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JPH0377283A - Socket for substrate - Google Patents

Socket for substrate

Info

Publication number
JPH0377283A
JPH0377283A JP1211241A JP21124189A JPH0377283A JP H0377283 A JPH0377283 A JP H0377283A JP 1211241 A JP1211241 A JP 1211241A JP 21124189 A JP21124189 A JP 21124189A JP H0377283 A JPH0377283 A JP H0377283A
Authority
JP
Japan
Prior art keywords
socket
legs
board
substrate
conical surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1211241A
Other languages
Japanese (ja)
Inventor
Yukio Serizawa
芹澤 幸雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
S II R KK
Original Assignee
S II R KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by S II R KK filed Critical S II R KK
Priority to JP1211241A priority Critical patent/JPH0377283A/en
Publication of JPH0377283A publication Critical patent/JPH0377283A/en
Pending legal-status Critical Current

Links

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  • Connecting Device With Holders (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PURPOSE:To obtain a socket allowing simple and proper insertion into a substrate by connecting external sleeves for forming sockets containing a notch part and a conical surface to each other at the same pitches as electronic part legs via the predetermined heat resistant, insulating and highly elastic thin film. CONSTITUTION:Sockets A formed with an external sleeve 1 having a conical surface 1a and containing an internal connector 2 fitted with a notch part 2b and the like, are connected at the same pitch as the legs of an electronic part with a heat resistant, insulating and highly elastic thin film such as a silicon rubber 4. According to this construction, the sockets A can be easily and properly inserted into a substrate. Also, it is possible to obtain a socket for a substrate allowing quick connection of a plurality of electronic part legs, and easy insertion into the substrate and easy fabrication.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、IC,マイクロコンピュータ等の複数の端子
となる足を有する電子部品の該足を、プリント基板に着
脱可能に接続するための基板用ソケットに関する。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a board for removably connecting the feet of an electronic component such as an IC or a microcomputer, which has feet serving as a plurality of terminals, to a printed circuit board. Regarding sockets for

〔従来の技術〕[Conventional technology]

従来、IC,マイクロコンピュータ等をプリント基板に
接続する場合には、その足を直接基板にハンダ付けする
場合を除いて、ソケットが使用される。
Conventionally, when connecting an IC, a microcomputer, etc. to a printed circuit board, a socket is used, except when the legs are soldered directly to the circuit board.

このソケットとして、最も一般的なものは、弾性をもっ
て、電子部品の足に接触すると共に、基板の孔に挿入さ
れて、その回路パターンにハンダ付けされるコンタクト
を、合成樹脂のソケットに、電子部品の足と同ピツチで
埋込んだものが用いられていた。
The most common type of socket is a socket made of synthetic resin that contacts the legs of the electronic component with elasticity, and a contact that is inserted into a hole in the board and soldered to the circuit pattern. It was implanted at the same pitch as the foot of the patient.

このソケットは、合成樹脂のソケットの高さだけ電子部
品の取付高さが高くなると共に、コンタクトを埋込む工
程が必要となるため、非常に高価となる欠点があった。
This socket has the disadvantage that the mounting height of the electronic component is increased by the height of the synthetic resin socket, and the process of embedding the contacts is required, making it very expensive.

そのため、第5図に示すような基板用ソケットが市販さ
れるようになった。
Therefore, a board socket as shown in FIG. 5 has become commercially available.

同図において、1は外部スリーブで、その上端は円錐面
1aに、下端は小径部1bとなっている。
In the figure, reference numeral 1 denotes an external sleeve, the upper end of which is a conical surface 1a, and the lower end a small diameter portion 1b.

2は、外部スリーブ1内に挿着された内部コンタクトで
、その上端は円錐面1aに密着する円錐面2a、下面は
縦方向の切り込み2bによって弾性を付与され、その先
端が狭小な接触部2Cとなっている。
Reference numeral 2 denotes an internal contact inserted into the external sleeve 1. Its upper end has a conical surface 2a that closely contacts the conical surface 1a, its lower surface is made elastic by a vertical notch 2b, and its tip is a narrow contact portion 2C. It becomes.

そして、円錐面2aの上部には、シリコーンゴムのiH
*3が挿入されている。
Then, on the upper part of the conical surface 2a, a silicone rubber iH
*3 is inserted.

この基板用ソケットは、プリント基板の電子部品の足挿
入位置に、外部スリーブ1の小径部1b又はその上部が
挿入され、プリント基板のパターンにハンダ付けされる
In this board socket, the small diameter portion 1b of the outer sleeve 1 or its upper part is inserted into the foot insertion position of the electronic component of the printed board, and is soldered to the pattern of the printed board.

この基板用ソケットには、電子部品の足が薄膜3を破り
ながら、次いで内部コンタクト2の円錐面2aに案内さ
れて接触部2Cに挿入されるもので、接触部2Cが広げ
られた弾力によって、電子部品の足との接触状態を保つ
ものである。
In this board socket, the legs of the electronic component break through the thin film 3 and are then guided by the conical surface 2a of the internal contact 2 and inserted into the contact portion 2C, and due to the elasticity of the contact portion 2C, This is to maintain contact between the electronic parts and the feet.

前記、シリコーンゴムの薄膜3は、ハンダ付けに際して
飛ぶフラックス、その他により、内部コンタクト2の内
面が汚損し、電子部品の足との接触不良を防止するもの
である。
The silicone rubber thin film 3 prevents the inner surface of the internal contact 2 from becoming dirty due to flying flux and other substances during soldering, thereby preventing poor contact with the legs of the electronic component.

[発明が解決しようどする課題] このような基板用ソケットは、電子部品の足の数だけ、
1個宛基板の孔に挿入しなければならないので、ICの
ような足の数の多いものは、時にその挿入作業に手間で
る欠点があった。
[Problem to be solved by the invention] Such a board socket has a number of parts equal to the number of legs of the electronic component.
Since each IC must be inserted into a hole in the board, the insertion process for ICs with a large number of legs is sometimes time-consuming.

又、クーリングの必要な装置においては、外部スリーブ
1の下端の小径部1bが基板の孔に挿入されてハンダ付
けされるが、その挿入、或いはハンダ付けに際して傾く
と、基板用ソケットのピッチが狂い、電子部品の足が挿
入できなくなる等の問題もあった。
In addition, in devices that require cooling, the small diameter portion 1b at the lower end of the external sleeve 1 is inserted into a hole in the board and soldered, but if it is tilted during insertion or soldering, the pitch of the socket for the board will be distorted. There were also problems, such as the feet of electronic components not being able to be inserted.

〔発明の目的〕[Purpose of the invention]

本発明は、従来の基板用ソケットの前述の課題を解消す
るためのもので、基板への挿入の手間を簡略化すると共
に、基板に対する傾き等でピンチが狂うことがなく、従
来の基板用ソケットの利点も併有する製造容易な基板用
ソケットを提供することを目的とする。
The present invention is intended to solve the above-mentioned problems of the conventional board socket.It simplifies the effort of inserting the socket into the board, and prevents the pinch from going out of order due to tilting with respect to the board. An object of the present invention is to provide a board socket that is easy to manufacture and also has the following advantages.

(課題を解決するための手段) 本発明は、前述の目的を達成するための基板用ソケット
の手段に関し、円錐挿入口を有し、内部に複数に分割さ
れて狭小接触部を有する内部コンタクトと、底部を小径
とした外部スリーブとから成るソケットを、IC等の複
数の足を有する電子部品の足のピッチにおいて、円錐挿
入口内を含め、シリコーンゴム等のような耐熱性、絶縁
性、高弾性材の薄膜で連結したものである。
(Means for Solving the Problems) The present invention relates to means for a board socket for achieving the above-mentioned object, which has a conical insertion opening and an internal contact that is divided into a plurality of parts and has a narrow contact part. , a socket consisting of an external sleeve with a small diameter at the bottom, and a heat-resistant, insulating, high-elastic material such as silicone rubber, etc., including the inside of the conical insertion hole, at the pitch of the legs of an electronic component with multiple legs such as an IC. They are connected by a thin film of material.

〔発明の実施例〕[Embodiments of the invention]

次に、本発明の一実施例を、第1図について説明する。 Next, one embodiment of the present invention will be described with reference to FIG.

1は、上端を円錐面1a、下端を小径部1bとした外部
スリーブ、2は外部スリーブl内に挿着され、上端を円
錐面2a、下端に縦方向の切り込み2bによって狭小な
接触部2Cとした内部コンタクトで、これ等は前記した
従来の基板用ソケットと同しである。
1 is an external sleeve having a conical surface 1a at the upper end and a small diameter portion 1b at the lower end; 2 is inserted into the external sleeve l, and has a conical surface 2a at the upper end and a narrow contact portion 2C at the lower end with a vertical cut 2b. These internal contacts are the same as those of the conventional board socket described above.

この基板用ソケットの上端の円錐面1a、2a内におい
ては、その端面より下には殆ど入らずそれ以外の部分で
は端面より下に入り込むような状態で、各ソケッ)Aの
間隔が電子部品の足のピッチと同じになるように、シリ
コーンゴム4で連結したものである。
In the conical surfaces 1a and 2a at the upper end of this board socket, the distance between each socket A is such that the distance between each socket A is such that the electronic component hardly goes below the end surface, and in other parts it goes below the end surface. They are connected with silicone rubber 4 so that the pitch is the same as that of the feet.

このシリコーンゴム4に代えて、耐熱性、絶縁性で溶融
性の方法で適宜な粘性を持たせることができ、後に凝固
によって高弾性を持たせることができる材料であれば、
これを使用できる。
In place of the silicone rubber 4, any material that can be heat-resistant, insulating, and meltable to give it an appropriate viscosity, and that can be made to have high elasticity by solidifying later, can be used.
You can use this.

この基板用ソケットは、外部スリーブlを従来と同様に
、その小径部1b、又はその上部を基板の孔に挿入し、
これを基板のパターンにハンダ付けすることは従来と同
様で、シリコーンゴム4が内部コンタクト2内に、半田
付けの際のフラックス等が飛散して入り、電子部品の足
との接触不良を防止するのも従来と同じである。
This board socket is made by inserting the small diameter portion 1b or the upper part of the external sleeve l into the hole of the board as in the conventional case, and
Soldering this to the circuit board pattern is the same as before, and the silicone rubber 4 prevents flux etc. from scattering and entering the internal contact 2 during soldering, preventing poor contact with the legs of the electronic component. is the same as before.

又、シリコーンゴム4は、円錐面2aの上側においては
薄いため、電子部品の足で容易に破ることができる。
Furthermore, since the silicone rubber 4 is thin on the upper side of the conical surface 2a, it can be easily torn by the feet of electronic components.

しかし、各ソケットAは円錐面2aの上側よりは厚いシ
リコーンゴム4で連結され、電子部品の足と同一ピッチ
であるため、外部スリーブ1が基板に傾いてハンダ付け
されても、円錐面2aのピッチは変わることがない。
However, each socket A is connected by a silicone rubber 4 that is thicker than the upper side of the conical surface 2a, and has the same pitch as the legs of the electronic component, so even if the external sleeve 1 is soldered to the board at an angle, the conical surface 2a The pitch never changes.

従って、シリコーンゴム4を破いて円錐面2aに挿入さ
れた電子部品の足は、これに案内されて接触部2Cに導
入され、電子部品の足の挿着が容易となる。
Therefore, the feet of the electronic component inserted into the conical surface 2a by tearing the silicone rubber 4 are guided by this and introduced into the contact portion 2C, making it easy to insert the feet of the electronic component.

更に、各ソケットAはシリコーンゴム4で連結されてい
るので、各別に基板の孔に挿入する必要がなくなり、−
度に必要な数のソケットAを挿入できるようになり、そ
の挿入の手間が著しく簡略化される。
Furthermore, since each socket A is connected with silicone rubber 4, there is no need to insert each socket into the hole of the board separately.
The required number of sockets A can be inserted at a time, and the effort required for insertion is greatly simplified.

また、このソケットAはシリコーンゴム4で多数個が連
結されているので、必要な本数のソケット分だけをシリ
コーンゴム4から切断して使用することにより、多数種
類の基板用ソケットを製作する必要がなくなる。従って
、コストの低減を図ることができるものである。
In addition, since a large number of sockets A are connected by silicone rubber 4, it is necessary to manufacture many types of board sockets by cutting and using only the required number of sockets from silicone rubber 4. It disappears. Therefore, it is possible to reduce costs.

次に、この基板用ソケットの製造方法を第3図、第4図
に示す型で製造する方法について説明する。
Next, a method of manufacturing this board socket using the mold shown in FIGS. 3 and 4 will be described.

この型Bには、電子部品の足のピッチと同間隔で、円錐
面1aの下端の径を内径とする孔Cが多数穿設されてい
る。
This mold B is provided with a large number of holes C having an inner diameter equal to the diameter of the lower end of the conical surface 1a at the same intervals as the pitch of the legs of the electronic component.

この孔Cの一列、或いは複数列の外側に、土堤りがソケ
ットへの上端よりも僅かに高く形成されているものであ
る。
An earthen embankment is formed outside one or more rows of holes C to be slightly higher than the upper end to the socket.

この型Bの土堤り内に、土堤りの高さと同一の高さまで
、適宜の粘度に調整したシリコーンゴム4を流し込む。
Silicone rubber 4 adjusted to an appropriate viscosity is poured into the earthen embankment of this type B to the same height as the earthen embankment.

すると、円錐面la上の部分は、表面張力によって円錐
面2a内には入り込まず、その上端と同一の高さとなり
、土堤りの高さとソケットAの高さの差のシリコーンゴ
ム4の薄膜が形成される。
Then, the part on the conical surface la does not enter into the conical surface 2a due to surface tension, and becomes at the same height as the upper end of the conical surface 2a, and the thin film of silicone rubber 4 corresponding to the difference between the height of the earth embankment and the height of the socket A. is formed.

これに対し、ソケットA間の部分では、その間隔が広い
ため、前記のような強い表面張力は働かず、型面にまで
達する厚さとなり、ソケットA間のピッチを保持する。
On the other hand, since the distance between the sockets A is wide, the strong surface tension as described above does not work, and the thickness reaches the mold surface to maintain the pitch between the sockets A.

その後、12時間放置して、シリコーンゴム4を硬化さ
せ、硬化したシリコーンゴム4をソケットAと共に、型
Bから剥離して完成するものである。
Thereafter, the silicone rubber 4 is left to stand for 12 hours to cure, and the cured silicone rubber 4 is peeled off from the mold B together with the socket A to complete the mold.

〔発明の効果〕〔Effect of the invention〕

本発明は畝上のように、各ソケットは電子部品の足と同
ピツチで、シリコーンゴム等の耐熱性、!縁性、高弾性
の薄膜で連結されているので、必要な個数を一組として
切り離し1、−度にプリント基板の孔に挿入できるので
、その挿入時間を著しく短縮できる。
The present invention is like a ridge, each socket is the same pitch as the foot of the electronic component, and is made of heat resistant material such as silicone rubber! Since they are connected by a thin, highly elastic thin film, the required number of pieces can be cut out as a set and inserted into a hole in a printed circuit board in one go, so the insertion time can be significantly shortened.

又、プリント基板へのハンダ付けが傾いたとしても、電
子部品の足の挿入ガイドとなる円錐面のピッチは電子部
品の足と同ピツチに確保されるので、電子部品の足の挿
入が容易に行える。
In addition, even if the soldering to the printed circuit board is tilted, the pitch of the conical surface that serves as the insertion guide for the electronic component's feet is ensured to be the same pitch as the electronic component's feet, making it easy to insert the electronic component's feet. I can do it.

その他、従来の基板用ソケットの利点も併有する多くの
特徴のある基板用ソケットが得られるものである。
In addition, a board socket with many other features that also has the advantages of conventional board sockets can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の断面図、 第2図は電子部品の足の挿入状態を示す断面図、第3図
はこれを製造する型の斜面図、 第4図はその断面図、 第5図は従来の基板用ソケットの一部切欠斜面図である
。 A・・・ソケット、B・・・型、1・・・外部スリーブ
、la・・・円錐面、2b・・・切り込み、2c・・・
接触部、4・・・シリコーンゴム。 第2図 第3 図 第4 図 第5 図
Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is a sectional view showing the inserted state of the legs of the electronic component, Fig. 3 is a perspective view of the mold for manufacturing this, and Fig. 4 is its sectional view. , FIG. 5 is a partially cutaway oblique view of a conventional board socket. A...Socket, B...Type, 1...External sleeve, la...Conical surface, 2b...Notch, 2c...
Contact part, 4... silicone rubber. Figure 2 Figure 3 Figure 4 Figure 5

Claims (1)

【特許請求の範囲】[Claims] 円錐挿入口を有し、内部に複数に分割されて狭小接触部
を有する内部コンタクトと、底部を小径とした外部スリ
ーブとから成るソケットを、IC等の複数の足を有する
電子部品の足のピッチにおいて、円錐挿入口内を含め、
シリコーンゴム等のような耐熱性、絶縁性、高弾性材の
薄膜で連結したことを特徴とする基板用ソケット。
A socket consisting of an internal contact that has a conical insertion opening, is divided into a plurality of parts and has a narrow contact part, and an external sleeve with a small diameter bottom is used to adjust the pitch of the legs of an electronic component such as an IC that has multiple legs. , including the inside of the conical insertion port,
A board socket characterized by being connected by a thin film of heat-resistant, insulating, and highly elastic material such as silicone rubber.
JP1211241A 1989-08-18 1989-08-18 Socket for substrate Pending JPH0377283A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1211241A JPH0377283A (en) 1989-08-18 1989-08-18 Socket for substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1211241A JPH0377283A (en) 1989-08-18 1989-08-18 Socket for substrate

Publications (1)

Publication Number Publication Date
JPH0377283A true JPH0377283A (en) 1991-04-02

Family

ID=16602627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1211241A Pending JPH0377283A (en) 1989-08-18 1989-08-18 Socket for substrate

Country Status (1)

Country Link
JP (1) JPH0377283A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5530193A (en) * 1978-08-24 1980-03-03 Augat Inc Contact and insulating socket and panel board having same contact
JPS5938711A (en) * 1982-08-27 1984-03-02 Matsushita Electric Ind Co Ltd Fixing method of optical fiber bundle

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5530193A (en) * 1978-08-24 1980-03-03 Augat Inc Contact and insulating socket and panel board having same contact
JPS5938711A (en) * 1982-08-27 1984-03-02 Matsushita Electric Ind Co Ltd Fixing method of optical fiber bundle

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