JPH03142999A - Electronic apparatus - Google Patents

Abstract

PURPOSE:To improve a reduction in weight of an electronic apparatus and maintainability of an electronic module by mounting in a curved surface manner a board on the wall surface of a structure having a freely curved surface, and integrally mounting in a curved surface manner a heat sink for cooling the module and a manifold on the board. CONSTITUTION:A board 5 is mounted in a curved surface manner on the wall 17 of the entire structure having a freely curved surface, individual modules 1 are reduced in size, connectors 7 are disposed on a plurality of cylindrical heat sinks 2 having refrigerant passages and the board 5 oppositely to the modules 1, a manifold 3 for distributing and collecting refrigerant at the sinks 2 is further adhered, and mounted in a curved surface manner. Thus, an electronic apparatus can be reduced in size and weight. The heat conductive rubbers of the sinks 2 and the modules 1 are brought into contact to cool the modules 1 to a predetermined temperature, and the modules 1 can be easily attached and detached. Thus, the apparatus can be reduced in size and the maintainability of the module 1 can be improved.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to an electronic device constructed by combining a plurality of electronics modules that require cooling on the wall surface of a structure having a free-form surface, and particularly relates to an electronics module 114IIi. This relates to improvements in performance and weight reduction of electronic devices.

[Conventional technology]

Figure 3 is a diagram showing the configuration of an electronic device constructed by combining a plurality of conventional electronics modules that require cooling, and Figure 4 is an external view showing a method of fixing one electronics module. (1) is an electronics module in which electronic circuits are mounted at high density; (2) is a heat sink that has a flow path through which a refrigerant flows inside and exhibits cooling performance by contacting the electronics module (1); 3) is two manifolds for distributing and supplying refrigerant to multiple heat sinks (2) and collecting them, (4) is a flexible tube with a refrigerant flow path, and (5) is multiple electronics. A board section for exchanging electrical signals with the module (1).

(6) is the electronics module (connector on the 11 side).

(7) is a connector on the board part (5) side, (8) is a back plate for supporting the electronics module (11 part), (91 is this back plate (8) and the board part (
5) A spacer part for fixing the electronics module (1), aω is a guide rod with one side fixed to the back plate (8) and the other side having a male thread;
OI) is a front plate with multiple holes for positioning the guide rod and electronics module (1), @ is a nut part for fixing the electronics module (11) with the guide rod, ■ is a front brake (II) is a housing for supporting it from the back plate (8), (B) is a tank for refrigerant, G9 is a pump for refrigerant circulation, (L) is an electronics module (11
This is a heat exchanger for cooling the refrigerant heated by the heat generated by the refrigerant.

Conventional electronic equipment uses a tank (b), a pump q9. A refrigerant sent out from a refrigerant circulation system consisting of a heat exchanger (υ, etc.) flows from the manifold (3) to the heat sink (2) to cool the electronics module (1).

[Problem to be solved by the invention]

In the configuration of the electronics module (1) group as described above, although it is mounted in a limited space within the overall structure, ) etc. are included in duplicate in addition to the entire structure.

When it is incorporated into a structure having a free-form surface, there is always a wasted space, which poses a problem in that it impairs the weight reduction of the electronic IM and the maintainability of the electronics module (1).

This invention was made in order to solve such problems, and by reviewing the overall configuration of electronic equipment, it is possible to compactly mount an electronics module (1) # in the overall structure having a free-form surface, and to make the electronic 81 device lightweight. The purpose is to improve the ease of maintenance of the electronics module (L).

[Means to solve the problem]

An electronic device according to the present invention has a substrate section curved mounted on the wall surface of the entire structure having a free-form surface, and each electronics module is miniaturized. A connector is placed on each heat sink and a board, and a manifold is used to distribute and collect the coolant to each heat sink, and the heat sink is connected to a curved surface.

[For production]

In this invention, the board portion is mounted on a curved surface, and the electronics module is miniaturized to a predetermined size.

By integrally configuring the heat sink and the manifold facing the electronics module group, it is possible to eliminate special structural elements in the electronics module group, making it possible to make the electronic device smaller and lighter. In addition, by bringing the heat sink into contact with the thermally conductive rubber part of the electronics module, the electronics module can be cooled to a predetermined temperature.

Electronics modules can be easily attached and detached.

! ! It is possible to improve the preparedness.

〔Example〕

FIG. 1 is a configuration diagram of an electronic device showing an embodiment of the invention.
FIG. 2 is an exploded view of the structure surrounding the electronics module, which is a feature of this invention.

(1) is an electronics module in the shape of a rectangular parallelepiped with a predetermined size, which has contacts for transmitting and receiving electrical signals and a thermally conductive rubber portion with a rectangular parallelepiped shape of a predetermined size.

(2) is a heat sink mounted on a curved surface that faces the electronics module (11 thermally conductive rubber part and has a refrigerant flow path inside); (3) is a heat sink that distributes and supplies refrigerant to this heat sink (2) part and then collects it. Two manifolds are mounted on curved surfaces, (5) is a free-form board part for transmitting and receiving electrical signals to and from the electronics module (1), and (7) is a manifold with predetermined dimensions located opposite to the heat sink (2). Electronics module (1) with a recessed part
The connectors (2) to (O) are the same as those of the conventional device, and (m is the wall of the structure having a free-form surface in which the electronic device is installed). It is.

Regarding electronic equipment configured as above.

Mount the board part (5) on a curved surface to match the wall (target) of the structure.

The electronics module (1) is placed on this substrate part (5).
) By arranging the cooling heat sink (2) and manifold (3) in an integrated manner, a system that does not include any special structural elements in the electronics module +11 group can be obtained, and the electronic equipment can be made smaller and lighter. In addition to this, it is possible to improve the efficiency of the electronics module (1).

〔Effect of the invention〕

As described above, the present invention has been achieved by mounting a board part on a curved surface on the wall of a structure having a free-form surface, and by integrating a heat sink and a manifold for cooling an electronics module on the board part and mounting it on a curved surface. This has the effect of reducing the weight of the equipment and improving Mfla properties of the electronics module.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram of an electronic device showing an embodiment of the present invention;
Fig. 2 is an exploded view showing the structure around the electronics module which is a feature of this invention, Fig. 3 is a configuration diagram of a conventional device, and Fig. 4 is an external view showing a method of fixing the electronics module of the conventional device. . (111,t electronics module, (2+ is a heat sink, (3) is a manifold, (5) is a board part,
(7) is the connector, (b) is the tank, (19 is the pump,
(υ is a heat exchanger. Nu is a wall of the structure. In the two figures, the same or corresponding parts are indicated by the same reference numerals.

Claims (1)

[Claims] In an electronic device that is constructed by combining multiple electronics modules that require cooling on a wall surface of a structure having a free-form surface, a predetermined device having contacts for transmitting and receiving electrical signals and a rectangular parallelepiped-shaped thermally conductive rubber portion with predetermined dimensions is used. A rectangular parallelepiped electronics module with dimensions facing the thermally conductive rubber part of this electronics module,
A connector having a plurality of cylindrical heat sinks with predetermined dimensions and having a refrigerant flow path therein and arranged opposite to the free-form surface of the structure, and a recess corresponding to the heat sink and mating with the contacts of the electronics module. a curved substrate fixed on a free-curved surface of the structure wall and having a large number of the connectors arranged thereon; and a cylindrical substrate with predetermined dimensions configured to distribute and supply refrigerant to the heat sink and facing the free-curved surface of the structure. An electronic device comprising two manifolds and a cooling system capable of supplying and recovering refrigerant to the manifolds, the heat sink, etc.