JPH1010191A - Connector and method and equipment for testing semiconductor using connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent detective connection between a semiconductor integrated circuit and a test member by enhancing the rigidity of an insulating elastic member through an insulating hard member thereby reinforcing the insulating elastic member and suppressing deformation thereof. SOLUTION: The equipment for testing a semiconductor comprises a connector 3 including a planar insulating elastic member 1 and a planar insulating hard member 2, a test board 5 being connected electrically with a BGA (semiconductor integrated circuit device) 4 through the connector 3 in order to test the BGA 4, and a guide member 6. When the BGA 4 is tested electrically using the connector 3, rigidity at the insulating elastic member 1 is enhanced through the insulating hard member 2 at the time of connecting the BGA 4 with the test board 5 and thereby reinforcing the insulating elastic member and the insulating elastic member 1 is reinforced. Consequently, the deformation of the insulating elastic member 1 can be suppressed at the time of high temperature test, for example and electrically defective connection between the BGA 4 and the test board 5 can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection technique for a semiconductor integrated circuit device, and more particularly to a BGA (Ball Grid Array) in which external terminals are spherical bump electrodes.
TECHNICAL FIELD The present invention relates to a connector for connecting a semiconductor device to an inspection member such as a test board and a semiconductor inspection method and apparatus using the connector.

[0002]

2. Description of the Related Art The technology described below studies the present invention,
Upon completion, they were examined by the inventor, and the outline is as follows.

In a BGA, which is an example of a semiconductor integrated circuit device requiring high-frequency operation, that is, high-speed operation, an evaluation connector (also referred to as a socket) used at the time of testing has a plurality of thin metal wires provided therein. In addition, it has an insulating elastic member formed of silicone rubber or the like, thereby suppressing the occurrence of connection failure of the bump electrodes in the BGA by pressing the BGA.

[0004] Further, regarding the positioning of the BGA, the positioning with respect to an inspection member (also referred to as an evaluation device) such as a test board is performed by using a holding member for positioning.

Further, since the BGA is required to operate at a high frequency, the length of the lead from the BGA to the inspection member is shortened when performing an inspection, thereby reducing the inductance.

Here, a test technique for inspecting a semiconductor integrated circuit device is described in, for example, Press Journal Inc., published on August 20, 1994, entitled "Monthly Semiconductor".
World, September 1994, pp. 72-76.

[0007]

However, in the above-mentioned technology, the insulating elastic member made of silicone rubber or the like has a low heat resistance, and therefore has a high temperature (for example, 8 mm).
(0 to 125 ° C.) At the time of inspection, the vicinity of the center of the insulating elastic member is deformed (raised).

As a result, the contact between the bump electrode of the BGA and the electrode of the inspection member such as a test substrate is significantly deteriorated, and a problem of poor connection between the two occurs.

An object of the present invention is to provide a connector for preventing a connection failure between a semiconductor integrated circuit device and an inspection member such as a test board, and a semiconductor inspection method and apparatus using the same.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0011]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the connector according to the present invention electrically connects a semiconductor integrated circuit device to a test member such as a test board, and has a plurality of conductive thin wires having connection ends on both front and back surfaces. A plate-shaped or spherical insulating elastic member, and an insulating hard member formed so as to guide external terminals of the semiconductor integrated circuit device to be in contact with the electrode of the inspection member and to be formed harder than the insulating elastic member. And the rigidity of the insulating elastic member is increased by the insulating hard member when the semiconductor integrated circuit device is connected to the inspection member.

Therefore, the insulating elastic member can be reinforced by the insulating hard member during the inspection of the semiconductor integrated circuit device,
Thereby, deformation of the insulating elastic member at the time of an inspection such as a high-temperature inspection can be suppressed.

As a result, it is possible to prevent a connection failure occurring between the semiconductor integrated circuit device and the inspection member when the semiconductor integrated circuit device is inspected.

Further, in the semiconductor inspection method according to the present invention, there is provided a step of preparing the connector comprising the insulating elastic member and the insulating hard member, and electrically connecting the semiconductor integrated circuit device via the connector. A step of preparing an inspection member such as a test substrate, positioning the semiconductor integrated circuit device and the inspection member, and pressing the semiconductor integrated circuit device against the inspection member to electrically connect the semiconductor integrated circuit device and the inspection member. Connecting the semiconductor integrated circuit device and the inspection member via the connector to inspect the semiconductor integrated circuit device by applying a current to the semiconductor integrated circuit device and the inspection member. At the time of connection, the rigidity of the insulating elastic member is increased by the insulating hard member, and the semiconductor integrated circuit device is inspected.

Further, the semiconductor inspection apparatus according to the present invention
The connector comprising the insulating elastic member and the insulating hard member; and the inspection member such as a test board electrically connected to the semiconductor integrated circuit device via the connector and for inspecting the semiconductor integrated circuit device. And a holding member that positions the semiconductor integrated circuit device and the inspection member and presses the semiconductor integrated circuit device against the inspection member, and when the semiconductor integrated circuit device is connected to the inspection member, The inspection of the semiconductor integrated circuit device is performed by increasing the rigidity of the insulating elastic member by the insulating hard member.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of the structure of the connector according to the present invention. FIG. 2 is a plan view showing an example of the structure of the insulating hard member in the connector of the present invention. 4A and 4B are diagrams illustrating an example of an embodiment of a structure of an insulating hard member in the connector of the present invention, in which FIG. 4A is a partially enlarged plan view, FIG. 4B is a partially enlarged cross-sectional view, and FIGS. FIG. 1B is a partial cross-sectional view showing an example of an embodiment of the semiconductor inspection method according to the present invention.

In the present embodiment, a case of a BGA 4 requiring high-frequency operation will be described as an example of a semiconductor integrated circuit device to be inspected.

Further, the connector 3 (also referred to as a socket) of the present embodiment connects the BGA 4 and a test board 5 which is an inspection member (also referred to as an evaluation device) when performing an electrical inspection (evaluation) of the BGA 4. It is electrically connected.

The structure of the connector 3 according to the present embodiment will be described. A plate-shaped insulating elastic member 1 provided with a plurality of conductive thin wires 1d having a connection end 1c on a front surface 1a and a back surface 1b is provided inside 1e. The BGA 4 and the test board 5 are formed by an insulating hard member 2 which guides the bump electrode 4 a as an external terminal of the BGA 4 so as to contact the electrode 5 a of the test board 5 and is formed to be harder than the insulating elastic member 1. When testing the BGA 4 by connecting it, the insulating hard member 2
Thereby, the rigidity of the insulating elastic member 1 is increased.

In this embodiment, the front surface 1a of the insulating elastic member 1 is the side on which the BGA 4 is mounted, and the back surface 1b is the test substrate 5 side. 1a or the back surface 1b.

The insulating elastic member 1 of the connector 3 shown in FIG. 1 is a plate having a thickness of about 2 to 3 mm.
The inside 1e has a conductive thin wire 1d such as a plurality of copper wires having a connection end 1c disposed on a front surface 1a and a back surface 1b. That is, the insulating elastic member 1
By using a soft elastic member such as silicone rubber, a flexible connection between the BGA 4 and the test board 5 is realized.

When electrically connecting the BGA 4 and the test board 5, the bump electrode 4a of the BGA 4 is connected to the connection end 1c exposed on the surface 1a of the insulating elastic member 1,
Further, the electrode 5a on the test substrate 5 is connected to the connection end 1c exposed on the back surface 1b of the insulating elastic member 1.

That is, the conductive fine wire 1 in which the BGA 4 and the test board 5 are embedded in the insulating elastic member 1 of the connector 3
and is electrically connected via d.

Further, the insulating hard member 2 in the connector 3 of the present embodiment is formed by a predetermined bump electrode 4a of the BGA 4.
Is a plate-shaped member having a plurality of through holes 2a for guiding (positioning) the bump electrodes 4a so as to contact the predetermined electrodes 5a of the test substrate 5.

Further, when the BGA 4 and the test board 5 are connected, they are joined to the insulating elastic member 1 to increase the rigidity of the insulating elastic member 1 at the time of inspection (to reinforce the insulating elastic member 1).
Has a function.

Here, the thickness of the insulating hard member 2 is formed to be slightly smaller than the diameter of the bump electrode 4a, and is formed of a resin or the like which is much harder than the insulating elastic member 1.

Further, a plurality of through holes 2a (see FIG. 2) formed at the same pitch as the mounting pitch of the bump electrodes 4a of the BGA 4 to be inspected and having a diameter slightly larger than the diameter of the bump electrodes 4a are provided. I have.

The insulating hard member 2 is shown in FIG.
As shown in the figure, the thickness is h and the diameter of the through hole 2a (φ).
D, the installation pitch of the through holes 2a is p, and the BGA4
Where P is the mounting pitch of the bump electrode 4a and D is the diameter of the bump electrode 4a, p ≒ P, d> D, h <D
Is formed so that the relationship of

For example, in the case of a 119-pin BGA 4 having 119 bump electrodes 4a as external terminals, D ≒ 0.6
mm, P ≒ 2.7 mm, the respective values of the insulating hard member 2 are d ≒ 0.7 mm, p ≒ 2.7 mm, h ≒
The insulating hard member 2 is formed with a thickness of 0.5 mm.

As a result, the relationship described above can be maintained, so that the connectivity between the BGA 4 and the test board 5 can be improved, and the positioning accuracy of both can be improved.

The configuration of the semiconductor inspection apparatus according to the present embodiment shown in FIG. 4B will be described with reference to FIGS.

The semiconductor inspection apparatus is provided with a connector 3
Is used to perform electrical inspection (evaluation) of a semiconductor integrated circuit device such as BGA4.

The structure of the semiconductor inspection apparatus is such that a connector 3 comprising a plate-shaped insulating elastic member 1 and a plate-shaped insulating hard member 2 is electrically connected to the BGA 4 via the connector 3 and the BGA 4 is connected to the connector 3. The BGA 4 includes a test board 5 that is an inspection member to be inspected (evaluated), and a guide member 6 that is a holding member that positions the BGA 4 and the test board 5 and presses the BGA 4 against the test board 5.
At the time of connection, the BGA 4 is inspected by increasing the rigidity of the insulating elastic member 1 by the insulating hard member 2.

The inspection member may be other than the test substrate 5, and may be, for example, an evaluation device in which an inspection program or the like is incorporated.

The guide member 6 positions the BGA 4, the connector 3, and the test board 5,
A jig for pressing A4 in the direction of the test substrate 5 from the main body surface 4b.

Further, the guide member 6 is detachably fixed to the test board 5 by, for example, four screw members 7 so that the BGA 4, the connector 3, and the test board 5 can be easily removed. .

Therefore, the BGA 4 has its body surface 4
In b, a substantially uniform load is applied over the entire surface, and the electrical connectivity between the BGA 4 and the test board 5 can be further improved.

Next, the semiconductor inspection method according to the present embodiment will be described.

In the semiconductor inspection method, an electrical inspection (evaluation) of a semiconductor integrated circuit device such as a BGA 4 is performed using the connector 3.

First, a connector 3 composed of a plate-shaped insulating elastic member 1 and a plate-shaped insulating hard member 2 is prepared.

Further, a test board 5 as an inspection member for performing a predetermined electrical inspection (evaluation) on the BGA 4 is prepared.

Incidentally, the inspection member may be an evaluation device for performing a high-temperature test or the like.

Thereafter, as shown in FIG.
The connector 3 is arranged between the test board 5 and the test board 5, and the guide member 6 is screwed to the test board 5 by the screw member 7 while positioning the BGA 4, the connector 3 and the test board 5 using the guide member 6. Fix (Fig. 4 (b)
reference).

At this time, in the connector 3, the insulating hard member 2 is arranged on the BGA 4 side, and the insulating elastic member 1 is arranged on the test board 5 side.

Thereafter, a predetermined bump electrode 4a of the BGA 4 is formed.
Is passed through a predetermined through hole 2a of the insulating hard member 2, and each bump electrode 4a is connected to one end 1c of the conductive thin wire 1d exposed on the front surface 1a or the back surface 1b of the insulating elastic member 1.
Connect to

Further, the other connection end 1 of the conductive thin wire 1d
c is connected to a predetermined electrode 5 a on the test substrate 5.

Thus, the guide member 6 allows the BGA
4 can be pressed against the test board 5 to electrically connect the BGA 4 and the test board 5.

When the BGA 4 is connected to the test board 5, the insulating hard member 2, which is formed much harder than the insulating elastic member 1, is provided between the two.
, The rigidity of the insulating elastic member 1 can be increased.

That is, when the guide member 6 is screwed by the screw member 7, the BGA 4 is pressed in the direction of the test board 5, whereby the insulating elastic member 1 and the insulating hard member 2 are connected in the connector 3. After joining, the rigidity of the insulating elastic member 1 is increased by the insulating hard member 2.

At this time, the insulating elastic member 1 has soft elasticity, and the main body surface 4b of the BGA 4 is uniformly pressed by the guide member 6 over the entire surface thereof, so that the bump electrode 4a of the BGA 4 Even if the height varies, all the bump electrodes 4a of the BGA 4 and the electrodes 5a of the test substrate 5 can be more reliably connected.

Thereafter, by applying a current to the test board 5, a current is also applied to the BGA 4 via the connector 3.

Thus, a predetermined electrical test of the BGA 4 can be performed in a state where the rigidity of the insulating elastic member 1 is increased by the insulating hard member 2.

After the inspection is completed, the guide member 6 can be removed from the test board 5 by removing the screw member 7, whereby the BGA 4 and the connector 3 can be removed from the test board 5.

According to the connector of the present embodiment and the semiconductor inspection method and apparatus using the same, the following operational effects can be obtained.

That is, when an electrical inspection of the BGA 4 (semiconductor integrated circuit device) is performed using the connector 3 composed of the plate-shaped insulating elastic member 1 and the plate-shaped insulating hard member 2, the BGA 4 and the test are performed. Since the rigidity of the insulating elastic member 1 is increased by the insulating hard member 2 at the time of connection with the substrate 5 (inspection member), the insulating elastic member 1 can be reinforced by the insulating hard member 2 at the time of inspection. it can.

Therefore, the deformation of the insulating elastic member 1 during an inspection such as a high-temperature inspection can be suppressed.

Thus, it is possible to prevent an electrical connection failure between the BGA 4 and the test board 5 at the time of inspection.

The plate-shaped insulating hard member 2 of the connector 3 is provided with a plurality of through holes for guiding the bump electrodes 4 a of the BGA 4 such that the predetermined bump electrodes 4 a contact the predetermined electrodes 5 a of the test board 5. With the member having 2a, the positioning of the BGA 4 can be assisted by the insulating hard member 2 when the BGA 4 and the test board 5 are connected.

That is, when connecting the BGA and the test board 5, the predetermined bump electrodes 4 a of the BGA 4 are passed through the predetermined through holes 2 a of the insulating hard member 2, so that the BGA 4 is positioned by the insulating hard member 2. Can be assisted.

As a result, it is possible to prevent a connection failure between the BGA 4 and the test board 5 while maintaining the positional relationship between the BGA 4 and the test board 5 with high accuracy.

In addition, the semiconductor inspection device comprises a connector 3,
By having the test board 5 and the guide member 6 (holding member) for pressing the BGA 4 against the test board 5, the BGA
When the BGA 4 is inspected, the BGA 4 can be inspected in a state close to a state where the BGA 4 is mounted on a mounting board such as a printed board.

Thus, for example, high-frequency operation, that is, high-speed inspection of the BGA 4 can be performed using the connector 3.

That is, by using the connector 3,
At the time of inspection, the length of the lead from the BGA 4 to the test board 5 can be shortened, and the inspection can be performed with low inductance.

Although the invention made by the inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the embodiments of the invention, and does not depart from the gist of the invention. It is needless to say that various changes can be made.

For example, the connector in the above-described embodiment is composed of a plate-like insulating elastic member and a plate-like insulating hard member. However, as in the other embodiment shown in FIG. A connector 3 is formed of a plate-shaped insulating elastic member 1 and a thin wire insulating hard member 2 which is formed at a predetermined position with a resin harder than the insulating elastic member 1 and is attached.
It may be composed of

That is, the connector 3 shown in FIG. 5 has a large number of fine wire insulating hard members 2 attached in a grid pattern to a plate-shaped insulating elastic member 1 and is insulated from external terminals of the semiconductor integrated circuit device. When the conductive thin wire 1d of the elastic elastic member 1 is connected, a predetermined external terminal of the semiconductor integrated circuit device (the BGA 4 in the above-described embodiment) is provided in a predetermined grid formed by the thin insulating hard member 2. Bump electrode 4
Connect through a).

The rigidity of the insulating elastic member 1 can be increased by attaching a plurality of fine wire insulating hard members 2.

Further, as in the other embodiment shown in FIG. 6, the connector 3 comprises a plate-shaped insulating hard member 2 and a spherical insulating elastic member 1 installed at a predetermined position thereof. It may be something.

Here, the spherical insulating elastic member 1 is attached to the plate-like insulating hard member 2 at the same pitch as the mounting pitch of the bump electrodes 4a of the BGA 4 (see FIG. 4), for example. A conductive thin wire 1d is provided inside 1e.
At the time of inspection, the conductive thin wire 1d is connected to an external terminal of the semiconductor integrated circuit device.

Note that the connector 3 shown in FIGS. 5 and 6 can also provide the same operation and effect as the connector 3 described in the above embodiment.

Further, in the above-described embodiment, the case where the semiconductor inspection apparatus has the guide member 6 which presses from the main body surface 4b of the BGA 4 toward the test substrate 5 has been described. Instead of having the guide member 6, for example, a socket that is detachably attached to the test board 5 or the like and that has an openable / closable lid may be used.

In this case, the body surface 4 b of the BGA 4 is pressed in the direction of the test board 5 by the lid of the socket.

In the above embodiment, the case where the semiconductor integrated circuit device is a BGA has been described. However, the semiconductor integrated circuit device is not limited to the BGA, but may be other types of semiconductor integrated circuit devices. There may be.

Further, in the above embodiment, the case where the inspection member is a test substrate has been described. However, if the inspection member is to electrically inspect (evaluate) the semiconductor integrated circuit device, other than the test substrate. Another inspection device (evaluation device) may be used.

[0077]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1). The rigidity of the insulating elastic member is increased by the insulating hard member when the semiconductor integrated circuit device is connected to the inspection member when inspecting the semiconductor integrated circuit device. The member can be reinforced. Therefore, it is possible to suppress deformation of the insulating elastic member at the time of inspection, thereby preventing poor connection occurring between the semiconductor integrated circuit device and the inspection member.

(2). The insulating hard member of the connector is a plate-shaped member having a plurality of through holes for guiding the external terminal so that the predetermined external terminal of the semiconductor integrated circuit device contacts the predetermined electrode of the inspection member. When the semiconductor integrated circuit device is connected to the inspection member, the positioning of the semiconductor integrated circuit device can be assisted by the insulating hard member. This makes it possible to prevent a connection failure between the semiconductor integrated circuit device and the inspection member while maintaining the positional relationship between the semiconductor integrated circuit device and the inspection member with high accuracy.

(3). When the semiconductor integrated circuit device is a BGA, when connecting the BGA and the inspection member, the BGA bump electrode is passed through the through hole of the insulating hard member to assist the positioning of the BGA by the insulating hard member. Can be.

(4). The semiconductor inspection device includes the connector, the inspection member, and a holding member that presses the semiconductor integrated circuit device against the inspection member, so that when inspecting the semiconductor integrated circuit device, the semiconductor integrated circuit device is mounted on the mounting substrate. Inspection can be performed in a state close to the mounted state. Accordingly, high-frequency operation, that is, high-speed inspection of the semiconductor integrated circuit device can be performed using the connector.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of an embodiment of the structure of a connector according to the present invention.

FIG. 2 is a plan view showing an example of an embodiment of the structure of the insulating hard member in the connector of the present invention.

FIGS. 3A and 3B are diagrams showing an example of an embodiment of the structure of an insulating hard member in the connector of the present invention, wherein FIG. 3A is a partially enlarged plan view thereof, and FIG. It is the elements on larger scale sectional view.

FIGS. 4A and 4B are partial cross-sectional views illustrating an example of an embodiment of a semiconductor inspection method according to the present invention.

FIG. 5 is a partial plan view showing a structure of a connector according to another embodiment of the present invention.

FIG. 6 is a partially cutaway perspective view showing the structure of a connector according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulative elastic member 1a Front surface 1b Back surface 1c Connection end 1d Conductive thin wire 1e Inside 2 Insulating hard member 2a Through hole 3 Connector 4 BGA (semiconductor integrated circuit device) 4a Bump electrode (external terminal) 4b Body surface 5 Test board ( Inspection member) 5a Electrode 6 Guide member (holding member) 7 Screw member

Claims (5)

[Claims] 1. A connector for electrically connecting a semiconductor integrated circuit device to a test member such as a test board, wherein the plurality of conductive thin wires having connection ends on both front and back surfaces are provided in a plate or spherical shape. An insulating elastic member, which guides an external terminal of the semiconductor integrated circuit device so as to contact an electrode of the inspection member, and has an insulating hard member formed harder than the insulating elastic member; When connecting the semiconductor integrated circuit device and the inspection member,
A connector characterized in that the rigidity of the insulating elastic member is increased by the insulating hard member. 2. The connector according to claim 1, wherein the insulating hard member guides the external terminal such that a predetermined external terminal of the semiconductor integrated circuit device contacts a predetermined electrode of the inspection member. A connector having a plurality of through-holes having a plate shape. 3. The connector according to claim 1, wherein the external terminals of the semiconductor integrated circuit device are spherical bump electrodes. 4. A semiconductor inspection method using the connector according to claim 1, 2, or 3, wherein the step of preparing the connector comprising the insulating elastic member and the insulating hard member is performed. Preparing an inspection member such as a test board that is electrically connected to the semiconductor integrated circuit device; positioning the semiconductor integrated circuit device and the inspection member; and pressing the semiconductor integrated circuit device against the inspection member. Electrically connecting the semiconductor integrated circuit device and the inspection member; and applying a current to the semiconductor integrated circuit device and the inspection member via the connector to inspect the semiconductor integrated circuit device. When connecting the semiconductor integrated circuit device and the inspection member,
A semiconductor inspection method, wherein the semiconductor integrated circuit device is inspected by increasing the rigidity of the insulating elastic member by the insulating hard member. 5. A semiconductor inspection device using the connector according to claim 1, 2, or 3, wherein said connector comprising said insulating elastic member and said insulating hard member, and said semiconductor via said connector. The inspection member electrically connected to an integrated circuit device and testing the semiconductor integrated circuit device, such as a test substrate; positioning the semiconductor integrated circuit device and the inspection member; and inspecting the semiconductor integrated circuit device. A holding member that presses against the member, when connecting the semiconductor integrated circuit device and the inspection member,
A semiconductor inspection device, wherein the semiconductor integrated circuit device is inspected by increasing the rigidity of the insulating elastic member by the insulating hard member.