JPH03106769U - - Google Patents
Info
- Publication number
- JPH03106769U JPH03106769U JP1662190U JP1662190U JPH03106769U JP H03106769 U JPH03106769 U JP H03106769U JP 1662190 U JP1662190 U JP 1662190U JP 1662190 U JP1662190 U JP 1662190U JP H03106769 U JPH03106769 U JP H03106769U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- same type
- board
- reinforced
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案による一実施例の斜視図、第２
図は第１図の分解斜視図、第３図は第２図の熱圧
着を示す要部側断面図、第４図は従来技術による
斜視図である。
図において、１……樹脂基板、２……補強部材
、３……樹脂接着剤を示す。
Fig. 1 is a perspective view of one embodiment of the present invention;
The figure is an exploded perspective view of FIG. 1, FIG. 3 is a sectional side view of a main part showing thermocompression bonding of FIG. 2, and FIG. 4 is a perspective view of the conventional technique. In the figure, 1...Resin substrate, 2...Reinforcement member, 3...Resin adhesive.
Claims (1)
も両面両側端に同系樹脂でなる帯板状の補強部材
２を同系の樹脂接着剤３で一体接着し補強するこ
とを特徴とする配線基板の補強構造。 This reinforcing structure for a wiring board is characterized in that a reinforcing member 2 in the form of a strip made of the same type of resin is integrally bonded and reinforced with a resin adhesive 3 of the same type to both ends of at least both sides of a resin board 1 on which a wiring pattern is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1662190U JPH03106769U (en) | 1990-02-20 | 1990-02-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1662190U JPH03106769U (en) | 1990-02-20 | 1990-02-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03106769U true JPH03106769U (en) | 1991-11-05 |
Family
ID=31519880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1662190U Pending JPH03106769U (en) | 1990-02-20 | 1990-02-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03106769U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015207008A (en) * | 2009-05-02 | 2015-11-19 | 株式会社半導体エネルギー研究所 | display device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5085877A (en) * | 1973-12-04 | 1975-07-10 |
-
1990
- 1990-02-20 JP JP1662190U patent/JPH03106769U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5085877A (en) * | 1973-12-04 | 1975-07-10 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015207008A (en) * | 2009-05-02 | 2015-11-19 | 株式会社半導体エネルギー研究所 | display device |
| US9397117B2 (en) | 2009-05-02 | 2016-07-19 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
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