JPH10107495A - Device for mounting component - Google Patents
Device for mounting componentInfo
- Publication number
- JPH10107495A JPH10107495A JP8254231A JP25423196A JPH10107495A JP H10107495 A JPH10107495 A JP H10107495A JP 8254231 A JP8254231 A JP 8254231A JP 25423196 A JP25423196 A JP 25423196A JP H10107495 A JPH10107495 A JP H10107495A
- Authority
- JP
- Japan
- Prior art keywords
- component
- inclination
- nozzle
- mounting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Manipulator (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品を回路基
板上に装着する部品装着装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for mounting electronic components on a circuit board.
【０００２】[0002]
【従来の技術】従来技術に係る部品装着装置の装着ヘッ
ド部分の構成を図５に断面図として示す。この装着ヘッ
ド３０は、ＸＹロボット等に搭載されてＸ−Ｙ軸平面上
の移動自在で、且つＺ軸方向に昇降自在に構成されてい
る。この装着ヘッド３０には部品３８を吸着するノズル
３７がＸ−Ｙ平面で回転自在に装填されている。ノズル
３７の回転は、モータ３２、回転伝達ギア３４、３５、
軸受け３６による回転機構によりなされる。2. Description of the Related Art FIG. 5 is a sectional view showing the structure of a mounting head portion of a component mounting apparatus according to the prior art. The mounting head 30 is mounted on an XY robot or the like, and is configured to be movable on an XY axis plane and to be movable up and down in the Z axis direction. The mounting head 30 is provided with a nozzle 37 for sucking a component 38 so as to be rotatable in an XY plane. The rotation of the nozzle 37 is performed by the motor 32, the rotation transmission gears 34 and 35,
This is performed by a rotation mechanism using the bearing 36.
【０００３】前記ノズル３７は装着ヘッド３０の移動に
より所定の部品供給位置から部品３８を吸着して、装着
ヘッド３０の移動により基板３９上に設定された所定の
装着位置に部品３８を装着する。前記ノズル３７が部品
３８を吸着したときのＸ−Ｙ平面での回転姿勢の基板３
９上の装着位置からのずれは、図示しない部品吸着姿勢
検出カメラによって認識されるので、前記回転機構によ
りノズル３７を回転させて補正する。The nozzle 37 sucks a component 38 from a predetermined component supply position by moving the mounting head 30, and mounts the component 38 at a predetermined mounting position set on the substrate 39 by moving the mounting head 30. The substrate 3 in a rotating posture on the XY plane when the nozzle 37 sucks the component 38
Since the deviation from the mounting position on 9 is recognized by a component suction attitude detection camera (not shown), the nozzle 37 is rotated by the rotation mechanism to correct the error.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、所定位
置に配設された基板の装着面にＸ−Ｙ軸平面からの傾き
が生じているような場合や、吸着した部品にＸ−Ｙ軸平
面からの傾きが生じているような場合には、図６に示す
ように基板３９と部品３８とが平行にならないため、装
着位置にずれが生じてしまう問題点があった。However, when the mounting surface of the substrate disposed at a predetermined position is inclined from the XY axis plane, or when the sucked component is tilted from the XY axis plane. In such a case, since the substrate 39 and the component 38 are not parallel as shown in FIG. 6, there is a problem that the mounting position is shifted.
【０００５】本発明は、上記従来の部品装着装置の問題
点を解決すべく創案されたもので、基板または部品の傾
きによる装着位置のずれを補正する機構を備えた部品装
着装置を提供することを目的とするものである。SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems of the conventional component mounting apparatus, and provides a component mounting apparatus provided with a mechanism for correcting a mounting position shift due to a tilt of a board or a component. It is intended for.
【０００６】[0006]
【課題を解決するための手段】本発明は、上記目的を達
成するために、部品を吸着保持するノズルが装填され、
Ｘ軸Ｙ軸Ｚ軸方向に移動自在に構成された装着ヘッドに
より、所定位置に供給された部品を前記ノズルで吸着
し、所定位置に配設された基板の部品装着位置に部品を
装着する部品装着装置において、前記ノズルの部品吸着
部をＸ−Ｙ平面に対する傾き角度変更自在に調整するノ
ズル傾き角度変更手段と、前記基板のＸ−Ｙ平面に対す
る傾きの角度及び方向を検出する基板傾き検出手段と、
前記ノズルに吸着した部品のＸ−Ｙ平面に対する傾きの
角度及び方向を検出する部品傾き角度検出手段と、前記
基板傾き検出手段による検出値と前記部品傾き検出手段
による検出値とを照合して前記ノズルによる部品吸着姿
勢を変更する補正値を前記ノズル傾き角度変更手段に出
力する部品傾き補正値出力手段とを具備してなることを
特徴とする。According to the present invention, in order to achieve the above object, a nozzle for holding a component by suction is mounted,
A component for supplying a component supplied to a predetermined position to the nozzle by a mounting head configured to be movable in the X-axis, Y-axis, and Z-axis directions, and mounting the component at a component mounting position of a substrate disposed at a predetermined position. In the mounting device, a nozzle inclination angle changing means for adjusting a tilt angle of a component suction portion of the nozzle with respect to an XY plane, and a board inclination detecting means for detecting an angle and a direction of inclination of the substrate with respect to an XY plane. When,
Component inclination angle detection means for detecting the angle and direction of inclination of the component adsorbed to the nozzle with respect to the XY plane, and comparing the detection value of the board inclination detection means with the detection value of the component inclination detection means, And a component inclination correction value output means for outputting a correction value for changing a component suction attitude of the nozzle to the nozzle inclination angle changing means.
【０００７】この構成によれば、基板の装着位置に傾き
が生じているような場合や、吸着された部品に傾きが生
じている場合においても、基板に対する部品の装着方向
が一致するようにノズル傾き角度変更手段によりノズル
による部品保持の姿勢が調整されるので、正確な装着動
作が実施できる。According to this configuration, even when the mounting position of the substrate is inclined or when the sucked component is inclined, the nozzles are mounted so that the mounting directions of the components with respect to the substrate match. Since the attitude of the component holding by the nozzle is adjusted by the inclination angle changing means, an accurate mounting operation can be performed.
【０００８】[0008]
【発明の実施の形態】以下、添付図面を参照して本発明
の一実施形態について説明し、本発明の理解に供する。
尚、以下の実施形態は本発明を具体化した一例であっ
て、本発明の技術的範囲を限定するものではない。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings to provide an understanding of the present invention.
The following embodiments are examples embodying the present invention and do not limit the technical scope of the present invention.
【０００９】図１（ａ）（ｂ）は、本実施形態に係る部
品装着装置の装着ヘッド部分の構成を示すもので、
（ａ）は正面図、（ｂ）は平面図で、部分的に断面構造
として示している。また、図２は部品装着装置の所定位
置に設けられた部品認識位置に装着ヘッドを移動させた
状態を示す正面図である。FIGS. 1A and 1B show the configuration of a mounting head portion of a component mounting apparatus according to this embodiment.
(A) is a front view and (b) is a plan view, partially showing a cross-sectional structure. FIG. 2 is a front view showing a state where the mounting head is moved to a component recognition position provided at a predetermined position of the component mounting apparatus.
【００１０】図１において、装着ヘッド１は、図示しな
いＸＹロボット等の移動手段に、図示Ｘ−Ｙ軸（水平
面）方向に移動自在で図示Ｚ軸（垂直）方向に昇降移動
自在に搭載されている。この装着ヘッド１には、部品４
を吸着保持するノズル３が、Ｘ−Ｙ平面での回転自在
で、Ｘ−Ｙ平面からの吸着面の傾き角度変更自在に取り
付けられている。前記回転の動作は、回転調整モータ１
３、回転伝達ギア１２、１４、軸受け１１を備えた回転
機構によってなされる。また、前記傾き角度変更の動作
は、ノズル３の上端が球体２１ａに形成され、その球体
２１ａが球面軸受け２１ｂによって自在支持されてなる
ユニバーサル軸受機構及び、ノズル軸が４方向から進退
駆動されるロッド５ａ、５ｂ、５ｃ、５ｄによって支持
されてなる傾き調整機構を利用した傾き角度変更機構
（ノズル傾き角度変更手段）６によりなされる。各ロッ
ド５ａ、５ｂ、５ｃ、５ｄはそれぞれ傾き調整モータ７
ａ、７ｂ、７ｃ、７ｄによって駆動されるボールネジ８
ａ、８ｂ、８ｃ、８ｄにより進退移動するので、各ロッ
ド５ａ、５ｂ、５ｃ、５ｄそれぞれの移動量を制御する
ことによって、通常はＺ軸方向にあるノズル３の傾き角
度が変更でき、吸着面のＸ−Ｙ平面に対する傾き角度を
自在に調整することができる。In FIG. 1, a mounting head 1 is mounted on a moving means, such as an XY robot (not shown), so as to be movable in an XY axis (horizontal plane) direction as shown and to be movable up and down in a Z axis (vertical) direction. I have. The mounting head 1 has a component 4
The nozzle 3 for sucking and holding the nozzle is rotatably mounted on the XY plane and is mounted so as to be capable of changing the inclination angle of the suction surface from the XY plane. The rotation operation is performed by the rotation adjustment motor 1.
3. It is performed by a rotation mechanism including the rotation transmission gears 12 and 14 and the bearing 11. The tilt angle changing operation includes a universal bearing mechanism in which the upper end of the nozzle 3 is formed in a spherical body 21a and the spherical body 21a is freely supported by a spherical bearing 21b, and a rod in which the nozzle shaft is driven forward and backward from four directions. This is performed by a tilt angle changing mechanism (nozzle tilt angle changing means) 6 using a tilt adjusting mechanism supported by 5a, 5b, 5c, and 5d. Each of the rods 5a, 5b, 5c, 5d has a tilt adjusting motor 7
ball screw 8 driven by a, 7b, 7c, 7d
a, 8b, 8c, and 8d, the tilt angle of the nozzle 3 normally in the Z-axis direction can be changed by controlling the amount of movement of each of the rods 5a, 5b, 5c, and 5d. Can be freely adjusted with respect to the XY plane.
【００１１】また、上記装着ヘッド１には、基板認識カ
メラ９と基板傾き検出センサ（基板傾き検出手段）１０
とが取り付けられている。更に、部品装着装置の所定位
置には、図２に示すように前記ノズル３により吸着した
部品４のＸ−Ｙ平面での回転姿勢を認識する部品認識カ
メラ１５と、Ｘ−Ｙ平面からの傾きを検出する部品傾き
検出センサ（部品傾き検出手段）１６とが設置されてい
る。The mounting head 1 has a board recognition camera 9 and a board tilt detecting sensor (board tilt detecting means) 10.
And are attached. Further, at a predetermined position of the component mounting device, as shown in FIG. 2, a component recognition camera 15 for recognizing the rotation posture of the component 4 sucked by the nozzle 3 in the XY plane, and an inclination from the XY plane. And a component inclination detecting sensor (component inclination detecting means) 16 for detecting the inclination angle.
【００１２】上記構成になる装着ヘッド１による部品装
着動作は、まず、所定位置に配設された基板２上に移動
して、装着ヘッド１に装備された基板認識カメラ９によ
り基板２上に記された基板マークを検出して実装すべき
位置を認識すると共に、基板傾き検出センサ１０により
基板２のＸ−Ｙ平面に対する傾き角度と傾き方向とを検
出する。次に、装着ヘッド１は所定位置に配設された部
品供給位置に移動して、ノズル３により部品４を吸着
し、図２に示す位置に移動して部品認識カメラ１５によ
り吸着した部品４の姿勢を認識させる。この部品認識カ
メラ１５による部品姿勢の認識データは、先に基板認識
カメラ９により検出された実装位置データと照合され、
Ｘ−Ｙ平面上での回転による姿勢誤差が演算され、補正
データが装着ヘッド１に入力されるので、回転調整モー
タ１３の駆動によりノズル３による吸着姿勢が補正調整
される。次いで、装着ヘッド１は部品傾き検出センサ１
６上にノズル３を移動させる。部品傾き検出センサ１６
は吸着された部品４のＸ−Ｙ平面に対する傾き角度と傾
き方向とを検出するので、図４に示すように、この検出
データは傾き補正値演算部（部品傾き補正値出力手段）
１７において、先に基板傾き検出センサ１０により検出
された基板２の傾き検出データと照合され、傾き姿勢の
誤差が演算され、補正データに基づく各傾き調整モータ
７ａ、７ｂ、７ｃ、７ｄの駆動信号が傾き角度調整機構
６に入力される。尚、前記傾き補正値演算部１７は、図
示していないが、部品装着装置内に装備されている制御
部に設けられている。The component mounting operation of the mounting head 1 having the above-described structure is performed by first moving onto the board 2 disposed at a predetermined position and writing the data on the board 2 by the board recognition camera 9 mounted on the mounting head 1. The mounted substrate mark is detected to recognize the mounting position, and the substrate tilt detection sensor 10 detects the tilt angle and the tilt direction of the substrate 2 with respect to the XY plane. Next, the mounting head 1 moves to the component supply position provided at a predetermined position, sucks the component 4 by the nozzle 3, moves to the position shown in FIG. Recognize the posture. The recognition data of the component posture by the component recognition camera 15 is collated with the mounting position data previously detected by the board recognition camera 9,
The posture error due to the rotation on the XY plane is calculated, and the correction data is input to the mounting head 1, so that the suction posture by the nozzle 3 is corrected and adjusted by driving the rotation adjustment motor 13. Next, the mounting head 1 is mounted on the component inclination detecting sensor 1.
The nozzle 3 is moved above the nozzle 6. Component tilt detection sensor 16
Detects the inclination angle and the inclination direction of the picked-up component 4 with respect to the XY plane. As shown in FIG. 4, this detection data is used as an inclination correction value calculation unit (component inclination correction value output means).
At 17, the inclination detection data of the substrate 2 previously detected by the substrate inclination detection sensor 10 is collated, an error of the inclination posture is calculated, and the drive signal of each inclination adjustment motor 7 a, 7 b, 7 c, 7 d based on the correction data Is input to the tilt angle adjusting mechanism 6. Although not shown, the inclination correction value calculating section 17 is provided in a control section provided in the component mounting apparatus.
【００１３】図３に示すように、基板２に傾きが生じて
いるような場合に、傾き調整機構６によりノズル３が基
板２の傾きと一致するように変更動作すると、基板２の
傾きと吸着した部品４との傾き方向が一致するため、基
板２または部品４の傾きによる装着不良の発生は回避さ
れる。As shown in FIG. 3, if the nozzle 3 is changed by the tilt adjusting mechanism 6 so as to match the tilt of the substrate 2 when the substrate 2 is tilted, the tilt of the substrate 2 and the suction Since the inclination direction of the component 4 coincides with that of the component 4, the occurrence of mounting failure due to the inclination of the board 2 or the component 4 is avoided.
【００１４】[0014]
【発明の効果】以上の説明の通り本発明によれば、部品
装着装置による基板への部品装着に際して、基板または
部品に所定平面からの傾きが生じていたときにも、傾き
に対応してノズルによる部品吸着角度が変更されるの
で、所定の装着位置への装着が正確になされ、部品装着
装置による実装基板の生産が安定してなされる効果を奏
する。As described above, according to the present invention, when mounting a component on a board by the component mounting apparatus, even if the board or component is tilted from a predetermined plane, the nozzle can be used in accordance with the tilt. , The component mounting angle is changed, so that the component mounting device can be accurately mounted at a predetermined mounting position, and the component mounting device can stably produce a mounting board.
【図１】本発明の一実施形態に係る部品装着装置の装着
ヘッドの構成を示す正面図（ａ）と平面図（ｂ）とであ
る。FIG. 1 is a front view (a) and a plan view (b) showing a configuration of a mounting head of a component mounting apparatus according to an embodiment of the present invention.
【図２】同部品装着装置に設置された部品認識位置に装
着ヘッドを移動させた状態を示す正面図である。FIG. 2 is a front view showing a state where the mounting head is moved to a component recognition position installed in the component mounting apparatus.
【図３】同部品装着装置による基板の傾きに対応するノ
ズルの傾き変更の状態を示す正面図である。FIG. 3 is a front view showing a state in which the inclination of the nozzle corresponding to the inclination of the substrate is changed by the component mounting apparatus.
【図４】同部品装着装置によるノズルの傾き変更の制御
動作を説明するブロック図である。FIG. 4 is a block diagram illustrating a control operation of changing the inclination of the nozzle by the component mounting apparatus.
【図５】従来技術に係る部品装着装置の装着ヘッドの構
成を示す断面図である。FIG. 5 is a cross-sectional view illustrating a configuration of a mounting head of a component mounting apparatus according to the related art.
【図６】従来技術に係る基板傾きによる装着不可の状態
を示す断面図である。FIG. 6 is a cross-sectional view showing a state in which mounting is impossible due to inclination of a substrate according to the related art.
１ 装着ヘッド ２ 基板 ３ ノズル ４ 部品 ６ 傾き角度変更機構（ノズル角度変更手段） ９ 基板認識カメラ １０ 基板傾き検出センサ（基板傾き検出手段） １５ 部品認識カメラ １６ 部品傾き検出センサ（部品傾き検出手段） １７ 傾き補正値演算部（部品傾き補正値出力手段） REFERENCE SIGNS LIST 1 mounting head 2 substrate 3 nozzle 4 component 6 tilt angle changing mechanism (nozzle angle changing means) 9 board recognition camera 10 board tilt detection sensor (board tilt detection means) 15 component recognition camera 16 component tilt detection sensor (component tilt detection means) 17 Tilt correction value calculator (part tilt correction value output means)
Claims (1)
Ｘ軸Ｙ軸Ｚ軸方向に移動自在に構成された装着ヘッドに
より、所定位置に供給された部品を前記ノズルで吸着
し、所定位置に配設された基板の部品装着位置に部品を
装着する部品装着装置において、前記ノズルの部品吸着
部をＸ−Ｙ平面に対する傾き角度変更自在に調整するノ
ズル傾き角度変更手段と、前記基板のＸ−Ｙ平面に対す
る傾きの角度及び方向を検出する基板傾き検出手段と、
前記ノズルに吸着した部品のＸ−Ｙ平面に対する傾きの
角度及び方向を検出する部品傾き角度検出手段と、前記
基板傾き検出手段による検出値と前記部品傾き検出手段
による検出値とを照合して前記ノズルによる部品吸着姿
勢を変更する補正値を前記ノズル傾き角度変更手段に出
力する部品傾き補正値出力手段とを具備してなることを
特徴とする部品装着装置。1. A nozzle for sucking and holding a part is loaded,
A component for supplying a component supplied to a predetermined position to the nozzle by a mounting head configured to be movable in the X-axis, Y-axis, and Z-axis directions, and mounting the component at a component mounting position of a substrate disposed at a predetermined position. In the mounting device, a nozzle inclination angle changing means for adjusting a tilt angle of a component suction portion of the nozzle with respect to an XY plane, and a board inclination detecting means for detecting an angle and a direction of inclination of the substrate with respect to an XY plane. When,
Component inclination angle detection means for detecting the angle and direction of inclination of the component adsorbed to the nozzle with respect to the XY plane, and comparing the detection value of the board inclination detection means with the detection value of the component inclination detection means, A component mounting apparatus comprising: component tilt correction value output means for outputting a correction value for changing a component suction attitude by a nozzle to the nozzle tilt angle changing means.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8254231A JPH10107495A (en) | 1996-09-26 | 1996-09-26 | Device for mounting component |
| PCT/JP1997/003401 WO1998014041A1 (en) | 1996-09-26 | 1997-09-25 | Parts mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8254231A JPH10107495A (en) | 1996-09-26 | 1996-09-26 | Device for mounting component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10107495A true JPH10107495A (en) | 1998-04-24 |
Family
ID=17262092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8254231A Pending JPH10107495A (en) | 1996-09-26 | 1996-09-26 | Device for mounting component |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH10107495A (en) |
| WO (1) | WO1998014041A1 (en) |
Cited By (8)
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|---|---|---|---|---|
| JP2007214227A (en) * | 2006-02-08 | 2007-08-23 | Matsushita Electric Ind Co Ltd | Board holding device, board holding method, part mounting device and method utilizing the both |
| CN100335242C (en) * | 2001-12-11 | 2007-09-05 | 三星钻石工业股份有限公司 | Method of suckingly holding substrate, and suckingly and holdingly carrying machine using the method |
| JP2009295946A (en) * | 2008-06-09 | 2009-12-17 | Fuji Mach Mfg Co Ltd | Component holding device, and electronic circuit component mounting system |
| CN101686633A (en) * | 2008-09-27 | 2010-03-31 | 松下电器产业株式会社 | Component mounting device |
| KR20110125915A (en) * | 2010-05-14 | 2011-11-22 | 주식회사 탑 엔지니어링 | Electronic Component Transfer Device |
| JP2014022633A (en) * | 2012-07-20 | 2014-02-03 | Fuji Mach Mfg Co Ltd | Component mounting machine |
| DE102018115144A1 (en) * | 2018-06-23 | 2019-12-24 | Besi Switzerland Ag | Actuator for a bondhead |
| JP2020080354A (en) * | 2018-11-12 | 2020-05-28 | 株式会社Ｆｕｊｉ | Working machine and mounting method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2007187A1 (en) | 2007-06-19 | 2008-12-24 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Placement device and assembly device |
| CN102674041B (en) * | 2012-04-24 | 2014-07-23 | 华中科技大学 | Sheet vacuum pickup and release device |
| DE102012014558B4 (en) | 2012-07-24 | 2014-02-20 | Datacon Technology Gmbh | Kinematic holding system for a placement of a placement |
| JP7212055B2 (en) * | 2018-10-11 | 2023-01-24 | 株式会社Fuji | work machine |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63252440A (en) * | 1987-04-09 | 1988-10-19 | Shinko Electric Ind Co Ltd | Collet |
| JPH0398719A (en) * | 1989-09-13 | 1991-04-24 | Hitachi Ltd | Position correction of deformed object and its production system |
| JPH0851299A (en) * | 1994-08-05 | 1996-02-20 | Hitachi Techno Eng Co Ltd | Electronic component mounter |
| JPH09283990A (en) * | 1996-04-10 | 1997-10-31 | Toshiba Corp | Mounting head and bonding apparatus |
-
1996
- 1996-09-26 JP JP8254231A patent/JPH10107495A/en active Pending
-
1997
- 1997-09-25 WO PCT/JP1997/003401 patent/WO1998014041A1/en active Application Filing
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100335242C (en) * | 2001-12-11 | 2007-09-05 | 三星钻石工业股份有限公司 | Method of suckingly holding substrate, and suckingly and holdingly carrying machine using the method |
| JP2007214227A (en) * | 2006-02-08 | 2007-08-23 | Matsushita Electric Ind Co Ltd | Board holding device, board holding method, part mounting device and method utilizing the both |
| JP2009295946A (en) * | 2008-06-09 | 2009-12-17 | Fuji Mach Mfg Co Ltd | Component holding device, and electronic circuit component mounting system |
| CN101686633A (en) * | 2008-09-27 | 2010-03-31 | 松下电器产业株式会社 | Component mounting device |
| KR20110125915A (en) * | 2010-05-14 | 2011-11-22 | 주식회사 탑 엔지니어링 | Electronic Component Transfer Device |
| JP2014022633A (en) * | 2012-07-20 | 2014-02-03 | Fuji Mach Mfg Co Ltd | Component mounting machine |
| DE102018115144A1 (en) * | 2018-06-23 | 2019-12-24 | Besi Switzerland Ag | Actuator for a bondhead |
| JP2020080354A (en) * | 2018-11-12 | 2020-05-28 | 株式会社Ｆｕｊｉ | Working machine and mounting method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO1998014041A1 (en) | 1998-04-02 |
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