JPH03170556A - Photopolymer composition - Google Patents

Abstract

PURPOSE:To obtain a highly sensitive and highly heat-resistant photosensitive polyimide resin composition having good adhesion and low modulus by mixing a siliconediamine/polyamic acid copolymer with an acrylamide, a biscoumarin compound and an oxazolone compound as essential components. CONSTITUTION:A photopolymer composition is formed by mixing a polyamic acid (A) copolymerized with 1-50wt.% silicone-diamine of formula I (wherein (n) is 1-50) with a photosensitizer (B) comprising an acrylamide of formula II (wherein R1 is H, CH3 or C2H5; and R2 and R3 are each H, CH3, C2H5, CH2OH or C6H5), a sensitizer (C) comprising a 3-carbonyl-substituted biscoumarin compound of formula III (wherein R4 and R5 are each H, alkoxy or dialkylamino) and an initiator (D) comprising an oxazolone compound of formula IV (wherein R6 is substituted phenyl or substituted naphthyl). The amounts of the components are such that 20-200 pts.wt. component B, 1-10 pts.wt. component C and 1-20 pts.wt. component D are used per 100 pts.wt. component A.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a photosensitive polyimide resin composition that has good adhesion, low elastic modulus, high sensitivity, and high heat resistance.

[Conventional technology] Conventionally, surface protection films of semiconductor elements, glabella insulating films, etc.
Polyimide resin is used because it has excellent heat resistance and outstanding electrical and mechanical properties. However, in recent years, semiconductor devices have become more highly integrated and larger, sealing resin packages have become thinner and smaller, and solder With the shift to surface mounting methods using reflow, there is a demand for significant improvements in heat cycle resistance, heat shock resistance, etc., and conventional polyimide resins have
It has become difficult to respond.

As a countermeasure against this problem, it is known that, for example, a silicone component is introduced into the polyimide resin to increase adhesion and lower the elastic modulus. (JP-A-61-64730, JP-A-62-223228, etc.) On the other hand, a technique for imparting photosensitivity to polyimide resin itself has recently attracted attention.

Using polyimide resins that have been given these photosensitizers not only simplifies the pattern creation process compared to polyimide resins that have not been given photosensitivity, but also eliminates the need to use highly toxic etching solutions, making them safer. It is also excellent in terms of pollution, and photosensitization of polyimide resin is expected to become an even more important technology in the future, along with the development of high adhesion and low elastic modulus of polyimide resin.

As the photosensitive polyimide resin, for example, a polyimide precursor composition to which a photosensitive group is added with an ester group having a structure as shown in the following formula (Japanese Patent Publication No. 55-30207, Japanese Patent Publication No. 55-41422) or the following. A composition in which a compound containing a carbon-carbon double bond and an amino group or a quaternized salt thereof that can be dimerized or polymerized by actinic radiation is added to a polyamic acid having a structure as shown in the formula (for example, Japanese Patent Publication No. 59 -52822) and the like are known.

All of these are dissolved in a suitable organic solvent, applied as a varnish, dried, exposed to ultraviolet light through a photomask, developed and rinsed to obtain the desired pattern, and then heat-treated to form a polyimide. It is a coating.

However, if such conventional photosensitization technology is applied to a polyimide resin with high adhesion and low elasticity that has a silicone group introduced into the polyimide resin component, it will be difficult to pattern it even when irradiated with ultraviolet rays. Bi Imaro Kaf Low Go
Zado Fukucho A: The exposure equipment that has been around for a long time in Tododen 1A was insufficient for processing.

Furthermore, when the film thickness of these photosensitive polyimide resins is increased, the photosensitivity is extremely reduced and the proper exposure time is extremely long.

[Problems to be Solved by the Invention] The purpose of the present invention is to improve adhesion by introducing silicone groups into polyamic acid, and to achieve photocuring with high sensitivity despite lowering the elastic modulus. It is an object of the present invention to provide a photosensitive resin composition which has high properties and also has an excellent heat resistance after curing.

[Means for Solving the Problem] The present invention provides a polyamic acid (A) containing 1 to 50% by weight of a silicone diamine represented by the following general formula (1).
and an acrylamide (B) represented by the following general formula (II) as a photosensitizer (where R x : -H,
-C H 3, -C 2H 5, R2. R3: -H
, -CH3, -C2H5, -CH20H, -C8H5), a biscoumarin compound (C) 0 represented by the following general formula (m) as a sensitizer, and the following general formula [■] as an initiator. The following oxazolone compound (D) is an essential component, and based on 100 parts by weight of (A), 20 to 200 parts by weight of photosensitizer (B), 1 to 10 parts by weight of sensitizer (C), and 1 part by weight of initiator (D) -20 parts by weight of the photosensitive resin composition is used.

[Function] The silicone diamine represented by the general formula CI) used in the present invention has the effect of improving the adhesion of the polyimide film and lowering the elastic modulus.

The degree of polymerization n of the silicone diamine needs to be 1 to 50, and when n is less than 1, the adhesion is improved,
If the effect of lowering the elastic modulus is not obtained and a long chain silicone diamine with n exceeding 50 is used, the reaction with the tetracarboxylic dianhydride will be difficult to proceed quantitatively, and it will remain as an unreacted product. This is not preferable because it not only does not increase the molecular weight but also reduces flexibility and makes cracks more likely to occur.

The amount of silicone diamine used is preferably 1 to 50% by weight based on the polyamic acid component.

If it is less than 1% by weight, the effects of improving adhesion and lowering the elastic modulus cannot be obtained, and if it exceeds 50% by weight, the heat resistance is significantly reduced and the characteristics inherent to polyimide resins cannot be obtained, which is not preferable.

As the diamine used in the present invention, in addition to the above-mentioned silicone diamine, aromatic diamines such as those listed below can also be used to impart various properties.

For example, m-phenylene diamine, 1-isopropyl-
2,4-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylpropane, 3,
3'-diaminodiphenylpropane, 4,4'-diaminodiphenylethane, 3,3'-diaminodiphenylethane, 4,4'-diaminodiphenylmethane,
3,3'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone , 4,4'-diaminodiphenyl ether, 3,3'
-diaminodiphenyl ether, benzidine, 3,3
'-Diaminobiphenyl, 3.3'-dimethyl-4.
4'-diaminobiphenyl, 3,3'-dimethoxybenzidine, 4.4''-diaminop-terphenyl,
3.3”-diamino-p-terphenyl, bis(p-aminocyclohexyl)methane, bis(p-β-amino-t-butylphenyl)ether, bis(p-β-methyl-δ-aminobentyl)benzene, p-bis(2-methyl-4-aminobentyl)benzene, p-bis(l
,1-dimethyl-5-aminopentyl)benzene, 1
, 5-diaminonaphthalene, 2,6-diaminonaphthalene, 2,4-bis(β-amino-L-butyl)toluene, 2,4-diaminotoluene, m-xylene-2
,5-diamine, p-xylene-2,5-diamine, m
-xylylene diamine, p-xylylene diamine,
2,6-diaminopyridine, 2,5-diaminopyridine, 2,5-diamino-1.3.4-oxadiazole, 1,4-diaminocyclohexane, viverazine,
Methylene diamine, ethylene diamine, propylene diamine, 2,2-dimethyl-propylene diamine, tetramethylene diamine, pentamethylene diamine, hexamethylene diamine, 2,5-dimethyl-hexamethylene diamine, 3- Methoxyhexamethylene diamine, heptamethylene diamine, 2,5-dimethyl heptamethylene diamine, 3-methyl heptamethylene diamine, 4,4-dimethyl/l-heptamethylene diamine, octamethylene diamine , nonamethylene diamine, 5-methylnonamethylene diamine, 2,5-dimethylnonamethylene diamine, decamethylene diamine, l,10-diamino l,10-
Dimethyl-decane, 2,11-diaminodecane, l
, 12-diamino-octadecane, 2,12-diamino-octadecane, 2,17-diamino-icosane, etc., but are not limited to these.

The tetracarboxylic dianhydride component to be reacted with the diamine component may be one type or a mixture of two or more types, but the tetracarboxylic dianhydride used is biromellitic dianhydride, benzene-1.2 , 3.4-tetracarboxylic dianhydride, 3.3', 4.4'-benzophenone tetracarboxylic dianhydride, 2.2', 3.3
'-benzophenonetetracarboxylic dianhydride, 2,3
．． 3',4'-benzophenonetetracarboxylic dianhydride, naphthalene-2,3,6,7-tetracarboxylic dianhydride, naphthalene-1,2,5,6-tetracarboxylic dianhydride, naphthalene- 1.2,4.5-tetracarboxylic dianhydride, naphthalene-1.4,5.8-tetracarboxylic dianhydride, naphthalene-1.2,6.7-
Tetracarboxylic dianhydride, 4.8-dimethyl-1.2
,3,5,6.7-hexahide naphthalene-1.2,
5.6-tetracarboxylic dianhydride, 4,8-dimethyl-1.2,3,5,6.7-hexahydronaphthalene-
2.3,6.7-tetracarboxylic dianhydride, 2,6-
Dichloronaphthalene-1.4,5.8-tetracarboxylic dianhydride, 2,7-dichloronaphthalene-1.4,5
．． 8-tetracarboxylic dianhydride, 2, 3, 6.
7-tetrachlornaphthalene-1.4,5.8-tetracarboxylic dianhydride, 1,4,5.8-tetracronaphthalene-2.3,6.7-tetracarboxylic dianhydride, 3 .3',4.4'-diphenyltetracarboxylic dianhydride, 2.2',3,3'-diphenyltetracarboxylic dianhydride, 2,3,3',4'-diphenyltetracarboxylic dianhydride Anhydride, 3,3", 4.4"-p-terphenyltetracarboxylic dianhydride, 2.2", 3.
3”-p-terphenyltetracarboxylic dianhydride, 2
, 3.3", 4"-p-terphenyltetracarboxylic dianhydride, 2,2-bis(2,3-dicarboxyphenyl)-propanihydride, 2,2-bis(3.4-dicarboxylic dianhydride) carboxyphenyl) monopropanihydride, bis(2,
3-dicarpoxyphenyl)ether dianhydride, bis(
3,4-dicarboxyphenyl)ether dianhydride, bis(2,3-dicarboxyphenyl)methane dianhydride,
Bis(3,4-dicarboxyphenyl)methanihydride, bis(2,3-dicarboxyphenyl)sulfonic anhydride, bis(3,4-dicarboxyphenyl)sulfonic anhydride, 1,1-bis( 2,3-dicarboxyphenyl)ethane dianhydride, 1,1-bis(3,4-dicarboxyphenyl)ethane dianhydride, berylene-2.3,8
．． 9-tetracarboxylic dianhydride, berylene-3.4,
9.10-Tetracarboxylic dianhydride, perylene-4.
5,10.11-tetracarboxylic dianhydride, perylene-5.6,11.12-tetracarboxylic dianhydride, phenanthrene-1,2,7.8-tetracarboxylic dianhydride, phenanthrene-1. 2,6.7-tetracarboxylic dianhydride, phenanthrene-1,2,9.10-tetracarboxylic dianhydride, cyclopentane-1.2,3
．． 4-tetracarboxylic dianhydride, pyrazine-2.3,
5.6-tetracarboxylic dianhydride, pyrrolidine-2.
3,4.5-tetracarboxylic dianhydride, thiophene-
Examples include, but are not limited to, 2,3,4,5-tetracarboxylic dianhydride.

The acrylamide component (B) in the present invention has good scattering properties in the final curing process when patterning into a photosensitive resin composition, so there is no need to expose it to high temperatures for a long time, and therefore there is no deterioration of the resin. It is characterized by Conventionally used acrylic esters, for example, require 30 minutes at 350°C even in the mixed type as disclosed in Japanese Patent Publication No. 59-52822, Japanese Patent Publication No. 55-30207,
In the case of a reactive type such as that disclosed in Japanese Patent No. 41422, it is necessary to maintain the temperature at 400° C. for one hour, and as a result, the final cured product becomes blackish and in the worst case becomes crumbly, making it impossible to obtain a strong film. In comparison, the acrylamide of the present invention has a
It is possible to disperse the particles sufficiently at °C and obtain a good film.

Moshitsu Publication No. 59-52822 and Special Publication No. 55-3
When the compositions of No. 0207 and No. 41422 are finally cured at 300°C, acrylic esters remain in the cured product, making it impossible to exhibit the heat resistance and various properties as a polyimide resin. The amount of acrylamide compounded is 20 to 200 parts by weight per 100 parts by weight of solid content of polyamic acid.
Parts by weight are preferred. If the amount is less than 20 parts by weight, a sufficient photocrosslinked product will not be obtained and will all dissolve during development, which is not preferred. Also, the blending amount is 200
If the amount exceeds 1 part by weight, the addition amount is so large that even if effective photocrosslinking is carried out, scattering shrinkage will be large during heat treatment and cracks will easily occur, which is not preferable.

The sensitizer as component (C) in the present invention is a biscoumarin compound substituted with carbonyl at the 3-position and represented by the following formula ([1) 0 (in the formula, R4, Rag-H+alkoxy group, dialkylamino group).

Examples of this biscoumarin compound include 3.3'-carbonylrubis(7-jethylaminocoumarin), 3
, 3'-carbonylrubis (5,7-dimethoxycarbonylcoumarin) and the like, but are not limited thereto.

Sensitizers used in the photosensitive resin composition include henzophenone, acetophenone, anthrone, p,p'-tetramethyldiaminobenzophenone (Michler ketone),
Phenanthrene, 2-nitrofluorene, 5-nitroacenaphthene, penzoquinone, N-acetyl-p-nitroaniline, p-nitroaniline, 2-ethylanthraquinone, 2-tert-butylanthraquinone, N-acetyl-4-nitro-1-naphthylamine, Picramide, 1,2-penzuanthraquinone, 3-methyl-1,3
-Diazar 1,9-Penzuanthrone, p. p'-tetraethyldiaminobenzophenone, 2-chloro-4-nitroaniline, dibenzalacetone, 1,2-naphthoquinone, 2,5-bis(4'-jethylaminobenzal)monocyclobentane, 2,6- Bis(4'-diethylaminobenzal)monocyclohexanone, 2,6-bis-
(4'-dimethylaminobenzal)-4-methyl-cyclohexanone, 2,6-bis-(4'-diethylaminobenzal)-4-methyl-cyclohexanone, 4,4'
-bis-(dimethylamino)monochalcone, 4,4'-bis-(diethylamino)monochalcone, ρ-dimethylaminobenzylideneindanone, 1,3-bis=(4'-dimethylaminobenzal)monoacetone, 1 ,3-bisou(
Examples include 4'-diethylaminobenzal) monoacetone, N-phenynotodiethanolamine, N-p-tolyludiethylamine, etc., but the biscoumarin compound discovered in the present invention can be used as an oxazolone compound used as an initiator in the present invention. A surprisingly excellent sensitizing effect is shown only when used in combination. The reason for this surprising synergistic effect is not yet clear.

In addition, the amount of biskuman compound compounded is 1 part boaamic acid.
It is most preferably 1 part by weight or more and 10 parts by weight or less per 00 parts by weight, and sensitizers other than biscoumarin compounds may also be used in combination.

When the amount of the biscoumarin compound is less than 1 part by weight,
If it exceeds 10 parts by weight, the amount of light energy transmitted will be insufficient and photocuring in deep areas will not progress rapidly, which is not preferable.

The initiator of component (D) in the present invention has the following formula (IV) R7: -H, -CH3, -C2H5, -C3H7, -C
4H9,-CeH=,. -OH, -OCHs. -OC2
H5, -O C3H7, -O C 4H9, -O C6
H5, -C H2CeH 5, -C H2CH2CeH
5, -CH20H, -CH2CH20
H , -CH 2CH :s, -CH (CH
3)2. -C (CH3)3, -CO CH3
, -CO C2H5. -O C O CH3. -OC
O C2H5, -C H2NH2, -C H2C
H2N H2, -C ONH2. -C O N H C
H3,-C O N(C H3)2,-C O N H
C2H5,-CON(C2H5)2,-N H C H
3,-N (C H 3)2,-N (C 2H 5
) It is an oxazolone compound having an aromatic group shown in 2).

Initiators used in photosensitive resin combinations include 2.2-
Dimethoxy-2-phenyl-acetophenone, 1-hydroxy-cyclohexyl-phenyl ketone, 2-methyl-14-(methylthio)phenyl]-2-morpholino-1-propane, 3.3',4.4'-tetra(t
-butylbaroxycarbonyl) penzophenone, benzyl, penzoin-isoglopylether, penzoin-isobutyl ether, 4,4'-dimethoxybenzyl, 1,4-dibenzoylbenzene, 4-penzoylbiphenyl, 2-penzoylnaphthalene, Methyl 10-penzoylbenzoate, 2,2'-bis(O-chlorophenyl)-4.4',5.5''-tetraphenyl,
2'-biimidazole, lO-butyl-2-chloroacridone, ethyl/I,-4-dimethylaminobenzoate, dibenzoylmethane, 2,4-jethylthioxanthone, 3,3-dimethyl-4-methoxypene Zophenone, 2-hydroxy-2-methyl-1-phenylpropane, 1-(4-isopropylphenyl)-2-
Hydroxy-2-methylpropane-1, 1-(4
-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one, l-phenyl-1,2-butanedione-2-(o-methoxycarbonyl)oxime, l-phenyl-propanebutanedione-2-(0- benzoyl)oxime, 1,2-diphenylethanedione-1-
(0-benzoyl)oxime, 1,3-dipheny/l-
propanetrione-2-(o-benzoyl)oxime,
1-phenyl-3-ethoxypropanetrione-2-
Although (0-bezoyl) oxime and the like are used, the oxazolone compound discovered in the present invention has a remarkable photoreaction initiation effect compared to other initiators due to its combination with a biscoumarin compound as a sensitizer. showed that.

It is currently unclear how this surprising effect is achieved.

The amount of the oxazolone compound to be blended is essentially 1 to 20 parts by weight per 100 parts by weight of the polyamic acid, and initiators other than the oxazolone compound may also be used in combination.

If the amount of the oxazolone compound used as an initiator is less than 1 part by weight, the photosensitivity will be insufficient, which is not preferable.

Moreover, if it exceeds 20 parts by weight, the film properties after heat treatment and curing will deteriorate.

The present invention will be specifically explained below using Examples.

Example 1 Silicone diamine has 5 siloxane bonds (n=5
) represented by the following formula: 10g CH3 CH3 (10% by weight in polyamic acid) and 57g of 3.3',4.4'-benzophenonetetracarboxylic dianhydride and 4,4'
- 33 g of diaminodiphenyl ether was reacted in N-methylpyrrolidone solvent, and 60 g (60 parts by weight) of N-methylolacrylamide and 3.3'-carbonyl rubis (7- diethylaminocoumarin) 3g (3 parts) and 3-phenyl-5-isoxazolone 6g (61 parts)
were added and mixed and dissolved at room temperature.

The obtained solution was applied onto an aluminum plate using a swinner and dried at 65°C for 1 hour using a drier.

Kodak Photographic Step Tablet No. 2 was attached to this film. 21 steps (In this gray scale, each time the number of steps increases, the amount of transmitted light increases by one step from the previous step.)
/ f2, so the larger the residual stage after development, the better the sensitivity), irradiated with 500 mj/cm2 ultraviolet rays, developed using a developer containing 60% by weight of N-methylpyrrolidone and 40% by weight of methanol, and then When rinsed with isopropyl alcohol, the pattern remained up to 13 steps, indicating high sensitivity.

Next, the coating was applied onto a silicone wafer in the same manner as described above, the entire surface was exposed, development and rinsing steps were performed, and then
Heat curing was carried out in nitrogen at 50°C, 25°C, and 300″C for 30 minutes each.

For the adhesion test, 100 pieces were cut into 1 mm squares and an attempt was made to peel them off using cellophane tape, but not a single piece was peeled off, indicating high adhesion.

Separately, it was coated on an aluminum plate, exposed to light over the entire surface, developed, rinsed, and cured with heat, and then the aluminum plate was removed by etching to obtain a film.

Tensile modulus of the obtained film (JIS K-6760
) was as low as 140 Kg/lIIIl2, and the thermal decomposition onset temperature was as high as 430°C.

In this way, the extremely excellent effects of high sensitivity, high adhesion, low elastic modulus, and high heat resistance were simultaneously obtained.

Comparative Examples 1 to 13 Similar experiments were carried out according to the method of Example 1, but the number of siloxane bonds and the amount added to the silicone diamine, and the type and amount of the sensitizer and initiator added were changed, and the results shown in Table 1 were obtained.

In Comparative Example 1, the amount of initiator added was 0.6 parts by weight, and the photosensitivity was extremely low.

In Comparative Example 2, the amount was 36 parts by weight, contrary to Comparative Example 1, and in this case, the initiator remained in the film, resulting in a low thermal decomposition initiation temperature.

Comparative Example 3 used an initiator other than the one according to the invention, had low photosensitivity, and was not practical.

In Comparative Example 4, the amount of sensitizer added was 0.3 parts by weight, and in this case, the photosensitivity was extremely low and the crosslinking was insufficient.

In Comparative Example 5, the amount of sensitizer was 33 parts by weight, and in this case, the amount of light transmitted to the deep part was insufficient, curing in the deep part was insufficient, voids were generated, and a uniform film was not obtained. .

Comparative Example 6 used a sensitizer other than the one of the present invention and had low photosensitivity, making it impractical.

In Comparative Example 7, the amount of photosensitizer added was 15 parts by weight, and in this case, not only the photosensitivity was low, but also the film loss was large due to insufficient crosslinking.

In Comparative Example 8, the amount of photosensitive agent added was 300 parts by weight, and in this case, the amount of scattering during high temperature curing was large, cracks occurred, and a uniform film could not be obtained.

Comparative Example 9 uses a photosensitizer other than the one according to the present invention, and because the final curing temperature is low, the photosensitizer remains in the final cured product, the thermal decomposition initiation temperature is low, and other physical properties are also insufficient. Met.

In Comparative Example 10, the amount of silicone diamine added was 0.5% by weight, and in this case, the elastic modulus could not be lowered.

In Comparative Example 11, the amount of silicone diamine added was 75% by weight, and in this case the film became brittle.

In Comparative Example 12, the number of siloxane bonds in the silicone diamine was n=0, and in this case, cracks occurred at the time of film formation due to lack of flexibility.

In Comparative Example 13, the number of siloxane bonds in the siloxane diamine was n = 100, and in this case, the reactivity was low, unreacted silicone stood out at the time of film formation, and the sensitivity did not increase.

Table 1 shows the performance results obtained in the Examples and Comparative Examples.

[Effects of the Invention] Attempts have been made to improve adhesion and reduce elastic modulus by introducing siloxane bonds into the main chain structure of polyimide resins.

However, with conventional photosensitization techniques, it has not been possible to obtain a good pattern because there is no suitable sensitizer or initiator to improve the photosensitivity of silicone-modified polyimide resin.

However, in the present invention, by employing a combination of a special sensitizer with extremely high photosensitivity and an initiator, it has become possible to obtain a good pattern with a small amount of irradiation. Furthermore, the heat-cured polyimide resin has excellent heat resistance because all the photo-cured acrylamide scatters, and since it has been modified with silicone, it has a low elastic modulus and high adhesion. obtained at the same time.

Claims (1)

[Claims] (1) Polyamic acid (A) containing 1 to 50% by weight of silicone diamine represented by the following formula [I] ▲There are numerical formulas, chemical formulas, tables, etc.▼‥‥[I] (In the formula, n: 1 to 50 ) Acrylamides (B) represented by the following formula [II] ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼‥‥ [II] (In the formula, R_1: -H, -CH_3, -C_2H_5R_
2, R_3: -H, -CH_3, -C_2H_5, -C
H_2OH, -C_6H_5) Biscoumarin compound (C) with carbonyl substitution at the 3-position represented by the following formula [III] ▲There are numerical formulas, chemical formulas, tables, etc.▼...[III] (In the formula, R_4, R_5: -H , alkoxy group, dialkylamino group) Oxazolone compound (D) represented by the following formula [IV] ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼‥‥‥‥ [IV] (R_6 in the formula: ▲ Numerical formulas, chemical formulas, tables, etc. There are ▼, ▲
There are mathematical formulas, chemical formulas, tables, etc. ▼R_7: -H, -CH
_3, -C_2H_5, -C_3H_7, -C_4H_
9, -C_6H_5, -OH, -OCH_3, -OC_
2H_5, -OC_3H_7, -OC_4H_9, -O
C_6H_5, -CH_2C_6H_5, -CH_2C
H_2C_6H_5, -CH_2OH, -CH_2CH
_2OH, -CH_2CH_3, -CH(CH_3)_
2, -C(CH_3)_3, -COCH_3, -COC
_2H_5, -OCOCH_3, -OCOC_2H_5
, -CH_2NH_2, -CH_2CH_2NH_2,
-CONH_2, -CONHCH_3, -CON(CH
_3)_2, -CONHC_2H_5, -CON(C_
2H_5)_2, -NHCH_3, -N(CH_3)_
2, -N(C_2H_5)_2) is an essential component, and (A
) 20 to 200 parts by weight of (B) to 100 parts by weight, (
A photosensitive resin composition comprising C) 1 to 10 parts by weight and (D) 1 to 20 parts by weight.