JPH02306184A - Magnetic sensor and manufacture thereof - Google Patents
Magnetic sensor and manufacture thereofInfo
- Publication number
- JPH02306184A JPH02306184A JP1126946A JP12694689A JPH02306184A JP H02306184 A JPH02306184 A JP H02306184A JP 1126946 A JP1126946 A JP 1126946A JP 12694689 A JP12694689 A JP 12694689A JP H02306184 A JPH02306184 A JP H02306184A
- Authority
- JP
- Japan
- Prior art keywords
- film
- terminal
- magnetic sensing
- substrate
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005291 magnetic effect Effects 0.000 title claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 238000007747 plating Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 229920001721 polyimide Polymers 0.000 claims abstract description 7
- 239000009719 polyimide resin Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 5
- 239000003302 ferromagnetic material Substances 0.000 claims description 4
- 230000005294 ferromagnetic effect Effects 0.000 abstract description 7
- 239000002904 solvent Substances 0.000 abstract description 5
- 229910000889 permalloy Inorganic materials 0.000 abstract description 4
- 238000000206 photolithography Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 239000006259 organic additive Substances 0.000 abstract description 2
- 229910052745 lead Inorganic materials 0.000 abstract 1
- 230000001012 protector Effects 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Measuring Magnetic Variables (AREA)
- Hall/Mr Elements (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、基板に有機物フィルムを用いた磁気センサ及
びその製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a magnetic sensor using an organic film as a substrate and a method for manufacturing the same.
従来の技術
近年、磁気センサとして有機物フィルムの基板を用いて
、フレキシブル性を持たせたものが使用される様になっ
てきた。この様な磁気センサは事由に変形させる事が出
来るため機器等に取り付は易いという利点がある。以下
従来の磁気センサについて説明する。BACKGROUND OF THE INVENTION In recent years, flexible magnetic sensors using organic film substrates have come into use. Such a magnetic sensor has the advantage of being easy to attach to equipment because it can be deformed depending on the situation. A conventional magnetic sensor will be explained below.
第８図及び第９図は従来の磁気センサを示す平面図及び
断面図である。第８図及び第９図において１はポリアミ
ドやポリプロピレン等の有機物フィルムでできた基板、
２は基板１上に形成された磁気感知膜で、磁気感知膜２
はパーマロイやＮｉ−Ｃｏ合金の様な強磁性材料によっ
て構成されている。又、磁気感知膜２は蒸着やスパッタ
リング等によって基板１上に０．１μｍ〜０．２μｍの
膜厚で形成され、第８図に示す様にＭ字型にフォトリソ
グラフィ技術を用いて形成されている。又磁気感知膜２
には両端部に端子部２ａが設けられている。３は端子部
２ａの上に形成された端子鍍金層で、端子鍍金層３はリ
ードを磁気感知膜２に接合しやすくするために形成され
ている。４は磁気感知部２を保護するために設けられた
保護フィルムで、保護フィルム４は接着剤５によって基
板１に接着されている。保護フィルム４には端子部２ａ
に対応した部分に孔４ａが設けられている。FIGS. 8 and 9 are a plan view and a sectional view showing a conventional magnetic sensor. In FIGS. 8 and 9, 1 is a substrate made of an organic film such as polyamide or polypropylene;
2 is a magnetic sensing film formed on the substrate 1;
is made of a ferromagnetic material such as permalloy or Ni-Co alloy. The magnetic sensing film 2 is formed on the substrate 1 by vapor deposition, sputtering, etc. to a film thickness of 0.1 μm to 0.2 μm, and is formed into an M-shape using photolithography technology as shown in FIG. There is. Also, magnetic sensing film 2
Terminal portions 2a are provided at both ends. Reference numeral 3 denotes a terminal plating layer formed on the terminal portion 2a, and the terminal plating layer 3 is formed to facilitate bonding of the lead to the magnetic sensing film 2. A protective film 4 is provided to protect the magnetic sensing section 2, and the protective film 4 is bonded to the substrate 1 with an adhesive 5. The protective film 4 has a terminal portion 2a.
A hole 4a is provided in a portion corresponding to the hole 4a.
以上の様に構成された従来の磁気センサについて以下そ
の製造方法を第１０図から第１４図を用いて説明する。A method of manufacturing the conventional magnetic sensor configured as described above will be described below with reference to FIGS. 10 to 14.
先ず第１０図に示す様に基板１の上に、パーマロイ等の
強磁性材料をスパッタリングして強磁性膜６を形成する
。次に第１１図に示す様にフォトリソグラフィ技術を用
いて強磁性膜６の不要部分を取り除いてＭ字型に成型し
、磁気感知膜２を形成する。その上にフォトレジスト膜
７を一様に塗布し、端子部２ａ上のフォトレジスト膜７
をに紫外線を照射して、その照射部分を現像液で洗い流
して取り除く。この様子を第１２図に示す。次に第１３
図に示す様に端子部２ａｉ：鍍金を施し、端子鍍金層３
を形成する。その後フォトレジスト膜７全てに紫外線を
照射して現像液で洗う流して取り除き、最後に第１４図
に示す様に接着剤５で保護フィルム４を基板１上に接着
する。First, as shown in FIG. 10, a ferromagnetic film 6 is formed on a substrate 1 by sputtering a ferromagnetic material such as permalloy. Next, as shown in FIG. 11, unnecessary portions of the ferromagnetic film 6 are removed using photolithography and formed into an M-shape to form the magnetic sensing film 2. A photoresist film 7 is uniformly applied thereon, and the photoresist film 7 on the terminal portion 2a is
The irradiated area is removed by irradiating it with ultraviolet light and washing it away with a developer. This situation is shown in FIG. Then the 13th
As shown in the figure, terminal part 2ai: Plating is applied, and terminal plating layer 3
form. Thereafter, the entire photoresist film 7 is irradiated with ultraviolet rays and washed away with a developer, and finally the protective film 4 is bonded onto the substrate 1 with an adhesive 5 as shown in FIG.
発明が解決しようとする課題
しかしながら前記従来の構成では、保護フィルム４を貼
り付ける時に保護フィルム４がずれて接着されると、第
１５図に示す様に接着剤５と磁気感知膜２の間に空隙部
８が形成され、磁気感知膜２が空気に触れる事になり、
磁気感知膜２が腐食しやすくなるので、保護フィルム４
は精度良く貼り付けなければならず、作業性が悪く生産
性が向上しないという問題点があった。又第１６図に示
す様に保護フィルム４の貼り付けに接着剤５が用いられ
ており、その接着剤５が端子鍍金層３表面にはみだして
しまうと、そのはみだし部９が形成される。このはみだ
し部９によってリードがうまく端子部２ａに接合しない
という問題点があった。Problems to be Solved by the Invention However, in the above-mentioned conventional configuration, if the protective film 4 is misaligned when it is pasted, as shown in FIG. A void 8 is formed, and the magnetic sensing film 2 comes into contact with air.
Since the magnetic sensing film 2 is easily corroded, the protective film 4
must be pasted with high precision, resulting in poor workability and no improvement in productivity. Further, as shown in FIG. 16, an adhesive 5 is used to attach the protective film 4, and if the adhesive 5 protrudes onto the surface of the terminal plating layer 3, a protruding portion 9 is formed. This protruding portion 9 caused a problem in that the lead could not be properly joined to the terminal portion 2a.
本発明は前記従来の問題点を解決するもので、作業性が
良く、シかも接着剤を用いずに作成できる磁気センサ及
びその製造方法を提供する事を目的としている。The present invention solves the above-mentioned conventional problems, and aims to provide a magnetic sensor that has good workability and can be manufactured without using an adhesive, and a method for manufacturing the same.
課題を解決するための手段
この目的を達成するために、基板上に端子部を有した磁
気感知膜を備え、端子部に端子鍍金層を形成し、端子鍍
金層の上を除いた磁気感知膜の部分を感光性樹脂膜を覆
った。Means for Solving the Problem In order to achieve this object, a magnetic sensing film is provided which includes a magnetic sensing film having a terminal portion on a substrate, a terminal plating layer is formed on the terminal portion, and the magnetic sensing film is removed from the top of the terminal plating layer. This part was covered with a photosensitive resin film.
作 用
この構成により、端子鍍金層を形成する６時に用いられ
るレジストの役目と、磁気感知膜の保護の役目を入角感
光性樹脂膜で兼用する事ができる。Function: With this configuration, the angle-of-angle photosensitive resin film can serve both the role of a resist used in forming the terminal plating layer and the role of protecting the magnetic sensing film.
実施例
第１図及び第２図は本発明の一実施例における磁気セン
サを示す平面図及び断面図である。第１図及び第２図に
おいて、ｌは基板、２は磁気感知膜、２ａは端子部、３
は端子鍍金層で、これらは従来の構成と同じである。１
０は感光性ポリイミド樹脂で形成された樹脂膜で、樹脂
膜１０は端子鍍金層３以外の部分に設けられている。Embodiment FIGS. 1 and 2 are a plan view and a sectional view showing a magnetic sensor according to an embodiment of the present invention. In FIGS. 1 and 2, l is a substrate, 2 is a magnetic sensing film, 2a is a terminal portion, and 3
is a terminal plating layer, which is the same as the conventional structure. 1
0 is a resin film formed of photosensitive polyimide resin, and the resin film 10 is provided on a portion other than the terminal plating layer 3.
以上の様に構成された本発明の一実施例について以下そ
の製造方法を説明する。A manufacturing method for an embodiment of the present invention constructed as described above will be described below.
先ず、第３図に示す様に基板ｌの上に、パーマロイ等の
強磁性材料をスパッタリングして強磁性膜６を形成する
。次に第４図に示す様にフォトリソグラフィ技術を用い
て強磁性膜６をＭ字型に成型し、磁気感知膜２を形成す
る。次に磁気感知膜２を覆う様に基板１上に感光性ポリ
イミド樹脂を溶媒で溶かしたものを塗布し、樹脂膜１ｏ
を形成する。この様子を第５図に示す。次に端子部２ａ
の上の樹脂膜８に紫外線を照射し、その後に現像液で現
像すると、紫外線が照射された部分の樹脂膜１０が現像
液に溶け、端子部２ａが剥出しになる。この様子を第６
図に示す。次に１リツトルあたりＳｎを１６〜２０ｇ、
Ｐｂを７〜１１ｇ、ＨＢＦ を２００〜２５０ｇ、有
機添加剤を２．０〜５．０ｇの範囲内で添加した鍍金浴
を作成し、鍍金浴を用いて端子部２ａに数μｍ程度の端
子鍍金膜３を形成する。この様子を第７図に示す。最後
に熱風オーブンや真空オーブンによってベーキングを行
い、樹脂膜１０の中に含まれている溶媒を除去する。こ
の様に構成された樹脂膜１０は耐熱性や耐薬品性に優れ
ている。従って樹脂膜１０だけで十分に磁気感知膜２を
保護する事ができる。First, as shown in FIG. 3, a ferromagnetic film 6 is formed on a substrate 1 by sputtering a ferromagnetic material such as permalloy. Next, as shown in FIG. 4, the ferromagnetic film 6 is formed into an M-shape using photolithography to form the magnetic sensing film 2. Next, a photosensitive polyimide resin dissolved in a solvent is applied onto the substrate 1 so as to cover the magnetic sensing film 2, and the resin film 10 is coated with a photosensitive polyimide resin dissolved in a solvent.
form. This situation is shown in FIG. Next, the terminal part 2a
When the resin film 8 on the resin film 8 is irradiated with ultraviolet rays and then developed with a developer, the portions of the resin film 10 irradiated with the ultraviolet rays are dissolved in the developer, and the terminal portions 2a are exposed. This situation can be seen in the 6th
As shown in the figure. Next, 16 to 20 g of Sn per liter,
A plating bath containing 7 to 11 g of Pb, 200 to 250 g of HBF, and 2.0 to 5.0 g of organic additives was created, and the terminal portion 2a was plated with a thickness of several μm using the plating bath. A film 3 is formed. This situation is shown in FIG. Finally, baking is performed using a hot air oven or a vacuum oven to remove the solvent contained in the resin film 10. The resin film 10 configured in this manner has excellent heat resistance and chemical resistance. Therefore, the magnetic sensing film 2 can be sufficiently protected only by the resin film 10.
以上の様に本実施例は、基板１上に磁気感知膜２を形成
し、その上に感光性ポリイミド樹脂によって構成された
樹脂膜１０を形成した事により、樹脂膜１０を端子部２
ａ上のみに端子鍍金層３を形成するためのレジストの役
目をさせるとともに、樹脂膜８をそのまま保護膜として
利用できるので、工数が減り、生産性が向上した。As described above, in this embodiment, the magnetic sensing film 2 is formed on the substrate 1, and the resin film 10 made of photosensitive polyimide resin is formed thereon.
Since the resin film 8 can be used as a resist for forming the terminal plating layer 3 only on the surface a and the resin film 8 can be used as it is as a protective film, the number of steps is reduced and productivity is improved.
発明の効果
本発明は、基板上に端子部を有した磁気感知膜を備え、
端子部に端子鍍金層を形成し、端子鍍金層の上を除いた
磁気感知膜の部分を感光性樹脂膜を覆った事により、端
子鍍金層を形成する時に用いられるレジストの役目と、
磁気感知膜の保護の役目を入角感光性樹脂膜で兼用する
事ができるので、従来の様に保護フィルムを別途設ける
必要はないので工数の削減になるとともに従来の様に保
護フィルムを精度良く貼り付けるという繁雑な工程が無
（なり、作業性が良くなり生産性が向上する。又接着剤
を用いていないので、接着剤のはみだしによるリードの
接合不良等が生じない。Effects of the Invention The present invention includes a magnetic sensing film having a terminal portion on a substrate,
By forming a terminal plating layer on the terminal part and covering the part of the magnetic sensing film except for the top of the terminal plating layer with a photosensitive resin film, the role of the resist used when forming the terminal plating layer,
Since the angle-of-view photosensitive resin film can also serve as a protection for the magnetic sensing film, there is no need to provide a separate protective film as in the past, which reduces man-hours and allows the protective film to be applied with greater precision than in the past. There is no need for the complicated process of pasting, which improves workability and productivity. Also, since no adhesive is used, there is no possibility of poor connection of the leads due to adhesive oozing out.
第１図は本発明の一実施例における磁気センサを示す断
面図、第２図は同平面図、第３図から第７図は本発明の
一実施例における磁気センサの製造方法を示した断面図
、第８図は従来の磁気センサを示す断面図、第９図は同
平面図、第１０図から第１４図は従来の磁気センサの製
造方法を示す断面図、第１５図は従来の磁気センサに不
具合が生じたときの断面図、第１６図は同断面図である
。
１ ・・・・・・ 基板
２ ・・・・・・ 磁気感知膜
２ａ・・・・・・ 端子部
３ ・・・・・・ 端子鍍金層
６ ・・・・・・ 強磁性膜
１０ ・・・・・・ 樹脂膜
代理人の氏名 弁理士 粟野重孝 ほか１名第１図
第２図
２０ １ どｑ
第８図
第９図
２０ １ どａ
第１５図FIG. 1 is a cross-sectional view showing a magnetic sensor according to an embodiment of the present invention, FIG. 2 is a plan view thereof, and FIGS. 3 to 7 are cross-sectional views showing a method of manufacturing a magnetic sensor according to an embodiment of the present invention. 8 is a sectional view showing a conventional magnetic sensor, FIG. 9 is a plan view of the same, FIGS. 10 to 14 are sectional views showing a method of manufacturing a conventional magnetic sensor, and FIG. FIG. 16 is a cross-sectional view when a problem occurs in the sensor. 1...Substrate 2...Magnetic sensing film 2a...Terminal section 3...Terminal plating layer 6...Ferromagnetic film 10... ...Resin membrane agent's name Patent attorney Shigetaka Awano and one other person Figure 1 Figure 2 20 1 Doq Figure 8 Figure 9 20 1 Doa Figure 15
Claims (4)
ドを接続する端子部を設けた磁気感知膜と前記端子部に
形成された端子鍍金層と、前記磁気感知膜の前記端子鍍
金層の上部以外の部分を覆う感光性樹脂膜を備えた事を
特徴とする磁気センサ。(1) a substrate, a magnetic sensing film formed on the substrate and provided with terminal parts connecting leads to both ends; a terminal plating layer formed on the terminal part; and the terminal plating of the magnetic sensing film. A magnetic sensor characterized by comprising a photosensitive resin film covering parts other than the upper part of the layer.
事を特徴とする請求項第１項記載の磁気センサ。(2) The magnetic sensor according to claim 1, wherein the photosensitive resin film is made of photosensitive polyimide resin.
磁気感知膜を形成し、その上に感光性樹脂膜を一面に形
成し、前記感光性樹脂膜の内、端子部上に形成されてい
る部分を除去し、前記端子部に端子鍍金層を形成する事
を特徴とする磁気センサの製造方法。(3) A magnetic sensing film having a terminal part made of a ferromagnetic material is formed on the substrate, a photosensitive resin film is formed all over it, and the part of the terminal part of the photosensitive resin film is A method of manufacturing a magnetic sensor, comprising: removing a portion formed on the terminal portion, and forming a terminal plating layer on the terminal portion.
事を特徴とする請求項第２項記載の磁気センサの製造方
法。(4) The method for manufacturing a magnetic sensor according to claim 2, wherein the photosensitive resin film is made of photosensitive polyimide resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1126946A JPH02306184A (en) | 1989-05-19 | 1989-05-19 | Magnetic sensor and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1126946A JPH02306184A (en) | 1989-05-19 | 1989-05-19 | Magnetic sensor and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02306184A true JPH02306184A (en) | 1990-12-19 |
Family
ID=14947809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1126946A Pending JPH02306184A (en) | 1989-05-19 | 1989-05-19 | Magnetic sensor and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02306184A (en) |
-
1989
- 1989-05-19 JP JP1126946A patent/JPH02306184A/en active Pending
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