and the Y direction by a movable table (not shown).
The electronic component is mounted horizontally at a predetermined position on the substrate 6.

【0013】次に図3、図4を参照して、ベルト1の装
着部分の詳細について説明する。図3に示すように、ベ
ルト1は下面の中央部に長手方向に沿って突起1aを有
している。ガイド部材3の上面には長手方向に沿ってガ
イド溝3aが設けられている。また、プーリ10の円周
面の中央部にも同様の溝10aが設けられている。ベル
ト1が装着された状態では、突起1aはプーリ10の溝
10aおよびガイド部材3のガイド溝3aに嵌合してい
る。また、ベルト1の上面は、押さえ部材4によってガ
イドされている。押さえ部材4には、取り付け穴12が
設けられている。またフレーム2の上面には、ねじ穴1
3が加工されている。押さえ部材4は、ボルト5を取り
付け穴12を通してねじ穴13に螺入することにより着
脱自在に装着される。このベルト1の突起1aが溝10
aおよびガイド溝3aに嵌合し、更に押さえ部材4によ
りベルト1の上面をガイドされることによって、ベルト
1はプーリ10からはずれることはなく、またガイド部
材3上での横方向の位置ずれも発生しない。
Next, with reference to FIGS. 3 and 4, details of the mounting portion of the belt 1 will be described. As shown in FIG. 3, the belt 1 has a protrusion 1a at the center of the lower surface along the longitudinal direction. A guide groove 3a is provided on the upper surface of the guide member 3 along the longitudinal direction. A similar groove 10a is provided in the center of the circumferential surface of the pulley 10. When the belt 1 is mounted, the protrusion 1a is fitted in the groove 10a of the pulley 10 and the guide groove 3a of the guide member 3. The upper surface of the belt 1 is guided by a pressing member 4. The holding member 4 is provided with a mounting hole 12. Also, screw holes 1 are provided on the upper surface of the frame 2.
3 has been processed. The holding member 4 is detachably mounted by screwing the bolt 5 into the screw hole 13 through the mounting hole 12. The protrusion 1a of the belt 1 is
a and the guide groove 3a, and furthermore, the upper surface of the belt 1 is guided by the pressing member 4, so that the belt 1 does not come off from the pulley 10 and the lateral displacement on the guide member 3 also occurs. Does not occur.

【0014】また、図4に示すように、ガイド溝3aの
先端部にはテーパカット部3bが設けられている。この
ため、プーリ10とガイド部材3との水平方向の位置あ
わせに多少のズレがあっても、ベルト1の突起1aはガ
イド溝3aにスムースに進入でき、従って突起1aがガ
イド溝3aの入り口のエッジに衝突してダメージを受け
るのを防止できる。
As shown in FIG. 4, a tapered cut portion 3b is provided at the tip of the guide groove 3a. For this reason, even if the pulley 10 and the guide member 3 are slightly misaligned in the horizontal direction, the protrusion 1a of the belt 1 can smoothly enter the guide groove 3a, so that the protrusion 1a is positioned at the entrance of the guide groove 3a. This prevents damage from being hit by the edge.

【0015】次に、図5、図6を参照してベルト1につ
いて説明する。ベルト1は、ウレタンゴムなどのエラス
トマーを素材として製作される。これらの素材は単独で
は強度的に十分でないため、特に引張り強度を増すため
に、図6にて示すようにベルト1の製作時には、複数本
のワイヤ1dを引張り方向に埋め込んで補強される。前
述のように、ベルト1には断面の中央にガイド用の突起
1aが断続して列状に設けられ、突起列1Aを構成して
いる。図6の、突起1aがとぎれている凹部1bの底部
には、切れ込み部1cが形成されている。この切れ込み
部1cは、ベルト1の屈曲性を高める。
Next, the belt 1 will be described with reference to FIGS. The belt 1 is manufactured using an elastomer such as urethane rubber as a material. Since these materials alone are not sufficient in strength, in order to increase the tensile strength, a plurality of wires 1d are buried in the tensile direction and reinforced when the belt 1 is manufactured as shown in FIG. As described above, the belt 1 is provided with guide projections 1a intermittently at the center of the cross section and in a row to form a projection row 1A. In FIG. 6, a cut 1c is formed at the bottom of the recess 1b where the protrusion 1a is cut off. The notch 1 c enhances the flexibility of the belt 1.

【0016】また、図5に示すように、ベルト1の突起
1aは部分的に除去され、除去部Aが形成されている。
この除去部Aの機能については後述する。また、この除
去部Aがベルト1の上面から容易に判別できるように、
その上面には目印Mが付されている。
Further, as shown in FIG. 5, the protrusion 1a of the belt 1 is partially removed, and a removed portion A is formed.
The function of the removing unit A will be described later. Also, in order that the removal portion A can be easily determined from the upper surface of the belt 1,
A mark M is provided on the upper surface.

【0017】この電子部品実装ラインにおける基板の搬
送装置は上記のような構成より成り、以下その動作を各
図を参照して説明する。図2において、基板6はベルト
1上にセットされている。ベルト1が走行することによ
り、基板6は所定位置まで搬送される。次に基板6に対
し、移載ヘッド7は電子部品の実装等の作業を行う。作
業が終了すると、基板6は次のステージへ搬送される。
The board transfer device in the electronic component mounting line has the above-described configuration, and the operation thereof will be described below with reference to the drawings. In FIG. 2, the substrate 6 is set on the belt 1. As the belt 1 travels, the substrate 6 is transported to a predetermined position. Next, the transfer head 7 performs operations such as mounting of electronic components on the substrate 6. When the operation is completed, the substrate 6 is transferred to the next stage.

【0018】ところで、一般にコンベアのベルトは消耗
部品であり、定期的な交換を必要とする。以下、図7
(a)、(b)、(c)、(d)、(e)を参照してベ
ルト1の交換について説明する。なお、ここでは図面を
見やすくするため、押さえ部材4は省略している。ま
ず、ベルト1の突起1aの除去部Aの位置をベルト1上
面の目印Mにより確認する。次いで、図7(a)に示す
ように、除去部Aをガイド部材3のいずれかの端部(図
7(a)では端部E1)に位置あわせする。次いで従動
プーリ11のテンションボルトを緩め、従動プーリ11
をスライドさせる(矢印a参照)。これによりベルト1
は緩められ、従動プーリ11から取り外し可能な状態と
なる。
By the way, the conveyor belt is generally a consumable part and needs to be periodically replaced. Hereinafter, FIG.
The replacement of the belt 1 will be described with reference to (a), (b), (c), (d), and (e). Here, the holding member 4 is omitted for easy viewing of the drawing. First, the position of the removed portion A of the protrusion 1 a of the belt 1 is confirmed by the mark M on the upper surface of the belt 1. Next, as shown in FIG. 7A, the removed portion A is aligned with one of the ends of the guide member 3 (the end E1 in FIG. 7A). Next, the tension bolt of the driven pulley 11 is loosened, and the driven pulley 11
Slide (see arrow a). With this, belt 1
Is loosened and can be removed from the driven pulley 11.

【0019】次に、図7(b)において示すようにベル
ト1の除去部Aを水平面内で屈曲させ、ガイド部材3の
端部から張り出した部分B突起列1Aをガイド部材3の
内方(矢印b参照)へ変位させる。次いで、図7
(c)、(d)に示すように、この突起列1Aを先導部
として後続の端子列1Aをガイド部材3の側面Sに沿っ
て反対側の端部E2に向かって移動させる(矢印c,d
参照)。この突起列1Aの移動をガイド部材3の全長に
わたって行うことにより、すべての突起列1Aがガイド
溝3aから離脱し、(矢印e参照)、図7(e)に示す
ようにベルト1はガイド部材3から取り外される。
Next, as shown in FIG. 7 (b), the removed portion A of the belt 1 is bent in the horizontal plane, and the portion B projecting row 1A projecting from the end of the guide member 3 is inserted into the guide member 3 ( (See arrow b). Then, FIG.
As shown in (c) and (d), the subsequent terminal row 1A is moved toward the opposite end E2 along the side surface S of the guide member 3 using the projection row 1A as a leading portion (arrows c and c). d
reference). By moving the projection row 1A over the entire length of the guide member 3, all the projection rows 1A are separated from the guide grooves 3a (see arrow e), and as shown in FIG. Removed from 3.

【0020】次に、ベルト1を新たに装着する方法につ
いて説明する。この場合は、上述の取り外しの順序と逆
の手順に従えばよい。すなわち、ベルト1をガイド部材
3の側面Sに沿ってセットし、除去部Aをガイド部材3
のいずれかの端部(図7(e)の例ではE2)に位置あ
わせする。次いで、除去部Aを水平面内で屈曲させて突
起列1Aを図7(d)に示す矢印eと反対の方向に変位
させ、ガイド溝3aの延長線上の位置に合わせる。次い
で突起列1Aを左方へ移動させてガイド溝3aに嵌入さ
せる。次に除去部Aがガイド部材3の反対側の端部にく
るまで突起列1Aを移動させることにより(矢印dの反
対方向)、突起列1Aはガイド溝3a内に嵌合する(図
7(b)参照)。この後、ベルト1をプーリ11にかけ
回し、プーリ11をスライドさせて張力を調整すること
によりベルト1の取り付けが完了する。
Next, a method for newly attaching the belt 1 will be described. In this case, a procedure reverse to the above-described order of removal may be performed. That is, the belt 1 is set along the side surface S of the guide member 3, and the removal portion A is
(E2 in the example of FIG. 7E). Next, the removal portion A is bent in the horizontal plane to displace the projection row 1A in the direction opposite to the arrow e shown in FIG. 7D, so as to match the position on the extension of the guide groove 3a. Next, the projection row 1A is moved to the left to fit into the guide groove 3a. Next, the projection row 1A is fitted into the guide groove 3a by moving the projection row 1A until the removed portion A reaches the end on the opposite side of the guide member 3 (the direction opposite to the arrow d) (FIG. 7 ( b)). Thereafter, the belt 1 is wound around the pulley 11, and the pulley 11 is slid to adjust the tension, thereby completing the attachment of the belt 1.

【0021】[0021]

【発明の効果】本発明によれば、無端ベルトの突起を部
分的に除去した除去部を設け、この除去部をガイド部材
の端部に位置させ、除去部を水平面内で屈曲させること
により、除去部に隣接した突起列を先導部としてガイド
溝内に嵌入させたり離脱させたりして、押さえ部材を装
着したままで無端ベルトの交換を迅速・容易に行うこと
ができる。
According to the present invention, there is provided a removing portion in which the protrusion of the endless belt is partially removed, the removing portion is located at the end of the guide member, and the removing portion is bent in a horizontal plane. The endless belt can be quickly and easily replaced while the holding member is mounted by fitting or removing the projection row adjacent to the removing section as a leading section in the guide groove.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態の電子部品実装ラインに
おける基板の搬送装置の側断面図
FIG. 1 is a side cross-sectional view of a board transfer device in an electronic component mounting line according to an embodiment of the present invention.

【図2】本発明の一実施の形態の電子部品実装ラインに
おける基板の搬送装置の正面図
FIG. 2 is a front view of a board transfer device in the electronic component mounting line according to the embodiment of the present invention;

【図3】本発明の一実施の形態の電子部品実装ラインに
おける基板の搬送装置の部分斜視図
FIG. 3 is a partial perspective view of a board transfer device in an electronic component mounting line according to an embodiment of the present invention.

【図4】本発明の一実施の形態の電子部品実装ラインに
おける基板の搬送装置の部分平面図
FIG. 4 is a partial plan view of a board transfer device in an electronic component mounting line according to an embodiment of the present invention.

【図5】本発明の一実施の形態の電子部品実装ラインに
おける基板の搬送装置のベルトの側面図
FIG. 5 is a side view of a belt of the board transfer device in the electronic component mounting line according to the embodiment of the present invention.

【図6】本発明の一実施の形態の電子部品実装ラインに
おける基板の搬送装置のベルトの拡大断面図
FIG. 6 is an enlarged cross-sectional view of a belt of the board transfer device in the electronic component mounting line according to the embodiment of the present invention.

【図7】(a)本発明の一実施の形態の電子部品実装ラ
インにおける基板の搬送装置の部分平面図(b)本発明
の一実施の形態の電子部品実装ラインにおける基板の搬
送装置の部分平面図(c)本発明の一実施の形態の電子
部品実装ラインにおける基板の搬送装置の部分平面図
(d)本発明の一実施の形態の電子部品実装ラインにお
ける基板の搬送装置の部分平面図(e)本発明の一実施
の形態の電子部品実装ラインにおける基板の搬送装置の
部分平面図
FIG. 7A is a partial plan view of a board transfer device in an electronic component mounting line according to one embodiment of the present invention; FIG. 7B is a partial plan view of a board transfer device in an electronic component mounting line according to one embodiment of the present invention; Plan view (c) Partial plan view of a board transfer device in an electronic component mounting line according to one embodiment of the present invention (d) Partial plan view of a board transfer device in an electronic component mounting line according to one embodiment of the present invention (E) Partial plan view of a board transfer device in an electronic component mounting line according to an embodiment of the present invention.

【図8】従来の電子部品実装ラインにおける基板の搬送
装置の部分斜視図
FIG. 8 is a partial perspective view of a substrate transfer device in a conventional electronic component mounting line.

【符号の説明】[Explanation of symbols]

1 ベルト 1a 突起 2 フレーム 3 ガイド部材 3a ガイド溝 4 押さえ部材 6 基板 10 駆動プーリ Reference Signs List 1 belt 1a protrusion 2 frame 3 guide member 3a guide groove 4 holding member 6 substrate 10 drive pulley

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】基板を搬送する無端ベルトと、この無端ベ
ルトの下面側にあってこの無端ベルトの走行を案内する
ガイド部材と、この無端ベルトの上面側にあってこの無
端ベルトの上面側を押さえる押さえ部材とを備え、無端
ベルトの下面にその長手方向に沿って突起列を突設し、
またガイド部材の上面にこの突起列が嵌入するガイド溝
をその長手方向に沿って形成し、かつ突起列を部分的に
除去して、この除去部を無端ベルトをガイド溝から取り
外す先導部としたことを特徴とする電子部品実装ライン
における基板の搬送装置。
An endless belt for transporting a substrate, a guide member on a lower surface side of the endless belt for guiding the traveling of the endless belt, and an upper surface side of the endless belt on an upper surface side of the endless belt. A holding member for holding down, and a projection row is provided on the lower surface of the endless belt along the longitudinal direction thereof,
Further, a guide groove into which the projection row is fitted is formed along the longitudinal direction on the upper surface of the guide member, and the projection row is partially removed, and the removed portion is used as a leading section for removing the endless belt from the guide groove. A substrate transfer device in an electronic component mounting line.
【請求項2】基板を搬送する無端ベルトと、この無端ベ
ルトの下面側にあってこの無端ベルトの走行を案内する
ガイド部材と、この無端ベルトの上面側にあってこの無
端ベルトの上面側を押さえる押さえ部材とを備え、無端
ベルトの下面にその長手方向に沿って突起列を突設し、
またガイド部材の上面にこの突起列が嵌入するガイド溝
をその長手方向に沿って形成した電子部品実装ラインに
おける基板の搬送装置の無端ベルトの交換方法であっ
て、突起列を部分的に除去した除去部をガイド部材の一
方の端部に位置させる工程と、無端ベルトを緩める工程
と、除去部を水平面内で屈曲させてガイド部材の端部か
ら張り出した部分の突起列をガイド部材の内方へ変位さ
せる工程と、このガイド部材の内方へ変位させた突起列
を先導部として、後続する突起列をガイド部材の側面に
沿って反対側の端部まで移動させ突起列全体をガイド溝
から離脱させることにより無端ベルトをガイド部材から
取り外す工程と、を含むことを特徴とする電子部品実装
ラインにおける基板の搬送装置の無端ベルトの交換方
法。
2. An endless belt for transporting a substrate, a guide member on a lower surface side of the endless belt for guiding the traveling of the endless belt, and an upper surface side of the endless belt on an upper surface side of the endless belt. A holding member for holding down, and a projection row is provided on the lower surface of the endless belt along the longitudinal direction thereof,
Further, the method is a method of exchanging an endless belt of a substrate transfer device in an electronic component mounting line in which a guide groove in which the projection row is fitted is formed along the longitudinal direction on the upper surface of the guide member, and the projection row is partially removed. A step of positioning the removing portion at one end of the guide member, a step of loosening the endless belt, and bending the removing portion in a horizontal plane to project a row of protrusions protruding from the end of the guide member into the guide member. And the projection row displaced inward of the guide member is used as a leading portion, and the subsequent projection row is moved to the opposite end along the side surface of the guide member to move the entire projection row from the guide groove. Removing the endless belt from the guide member by detaching the endless belt from the guide member.
JP04751197A 1997-03-03 1997-03-03 Board transfer device and method for replacing endless belt in electronic component mounting line Expired - Fee Related JP3555375B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04751197A JP3555375B2 (en) 1997-03-03 1997-03-03 Board transfer device and method for replacing endless belt in electronic component mounting line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04751197A JP3555375B2 (en) 1997-03-03 1997-03-03 Board transfer device and method for replacing endless belt in electronic component mounting line

Publications (2)

Publication Number Publication Date
JPH10242690A true JPH10242690A (en) 1998-09-11
JP3555375B2 JP3555375B2 (en) 2004-08-18

Family

ID=12777146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP04751197A Expired - Fee Related JP3555375B2 (en) 1997-03-03 1997-03-03 Board transfer device and method for replacing endless belt in electronic component mounting line

Country Status (1)

Country Link
JP (1) JP3555375B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009264737A (en) * 2008-04-21 2009-11-12 Ids Co Ltd Feed device of specimen and treatment apparatus of specimen
JP2010261779A (en) * 2009-05-01 2010-11-18 Seiko Instruments Inc Slice making device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009264737A (en) * 2008-04-21 2009-11-12 Ids Co Ltd Feed device of specimen and treatment apparatus of specimen
JP4522463B2 (en) * 2008-04-21 2010-08-11 株式会社アイディエス Sample transport apparatus and sample processing apparatus
US7921989B2 (en) 2008-04-21 2011-04-12 Ids Co., Ltd. Sample conveyor apparatus and sample processing apparatus
JP2010261779A (en) * 2009-05-01 2010-11-18 Seiko Instruments Inc Slice making device

Also Published As

Publication number Publication date
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