JPH10144773A - Substrate holder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a holder which holds a substrate where a thin film is formed and capable of enhancing a thin film on the substrate in formation efficiency and reducing the substrate's defects caused by dusts attached to the substrate. SOLUTION: A substrate holder 11 holds a substrate 3 housed in a recessed part, where a recess 13 is provided to the substrate's surface opposite to its other surface where the substrate 3 is provided so as to make a part of the surface of the holder 11 corresponding to the substrate 3 different from the rest of the surface in a contacting area ratio to a heater 4, whereby the temperature of the surface 15 of the holder 11 is set equal to or lower than of the substrate 3.

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holder, and more particularly, to a substrate holder useful for forming a thin film such as a semiconductor, an insulator, and a conductor. 2. Description of the Related Art When forming a thin film on various substrates, the substrate is often heated with a heater to increase the temperature. Therefore, a substrate holder is required for positioning and transporting the substrate, and the substrate is often buried and held in the substrate holder and heated in a state of being placed on a heater. FIG. 7 shows an example of a substrate holder according to the prior art.
Shown in As shown in FIG. 1, a substrate holder 1 has a positioning recess 2 for embedding / holding a substrate for positioning. The substrate holder 1 is made of metal such as SUS, Inconel, Hastelloy, or carbon, ceramics or the like. The material is selected and configured. As shown in FIG. 8, the substrate holder 1 is placed on the heater 4 with the substrate 3 buried in the recess 2, and the substrate 4 is heated by energizing and heating the heater 4. [0004] The substrate holder 1 according to the prior art as described above has a different thermal conductivity due to a difference in the material between the substrate holder 1 and the substrate 3.
In some cases, the temperature of the surface 5 of the substrate holder 1 is higher than the temperature of the surface of the substrate 3, and the film may be formed thicker on the surface 5 of the substrate holder 1 than on the substrate 3. This is because a thin film forming method such as a thermal CVD method has a property that a thick film is formed at a high temperature. Therefore, in this case, there is a problem that the efficiency of film formation on the substrate 3 (amount of the film / amount of the supplied material) is reduced. In addition, the surface 5 of the substrate holder 1 is
When a thick film is deposited on the substrate 3, the deposited film is peeled off and moved to the surface of the substrate 3, causing a defect of the substrate 3 due to adhesion of dust. For this reason, there has been a problem that the substrate holder 1 must sometimes be washed to remove deposits. In particular, in the case of the substrate holder 1 in which a carbon material is coated with ceramics, there is a problem that the ceramic coating is peeled off when the substrate holder 1 is washed. Since it is immediately oxidized in an atmosphere, it cannot be used. Further, the material of the substrate holder 1 is SUS,
Heater 4 for metals such as Inconel and Hastelloy
When the temperature of the substrate holder is 200 ° C. or higher, thermal stress concentrates on the thin portion of the substrate holder 1 and the substrate holder 1 is deformed as shown in FIG. 9, and the substrate 3 and the substrate holder 1 are separated from each other. There is a problem that the heat of No. 4 is not transmitted to the substrate 3 and the temperature of the substrate 3 does not rise. Further, the material of the substrate holder 1 is carbon,
If a material other than metal such as ceramics is used, such thermal deformation does not occur, but there is a problem that not only the production cost of the substrate holder 1 rises but also the delivery time is required. In particular, in the case of carbon, carbon is remarkably oxidized in an oxidizing atmosphere at high temperatures, so it cannot be used with carbon material alone, and it is necessary to coat a ceramic thin film on the surface of the carbon material. Requires a special coating technique. This, combined with this, further increases the production cost. In view of the above prior art, the present invention improves the efficiency of film formation on a substrate, reduces defects of the substrate due to dust adhesion, and heats a predetermined substrate without causing thermal deformation even with inexpensive metal. It is an object of the present invention to provide a substrate holder capable of performing the following. [0009] The structure of the present invention that achieves the above object is characterized by the following points 1) to 4). 1) In a substrate holder for forming a thin film for burying and holding a substrate on which a thin film is to be grown, a concave portion is formed on a surface of the substrate holder opposite to the surface in contact with the substrate and on the side in contact with the heater. To reduce the contact area with the heater. According to the present invention, the surface temperature of the substrate holder corresponding to the concave portion can be suppressed lower than that of other portions. 2) In the substrate holder described in 1), the concave portion is provided in a portion other than the portion corresponding to the portion of the substrate holder in which the substrate is embedded and held. According to the present invention, the portion of the substrate holder other than the portion where the substrate is buried / held therein has a small contact area ratio with the heater, so that heat flows into the substrate holder from this heater by heat conduction. Can be suppressed. On the other hand, the part of the substrate holder that embeds and holds the substrate is in full contact with the heater, so the heat inflow from the heater to the substrate holder due to heat conduction is large,
This heat flows into the substrate and efficiently raises the substrate temperature. That is, as in the present invention, the temperature of the surface of the substrate holder is made the same as the surface of the substrate by making the amount of heat inflow due to heat conduction from the heater different between the buried / holding portion of the substrate and the other portions. Or less. 3) In a substrate holder for forming a thin film for burying and holding a substrate on which a thin film is to be grown, a structure in which a portion in contact with a surface of the substrate and a portion not in contact with the substrate are separated from each other. 4) In the substrate holder described in 3), a portion that is in contact with the surface of the substrate and a portion that is not in contact with the substrate are made of different materials. According to the inventions of 3) and 4) above, since the embedded / holding portion of the substrate and the peripheral portion are separated from each other, the thickness of each component member can be made uniform. As a result, the substrate holder does not undergo thermal deformation and the substrate and the substrate holder adhere to each other, so that heat from the heater is effectively transmitted to the substrate. That is, since the thickness of each of the multi-component members can be made uniform, the thermal stress when the holder is placed on the heater and heated is not concentrated on a specific portion such as a thin portion. As a result, the substrate holder is not deformed, and the members in contact with the substrate are not thermally deformed, so that the heat of the heater is effectively transmitted to the substrate,
The temperature of the substrate can be raised to the same extent as if the substrate were placed directly on the heater. Embodiments of the present invention will be described below in detail with reference to the drawings. Note that the same portions are denoted by the same reference numerals in the related art and the embodiments, and the overlapping description is omitted. FIG. 1 is a sectional structural view showing a first embodiment of the present invention. As shown in FIG.
The surface (upper surface) 15 is provided with a concave portion 2, and the substrate 3 is embedded and held in the concave portion 2.
On the other hand, on the back surface (lower surface) of the substrate holder 11 on the side in contact with the heater 4, a concave portion 13 is provided in a portion other than the portion corresponding to the concave portion 2, which is the embedding / holding portion of the substrate 3. As shown in FIG. 2, the substrate holder 11
Is mounted on the heater 4, the recess 2, which is an embedded / holding portion of the substrate 3, is provided between the heater 4 and the substrate holder 11.
Due to the recess 13 formed in a portion other than the portion corresponding to the above, there is a space not in contact with the heater 4. As a result, when the heater 4 is energized and heated, the temperature of the substrate 3 rises due to heat conduction. However, only heat transmitted by radiation in the space formed by the concave portion 13 flows into the surface 15 of the substrate holder 11, Since the amount is much smaller than the amount of heat due to heat conduction, the temperature of the surface 15 of the substrate holder 11 does not become higher than the temperature of the surface (upper surface) of the substrate 3. When a film is formed by the thermal CVD method in this state, more films are formed on the surface of the substrate 3 than on the surface of the substrate holder 11, and the film forming efficiency is improved. Further, since a film is not formed on the surface of the substrate holder 11 to a large extent, dust is less likely to be transferred to the surface of the substrate 3 due to peeling from the surface, and the occurrence of defects on the substrate 3 is reduced accordingly. . That is, in this embodiment, the contact area ratio between the portion corresponding to the concave portion 2 and the other portion of the surface of the substrate holder 11 which contacts the heater 4 is different.
The temperature of the surface 15 of the substrate holder 11 is equal to or lower than the temperature of the surface of the substrate 3. FIG. 3 is a sectional structural view showing a second embodiment of the present invention. As shown in the figure, in the present embodiment, the recesses 24a and 24b are formed so that the contact area ratio between the substrate holder 21 and the heater 4 is larger than in the first embodiment, and the surface 25 of the substrate holder 21 is formed. Is higher than that in the first embodiment.
By changing the contact area ratio with the heater 4 in this manner, the temperature of the surface 25 of the substrate holder 21 can be controlled to a desired temperature. FIG. 4 is a sectional structural view showing a third embodiment of the present invention. As shown in the figure, the substrate holder 31 according to the present embodiment has a stainless steel substrate embedding / holding member 31a in contact with the surface of the substrate 3 and a stainless steel peripheral member 31b not in contact with the surface of the substrate 3. In addition, flanges 31c and 31d having a thickness of about 0.3 mm are provided to prevent the substrate burying / holding member 31a from dropping when the peripheral member 31b is lifted by combining them. Here, when the substrate embedding / holding member 31a is placed on the heater 4, the contact between the substrate embedding / holding member 31a and the upper surface of the heater 4 is ensured.
a is designed so as to protrude downward by about 1 mm. Also,
The substrate burying / holding member 31a and the peripheral member 31b can be manufactured independently, and each is configured to have a uniform thickness. FIG. 5 shows a state where the substrate 3 is embedded in the substrate
2 shows a state when it is buried and held, and installed on the heater 4. Since the thickness of each component of the substrate holder 31 according to the present embodiment is uniform, even when the temperature of the heater 4 is increased, the thermal stress on the substrate holder 31 does not concentrate on a specific position. As a result, no thermal deformation occurs in the substrate holder 31, and the temperature of the substrate 3 can be effectively increased. FIG. 6 is a sectional structural view showing a fourth embodiment of the present invention. As shown in the drawing, the outer shape of a substrate holder 41 according to the present embodiment is the same as that of the substrate holder 31 according to the third embodiment. In the present embodiment, the material of the substrate burying / holding member 41a is made of a material different from that of the peripheral member 31b, and the substrate burying / holding member 41a is made of Cu, Ag having a higher thermal conductivity than stainless steel, or an alloy containing them. The heating of the substrate 3 can be performed more effectively. The substrate holders 31 and 41 are particularly useful as substrate holders for forming a thin film, but are not limited to these. The present invention can also be applied to a substrate holder of a heat treatment apparatus. As described above in detail with the embodiments, according to the present invention, the surface temperature of the substrate and the surface temperature of the substrate holder can be easily controlled. Therefore, if the present invention is applied to a substrate holder for forming a thin film by a thermal CVD method, the efficiency of film formation on a substrate can be increased, and the defect of the film due to adhesion of dust can be reduced. According to the substrate holder of the present invention, the substrate can be effectively heated. For this reason, the present invention
If the present invention is applied to a substrate holder of an apparatus for forming a thin film such as VD or PVD, the substrate can be heated without deforming the substrate holder, so that the temperature distribution on the surface of the substrate can be made uniform and uniform. A thin film can be formed. Further, if the present invention is applied to a substrate holder of a heat treatment apparatus, the distribution of the substrate temperature can be made uniform, so that
A uniform heat treatment effect can be obtained.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional structural view showing a substrate holder according to a first embodiment of the present invention. FIG. 2 is a cross-sectional configuration diagram showing a mode when the substrate holder shown in FIG. 1 is placed on a heater and heated. FIG. 3 is a sectional structural view showing a substrate holder according to a second embodiment of the present invention. FIG. 4 is a sectional structural view showing a substrate holder according to a third embodiment of the present invention. FIG. 5 is a cross-sectional configuration diagram showing a mode when the substrate holder shown in FIG. 4 is placed on a heater and heated. FIG. 6 is a sectional structural view showing a substrate holder according to a fourth embodiment of the present invention. FIG. 7 is a sectional structural view showing a substrate holder according to the related art. FIG. 8 is a cross-sectional configuration diagram showing an aspect in which the substrate holder shown in FIG. 7 is placed on a heater and heated. FIG. 9 is a cross-sectional configuration diagram showing an aspect (state in which deformation due to thermal stress has occurred) when the substrate holder shown in FIG. 7 is placed on a heater and heated. [Description of Signs] 3 Substrate 4 Heaters 11, 21, 31, 41 Substrate holders 13, 24a, 24b Concave portion 12 Substrate burying portion 13, 15 Substrate holder surface 31a, 41a Substrate burying / holding member 31b Peripheral member

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[Procedure amendment] [Submission date] December 26, 1996 [Procedure amendment 1] [Document name to be amended] Description [Item name to be amended] Explanation of sign [Amendment method] Change [Content of amendment] Description: 1 , 11, 21, 31, 41 Substrate holder 2 Substrate embedding part 3 Substrate 4 Heater 5 , 15, 25 Substrate holder surface 13, 24a, 24b Depression 31a, 41a Substrate embedding / holding member 31b Peripheral members 31c, 31d Flange Department

Claims (1)

Claims 1. A substrate holder for burying and holding a substrate on which a thin film is to be grown, for forming a thin film or the like, the surface being opposite to the surface of the substrate holder in contact with the substrate and being in contact with the heater. A substrate holder characterized in that a concave area is provided on a surface on the side to be contacted to reduce a contact area with a heater. 2. The substrate holder according to claim 1, wherein the recess is provided in a portion other than a portion corresponding to a portion of the substrate holder in which the substrate is embedded and held. 3. A substrate holder for forming a thin film for embedding and holding a substrate on which a thin film is to be buried, wherein a portion in contact with a surface of the substrate and a portion not in contact with the surface of the substrate are separated from each other. 4. The substrate holder according to claim 3, wherein a portion that is in contact with the surface of the substrate and a portion that is not in contact are formed of different materials.