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JPH0390645U - - Google Patents

Info

Publication number
JPH0390645U
JPH0390645U JP15210689U JP15210689U JPH0390645U JP H0390645 U JPH0390645 U JP H0390645U JP 15210689 U JP15210689 U JP 15210689U JP 15210689 U JP15210689 U JP 15210689U JP H0390645 U JPH0390645 U JP H0390645U
Authority
JP
Japan
Prior art keywords
nozzles
common conduit
row
diameter
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15210689U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15210689U priority Critical patent/JPH0390645U/ja
Publication of JPH0390645U publication Critical patent/JPH0390645U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Nozzles (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
図面は本考案の一実施例を示すもので、第１図
は正面図、第２図は第１図のＡ部拡大正面図、第
３図は第２図のＢ−Ｂ線断面図、第４図は各ノズ
ル位置における縮径部の長さと吐出量を表すグラ
フである。 １……共通導管、２……ノズル、２ａ……縮径
部。

Claims (1)

  1. 【実用新案登録請求の範囲】 Ｔ字型の共通導管に複数のノズルが１列に植設
    してあり、 上記ノズルには、その中途に流路抵抗を調整す
    る縮径部が形成してあり、 上記流路抵抗は、上記共通導管の中心から遠ざ
    かるにつれて小さくなつている ことを特徴とする流体用デイスペンサ。
JP15210689U 1989-12-28 1989-12-28 Pending JPH0390645U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15210689U JPH0390645U (ja) 1989-12-28 1989-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15210689U JPH0390645U (ja) 1989-12-28 1989-12-28

Publications (1)

Publication Number Publication Date
JPH0390645U true JPH0390645U (ja) 1991-09-17

Family

ID=31698382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15210689U Pending JPH0390645U (ja) 1989-12-28 1989-12-28

Country Status (1)

Country Link
JP (1) JPH0390645U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007216139A (ja) * 2006-02-16 2007-08-30 Alps Electric Co Ltd 糊状接合剤の塗布装置
JP2014502920A (ja) * 2011-01-07 2014-02-06 ビーエーエスエフ ソシエタス・ヨーロピア カバー層に液体反応混合物を塗布するための方法と装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54119879A (en) * 1978-03-09 1979-09-18 Toshiba Corp Manufacturing device for semiconductor device
JPS6148065B2 (ja) * 1979-06-14 1986-10-22 Sanyo Denki Kk

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54119879A (en) * 1978-03-09 1979-09-18 Toshiba Corp Manufacturing device for semiconductor device
JPS6148065B2 (ja) * 1979-06-14 1986-10-22 Sanyo Denki Kk

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007216139A (ja) * 2006-02-16 2007-08-30 Alps Electric Co Ltd 糊状接合剤の塗布装置
JP2014502920A (ja) * 2011-01-07 2014-02-06 ビーエーエスエフ ソシエタス・ヨーロピア カバー層に液体反応混合物を塗布するための方法と装置

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