JPH03159221A - Electric two layered capacitor - Google Patents

Abstract

PURPOSE:To lessen the falling troubles of lead terminals in the mounting process by a method wherein the buffer means having specific spring elasticity are provided between welding parts to an electrode surface of lead terminals and fixing legs of a circuit substrate. CONSTITUTION:Respective lead terminals 11, 12 are provided with welding parts 11a, 12a to be welded an electrode surface 2b as well as fixing legs 11b, 12b to be inserted in mounting process into fixing holes perforated in an circuit substrate (not shown) while buffer means 13 having specific spring elasticity are formed between the welding parts and the fixing legs. The buffer means 13 are composed of bent parts 11c, 12c formed in almost U-shape by bending the specific part of the fixing legs 11b, 12b almost right angle while the welding parts 11a, 12a sides are turned up at almost 180 deg.. Through these procedures, the mechanical stress imposed in the substrate mounting process can be relieved by the bent parts 11c, 12c thereby enabling the falling troubles of the lead terminals 11, 12 to be lessened notably.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electric double layer capacitor, and more specifically, to a lead terminal thereof.

[Conventional technology]

5 and 6 show an electric double layer capacitor 1 in which, for example, two coin-shaped capacitor cells 2 and 3 are laminated. That is, according to this conventional example, a dish-shaped holder 4 made of metal such as stainless steel is fixed, for example, by welding, to the anode surface 2a side of one capacitor cell 2, and the cathode of the other capacitor cell 3 is fixed to the holder 4, for example, on the anode surface 2a side. The surface 3b side is fitted, and in this case, the cathode surface 3b and the holder 4 are welded at several places. Then, an electrically insulating sleeve 5 made of heat-shrinkable resin is placed around this capacitor cell laminate, and the cathode surface 2b of one capacitor cell 2 and the anode of the other capacitor cell 3 are exposed to the outside. Lead terminals 6 and 7 are respectively attached to the surface 3a by welding or the like.

[Problem to be solved by the invention]

This electric double layer capacitor 1 is mounted such that it is gripped by an automatic machine or the like and its lead terminals 6 and 7 are inserted into a mounting hole drilled in a circuit board, for example, but the position of the mounting hole is determined. If there is an error or dimensional error, excessive force is applied to the lead terminals 6, 7, resulting in the welded portions peeling off.

[Means to solve the problem]

In order to solve the above problems, in this invention.

In an electric double layer capacitor in which lead terminals are attached to the anode and cathode surfaces of a coin-shaped capacitor cell, there is a predetermined distance between the welded part of the lead terminal to the electrode surface and the mounting leg to the circuit board. The structure includes a buffer means having spring elasticity.

In this case, the buffer means preferably consists of a bent portion formed by bending a portion of the lead terminal into a substantially U-shape.

Further, the lead terminal is made of a round metal rod, and the welded portion is formed by flattening one end of the rod.

[For production]

According to the above configuration, excessive stress and impact during mounting are alleviated by the buffer means, so that accidents of lead terminals falling off can be significantly reduced.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 4.

First, referring to Figure 1, this electric double layer capacitor l
O is equipped with a capacitor cell laminate in which, for example, two coin-shaped capacitor cells 2 and 3 are stacked, as in the conventional example previously described, and each electrode surface 2b, 3a (see FIG. 6).
The following lead terminals 11 and 12 are attached to the terminals.

That is, each lead terminal 11.12 is connected to the electrode surface 2b.
, 3a, and mounting legs 11b that are inserted into mounting holes drilled in the circuit board (not shown) when mounted on the circuit board.

12b, between which a buffer means 13.13 having a predetermined spring elasticity is formed.

In this embodiment, the damping means 13.13 are arranged on the mounting leg 1.
Bent portions 11c, 12 are formed into approximately U-shapes by bending predetermined portions of 1b, 12b at approximately right angles, and then folding back the welded portions 11a, 12a by approximately 180 degrees.
Consists of C. This lead terminal 11.12 is preferably made of a stainless steel round bar, and has welded parts 11'a and 12a.
In order to secure the necessary welding area, the same part is flattened using a press or the like to form a plate-like body. Therefore, according to the lead terminals 11, 12, the mechanical stress at the time of board mounting is buffered by the bent portions 11c, 12c, and it is possible to weld more firmly to the electrode surface. For convenience of explanation 1, each lead terminal is given a separate reference numeral 11 and 12, but they have the same structure and are arranged symmetrically as shown in the figure, with the mounting legs 11b.

By widening the distance between the parts 12b, it is possible to improve the mounting stability during board mounting. In addition, the lead terminal 11
．． The mounting legs 11b and 12b of No. 12 are preferably solder-plated or hook-plated in order to improve solderability.
The attachment positions of the welded parts 11a and 12a of No. 2 to the electrode surfaces 2b and 3a of the capacitor cell laminate are below the center of the capacitor cells 2 and 3, that is, to the circuit board etc. in relation to the gripping by a chuck of an automatic machine. Preferably on the implementation side.

2nd WI and 3rd w! 1 shows an example in which the electric double layer capacitor 10 can be taped to form a series of electronic components. That is, crank-shaped bent portions 11d and 12d are formed, for example, at approximately the middle portions of the mounting legs 11b and 12b of each lead terminal 11 and 12, so that each mounting leg 11b, 12b are located on the same plane. According to this, the mounting legs 11b and 12b of each electric double layer capacitor 10 are attached to the mount 1 at predetermined intervals.
By arranging them on 4 and pressing them onto the mount 14 with adhesive tape 15, it is possible to form a series of electronic parts.

On the other hand, FIG. 4 shows an example of a so-called horizontal mounting type in which an electric double layer capacitor 1o is mounted so that its electrode surfaces 2b and 3a are parallel to a substrate surface (not shown). In this horizontal mounting type, the welded portions 16a, 17a of each side terminal 16, 17 are bent approximately at right angles to the mounting legs 16b, 17b; A bent portion 11c having a substantially U-shape as in the above embodiment at a predetermined portion, preferably near the bent portion,
A damping means 18.18 consisting of 12c is provided.

In each of the embodiments described above, the bending portions 11c, 12c;
c.

17c is shown as an example, but it may be V-shaped or Ω-shaped, for example.

〔Effect of the invention〕

As explained above, according to the present invention, by providing a buffer means having a predetermined spring elasticity between the welded part of the lead terminal to the electrode surface and the mounting leg to the circuit board, excessive stress during mounting can be avoided. Since the shock and impact are softened by the same buffering means, the chance of lead terminals falling off can be significantly reduced.

[Brief explanation of the drawing]

Figure 1 is a perspective view of the embodiment showing the capacitor cell stack and each lead terminal separated, Figure 2 is a front view of the electronic component series, and Figure 3 is a side view of the same electronic component series. , FIG. 4 is a perspective view similar to FIG. 1 showing another embodiment, FIG. 5 is a perspective view similar to FIG. 1 showing a conventional example, and FIG. 6 is a sectional view of the same conventional example. 6 In the figure, 2 and 3 are capacitor cells, 4 is a holder 5 is a sleeve, IO is an electric double layer capacitor, 11° 12; 1
6.17 is the lead terminal, lla, 12a; 1
6a. 17a is the welding part, 16b and 17b are the mounting legs, llc *
12c: 16c and 17c are bent portions, and 13.18 is a buffer means. Patent applicant: ELNA Co., Ltd. Patent applicant: Asahi Glass Co., Ltd.

Claims (3)

[Claims] (1) In an electric double layer capacitor in which lead terminals are attached to the anode and cathode surfaces of a coin-shaped capacitor cell, the welded portion of the lead terminal to the electrode surface and the mounting leg to the circuit board An electric double layer capacitor characterized in that a buffer means having a predetermined spring elasticity is provided between them. (2) The buffer means has a portion of the lead terminal approximately U
The electric double layer capacitor according to claim 1, comprising a bent portion bent in a letter shape. (3) The electric double layer capacitor according to claim 1, wherein the lead terminal is made of a metal round bar, and the welded part is made of a plate-shaped body with one end crushed flat.