JPH10223143A - Planar luminous element - Google Patents
Planar luminous elementInfo
- Publication number
- JPH10223143A JPH10223143A JP9024784A JP2478497A JPH10223143A JP H10223143 A JPH10223143 A JP H10223143A JP 9024784 A JP9024784 A JP 9024784A JP 2478497 A JP2478497 A JP 2478497A JP H10223143 A JPH10223143 A JP H10223143A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- panel
- plug
- sealed
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Gas-Filled Discharge Tubes (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は平面状発光素子に関
する。The present invention relates to a planar light emitting device.
【0002】[0002]
【従来の技術】従来、例えばPDPの封止密着接合は、
図1に示すものが知られている。この図で1aはガラス
基板上に放電用の電極形成(表示電極)2aし、絶縁用
の誘電体とMgO(図示せず)で被覆された前面板、ま
た1bはアドレス用電極2b形成されかつ放電空間(セ
ル)3を形成する隔壁4が形成された背面板、5は密閉
空間を封止するシール部である。6は本発明の対象とな
る排気用貫通孔であり、これらによってPDPが形成さ
れる。放電空間6内にはNe+Xe(0.1%)のペニン
グ混合ガスがガス圧約300Torrで充填され、隔壁4に塗
布形成された螢光体R,G,B(図示せず)が表示電極
間で発生するプラズマにより発生した紫外光により安定
発光される。背面板1bには、真空装置と接続するに用
いるガラス管7を低融点ガラス8等で溶着接続されてい
る。2. Description of the Related Art Conventionally, for example, the sealing contact bonding of a PDP is performed by:
The one shown in FIG. 1 is known. In this figure, reference numeral 1a denotes a discharge electrode formation (display electrode) 2a on a glass substrate, a front plate covered with an insulating dielectric and MgO (not shown), and 1b an address electrode 2b formed and The back plate 5 on which the partition walls 4 forming the discharge spaces (cells) 3 are formed is a seal portion for sealing the closed space. Reference numeral 6 denotes an exhaust through-hole that is an object of the present invention, and a PDP is formed by these. The discharge space 6 is filled with a Ne + Xe (0.1%) Penning mixed gas at a gas pressure of about 300 Torr. Stable light is emitted by ultraviolet light generated by the generated plasma. A glass tube 7 used for connection to a vacuum device is welded and connected to the back plate 1b with a low-melting glass 8 or the like.
【0003】[0003]
【発明が解決しようとする課題】しかし、従来の排気用
ガラス管接続による、パネル内真空排気方法及びガス置
換方法では、小口径(約6mm)のガラス管7をパネル面
に垂直に立て、かつ低融点ガラス8で接合するには難し
い。However, in the conventional method of evacuating the inside of the panel and the gas replacement method by connecting the exhaust glass tube, the glass tube 7 having a small diameter (about 6 mm) is set upright on the panel surface, and It is difficult to join with low melting glass 8.
【0004】また、このような作業終了後に、図3に示
すように前述したガラス管をガス溶接等で切断封着(チ
ップオフ)9しなければ成らず、切断後にパネル背面に
ガラス管の突起をなくす事ができない。[0004] Further, after the completion of such an operation, the above-mentioned glass tube must be cut and sealed (tip-off) 9 by gas welding or the like as shown in FIG. Can not be eliminated.
【0005】また、かかるガラス間の突起は、パネル封
着排気後の表示管として組み立てる際に他部品との形状
的な干渉が生じ、接触破損を防ぐため組立には多大な注
意を要するものであった。Further, the projections between the glasses cause shape interference with other parts when assembling as a display tube after the panel is sealed and evacuated, so that great care must be taken in assembling to prevent contact damage. there were.
【0006】本発明の目的は、貫通孔の封止が簡単で、
かつ作業を自動化しやすいパネルを提供することにあ
る。An object of the present invention is to easily seal a through-hole,
Another object of the present invention is to provide a panel which can easily automate the operation.
【0007】[0007]
【課題を解決するための手段】本発明によるパネル排気
用貫通孔の封止方法は基本的に貫通孔の内径よりやや大
きめの気密性に優れた素材からなる栓状体でいわゆる焼
きばめ法により前記貫通孔を塞ぐ事で達成できる。The method for sealing a through hole for exhausting a panel according to the present invention is basically a so-called shrink-fitting method using a plug-like body made of an airtight material slightly larger than the inner diameter of the through hole. This can be achieved by closing the through hole.
【0008】すなわち、パネルの前面板と背面板を組み
立てた後、前面板の誘電体表面に形成するMgOを活性
化処理する温度が一般的に350℃で行い、その後冷却す
るため貫通孔の口径が3mmとすると約8ミクロン膨張す
る。ここで栓状体の熱膨張係数を貫通孔が形成されてい
る平面体の線膨張係数よりも小さくすることで強固な気
密性を増すことができる。That is, after assembling the front plate and the rear plate of the panel, the temperature for activating MgO formed on the dielectric surface of the front plate is generally 350 ° C., and then the diameter of the through hole is reduced for cooling. If it is 3 mm, it expands about 8 microns. Here, by setting the thermal expansion coefficient of the plug-like body to be smaller than the linear expansion coefficient of the plane body in which the through-hole is formed, it is possible to increase the strong airtightness.
【0009】さらに言えば、前記した栓状体の表面を35
0℃以下の体融点の金属例えば錫、鉛、アンチモンなど
の金属もしくは合金で被覆し、高温下で貫通孔にねじり
ながら挿入封止する事で金属シールできる。前記した栓
状体には、封栓時に生じる応力歪みを緩和する目的で窪
み状の肉ぬすみをし、さらに挿入しやすいように栓中央
部に突起を設けた。More specifically, the surface of the above-mentioned plug-like body is 35
A metal seal having a body melting point of 0 ° C. or less, for example, a metal or an alloy such as tin, lead, and antimony, can be sealed by inserting and sealing while twisting the through hole at a high temperature. The plug-like body was provided with a hollow-shaped indentation for the purpose of alleviating the stress distortion generated at the time of sealing, and a projection was provided at the center of the plug to facilitate insertion.
【0010】貫通孔と栓状体の位置合わせ誤差及び羽目
合い誤差を少なくするため各々の接触面にはやや勾配を
設ける事で、気密接触面を増加させた。In order to reduce the positioning error and the mating error between the through hole and the plug-like body, each contact surface is provided with a slight gradient to increase the hermetic contact surface.
【0011】[0011]
【発明の実施の形態】図4及び図5は本発明の一実施例
を示すもので、本発明の効果を説明するのに用いた図で
ある。4 and 5 show one embodiment of the present invention and are used to explain the effects of the present invention.
【0012】(実施例1)図4は第1の実施例を示す図
で、図5はその一部拡大断面図である。(Embodiment 1) FIG. 4 is a view showing a first embodiment, and FIG. 5 is a partially enlarged sectional view thereof.
【0013】熱膨張係数(8×10~6)のソーダライム
ガラス(青板ガラス)からなる背面板1bには本発明の
対象となる内径3mmのテーパ付き貫通孔6aと、従来と
同様に排気用のガラス管7aを接続した貫通孔を対角の
他方に配設したものを用いた。A back plate 1b made of soda lime glass (blue plate glass) having a coefficient of thermal expansion (8 × 10 to 6 ) has a tapered through hole 6a having an inner diameter of 3 mm, which is an object of the present invention, and an exhaust port as in the prior art. The through-hole connected to the glass tube 7a was disposed on the other side of the diagonal.
【0014】かかる様にして得た背面板を約350℃に加
熱し、貫通孔よりやや大きめの外形を有し、テーパ加工
したパイレックスガラス(熱膨張係数3.5×10~6)
からなる栓状体9aを挿入した後に室温まで冷却した。
ここで用いた栓状体はパーツフィーダ等での自動送りを
考慮して縁付きの形状にした。The back plate obtained in this manner is heated to about 350 ° C., and has a slightly larger outer shape than the through-hole, and is tapered Pyrex glass (coefficient of thermal expansion: 3.5 × 10 to 6 ).
After inserting the plug-like body 9a made of, the mixture was cooled to room temperature.
The plug-shaped body used here was formed into a shape with an edge in consideration of automatic feeding by a parts feeder or the like.
【0015】350℃に加熱した理由はPDPの前面板に
形成されたMgO皮膜を加熱エージングしながら排気す
るのが一般的であるためである。The reason for heating to 350 ° C. is that the MgO film formed on the front panel of the PDP is generally exhausted while being heated and aged.
【0016】封栓後、他方の排気管を用いてパネル内を
2×10~6Toorまで真空排気し、排気管に接続した真
空ゲージによりパネル内の真空度を観測した結果、従来
方法によると同様の効果が得られることが分かった。After plugging, the inside of the panel was evacuated to 2 × 10 to 6 torr using the other exhaust pipe, and the degree of vacuum in the panel was observed using a vacuum gauge connected to the exhaust pipe. It was found that a similar effect was obtained.
【0017】(実施例2)図6は他の実施例について説
明した図である。(Embodiment 2) FIG. 6 is a diagram for explaining another embodiment.
【0018】貫通孔の孔精度、表面性は管理して作成す
るが微少なバラツキが有り、大量に製造する際での歩留
まりが問題となる。The precision and surface properties of the through-holes are controlled and created, but there is a slight variation, and the yield in mass production is a problem.
【0019】このため、栓状体9bもしくは貫通孔6a
側面に、300℃付近で溶融する低融点金属もしくは合金
を被覆19し、その融点近くもしくはそれ以上の温度に
加熱しながら、貫通孔に栓状体を挿入しそのまま冷却す
る方法を採った。For this reason, the plug-like body 9b or the through-hole 6a
A method was adopted in which the side surface was coated with a low-melting metal or alloy 19 melting at around 300 ° C., and a plug was inserted into the through-hole and cooled as it was while heating to a temperature near or above that melting point.
【0020】ここでは、栓状体の側面及び縁に錫(融点
232℃)を厚さ2ミクロンにスパッタ法で形成した。こ
の方法は、パネルに形成した貫通孔を金属被覆するより
同時多数被覆できるので、部材を安価に形成できる利点
がある。Here, tin (melting point) is applied to the side and edge of the plug.
232 ° C.) to a thickness of 2 μm by sputtering. This method has an advantage that the members can be formed at a low cost because a larger number of the through holes formed in the panel can be coated simultaneously than the metal coating.
【0021】このようにして得た、栓状体9bを貫通孔
6aにあわせ荷重をかけながら350℃の雰囲気下で封栓
した。The plug-like body 9b thus obtained was sealed in a 350 ° C. atmosphere while applying a load to the through-hole 6a.
【0022】封栓後、他方の排気管を用いてパネル内を
2×10~6Toorまで真空排気し、排気管に接続した真
空ゲージによりパネル内の真空度を観測した結果、従来
方法によると同様の効果が得られることが分かった。After sealing, the inside of the panel was evacuated to 2 × 10 to 6 torr using the other exhaust pipe, and the degree of vacuum in the panel was observed using a vacuum gauge connected to the exhaust pipe. It was found that a similar effect was obtained.
【0023】ここでは錫を用いたが、これ以外にも鉛、
及び錫と鉛等の合金例えばPb10Sn(錫10%合金:30
0℃)などの他の低融点合金も用いることができる。Although tin was used here, lead,
And alloys such as tin and lead, for example, Pb10Sn (tin 10% alloy: 30
Other low melting point alloys such as 0 ° C.) can also be used.
【0024】(実施例3)実施例1、2では本発明の簡
単な実施例について説明した。Embodiment 3 In Embodiments 1 and 2, a simple embodiment of the present invention has been described.
【0025】ここでは生産性を考慮した他の実施例につ
いて図面等を用いて説明する。Here, another embodiment in consideration of productivity will be described with reference to the drawings and the like.
【0026】図7は栓状体を排気孔にとりつけるために
作成した真空ポンプ(図示せず)に接続可能な排気筒1
1を示す。排気筒11は透明なパイレックスガスで作成
し、中の状態が見えるようにしてある。排気筒11内部
には栓状体9aが保持できるばね12を有したシャフト
13を配置し、排気筒11とシャフト12間はOリング
(図示せず)でシールしてある。排気筒11にはパネル
との密着シールするOリング14が配設してある。また
排気筒内部及び周囲の温度をコントロールするため部分
的にヒーターコイル15を設けてある。FIG. 7 shows an exhaust pipe 1 which can be connected to a vacuum pump (not shown) created for attaching the plug to the exhaust hole.
1 is shown. The exhaust pipe 11 is made of transparent Pyrex gas so that the inside state can be seen. A shaft 13 having a spring 12 that can hold the plug 9a is arranged inside the exhaust pipe 11, and the exhaust pipe 11 and the shaft 12 are sealed with an O-ring (not shown). The exhaust pipe 11 is provided with an O-ring 14 for tightly sealing the panel. Further, a heater coil 15 is provided partially to control the temperature inside and around the exhaust pipe.
【0027】以下これを用いた手順を図面により説明す
る。The procedure using this will be described below with reference to the drawings.
【0028】図8はここで用いた栓状体9bを示す断面
図で、16は突起部、17は肉盗み部である。FIG. 8 is a cross-sectional view showing the plug-like body 9b used here, 16 is a projection, and 17 is a stolen portion.
【0029】図9に示すように、シャフト13のばね1
2に栓状体の突起部16をつまみながら固定した栓を貫
通孔に仮合わせする。突起部16周囲は保持ばねが掴み
やすいようにと、また封栓時の収縮応力を緩和できるよ
うに肉盗み17してある。As shown in FIG. 9, the spring 1 of the shaft 13
The plug fixed to 2 while being pinched by the protrusion 16 of the plug is temporarily aligned with the through hole. The periphery of the protruding portion 16 is cut away 17 so that the holding spring can be easily grasped and the contraction stress at the time of sealing can be reduced.
【0030】その後、図10に示すように、排気筒11
をパネルに固定した後、シャフトを引き上げ栓状体を貫
通孔から離し、この状態でパネルを所定の温度(ここで
は350℃)まで加熱しながら排気筒に接続した真空ポン
プでパネル内を排気し、パネル内にXe−Neガスを封入
した。Thereafter, as shown in FIG.
After fixing the panel to the panel, pull up the shaft to separate the plug from the through-hole, and in this state, exhaust the inside of the panel with a vacuum pump connected to an exhaust pipe while heating the panel to a predetermined temperature (here, 350 ° C). Xe-Ne gas was sealed in the panel.
【0031】所定のガス圧に達した後、図11に示すよ
うにシャフトを下降させ貫通孔6aに栓状体9bを押し
込んで固定した。After reaching the predetermined gas pressure, the shaft was lowered as shown in FIG. 11, and the plug 9b was pushed into the through hole 6a and fixed.
【0032】図12は最後の工程で、この状態で充分に
パネル全体を冷却した後、排気筒を取り外してパネルの
貫通孔の封栓を行った。FIG. 12 shows the last step. In this state, after the entire panel was sufficiently cooled, the exhaust pipe was removed and the through hole of the panel was sealed.
【0033】[0033]
【発明の効果】本発明による平面状発光素子は簡易な形
状の栓状体で封栓する事ができるため、従来のガラス管
を用いた封止法に比べ、外力にたいし剛性を持たせる事
が可能である。またパネルを加熱する事で栓状体を取り
外す事もでき、パネルの再生利用も可能である。According to the present invention, the planar light emitting device according to the present invention can be sealed with a plug having a simple shape, so that it has higher rigidity against external force than the conventional sealing method using a glass tube. Things are possible. Further, the plug can be removed by heating the panel, and the panel can be recycled.
【0034】さらに言えば、従来ガラス排気管をパネル
に接合するときに用いた、鉛含有の低融点ガラスの使用
量が大幅に低減できる等の環境に配慮した効果がある。In addition, there is an effect in consideration of the environment such that the amount of use of lead-containing low-melting glass conventionally used for joining a glass exhaust pipe to a panel can be greatly reduced.
【0035】また、パネルからの突起物高さを小さくで
きるためパネル全体の厚さ低減にも寄与できる。Further, since the height of the projection from the panel can be reduced, it can contribute to the reduction in the thickness of the entire panel.
【図1】PDPの従来例を示す断面図。FIG. 1 is a sectional view showing a conventional example of a PDP.
【図2】PDPの従来例を示す断面図。FIG. 2 is a sectional view showing a conventional example of a PDP.
【図3】PDPの従来例を示す断面図。FIG. 3 is a sectional view showing a conventional example of a PDP.
【図4】本発明の一実施例を示す断面図。FIG. 4 is a sectional view showing an embodiment of the present invention.
【図5】本発明の一実施例を示す断面図。FIG. 5 is a sectional view showing an embodiment of the present invention.
【図6】本発明の他の実施例の構成を示す断面図。FIG. 6 is a sectional view showing the configuration of another embodiment of the present invention.
【図7】本発明の他の実施例の構成を示す断面図。FIG. 7 is a sectional view showing the configuration of another embodiment of the present invention.
【図8】本発明の他の実施例の構成を示す断面図。FIG. 8 is a sectional view showing a configuration of another embodiment of the present invention.
【図9】本発明の他の実施例の工程を示す断面図。FIG. 9 is a sectional view showing a step of another embodiment of the present invention.
【図10】本発明の他の実施例の工程を示す断面図。FIG. 10 is a sectional view showing a step of another embodiment of the present invention.
【図11】本発明の他の実施例の工程を示す断面図。FIG. 11 is a sectional view showing a step of another embodiment of the present invention.
【図12】本発明の他の実施例の工程を示す断面図。FIG. 12 is a sectional view showing a step of another embodiment of the present invention.
1a…前面板、 1b…背面板、 2a…電極、 2b…アドレス電極、 3…放電空間、 4…隔壁、 5…シール材。 1a: Front plate, 1b: Back plate, 2a: Electrode, 2b: Address electrode, 3: Discharge space, 4: Partition wall, 5: Seal material.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 笹本 敏雄 東京都千代田区神田駿河台四丁目6番地株 式会社日立製作所家電・情報メディア事業 本部内 (72)発明者 中村 成身 東京都千代田区神田駿河台四丁目6番地株 式会社日立製作所家電・情報メディア事業 本部内 ──────────────────────────────────────────────────続 き Continued on front page (72) Inventor Toshio Sasamoto 4-6-6 Kanda Surugadai, Chiyoda-ku, Tokyo Inside the Home Appliances and Information Media Business Division of Hitachi, Ltd. (72) Inventor Narumi Nakamura Kanda Surugadai, Chiyoda-ku, Tokyo 4-6-Chome Hitachi, Ltd. Home Appliances and Information Media Business Unit
Claims (5)
光素子の真空封止において、パネル面内に形成された排
気用貫通孔と合致する抜き勾配を持った栓状体を前記貫
通孔に挿入固着封止して得た事を特徴とする平面状発光
素子。In a vacuum sealing of a planar light emitting element which is discharged in a rare gas atmosphere, a plug-like body having a draft matching with an exhaust through hole formed in a panel surface is inserted into the through hole. A planar light emitting device characterized by being obtained by being inserted and fixedly sealed in a light emitting device.
し、前記パネルのガラスの熱膨張係数より小さな熱膨張
係数を有する小径ガラス栓で前記排気孔を封じた請求項
1に記載の平面状発光素子。2. The planar shape according to claim 1, wherein said exhaust hole is sealed with a small-diameter glass stopper having a smaller coefficient of thermal expansion than a coefficient of thermal expansion of glass of said panel when said exhaust hole of said planar light emitting element is sealed. Light emitting element.
内壁面に接触する表面が錫、鉛、アンチモン等の低融点
金属もしくは合金等により被覆形成された小径ガラス栓
で前記排気孔を封じた請求項1に記載の平面状発光素
子。3. The small-diameter glass stopper whose surface in contact with the inner wall surface of the panel exhaust hole is covered with a low-melting-point metal or alloy such as tin, lead, or antimony, and the small-diameter glass stopper is sealed with the small-diameter glass stopper. The planar light emitting device according to claim 1.
開放側の面にパネル排気孔に小径ガラス栓を配設するに
用いるつまみ状の突起を設け、肉盗みをした小径ガラス
栓で前記排気孔を封じた請求項1に記載の平面状発光素
子。4. A small-diameter glass stopper, wherein a knob-shaped projection used for arranging a small-diameter glass stopper in a panel exhaust hole is provided on a surface of the panel on an open-air side of the panel, and the small-diameter glass stopper is stolen. The planar light-emitting element according to claim 1, wherein the element is sealed.
栓で前記排気孔を封じた請求項1に記載の平面状発光素
子。5. The planar light-emitting device according to claim 1, wherein the exhaust hole is sealed with a small-diameter glass stopper having a rim with the stopper.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9024784A JPH10223143A (en) | 1997-02-07 | 1997-02-07 | Planar luminous element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9024784A JPH10223143A (en) | 1997-02-07 | 1997-02-07 | Planar luminous element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10223143A true JPH10223143A (en) | 1998-08-21 |
Family
ID=12147821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9024784A Pending JPH10223143A (en) | 1997-02-07 | 1997-02-07 | Planar luminous element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10223143A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013219224A (en) * | 2012-04-10 | 2013-10-24 | Nec Corp | Vacuum package, manufacturing method of vacuum package, and sensor |
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- 1997-02-07 JP JP9024784A patent/JPH10223143A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013219224A (en) * | 2012-04-10 | 2013-10-24 | Nec Corp | Vacuum package, manufacturing method of vacuum package, and sensor |
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