JPH03190182A - Manufacture of molded circuit board - Google Patents
Manufacture of molded circuit boardInfo
- Publication number
- JPH03190182A JPH03190182A JP32713689A JP32713689A JPH03190182A JP H03190182 A JPH03190182 A JP H03190182A JP 32713689 A JP32713689 A JP 32713689A JP 32713689 A JP32713689 A JP 32713689A JP H03190182 A JPH03190182 A JP H03190182A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- film
- circuit film
- resin
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229920005989 resin Polymers 0.000 claims abstract description 43
- 239000011347 resin Substances 0.000 claims abstract description 43
- 239000000853 adhesive Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 22
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 238000000465 moulding Methods 0.000 claims description 7
- 239000010410 layer Substances 0.000 abstract description 14
- 239000012790 adhesive layer Substances 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012939 laminating adhesive Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリント回路フィルムと樹脂成形体とを一体
化したモールド成形回路基板の製造方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a molded circuit board in which a printed circuit film and a resin molded body are integrated.
［従来技術〕
従来から、ＦＰＣのようなプリント回路フィルムをモー
ルド成形用の金型内にセットした状態で樹脂の射出成形
（トランスファ成形などでも可）を行い、プリント回路
フィルムと樹脂成形体とを一体化することによりモール
ド成形回路基板を製造することは公知である（特開昭６
３−９８１９４号公報など）。この場合、プリント回路
フィルムと樹脂成形体との一体化は、プリント回路フィ
ルムの片面に予めホットメルトあるいはエポキシ等の接
着剤を塗布または積層しておき、樹脂充填時の熱および
圧力を利用して両者を接着することにより行われる。[Prior art] Conventionally, resin injection molding (transfer molding, etc. is also possible) is performed with a printed circuit film such as FPC set in a mold for molding, and the printed circuit film and resin molded body are combined. It is known to manufacture molded circuit boards by integrating them (Japanese Unexamined Patent Publication No. 6
3-98194, etc.). In this case, the printed circuit film and the resin molded body are integrated by applying or laminating adhesive such as hot melt or epoxy on one side of the printed circuit film in advance, and using the heat and pressure during resin filling. This is done by gluing the two together.
しかしこのような方法でモールド成形回路基板を製造し
た場合、接着剤の層と樹脂成形体との間に気泡が発生し
やすく、種々の不都合が生しることが判明した。すなわ
ち、このような気泡が発生すると、プリント回路フィル
ムの表面に凹凸ができ、表面実装部品を定位置に搭載で
きないとか、プリント回路フィルムが樹脂成形体から浮
いているため電子部品を半田付けした後に、半田付は部
に無理な応力が発生しやすく、半田付は部の信頼性が損
なわれる等の問題がある。However, it has been found that when a molded circuit board is manufactured by such a method, air bubbles are likely to be generated between the adhesive layer and the resin molded body, resulting in various inconveniences. In other words, when such air bubbles occur, the surface of the printed circuit film becomes uneven, making it impossible to mount surface mount components in the correct position, and the printed circuit film is floating from the resin molding, making it difficult to mount electronic components after soldering. Soldering tends to generate excessive stress on the parts, and soldering has problems such as impairing the reliability of the parts.
そこで気泡の発生原因を調査した結果、気泡は、金型内
に樹脂を充填したときに、樹脂の熱で接着剤が接着性能
を発揮できる程度にまで十分に加熱されないうちに樹脂
が固化してしまう場合に発生することが分かった。As a result of investigating the cause of air bubbles, we found that air bubbles are caused by the resin solidifying when the mold is filled with resin, before the resin heats up enough to allow the adhesive to exhibit its adhesive properties. I found out that it occurs when I put it away.
本発明は、上記のような問題点に鑑み、接着剤の層と樹
脂成形体との間に気泡が発生することのないモールド成
形回路基板の製造方法を提供するものである。In view of the above problems, the present invention provides a method for manufacturing a molded circuit board in which air bubbles are not generated between the adhesive layer and the resin molded body.
本発明によれば、その方法は、モールド成形用の金型内
面に、片面に接着剤を有するプリント回路フィルムを、
接着剤側の面をキャビティ内に向けてセットした後、そ
の金型内に樹脂を充填してモールド成形を行い、樹脂成
形体と前記プリント回路フィルムとを前記接着剤により
一体化してモールド成形回路基板を製造する方法におい
て、前記金型のプリント回路フィルムセット面とプリン
ト回路フィルムの接着剤との間が７０μｍ以上となるよ
うに断熱層を設けることを特徴とするものである。According to the invention, the method includes placing a printed circuit film having an adhesive on one side on the inner surface of a molding die.
After setting the adhesive side facing into the cavity, the mold is filled with resin and molded, and the resin molded body and the printed circuit film are integrated with the adhesive to form a molded circuit. The method for manufacturing a board is characterized in that a heat insulating layer is provided so that the distance between the printed circuit film setting surface of the mold and the adhesive of the printed circuit film is 70 μm or more.
このような断熱層を設けると、金型内に樹脂を充填した
ときに、樹脂の熱が金型に逃げにくくなり、樹脂の硬化
速度が遅くなるため、接着剤に十分に熱が伝わり、プリ
ント回路フィルムと樹脂成形体との良好な接着状態が得
られるようになる。By providing such a heat insulating layer, when the mold is filled with resin, it becomes difficult for the heat of the resin to escape into the mold, slowing down the curing speed of the resin, and allowing sufficient heat to be transferred to the adhesive to prevent printing. Good adhesion between the circuit film and the resin molded body can be obtained.
断熱層を設ける手段としては次のような種々の方法が考
えられる。The following various methods can be considered as means for providing the heat insulating layer.
一つの方法は、上記の断熱層を、プリント回路フィルム
の絶縁フィルムが兼ねることである。つまりプリント回
路フィルムの絶縁フィルムの厚さを７０μｍ以上にする
ことにより、絶縁フィルムを断熱層として使用するもの
である。One method is for the insulating film of the printed circuit film to also serve as the above-mentioned heat insulating layer. That is, by setting the thickness of the insulating film of the printed circuit film to 70 μm or more, the insulating film is used as a heat insulating layer.
他の方法は、プリント回路フィルムを金型内面にセット
するときに、両者間に断熱層としてプラス千ツクフィル
ム等の断熱フィルムを介在させることである。Another method is to interpose a heat insulating film such as a plastic film as a heat insulating layer between the printed circuit film and the inner surface of the mold.
さらに他の方法は、金型の、プリント回路フィルムをセ
ットする面に予め断熱層として樹脂をコーティングまた
はラミネートしておくことである。Yet another method is to previously coat or laminate a resin as a heat insulating layer on the surface of the mold on which the printed circuit film is set.
以下、本発明の実施例を図面を参照して詳細に説明する
。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
図−Ｍａｌ（ｂｌは本発明の一実施例を示す。この方法
は、まず（ａｌに示すようにモールド成形用の金型１１
Ａ・ＩＩＢを開いて、一方の金型１１Ａの内面１２にプ
リント回路フィルム１３をセットする。Figure-Mal (bl shows one embodiment of the present invention. This method first involves a mold 11 for mold forming as shown in (al).
Open A/IIB and set the printed circuit film 13 on the inner surface 12 of one mold 11A.
このプリント回路フィルム１３は、例えば図−２に示す
ように、可撓性を有する絶縁フィルム１４の片面に所要
パターンの回路導体１５を形成し、その上に電子部品を
半田付けするバンド部１６を残してソルダーレジスト１
７を印刷すると共に、反対側の面に接着剤１８の層を設
けたものである。絶縁フィルム１４としてはポリイミド
フィルム等が使用される。回路導体１５は導電ペースト
の印刷あるいは銅箔のパターンエツチング等により形成
される。接着剤１８は例えばエポキシ系の接着剤を塗布
した後、高温でタックフリーの状態に半硬化させたもの
である。For example, as shown in FIG. 2, this printed circuit film 13 has a circuit conductor 15 of a desired pattern formed on one side of a flexible insulating film 14, and a band portion 16 on which electronic components are soldered. Leave solder resist 1
7 is printed, and a layer of adhesive 18 is provided on the opposite side. As the insulating film 14, a polyimide film or the like is used. The circuit conductor 15 is formed by printing a conductive paste or pattern etching a copper foil. The adhesive 18 is, for example, an epoxy adhesive that is applied and then semi-cured to a tack-free state at a high temperature.
このプリント回路フィルム１３を金型１１Ａの内面１２
にセットするときは、接着剤１８例の面がキャビティ１
９内を向く （図−１（ａ）で右側を向く）ようにする
。金型１１Ａ・ＩＩＢは７０℃前後の温度に制御されて
いる。This printed circuit film 13 is attached to the inner surface 12 of the mold 11A.
When setting the adhesive on the surface of cavity 1,
9 (face to the right in Figure 1(a)). The temperature of the molds 11A and IIB is controlled at around 70°C.
次いで図−１（ｂ）に示すように金型１１Ａ・ＩＩＢを
閉じ、樹脂注入孔２１よりキャビティ１９内に溶融樹脂
２２”を圧入する。その後、樹脂２２゛ を冷却固化さ
せ、金型１１Ａ・ＩＩＢを開くと、図−３に示すように
プリント回路フィルム１３と樹脂成形体２２とが接着剤
１８により一体化されたモールド成形回路基板２３を取
り出すことができる。なお成形樹脂としては例えば強化
ポリエチレンテレフタレート等が用いられる。Next, as shown in Figure 1(b), the molds 11A and IIB are closed, and the molten resin 22'' is press-fitted into the cavity 19 through the resin injection hole 21.Then, the resin 22'' is cooled and solidified, and the molds 11A and IIB are closed. When the IIB is opened, a molded circuit board 23 in which a printed circuit film 13 and a resin molded body 22 are integrated with an adhesive 18 can be taken out as shown in FIG. 3.The molded resin may be, for example, reinforced polyethylene. Terephthalate etc. are used.
以上のような方法で、絶縁フィルムの厚さが３０．５０
．７０．１００ μｍの４種類のプリント回路フィルム
を用い、各々についてモールド成形回路基板を製造した
。その結果、絶縁フィルムの厚さが３０．５０μ僧のプ
リント回路フィルムを使用した場合は接着剤と樹脂成形
体との間に気泡の発生が見られたが、同厚さが７０．１
００μｍのプリント回路フィルムを使用した場合は気泡
のない良好なモールド成形回路基板を製造することがで
きた。By the above method, the thickness of the insulating film is 30.50
．． 70. Four types of printed circuit films of 100 μm were used to produce molded circuit boards for each. As a result, when a printed circuit film with an insulating film thickness of 30.50 μm was used, air bubbles were observed between the adhesive and the resin molding, but when the same thickness was 70.1 μm, air bubbles were observed between the adhesive and the resin molded body.
When a 00 μm printed circuit film was used, a good molded circuit board without bubbles could be manufactured.
次に図−４を参照して本発明の他の実施例を説明する。Next, another embodiment of the present invention will be described with reference to FIG.
金型１１Ａ４１Ｂおよびプリント回路フィルム１３の構
成は前記実施例と同様である。The configurations of the mold 11A41B and the printed circuit film 13 are the same as in the previous embodiment.
この方法は、プリント回路フィルム１３を金型１１Ａの
内面１２にセットするときに、金型内面１２との間にポ
リエステルフィルム等の断熱フィルム２４を介在させる
ものである。その後は前記実施例と同様で、金型１１Ａ
−１１Ｂを閉じ、溶融樹脂を充填し、充填した樹脂を
固化させ、金型を開いて、樹脂成形体を取り出す。取り
出し後、断熱フィルム２４を剥離すると、図−３に示す
ようなモールド成形回路基板１３が得られるものである
。In this method, when the printed circuit film 13 is set on the inner surface 12 of the mold 11A, a heat insulating film 24 such as a polyester film is interposed between the printed circuit film 13 and the inner surface 12 of the mold 11A. After that, the process is the same as in the above embodiment, and the mold 11A
-11B is closed, filled with molten resin, the filled resin is solidified, the mold is opened, and the resin molded body is taken out. After taking out, when the heat insulating film 24 is peeled off, a molded circuit board 13 as shown in FIG. 3 is obtained.
この方法では、絶縁フィルムの厚さが３０μｍのプリン
ト回路フィルムを用い、断熱フィルム２４の厚さを２０
．４０．７０μｍに変えて、モールド成形回路基板を製
造した。その結果、断熱フィルム２４の厚さが２０μｍ
の場合は接着剤と樹脂成形体との間に気泡の発生が見ら
れたが、４０．７０μｍの場合は気泡のない良好なモー
ルド成形回路基板を製造することができた。この方法で
は、断熱フィルム２４とプリント回路フィルム１３の絶
縁フィルムとが断熱層として作用していることが分かる
。In this method, a printed circuit film with an insulating film thickness of 30 μm is used, and the thickness of the insulating film 24 is 20 μm.
．． A molded circuit board was manufactured by changing the thickness to 40.70 μm. As a result, the thickness of the heat insulating film 24 was 20 μm.
In the case of 40.70 μm, generation of bubbles was observed between the adhesive and the resin molded body, but in the case of 40.70 μm, a good molded circuit board without bubbles could be manufactured. It can be seen that in this method, the heat insulating film 24 and the insulating film of the printed circuit film 13 act as a heat insulating layer.
次に図−５を参照して本発明のさらに他の実施例を説明
する。この方法は、金型１１Ａの、プリント回路フィル
ム１３をセットする面１２に予めフン素樹脂などの断熱
塗膜２５を設けた上で、図−１の実施例と同様にしてモ
ールド成形回路基板を製造するものである。Next, still another embodiment of the present invention will be described with reference to FIG. In this method, a heat insulating coating film 25 such as fluorine resin is provided in advance on the surface 12 of the mold 11A on which the printed circuit film 13 is set, and then a molded circuit board is placed in the same manner as in the embodiment shown in FIG. It is manufactured.
この方法では、断熱塗膜２５の厚さを２０μｍにして、
絶縁フィルムの厚さが３０．５０．７０．１００ μｍ
の４種類のプリント回路フィルムを用い、各々について
モールド成形回路基板を製造した。その結果、絶縁フィ
ルムの厚さが３０μｍのプリント回路フィルムを使用し
た場合は接着剤と樹脂成形体との間に気泡の発生が見ら
れたが、同厚さが５０．７０．１００ μｍのプリント
回路フィルムを使用した場合は気泡のない良好なモール
ド成形回路基板を製造することができた。この方法でも
、断熱塗膜２５とプリント回路フィルム１３の絶縁フィ
ルムとが断熱層として作用していることが分かる。In this method, the thickness of the heat insulating coating film 25 is 20 μm,
The thickness of the insulation film is 30.50.70.100 μm
Using four types of printed circuit films, molded circuit boards were manufactured for each. As a result, when a printed circuit film with an insulating film thickness of 30 μm was used, air bubbles were observed between the adhesive and the resin molded body, but when using a printed circuit film with the same thickness of 50, 70, and 100 μm, When a circuit film was used, a good molded circuit board without bubbles could be manufactured. It can be seen that even in this method, the heat insulating coating film 25 and the insulating film of the printed circuit film 13 act as a heat insulating layer.
なお以上の実施例では、プリント回路フィルムの絶縁フ
ィルムとしてポリイミドフィルムを用いたが、絶縁フィ
ルムはモールド成形時の熱に耐え得るものであればよく
、ポリエチレンテレフタレートフィルムなどの使用も可
能である。In the above embodiments, a polyimide film was used as the insulating film of the printed circuit film, but the insulating film may be any material as long as it can withstand the heat during molding, and polyethylene terephthalate film or the like may also be used.
また上記実施例ではプリント回路フィルムとして絶縁フ
ィルムの片面に回路導体を形成したものを使用したが、
プリント回路フィルムは絶縁フィルムの両面に回路導体
を形成したものでもよい。Furthermore, in the above embodiment, an insulating film with a circuit conductor formed on one side was used as the printed circuit film.
The printed circuit film may be an insulating film with circuit conductors formed on both sides.
またモールド成形用の樹脂としては、ポリプロピレン、
アクリル・ブタジェン・スチレン共重合体、ポリカーボ
ネート、ポリブチレンテレフタレート、ポリスルホン、
ポリフェニレンスルファイド、ポリエーテルイミド、ボ
リアリレート、液晶ポリマー等が使用できる。In addition, polypropylene, resin for molding,
Acrylic-butadiene-styrene copolymer, polycarbonate, polybutylene terephthalate, polysulfone,
Polyphenylene sulfide, polyetherimide, polyarylate, liquid crystal polymer, etc. can be used.
また上記実施例では、エポキシ系接着剤を用いたが、ホ
ントメルト系接着剤でも同様の効果が得られる。Further, in the above embodiments, an epoxy adhesive was used, but the same effect can be obtained with a true melt adhesive.
以上説明したように本発明によれば、金型のプリント回
路フィルムセット面とプリント回路フィルムの接着剤と
の間が７０μｍ以上となるように断熱層を設けたことに
より、金型内に充填された樹脂の冷却速度が遅くなり、
接着剤が十分に熱せられて樹脂成形体と接着するため、
接着剤の層と樹脂成形体との間に気泡のない、高品質の
モールド成形回路基板を製造できる利点がある。As explained above, according to the present invention, the heat insulating layer is provided so that the distance between the printed circuit film setting surface of the mold and the adhesive of the printed circuit film is 70 μm or more, so that the inside of the mold is filled. The cooling rate of the resin is slowed down,
Because the adhesive is heated enough to bond with the resin molded object,
There is an advantage that a high quality molded circuit board can be manufactured without air bubbles between the adhesive layer and the resin molded body.
図−１（ａ）（ｂｌは本発明の一実施例に係るモールド
成形回路基板の製造方法を工程順に示す断面図、図−２
はその方法に用いるプリント回路フィルムの断面図、図
−３はその方法によって製造されたモールド成形回路基
板の断面図、図−４および図−５はそれぞれ本発明の他
の実施例を示す断面図である。
１１Ａ・１１Ｂ＝金型
１２ニブリント回路フィルムセット面
１３ニブリント回路フィルム １４：絶縁フィルム１５
：回路導体 １７：ソルダーレジスト１８：接着剤 １
９：キャビティ ２２：樹脂成形体２３：モールド成形
回路基板
２４：断熱フィルム ２５：断熱塗膜
図−４
図−２
図−５
図−１
図−３Figure 1(a) (bl is a sectional view showing the manufacturing method of a molded circuit board according to an embodiment of the present invention in order of steps, Figure 2
is a sectional view of a printed circuit film used in the method, FIG. 3 is a sectional view of a molded circuit board manufactured by the method, and FIGS. 4 and 5 are sectional views showing other embodiments of the present invention, respectively. It is. 11A/11B = Mold 12 Niblint circuit film set surface 13 Niblint circuit film 14: Insulating film 15
:Circuit conductor 17:Solder resist 18:Adhesive 1
9: Cavity 22: Resin molded body 23: Molded circuit board 24: Heat insulating film 25: Heat insulating coating Figure-4 Figure-2 Figure-5 Figure-1 Figure-3
Claims (2)
るプリント回路フィルムを、接着剤側の面をキャビティ
内に向けてセットした後、その金型内に樹脂を充填して
モールド成形を行い、樹脂成形体と前記プリント回路フ
ィルムとを前記接着剤により一体化してモールド成形回
路基板を製造する方法において、前記金型のプリント回
路フィルムセット面とプリント回路フィルムの接着剤と
の間が７０μｍ以上となるように断熱層を設けることを
特徴とするモールド成形回路基板の製造方法。1. A printed circuit film with adhesive on one side is set on the inside of a mold for molding, with the adhesive side facing into the cavity, and then the mold is filled with resin and molded. In the method of manufacturing a molded circuit board by integrating a resin molded body and the printed circuit film with the adhesive, the distance between the printed circuit film setting surface of the mold and the adhesive of the printed circuit film is 70 μm or more. 1. A method for manufacturing a molded circuit board, characterized by providing a heat insulating layer so as to provide a heat insulating layer.
のプリント回路フィルムセット面とプリント回路フィル
ムとの間に設けることを特徴とするもの。2. 2. The manufacturing method according to claim 1, wherein a heat insulating layer is provided between the printed circuit film setting surface of the mold and the printed circuit film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32713689A JPH03190182A (en) | 1989-12-19 | 1989-12-19 | Manufacture of molded circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32713689A JPH03190182A (en) | 1989-12-19 | 1989-12-19 | Manufacture of molded circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03190182A true JPH03190182A (en) | 1991-08-20 |
Family
ID=18195717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32713689A Pending JPH03190182A (en) | 1989-12-19 | 1989-12-19 | Manufacture of molded circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03190182A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002290132A (en) * | 2000-12-26 | 2002-10-04 | Furukawa Electric Co Ltd:The | Small-sized antenna and manufacturing method therefor |
| JP2014013930A (en) * | 2013-09-11 | 2014-01-23 | Teikoku Tsushin Kogyo Co Ltd | Method for manufacturing substrate with base |
-
1989
- 1989-12-19 JP JP32713689A patent/JPH03190182A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002290132A (en) * | 2000-12-26 | 2002-10-04 | Furukawa Electric Co Ltd:The | Small-sized antenna and manufacturing method therefor |
| JP2014013930A (en) * | 2013-09-11 | 2014-01-23 | Teikoku Tsushin Kogyo Co Ltd | Method for manufacturing substrate with base |
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