JPH10113946A - Resin mold apparatus employing release film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily carry out supply operation of release films and carry-out operation of molded items by allowing the release films to readily separate from the molded items. SOLUTION: Conveying mechanisms 34a, 34b, 36a, 36b of release films are furnished for supplying release films 20a, 20b to the mold and conveying out molded items to the withdrawal side of release films in a state of molded items 62 after being resin molded with release films adhered on its outer surfaces by forwarding continuous release films at constant lengths from one side to the other side of the mold passing through the resin molding surface of the mold. In addition, guide mechanisms 42, 50... are installed for separating the release films from the molded items 62 through conveyance of the release films 20a, 20b adhered to both the surfaces of the molded items in the mutual separation direction at the time of conveying the release films to the withdrawal side of each conveying mechanism.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding apparatus using a release film.

[0002]

2. Description of the Related Art With a resin molding method using a release film, when a molded product such as a lead frame is resin-molded, a surface, such as an inner surface of a cavity, where resin is directly in contact with a mold is covered with a release film. This is a method of resin molding without bringing the resin into contact with the surface. Since the release film covers the resin molding surface of the mold in this manner, a material having predetermined heat resistance, flexibility, and releasability from the resin is used.

FIG. 4 shows a resin molding method using a release film. In the figure, the left half of the center line shows a state before the resin is filled in the cavity, and the right half shows a state in which the cavity is filled with the resin. The molded article 12 is clamped by the upper mold 10a and the lower mold 10b, and the resin 16 is filled into the cavity 18 from the pot 14 and resin-molded. 20a, 20
b is a release film, each of which is an upper mold 10a and a lower mold 10b.
The mold surface is covered according to the inner surface shape of the cavity recessed portion.

The method of covering the mold surface with the release films 20a and 20b is as follows. First, a suction hole 22 is provided on the clamp surface of the upper die 10a and the lower die 10b, and a cavity suction hole 24 is provided on the inner bottom surface of the cavity recess. After sucking air from the suction hole 22 of the clamping surface of the mold and adsorbing to the clamping surface,
By suctioning air from the cavity suction hole 24 on the bottom surface in the cavity. Since the release films 20a and 20b have sufficient flexibility, they are sucked and supported along the inner surface of the cavity as shown in the figure by sucking air from the inner bottom surface of the cavity.

[0005] In this example, as a mold resin, FIG.
The wrapping resin 26 shown in FIG. The wrapping resin 26 is obtained by sealing a stick-shaped resin with a wrapping film, and supplies the resin to the pot 14 in a state of being sealed with the wrapping film. The resin melted in the pot 14 is pressure-fed by a plunger, so that the sealing portions at both side edges of the wrapping film are expanded, and the cavity 16 is filled with the resin 16.

[0006]

FIG. 6 shows a planar arrangement of the cavity concave portion, the pot 14, and the like in the lower mold 10b. The pot 14 is opened in a long hole shape, and is formed so that a lapping resin 26 formed in a stick shape can be charged. The release films 20b have a width covering the cavity recesses 18a, and are arranged on both sides of the pot 14, respectively.

After adsorbing and supporting the release films 20a and 20b on the mold surface, the molded article 12 and the lapping resin 16
Is set and clamped with the upper mold 10a and the lower mold 10b to seal with resin. FIG. 6 shows a clamp portion A by a mold.
As shown in the figure, the portion where the molded product 12 is clamped by the mold is a portion having a fixed width around the cavity concave portion 18a and a portion through which a runner and a gate, which are resin paths for filling the cavity with resin, pass. The reason why the entire surface of the molded article 12 is not clamped by the mold is to effectively apply the clamping force of the mold to the molded article 12 so that the clamp can be surely performed.

FIG. 7 is an enlarged view showing a state in which the lead frame of the molded article 12 is clamped by a mold. The mold is clamped so that a clamping force is effectively applied to the molded product 12.
a, when the lead frame is clamped through 20b,
Since the release films 20a and 20b have high compressibility, the release films 20a and 20b are inserted into the middle of the adjacent leads 12a by the clamping force, and after the resin molding, the release films 20a and 20b are removed from the lead frame.
There was a problem that a and 20b were difficult to peel off. Lead 1 in lead frame manufactured by etching
A side edge portion of 2a is formed in an edge shape. In a lead frame manufactured by press working, a burr is formed so as to protrude from a side surface of the lead, so that a release film 20a inserted between the leads 12a, 2
Ob is easily caught and hardly peeled off.

In the case where the release films 20a and 20b enter between the leads 12a and are clamped at the time of clamping as in the case of the lead frame, the release films 20a and 20b are peeled from the molded article 12 after resin molding. There is a problem in that the operation cannot be performed smoothly, and there is a problem in that the release film is automatically peeled off, or that the lead is deformed when the release film is forcibly peeled off.

[0010] The present invention uses a release film that enables the release film to be surely peeled off when the release film is difficult to peel off from the molded article after resin molding, and enables a smooth resin molding operation. An object is to provide a resin molding device.

[0011]

The present invention has the following arrangement to achieve the above object. That is, in a resin molding apparatus using a release film for covering the resin molding surfaces of the upper mold and the lower mold with a release film and clamping and molding the molded article through the release film, the resin molding of the mold is performed. By feeding the release film of the long body from the one side of the mold to the other side by fixed length feed through the surface, the release film is supplied to the mold,
A release film transport mechanism for transporting the molded product to the release film collection side with the release film adhered to the outer surface of the molded product after resin molding is provided, and the release film is mounted on the release film collection side of the transport mechanism. When transporting, a guide mechanism is provided for transporting release films adhered to both surfaces of the molded product in directions away from each other to separate the release film from the molded product. In addition, a support roller is provided outside the collecting side of the mold from which the molded article is carried out, the supporting roller supporting the molded article that is gradually carried out to the collecting side by gradually releasing the release film from the molded article. It is characterized by having. Further, the transport mechanism for the release film includes a support mechanism for supporting the release film at a distance from the mold surface when transporting the release film.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below. 1 to 3 are front views illustrating the configuration of a resin molding apparatus using a release film according to the present invention and the operation of the resin molding apparatus. 30a is the upper mold 10
Reference numeral 30b denotes a movable platen that supports the lower mold 10b. The upper die 10a is fixed to the fixed platen 30a via the hot plate 32a and the base, and the lower die 10b is fixed to and supported by the base 33 via the hot plate 32b.

34a and 34b are an upper mold 10a and a lower mold 10b.
Is a supply reel for supplying release films 20a and 20b to each of them. The supply reels 34a and 34b are driven and controlled so that the long release films 20a and 20b are wound around the reels and fed by a fixed size every time a resin molding operation is performed.
36a and 36b are used release films 20a and 2a.
0b is a collecting reel for collecting 0b. Collection reel 36a,
36b is also provided separately for the upper die and the lower die.

FIG. 1 shows a state in which the mold is opened, the molded article 50 is unloaded from the mold, the release films 20a and 20b are fed by a fixed length, and the molded article 12 and the mold resin are set in the mold. When the release films 20a and 20b are fed by a fixed size, the release films 20a and 20b are moved to the upper mold 10a.
And it is conveyed in a state separated from the mold surface of the lower mold 10b. In the resin molding apparatus of this embodiment, the supply reel 34a and the collection reel 36a on the upper die side are fixed to upper reel support plates 38 and 39 supported to be movable up and down in the mold opening and closing direction, respectively. The release film 20a is moved toward and away from the mold surface of the upper mold 10a by raising and lowering the mold.

Reference numerals 40, 41, 42, 43, and 44 denote guide rollers for guiding the transport of the release film 20a. The guide rollers 40 and 41 are fixed to the upper reel support plate 38 on the supply side. 44
Is fixed to the upper reel support plate 39 on the collecting side.

Release film 2 to be supplied to lower mold 10b
0b, the supply reel 34b and the collection reel 36
b is supported on lower reel support plates 46 and 47 supported to be movable up and down in the mold opening and closing direction, and guide rollers 48 and 49 are supported on the lower reel support plate 46 on the supply side, and guide rollers 50, 51 and 52 are provided. Is supported by the lower reel support plate 47 on the collection side. The supply reel 34b and the collection reel 36b are supported on the lower reel support plates 46 and 47 so as to be able to move up and down, unlike the upper die side, and the guide rollers 48 and 49 and the guide rollers 50, 51 and 52 are also provided on the lower reel support plate, respectively. 46 and 47 are supported so as to be able to move up and down.

When the release film 20b is supplied, the supply reel 34b, the recovery reel 36b, and the guide rollers 48, 49, 50, 51, and 52 as a whole are slightly raised with the lower reel support plates 46, 47 at the lower position. Then, the release film 20b is conveyed slightly apart from the mold surface of the lower mold 10b.

The release films 20a and 20b are transported by transporting the release films 20a and 20b parallel to the mold surfaces of the upper mold 10a and the lower mold 10b, and bringing the release films 20a and 20b into contact with the mold surfaces. The release films 20a and 20b are supported on the mold surface by air suction. For this reason, in this embodiment, the upper reel support plates 38 and 39 and the lower reel support plates 46 and 47
In both cases, the elevation position is adjusted to coincide with the height position on the supply side and the recovery side. Further, in the present embodiment, the upper reel support plates 38, 39 on the supply side and the lower reel support plates 46, 47 are connected at a constant interval, and together with the movable platen 30b, the lower reel support plate 46,
47 is driven up and down, and the upper reel support plates 38 and 39 are moved up and down with this.

In FIG. 1, a release film 20b is suction-supported on the mold surface of the lower mold 10b, and the release film 20a is supported on the upper mold 10a while being separated from the mold surface of the upper mold 10a. Guide rollers 49, 50 supported on lower reel support plates 46, 47 with lower mold 10b interposed therebetween.
Are located at positions where the release film 20b is supported on both sides of the lower mold 10b so as to be stretched in accordance with the mold surface position.

The guide rollers 42 and 43 provided on the upper reel support plate 39 on the collecting side and the guide rollers 50 and 51 provided on the lower reel support plate 47 are provided at the discharge positions where the release films 20a and 20b are discharged from the mold, respectively. , 20b are arranged so as to be guided vertically in the direction in which the discharge direction is divided. That is, at the entrance to the collection side, the guide rollers 42 and 43 guide the release film 20a upward substantially at right angles to the conveying direction of the release film 20a on the mold surface, and the guide rollers 50 and 51
b is arranged to be directed downward substantially at a right angle.

The guide rollers 44 and 52 are configured to pinch the release films 20a and 20b with a pair of rollers, so that even if the release films 20a and 20b are deformed into an embossed shape or the like, the release films 20a and 20b are pressed.
20b is flattened so that it can be wound around the collection reels 36a and 36b.

Reference numeral 60 denotes a support roller for taking out the molded product 62 after the resin molding. The support roller 60 has a plurality of rollers arranged in parallel with the height of the mold surface of the lower mold 10b and the upper surface of the roller being substantially the same when the mold is opened. The support roller 60 functions to guide and support the molded product 60 delivered from the mold.

In FIG. 1, release film 2 is attached to lower mold 10b.
After adsorbing and supporting 0b, the molded article 12 is set in the lower mold 10b. In this case, the method of setting the molded article 12 is not particularly limited. For example, it is also possible to use a method in which the transport head is inserted into the mold from a direction perpendicular to the transport direction of the release films 20a and 20b in the mold opened state, and a molded product is supplied from the transport head. A method is also possible in which the transfer head is moved into the mold from the same direction as the transfer direction (left direction in the figure) and the molded product 12 is supplied from the transfer head. In addition, the molding resin (lapping resin) is supplied to the pot together with the supply of the molded article 12.

After the molded article 12 and the resin for molding are supplied to the lower mold 10b, the resin is molded by clamping. FIG. 2 shows a state in which the resin is molded by clamping. When the movable platen 30b is moved upward from the state shown in FIG. 1, both the upper reel support plates 38 and 39 and the lower reel support plates 46 and 47 are driven to rise. Upper reel support plate 38, 3
The lower reel supporting plate 9 and the lower reel supporting plates 46 and 47 are raised to a position where the release film 20a is in contact with the mold surface of the upper die 10a and stopped. Release film 2 on the mold surface of upper mold 10a
The release film 20a is suctioned by air to the mold surface in a state where 0a is in contact with the mold surface, and the mold surface such as the inner surface of the cavity concave portion 18 is covered with the release film 20a.

Next, with the upper reel support plates 38, 39 and the lower reel support plates 46, 47 stopped,
The lower mold 10b is further moved up, and the process proceeds to the mold clamping step. In this mold clamping step, the supply reel 34b and the recovery reel 36b supported by the lower reel support plates 46, 47 and the guide rollers 48, 49, 50, 51, 62 are raised with respect to the lower reel support plates 46, 47, and the release film is released. The mold 12 is smoothly clamped through the molds 20a and 20b. As shown in FIG. 2, the molded article 12 is clamped, and the cavity is filled with a resin to perform resin molding.

After the resin has hardened, the mold is opened and the molded product 62 is opened.
Proceed to take out operation. When the mold is opened, the movable platen 30b is lowered with the supply reel 34b and the recovery reel 36b at the upper positions with respect to the lower reel support plates 46 and 47. FIG. 3 shows a state where the movable platen 30b has been lowered to the lower position. As the movable platen 30b descends, both the upper reel support plates 38, 39 and the lower reel support plates 46, 47 descend to the lower position.

The molded product 62 is separated from the mold surface of the upper die 10a by the lowering of the upper reel support plates 38 and 39 as the mold is opened, and is lowered with the surface covered with the release film 20a. Release film 2
Since the release films 20a are formed from a film material having good releasability from the mold, the release film 20a is easily peeled from the upper mold 10a by opening the mold, but if the release film 20a is difficult to be peeled, the air used for air suction is used. It is also possible to release the mold by discharging air from the flow path in reverse.

As the mold opening progresses, the molded article 62 descends while being placed on the lower mold 10b with the outer surfaces covered by the release films 20a and 20b. Then, when the lower mold 10b descends to the lowermost position, the lower mold 10b is peeled off from the lower mold 10b and released as shown in FIG.
Will be suspended. Lower reel support plate 46,
The reason why the supply reel 34b and the collection reel 36b are set at the upper position at 47 is that when the lower die 10b is lowered to the lowest position, the height position of the release film 20b is changed to the lower die 10b.
In order to be slightly higher than the mold surface.

With the molded product 62 separated from the lower mold 10b, the supply reels 34a and 34b and the collection reel 36a
36b is driven to rotate, and the molded article 62 is transferred to the side where the support roller 60 is disposed outside the mold. Release film 20
Since the a and 20b are attached to the molded product 62, the molded product 62 is advanced by transporting the release films 20a and 20b.

Then, when the molded product 62 advances to the entrance to the support roller 60 outside the mold, the above-described guide roller 4
Release film 2 by arrangement of 2, 43, 50, 51
0a and the release film 20b are separated so as to be distributed upward and downward, and the release films 20a and 20b are separated.
The release films 20a and 20b are peeled off from the surface of the molded product 62 by a tensile force caused by conveying
Only the molded product 62 is extruded onto the support roller 60, and the release films 20a and 20b
a and the collecting reel 36b on the lower die side.

The operation of transporting the release films 20a and 20b is an operation for discharging the molded product 62 to the support roller 60 and supplying new release films 20a and 20b onto the mold. By carrying the release films 20a and 20b, the unloading of the molded product 62 and the supply operation of the release films 20a and 20b are performed simultaneously.

Unloading of molded article 62 and release film 20
After the fixed-size feeding of the a and 20b is completed, the supply reel 34b and the collection reel 36b supported by the lower reel support plates 46 and 47, and the guide rollers 48, 49, 50, 51, and 5
2 is lowered to the lower position, the release film 20b is brought into contact with the mold surface of the lower mold 10b, and the release film 20b is sucked and supported on the lower mold 10b by air. FIG. 1 shows a state in which the molded article 12 is set in the lower mold 10b in this state.

According to the resin molding apparatus of the present embodiment,
As described above, the supply operation of the release films 20a, 20b and the molded article 12, the peeling of the release films 20a, 20b adhered to the molded article 62 and the molded article 6
2 can be automatically performed. In this embodiment, the release film 20a is provided on the outer surface of the molded product 62,
Even if 20b is adhered, the release films 20a and 20b are peeled off from both sides of the molded product 62 at the same time so that the release films 20a and 20b can be physically peeled off, so that the release films 20a and 20b can be reliably peeled from the molded product 62. There is a feature. According to this method, the release film can be reliably peeled even when the release film is caught between the leads of the lead frame.

In the embodiment described above, the upper reel support plates 38 and 39 and the lower reel support plate 4
Although the configuration is such that the upper and lower reel supporting plates 38 and 39 and the lower reel supporting plates 46 and 47 are driven separately, the upper and lower reel supporting plates 38 and 39 can be of course configured separately. Also, upper reel support plates 38, 39
And the lower platen support plate 46, 47
It is also possible to drive separately from b. In this case, the supply reel 34b and the recovery reel 36b are provided so as to be able to move up and down with respect to the lower reel support plates 46 and 47, and the lower reel support plates 46 and 47 are moved up and down instead of moving the release film 20b into and out of the mold surface. Let's release film 20
It is possible to adjust the position of b. As described above, the method of transporting the release films 20a and 20b is not limited to the above embodiment.

[0035]

According to the resin molding apparatus using the release film according to the present invention, as described above, even when the release film is difficult to peel off from the molded product when the resin molding is performed using the release film, In particular, the release film is peeled off, and the supply operation of the release film and the removal operation of the molded product can be reliably performed.

[Brief description of the drawings]

FIG. 1 is a front view showing a state in which a molded article is set by a resin molding apparatus using a release film according to the present invention.

FIG. 2 is a front view showing a state where the mold is clamped by a resin molding apparatus using a release film according to the present invention.

FIG. 3 is a front view showing a state in which a molded product is taken out after the mold is opened by a resin molding apparatus using a release film according to the present invention.

FIG. 4 is an explanatory view showing a resin molding method using a release film.

FIG. 5 is a perspective view of a wrapping resin.

FIG. 6 is an explanatory view showing a portion where a molded product is clamped by a mold.

FIG. 7 is an explanatory view showing a state in which a release film is hardly inserted between leads.

[Explanation of symbols]

 10a Upper die 10b Lower die 12 Molded product 14 Pot 20a, 20b Release film 26 Wrapping resin 30a Fixed platen 30b Movable platen 32a, 32b Hot plate 34a, 34b Supply reel 36a, 36b Recovery reel 38, 39 Upper reel support plate 40, 41, 42, 43, 44 Guide rollers 48, 49, 50, 51, 52 Guide rollers 46, 47 Lower reel support plate 60 Support plate 62 Molded product

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI // B29K 105: 20 B29L 31:34

Claims (3)

[Claims] 1. A resin molding apparatus using a release film for covering a resin molding surface of each of an upper mold and a lower mold with a release film and clamping and molding a molded product through the release film. By feeding a long release film from one side of the mold to the other side of the mold through the resin molding surface of the mold, the release film is supplied to the mold, and the release film is applied to the outer surface of the molded product after resin molding. A release film transport mechanism is provided to carry out the molded product to the release film collection side with the release film applied. When the release film is transported to the release film collection side of the transport mechanism, both sides of the release product are transported. A guide mechanism is provided to separate the release film from the molded product by transporting the release film attached to the product in a direction away from each other. Resin molding device using the release film to. 2. A supporting roller for supporting a molded product gradually carried out to the collection side by releasing a release film from the molded product gradually outside the collection side of the mold from which the molded product is carried out. The resin molding apparatus using the release film according to claim 1, wherein the resin molding apparatus is provided. 3. The release film transport mechanism according to claim 1, wherein the release film transport mechanism includes a support mechanism for supporting the release film while being separated from a mold surface when transporting the release film. The resin molding device used.