JPH1022641A - Multilayer printed wiring board and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable multilayer printed wiring board where the adhesion to an electroless and electrolytic plated film and the adhesion to a conductive circuit pattern show excellent adhesive strength, easily and at a low price, by constituting the resin insulating layer consisting of heat- resistant resin in the two layers of an easy-toadhesion layer and a high peel strength layer. SOLUTION: These are a multilayer printed wiring board where the resin insulating layer 3 consists of the two layers of an easy-to-adhesion layer 3a mainly constituted of resin high in adhesion with the conductor circuit pattern 2, and a high peel strength layer 3b high in adhesion with an electroless and electrolytic plated film, and the high peel strength layer 3b consists of the one where silica fine particles soluble to alkali are added to heat-resistant resin used for the easy-to-adhesion layer 3a, in a multilayer printed wiring board where conductor circuit patterns 2 consisting of electroless plating and electrolytic plating and the resin insulating layers 3 consisting of heat-resistant resin are stacked alternately, and its manufacture.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board, and more particularly to a multilayer printed wiring board in which a resin insulating layer is composed of two layers, an easy-adhesion layer and a high peel strength layer.

[0002]

2. Description of the Related Art In recent years, with the advance of electronic technology, electronic devices such as large-sized computers have been increased in density or speed of arithmetic functions. As a result, high-density multilayer printed wiring boards have come into the spotlight in printed wiring boards.

Conventionally, as a multilayer printed wiring board, for example, a multilayer printed wiring board in which an internal circuit is connected and made conductive is typical. However, in such a multilayer printed wiring board, since a plurality of internal circuits are connected and conducted through through holes, the wiring circuit becomes too complicated, and it is difficult to realize high density or high speed. Met.

[0004] As a multilayer printed wiring board capable of overcoming such problems, a multilayer printed wiring board in which conductive circuits and organic insulating films are alternately built up has been developed recently. This multilayer printed wiring board is suitable for ultra-high density and high speed, but has a drawback in that it is difficult to form an electroless plating film on an organic insulating film with high reliability.

For this reason, in such a multilayer printed wiring board, the conductor layer is formed by a PVD method such as vapor deposition or sputtering, or a combined method of the PVD method and the electroless plating. The circuit forming method has problems that productivity is low and cost is high.

Recently, as a method for forming an electroless plating film on such an organic insulating film with high reliability, an electroless plating film is mixed with a oxidizing agent in a resin insulating layer and dissolved and removed. A method of roughening a resin surface in contact with a plating film has been proposed. For example, JP-A-64-47
No. 095, an epoxy resin soluble in an oxidizing agent in a resin layer using a heat-resistant resin insulating layer as a matrix,
A mixture of a resin such as bismaleimide / triazine resin or polyester resin and a resin or inorganic filler that is insoluble in an oxidizing agent, roughening the surface of the resin insulating layer with an oxidizing agent to enhance the anchoring effect of electroless plating film formation And so on. Further, as disclosed in Japanese Patent Application Laid-Open No. 61-276875, a method of improving the adhesiveness to an electroless plating film by incorporating a diene rubber component or the like into the heat-resistant insulating resin molecule has been proposed.

However, according to these methods, the heat resistance of the resin modifier itself such as resin particles and rubber components dissolved in the heat-resistant resin insulating layer with an oxidizing agent or the like is inferior. There has been a problem of lowering the heat resistance of the resin insulating layer.

[0008]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the conventional multilayer printed wiring board,
By forming the resin insulation layer made of a heat-resistant resin into a two-layer structure of an easy-adhesion layer and a high-peel-strength layer, the adhesion to electroless and electrolytic plating films and the adhesion to conductor circuit patterns are both excellent. An object of the present invention is to provide a multilayer printed wiring board having high heat resistance easily and at low cost.

[0009]

Means for Solving the Problems In order to solve the above problems in the present invention, first, in claim 1, a conductive circuit pattern made of electroless plating and electrolytic plating and a resin insulating layer made of a heat-resistant resin are used. Are alternately laminated, the resin insulating layer has an adhesive layer mainly composed of a resin having high adhesiveness to the conductive circuit pattern, and a high adhesion between the electroless and electrolytic plating films. A multilayer printed wiring board comprising two layers of a high peel strength layer.

[0010] According to a second aspect of the present invention, the high peel strength layer is formed by adding a heat resistant fine powder to a heat resistant resin used for the easy adhesion layer. It is a printed wiring board.

According to a third aspect of the present invention, in the multilayer printed wiring board according to the first or second aspect, the heat-resistant fine powder is alkali-soluble silica-based fine particles.

Further, the method according to any one of claims 1 to 3, further comprising the following steps (a) to (e). (A) A photosensitive resin composition (Solution A) comprising a photosensitive resin component, a thermosetting resin component, a photopolymerization initiator and a solvent, and silica-based fine particles added to the photosensitive resin composition (Solution A) A step of preparing a photosensitive resin composition (Solution B) as described above. (B) A photosensitive resin composition (Solution A) is first applied onto the insulating substrate on which the conductive circuit pattern is formed, and then a photosensitive resin composition (Solution B) is applied to form a two-layer photosensitive resin. A step of forming a layer, exposing and baking a predetermined pattern, developing, and then heating and curing to form a resin insulating layer including an easy-adhesion layer and a high peel strength layer. (C) forming an anchor layer by treating the surface of the high peel strength layer of the resin insulating layer with alkali; (D) a step of forming a second conductor layer by performing electroless plating and electrolytic plating, and performing a patterning process to form a second conductor circuit pattern; (E) A step of manufacturing the multilayer printed wiring board by repeating the above steps (b) to (d) a required number of times.

According to the present invention, the resin insulating layer constituting the multilayer printed wiring board is formed of an easy-adhesion layer having high adhesiveness to a conductor circuit pattern and a high peel strength layer having high adhesiveness to electroless and electrolytic plating films. By having a two-layer structure of
It is possible to provide a multilayer printed wiring board having excellent adhesion strength to both electroless and electrolytic plating films and adhesion to a conductive circuit pattern, and having high heat resistance.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail. FIG. 1 is a sectional view showing the configuration of the multilayer printed wiring board of the present invention.

First, the resin insulating layer 3 constituting the multilayer printed wiring board of the present invention comprises a photosensitive resin composition (A) comprising a photosensitive resin component, a thermosetting resin component, a photopolymerization initiator and a solvent. Liquid) and the photosensitive resin composition (liquid A) to which alkali-soluble silica-based fine particles are added.
Liquid), the photosensitive resin composition (A liquid) is first applied on the insulating substrate 1 on which the conductive circuit pattern 2 is formed,
Next, a photosensitive resin composition (solution B) is applied to form a two-layer photosensitive resin layer, a predetermined pattern is exposed and baked, developed, heated and cured to form a heat-resistant easy-adhesion layer 3a.
And a high peel strength layer 3b.

First, the photosensitive resin component constituting the photosensitive resin composition is obtained by reacting a reaction product of a bisphenol type epoxy compound and an unsaturated monocarboxylic acid with a saturated or unsaturated polybasic acid anhydride. Of an ultraviolet curable resin obtained by the above method. Specific examples of the bisphenol component include bis (4-hydroxyphenyl) ketone, bis (4-hydroxy-3,5-dimethylphenyl) ketone, bis (4
-Hydroxy-3,5-dichlorophenyl) ketone, bis (4-hydroxyphenyl) sulfone, bis (4-hydroxy-3,5-dimethylphenyl) sulfone, bis (4-hydroxy-3,5-dichlorophenyl) sulfone, bis (4-hydroxyphenyl) methane, bis (4
-Hydroxy-3,5-dimethylphenyl) methane, bis (4-hydroxy-3,5-dichlorophenyl) methane, bis (4-hydroxyphenyl) hexafluoropropane, bis (4-hydroxy-3,5-dimethylphenyl) Hexafluoropropane, bis (4-hydroxy-3,5-dichlorophenyl) hexafluoropropane, bis (4-hydroxyphenyl) dimethylsilane,
Bis (4-hydroxy-3,5-dimethylphenyl) dimethylsilane, bis (4-hydroxy-3,5-dichlorophenyl) dimethylsilane, bis (4-hydroxyphenyl) methane, bis (4-hydroxy-3,5- Dichlorophenyl) methane, bis (4-hydroxy-3,5)
-Dibromophenyl) methane, 2,2-bis (4-hydroxyphenyl) propane, 2,2-bis (4-hydroxy-3,5-dimethylphenyl) propane, 2,2-
Bis (4-hydroxy-3,5-dichlorophenyl) propane, 2,2-bis (4-hydroxy-3-methylphenyl) propane, 2,2-bis (4-hydroxy-3
-Chlorophenyl) propane, bis (4-hydroxyphenyl) ether, bis (4-hydroxy-3,5-dimethylphenyl) ether, bis (4-hydroxy-
3,5-dichlorophenyl) ether and the like.

Specific examples of the unsaturated monocarboxylic acid include acrylic acid, methacrylic acid, and cinnamic acid.

Further, specific examples of the saturated or unsaturated polybasic anhydride include, for example, maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, Dibasic acid anhydrides such as methylhexahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, methylendmethylenetetrahydrophthalic anhydride, chlorendic anhydride, methyltetrahydrophthalic anhydride; trimellitic anhydride, pyromellitic anhydride, Aromatic polycarboxylic anhydrides such as benzophenonetetracarboxylic dianhydride; and other accompanying compounds such as 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1,2-dicarboxylic acid Polycarboxylic acid anhydride derivatives such as acid anhydrides can be used

Next, the thermosetting resin component constituting the photosensitive resin composition comprises two types of epoxy compounds,
One is an alicyclic epoxy compound and the other is an epoxy compound having a structure containing an aromatic ring. Specific examples of the alicyclic epoxy compounds include various derivatives of cyclohexene oxide and hydrogenated compounds of the aromatic epoxies. Specific examples of the epoxy compound having a structure containing an aromatic ring include phenol novolak epoxy resin, cresol novolak epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin,
Epoxy resin such as biphenyl type epoxy resin and alicyclic epoxy resin, and at least three epoxy groups such as phenyl glycidyl ether, p-butylphenol glycidyl ether, triglycidyl isocyanurate, diglycidyl isocyanurate, allyl glycidyl ether and glycidyl methacrylate; And the like.

The weight ratio of the alicyclic epoxy compound to the epoxy compound having an aromatic ring is preferably from 4: 1 to 1: 1. , 2.5: 1 to 1.5: 1. If the weight ratio of the alicyclic epoxy compound to the epoxy compound having a structure containing an aromatic ring is out of the above range, the glass transition temperature (Tg) is extremely reduced, heat resistance is lowered, and plating adhesion strength ( Peel strength), and it may be difficult to form an electroless plating film with high reliability.

Further, as the photopolymerization initiator constituting the photosensitive resin composition, for example, acetophenone, 2,2-
Diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminopropiophenone, dichloroacetophenone, trichloroacetophenone, p-ter
Acetophenones such as t-butylacetophenone, benzophenone, 2-chlorobenzophenone, p, p'-
Benzophenones such as bisdimethylaminobenzophenone; benzoin ethers such as benzyl, benzoin, benzoin methyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzyl dimethyl ketal, thioxanthone, 2-chlorothioxanthone, and 2,4- Sulfur compounds such as diethylthioxanthone, 2-methylthioxanthone and 2-isopropylthioxanthone; and anthraquinones such as 2-ethylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, and 2,3-diphenylanthraquinone; Organic peroxides such as azobisisobutylnitrile, benzoyl peroxide, cumene peroxide, 2-mercaptobenzimidazole, 2-mercaptobenzoxazo , Thiol compounds such as 2-mercaptobenzothiazole and the like. These compounds may be used in combination of two or more. In addition, a compound which does not act as a photopolymerization initiator by itself, but can be used in combination with the above compound, can increase the ability of the photopolymerization initiator. Such compounds include, for example, tertiary amines such as triethanolamine, which are effective when used in combination with benzophenone.

Further, as the silica-based fine particles to be dissolved in the alkaline solution constituting the photosensitive resin composition, those having an acid surface of the fine particles are preferable, and specifically, those having a pH of 2 to 6 in a slurry state of about 5%. Are highly soluble in alkaline solutions, and those having a pH of about 3 to 5 are particularly desirable. The silica-based fine particles on the surface of the resin insulating layer are dissolved by an alkaline solution, and the surface of the resin insulating layer is uniformly roughened, whereby a clear anchor is formed. As a result, high adhesion strength with the electroless plating film is obtained. And reliability.

The compounding amount of the silica-based fine particles is preferably in the range of 5 to 100 parts by weight based on 100 parts by weight (solid content) of the heat-resistant resin constituting the matrix.
In particular, it is preferable that the content be in the range of 10 to 50 parts by weight in order to increase the adhesion strength between the resin insulating layer and the electroless plating film.

The solvent used in the photosensitive resin composition is usually a solvent such as methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, butyl cellosolve, butyl cellosolve acetate, butyl carbitol, butyl cellulose, tetralin, dimethylformamide. , N-methylpyrrolidone and the like.

In the photosensitive resin composition, if necessary, for example, an organic filler such as a fluorine resin, a polyimide resin or a benzoguanamine resin, or silica, talc, alumina, clay, calcium carbonate or titanium oxide And an inorganic filler such as barium sulfate.

Further, in the above-mentioned photosensitive resin composition, an epoxy group curing accelerator, a thermal polymerization inhibitor, a plasticizer, a dispersant, a leveling agent, an antifoaming agent, an ultraviolet absorber,
It is possible to add additives such as flame retardants, coloring pigments and the like.

Next, a method for manufacturing a multilayer printed wiring board will be specifically described. 2 (a) to 2 (f) show a manufacturing process of the multilayer printed wiring board of the present invention. First, the insulating substrate 1
A conductive circuit pattern 2 is formed thereon (see FIG. 2A). As the insulating substrate 1, for example, a plastic substrate,
A ceramic substrate, a film substrate, or the like can be used, and specifically, a glass epoxy substrate, a bismaleimide-triazine substrate, a low-temperature fired ceramic substrate, an aluminum nitride substrate, a polyimide film substrate, or the like can be used.

Next, the above-mentioned photosensitive resin composition (Solution A) is applied on the insulating substrate 1 on which the conductor circuit pattern 2 has been formed to form a photosensitive resin layer 3a '(see FIG. 2 (b)). As a method for applying the photosensitive resin composition, for example, a roller coating method, a dip coating method, a spray coating method, a spin coating method, a curtain coating method, a screen printing method, or the like can be applied. Further, a method of attaching a photosensitive resin film obtained by processing the above photosensitive resin composition into a film shape can also be applied.

Next, the photosensitive resin composition (Solution B) is applied on the photosensitive resin layer 3a 'to form a photosensitive resin layer 3b', which is dried to form a two-layer photosensitive resin layer 3b '. (See FIG. 2 (c)). Here, the preferable thickness of the photosensitive resin layer 3 'is usually about 20 to 100 [mu] m, but it can be made larger when particularly high insulation is required.

Next, after exposing using a photomask having a predetermined pattern formed on the photosensitive resin layer 3 ', it is developed using a weak alkaline aqueous solution, and is heated and cured at a temperature of 150 ° C. or more to form a via hole forming hole. The resin insulating layer 3 including the easy-adhesion layer 3a and the high-peel strength layer 3b having the layer 4 is formed (see FIG. 2D).

Here, examples of the alkaline solution include an aqueous solution of sodium carbonate, an aqueous solution of sodium hydrogen carbonate, an aqueous solution of diethanolamine, an aqueous solution of triethanolamine, an aqueous solution of ammonium hydroxide, and an aqueous solution of sodium hydroxide. Above all, an aqueous solution of diethanolamine is particularly preferable since it has appropriate alkalinity and does not cause sodium ions to remain on the resin on the substrate after development.

After the alkali development, an epoxy curing treatment is performed by heating to improve the alkali resistance. this is,
Not only is the durability significantly improved in strong alkaline water, but also various properties such as adhesion to metals such as glass and copper, heat resistance, and surface hardness are improved.

Next, the silica fine particles on the surface of the high peel strength layer 3b are dissolved and removed using an alkaline solution. As a method of dissolution removal, immerse the substrate in an alkaline solution,
A method such as spraying an alkaline solution on the surface of the resin insulating layer can be applied.

Next, the second conductor layer 6 having the via hole 5 is formed by performing electroless plating and electrolytic plating on the insulating resin layer 3 having the via hole forming hole (see FIG. 2E). Examples of the electroless and electrolytic plating methods include copper plating, nickel plating, gold plating, silver plating, and tin plating, but copper plating is generally used.

Next, a photoresist is applied on the second conductor layer 6, and a second conductor pattern 6a is formed by a photo patterning process (see FIG. 2F). As a method for forming the conductor pattern, in addition to the method of forming the conductor layer by the photopatterning process after forming the conductor layer, the conductor pattern is formed in advance with a plating resist, and then the electroless plating is performed. Also, an additive method of directly forming a conductor pattern by performing electrolytic plating can be applied.

Through the above steps, a multilayer printed wiring board of the present invention having a two-layer conductor pattern is obtained. Further, in the case of manufacturing a multilayer wiring board having two or more layers, a desired multilayer printed wiring board can be obtained by sequentially repeating the resin insulating layer and the conductor pattern forming step.

[0037]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment for manufacturing a multilayer printed wiring board according to the present invention will be described below.

Example 1 First, a reaction product of bisphenol A type epoxy resin Epicoat 1001 (made by Yuka Shell Epoxy) and acrylic acid was reacted with a 1: 1 mixture of pyromellitic anhydride and tetraphthalic anhydride. 40 parts by weight of the obtained ultraviolet curable resin, 20 parts by weight of alicyclic epoxy resin EHPE-3150 (manufactured by Daicel Chemical),
5 parts by weight of an epoxy resin HP-7200H (manufactured by Dainippon Ink and Chemicals) containing an aromatic ring, and a dispersant (BYK-CHEM)
0.5 parts by weight, defoamer (BYK-CHEMI)
E) (0.5 parts by weight, photopolymerization initiator Lucirin-
4 parts by weight of TPO (manufactured by BASF) were mixed and kneaded with a three-roll mill to prepare a photosensitive resin composition (solution A).

An ultraviolet curable compound obtained by reacting a reaction product of bisphenol A type epoxy resin Epicoat 1001 (made by Yuka Shell Epoxy) with acrylic acid with a one-to-one mixture of pyromellitic anhydride and tetraphthalic anhydride. 40 parts by weight of resin, alicyclic epoxy resin EHPE-31
50 (manufactured by Daicel Chemical) 20 parts by weight, epoxy resin HP-7200H containing an aromatic ring (manufactured by Dainippon Ink and Chemicals) 5
Parts by weight, 10 parts by weight of silica gel fine powder FB-3S (manufactured by Denki Kagaku Kogyo, average particle size 3 μm), dispersant (BYK-C)
0.5 parts by weight, defoamer (BYK-CH)
0.5 parts by weight, photopolymerization initiator Lucir
4 parts by weight of in-TPO (manufactured by BASF) were mixed, 20 parts by weight of ethyl cellosolve acetate was added to the mixture, and the mixture was stirred and kneaded with three rolls to obtain a photosensitive resin composition (solution B). ) Was prepared.

Next, the above-mentioned photosensitive resin composition (Solution A) is applied on the glass epoxy insulating substrate 1 on which the first conductive circuit pattern 2 is formed by screen printing and dried to form a photosensitive resin layer 3a '. Was formed (see FIG. 2B). Similarly, on the photosensitive resin layer 3a ', the photosensitive resin composition (B
The liquid was applied by screen printing and dried to form a photosensitive resin layer 3b ', thereby forming a two-layered photosensitive resin layer 3' having a thickness of about 50 μm (see FIG. 2 (c)).

Next, 700 mJ / cm ² is applied through a photomask in which a predetermined pattern is formed on the photosensitive resin layer 3 ′.
, Developed with a 1% aqueous solution of diethanolamine at 30 ° C. for 1 minute, and heat-cured at 180 ° C. for 1 hour to form an easy-adhesion layer 3a having via hole forming holes and a high peel strength layer 3b. A resin insulating layer 3 was formed (see FIG. 2D).

Next, the high peel strength layer 3b, which is the surface layer of the resin insulating layer 3, is immersed in a swelling liquid (manufactured by Shipley Co.) at 50.degree.
For 5 minutes at 70 ° C. for 5 minutes in a mixed solution of potassium permanganate / sodium hydroxide to roughen the surface of the high-peel strength layer 3b, and then immersed in a neutralizing solution (manufactured by Shipley), and Dried.

Next, after applying a palladium catalyst (manufactured by Shipley) on the roughened resin insulating layer and activating the surface with an accelerator (manufactured by Shipley), an electroless plating solution (manufactured by Shipley) is used. Immersion in an electrolytic plating solution (sulfuric acid-copper sulphate) for 2 hours while applying a current of 1 A / dm ² to a 25 μm
A thick second conductor layer 6 was formed (see FIG. 2E).

Next, a photoresist is applied on the second conductor layer 6, and the second conductor layer 6 is subjected to the second photolithography process.
A conductive circuit pattern 6a was formed (see FIG. 2 (f)).
Through the above steps, a multilayer printed wiring board according to the present invention including two conductive circuit patterns was obtained.

The adhesive strength between the insulating resin layer and the copper plating layer of the multilayer printed wiring board obtained by the above method was measured according to JIS-C-
When measured by the method of No. 6481, 1000 to 1200
(G / cm), indicating a sufficient adhesive strength.

[0046]

According to the multilayer printed wiring board of the present invention, since the resin insulating layer has a two-layer structure, the adhesive strength to the electroless and electrolytic plating films and the adhesive strength to the conductive circuit pattern are both excellent. Thus, a multilayer printed wiring board having high heat resistance can be easily and inexpensively manufactured.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of a multilayer printed wiring board according to the present invention.

FIGS. 2A to 2F are process cross-sectional views illustrating a method for manufacturing a multilayer printed wiring board according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating board 2 ... 1st conductor circuit pattern 3 ... Resin insulating layer 3a ... Easy adhesion layer 3b ... High peel strength layer 3 '... Photosensitive resin layer 3a' ... Photosensitive resin layer 3b 'photosensitive resin layer 4 via hole forming hole 5 via hole 6 second conductor layer 6a second conductor circuit pattern

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Jiro Watanabe 1-5-1, Taito, Taito-ku, Tokyo Toppan Printing Co., Ltd.

Claims (4)

[Claims] 1. A multilayer printed wiring board in which conductive circuit patterns made of electroless plating and electrolytic plating and resin insulating layers made of a heat-resistant resin are alternately laminated, wherein the resin insulating layer is formed by A multilayer printed wiring board comprising two layers: an easy-adhesion layer mainly composed of a resin having high adhesiveness, and a high peel strength layer having high adhesion to electroless and electrolytic plating films. 2. The multilayer printed wiring board according to claim 1, wherein the high peel strength layer is formed by adding a heat-resistant fine powder to a heat-resistant resin used for the easy-adhesion layer. 3. The multilayer printed wiring board according to claim 1, wherein the heat-resistant fine powder is alkali-soluble silica-based fine particles. 4. The method for manufacturing a multilayer printed wiring board according to claim 1, further comprising the following steps (a) to (e). (A) A photosensitive resin composition (Solution A) comprising a photosensitive resin component, a thermosetting resin component, a photopolymerization initiator, and a solvent, and silica-based fine particles added to the photosensitive resin mixture (Solution A). Producing a photosensitive resin composition (solution B). (B) A photosensitive resin composition (Solution A) is first applied onto the insulating substrate on which the first conductive circuit pattern is formed, and then a photosensitive resin composition (Solution B) is applied to form two layers of photosensitive resin. Forming a conductive resin layer, exposing and baking a predetermined pattern, developing, and heat-curing to form a resin insulating layer including an easy-adhesion layer and a high-peel strength layer. (C) forming an anchor layer by treating the surface of the high peel strength layer of the resin insulating layer with alkali; (D) a step of forming a second conductor layer by performing electroless plating and electrolytic plating, and performing a patterning process to form a second conductor circuit pattern; (E) A step of manufacturing the multilayer printed wiring board by repeating the above steps (b) to (d) a required number of times.