JPH036438U - - Google Patents
Info
- Publication number
- JPH036438U JPH036438U JP6523389U JP6523389U JPH036438U JP H036438 U JPH036438 U JP H036438U JP 6523389 U JP6523389 U JP 6523389U JP 6523389 U JP6523389 U JP 6523389U JP H036438 U JPH036438 U JP H036438U
- Authority
- JP
- Japan
- Prior art keywords
- conductive metal
- adhesive
- layer
- metal layer
- shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000010410 layer Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第1図は従来のシールド用粘着金属テープの断
面図、第2図は他の従来のシールド用粘着金属テ
ープを製造する過程を説明する説明図であり、第
3図は本考案の実施例の断面図である。
第3図において、1…導電性金属層、2…粘着
剤層、3…小穴、d…小穴3の穴径、4…導電性
金属層のバリ。
FIG. 1 is a cross-sectional view of a conventional adhesive metal tape for shielding, FIG. 2 is an explanatory diagram illustrating the process of manufacturing another conventional adhesive metal tape for shielding, and FIG. 3 is a cross-sectional view of a conventional adhesive metal tape for shielding. FIG. In FIG. 3, 1... conductive metal layer, 2... adhesive layer, 3... small hole, d... hole diameter of small hole 3, 4... burr of the conductive metal layer.
Claims (1)
電性金属層側から粘着剤層の方向に向けて針を貫
通させて形成した穴径が0.1〜0.5mmの小
穴を多数有することを特徴とするシールド用粘着
金属テープ。 The conductive metal layer has an adhesive layer on one side, and a large number of small holes with a hole diameter of 0.1 to 0.5 mm are formed by passing a needle through the conductive metal layer toward the adhesive layer. An adhesive metal tape for shielding, comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6523389U JPH036438U (en) | 1989-06-02 | 1989-06-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6523389U JPH036438U (en) | 1989-06-02 | 1989-06-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH036438U true JPH036438U (en) | 1991-01-22 |
Family
ID=31596879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6523389U Pending JPH036438U (en) | 1989-06-02 | 1989-06-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH036438U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5556301U (en) * | 1978-10-11 | 1980-04-16 | ||
WO2011108490A1 (en) * | 2010-03-03 | 2011-09-09 | 日東電工株式会社 | Electrically conductive adhesive tape |
WO2016088381A1 (en) * | 2014-12-05 | 2016-06-09 | タツタ電線株式会社 | Electromagnetic wave shielding film |
JP2021174948A (en) * | 2020-04-30 | 2021-11-01 | 東洋インキScホールディングス株式会社 | Electromagnetic wave shield sheet, and printed wiring board and production method thereof |
-
1989
- 1989-06-02 JP JP6523389U patent/JPH036438U/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5556301U (en) * | 1978-10-11 | 1980-04-16 | ||
WO2011108490A1 (en) * | 2010-03-03 | 2011-09-09 | 日東電工株式会社 | Electrically conductive adhesive tape |
JP6061676B2 (en) * | 2010-03-03 | 2017-01-18 | 日東電工株式会社 | Conductive adhesive tape |
WO2016088381A1 (en) * | 2014-12-05 | 2016-06-09 | タツタ電線株式会社 | Electromagnetic wave shielding film |
JP2021174948A (en) * | 2020-04-30 | 2021-11-01 | 東洋インキScホールディングス株式会社 | Electromagnetic wave shield sheet, and printed wiring board and production method thereof |
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