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JPH02285700A - Component mounting device - Google Patents

Component mounting device

Info

Publication number
JPH02285700A
JPH02285700A JP1108803A JP10880389A JPH02285700A JP H02285700 A JPH02285700 A JP H02285700A JP 1108803 A JP1108803 A JP 1108803A JP 10880389 A JP10880389 A JP 10880389A JP H02285700 A JPH02285700 A JP H02285700A
Authority
JP
Japan
Prior art keywords
component
suction
suction nozzle
electronic component
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1108803A
Other languages
Japanese (ja)
Inventor
Kazumasa Okumura
一正 奥村
Yasuo Izumi
康夫 和泉
Kazumi Ishimoto
石本 一美
Yutaka Makino
豊 牧野
Daisuke Ogawara
大河原 大輔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1108803A priority Critical patent/JPH02285700A/en
Publication of JPH02285700A publication Critical patent/JPH02285700A/en
Pending legal-status Critical Current

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  • Automatic Assembly (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To make it possible to use effectively components without disposing even when the component is supplied in a wrong direction by a method wherein a component mounting device is provided with a control means, by which the mark of each component is recognized through a see-through suction nozzle and when the recognized direction of a component is not the prescribed direction, the component is remounted in the proper direction. CONSTITUTION:A suction nozzle 11 is made to position over a component supply cassette 40 in opposition to the cassette 40, a mark 42 and a form of an electronic component P put at a suction position are recognized by a recognition camera 35 through the nozzle 11 consisting of a light-transmitting material and a light-transmitting plate 15 and the supplied direction of the component is discriminated. Then, an elevating member 34 is made to descend, the component P is sucked by the nozzle 11 and the elevating member 34 is again made to ascend. After that, in case the component is supplied in a wrong direction, a pulley 31 is rotatingly driven and the wrong direction is corrected in a prescribed direction. After that, the sucked component P is made to position over a prescribed installation position on a circuit board, the amounts of eccentricity of the component in X- and Y-directions and the angle theta of inclination to the installation posture of the component P are detected by the camera 35 and after a correction of the amounts of eccentricity and the angle theta of inclination, the component P is accurately remounted in the prescribed position on the circuit board.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、電子部品を吸着して回路基板に装着する場合
等に利用される部品装着装置に関し、特に吸着した部品
を透視可能な吸着ノズルを備えた部品装着装置に関する
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a component mounting device used for sucking electronic components and mounting them on a circuit board, and in particular, to a component mounting device that is equipped with a suction nozzle that allows the picked-up components to be seen through. The present invention relates to a component mounting device.

従来の技術 従来、電子部品を回路基板に装着する際には、第6図に
示すように、部品供給部52において装着すべき電子部
品Pを吸着ノズル51で吸着し、次に吸着ノズル51を
認識位置に移動させて認識カメラ53で吸着した電子部
品Pの位置を検出し、その後吸着ノズル51を回路基板
Bの部品装着位置に対向する位置まで移動させ、電子部
品Pの位置ずれの補正を行って回路基板B上の所定位置
に装着していた。
2. Description of the Related Art Conventionally, when mounting electronic components on a circuit board, as shown in FIG. The electronic component P is moved to the recognition position and the position of the picked-up electronic component P is detected by the recognition camera 53. Thereafter, the suction nozzle 51 is moved to a position opposite to the component mounting position on the circuit board B, and the positional deviation of the electronic component P is corrected. and mounted it in a predetermined position on circuit board B.

上記装着方法では、吸着ノズル51で電子部品Pを吸着
した後回路基板Bに向かって移動する途中で吸着ノズル
51を認識位置に正確に位置決めし、吸着ノズル51に
対する電子部品Pの位置認識を行った後再び吸着ノズル
51を移動させるため、1回の部品装着動作に要する時
間が長くかかり、部品装置能率が悪いため、これを解消
できる装着装置として、本出願人は先に、透視可能な吸
着ノズルを用いるとともに、この吸着ノズルで吸着した
電子部品の位置や形状等を認識する認識手段を設けた電
子部品装着装置を提案した。
In the above mounting method, after the electronic component P is sucked by the suction nozzle 51, the suction nozzle 51 is accurately positioned at the recognition position while moving toward the circuit board B, and the position of the electronic component P with respect to the suction nozzle 51 is recognized. Since the suction nozzle 51 is moved again after the suction nozzle 51 is removed, it takes a long time for one component mounting operation, and the efficiency of the component equipment is poor. We have proposed an electronic component mounting device that uses a nozzle and is equipped with recognition means for recognizing the position, shape, etc. of the electronic component picked up by the suction nozzle.

発明が解決しようとする課題 上記のように透視可能な吸着ノズルを通して吸着した電
子部品を認識するようにする七、吸着ノズルを認識位置
で停止させて位置決めすることなく、吸着した電子部品
をそのまま装着位置まで搬送して装着することができ、
装着能率を向上できるに至った。
Problems to be Solved by the Invention As mentioned above, it is possible to recognize electronic components that have been sucked through a transparent suction nozzle.7. To mount the sucked electronic components as they are without stopping the suction nozzle at the recognition position and positioning it. It can be transported to the location and installed.
We were able to improve mounting efficiency.

しかし、部品供給部で間違った方向に電子部品が供給さ
れた場合、従来はそのまま装着されてしまったり、別の
部品確認工程が必要になるということが問題となってき
た。
However, conventionally, if an electronic component is supplied in the wrong direction at the component supply section, the problem has been that it may be mounted as is, or a separate component confirmation process may be required.

本発明は上記問題点に鑑み、間違った方向に部品が供給
されたときにも廃棄ぜずに有効に使用されるようにした
部品装着装置を提供することを目的とする。
SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide a component mounting device that can be used effectively without being discarded even when a component is supplied in the wrong direction.

課題を解決するための手段 本発明は、上記目的を達成するために、種類別にマーク
を付された部品を種類毎に供給する部品供給部と、吸着
した部品を透視可能な吸着ノズルと、部品を吸着ノズル
を通して認識する認識手段と、前記部品供給部における
各部品の種類を記憶する記憶手段と、前記認識手段にて
各部品のマークを認識して判明した部品の方向が所定の
方向ではない時に方向修正を行う制御手段を備えたこと
を特徴とする。
Means for Solving the Problems In order to achieve the above object, the present invention provides a parts supply unit that supplies parts marked by type, a suction nozzle that can see through the suctioned parts, and a parts supply unit that supplies parts marked by type. a recognition means for recognizing the type of each component through a suction nozzle; a storage means for storing the type of each component in the component supply section; and a direction of the component determined by recognizing the mark of each component by the recognition means is not a predetermined direction. It is characterized in that it is equipped with a control means that sometimes makes direction corrections.

作   用 本発明によると、部品の装着時において、指定された部
品を吸着する際に吸着ノズルを通して部品を認識したと
ころ所定の方向と異なっていた場合、この部品は方向修
正して装着されるので廃棄されて無駄になることがない
According to the present invention, when mounting a component, if the specified component is recognized through the suction nozzle and the direction is different from the predetermined direction, the direction of the component is corrected and installed. It will not be discarded and wasted.

実施例 以下、本発明の一実施例を第1図〜第5図に基づいて説
明する。
EXAMPLE Hereinafter, an example of the present invention will be described based on FIGS. 1 to 5.

第3図において、1は本体フレームで、その上部に左右
一対のY軸テーブル2a、2bが配設され、その上にX
軸テーブル3がX方向に移動可能に設置され、さらにこ
のX軸テーブル3に沿ってX方向に移動可能にZ軸テー
ブル4−が設置され、このZ軸テーブル4に吸着ノズル
11を有する装着ヘッド(図示せず、第4図参照)が2
方向に移動可能に内蔵されている。又、本体フレーム1
の上面の前部には、電子部品Pを装着すべき回路基板B
の搬送位置決め手段5が配設され、後部には部品供給部
6が配設されており、吸着ノズル11が部品供給部6の
吸着位置と回路基板B上の電子部品Pを装着すべき任意
の位置との間を移動するように構成されている。
In Fig. 3, reference numeral 1 denotes a main body frame, on the top of which a pair of left and right Y-axis tables 2a, 2b are arranged.
An axis table 3 is installed movably in the X direction, a Z axis table 4- is installed along the X axis table 3 so as to be movable in the X direction, and a mounting head having a suction nozzle 11 is mounted on the Z axis table 4. (not shown, see Figure 4) is 2
It is built in so that it can be moved in any direction. Also, main body frame 1
On the front part of the upper surface of the
A transport positioning means 5 is disposed, and a component supply section 6 is disposed at the rear, and a suction nozzle 11 moves between the suction position of the component supply section 6 and an arbitrary position on which the electronic component P on the circuit board B is to be mounted. configured to move between locations.

第4図において、透光材から成る吸着ノズル11は、ノ
ズルホルダ12に保持されている。ノズルホルダ12は
吸引筒]3の下端部に嵌合されると吉もに、吸着すべき
電子部品Pの大きさに対応してワンタッチで交換できる
ように弾性係止具14にて係止されている。吸引筒13
の上端部は透光板15にて遮蔽されて吸引室16が区画
されるとともに、その周側壁に周方向に適当間隔おきに
複数の吸引開口17が形成されている。18は透光板1
5の固定ナツトである。
In FIG. 4, a suction nozzle 11 made of a transparent material is held in a nozzle holder 12. When the nozzle holder 12 is fitted to the lower end of the suction tube 3, it is locked with an elastic locking device 14 so that it can be replaced with one touch depending on the size of the electronic component P to be sucked. ing. Suction tube 13
The upper end portion of the suction chamber 16 is blocked by a light-transmitting plate 15 to define a suction chamber 16, and a plurality of suction openings 17 are formed at appropriate intervals in the circumferential direction on the peripheral side wall of the suction chamber 16. 18 is transparent plate 1
5 fixing nut.

吸引筒13の上端部は回転筒20の下端部に嵌合される
とともに、吸引室16内が汚れた時に簡11に交換でき
るように弾性係止具19にて係止されている。回転筒2
0はその上部と下部の外周に配置された軸受21a、2
1bを介して可動体22に設けられた支持筒部23にて
回転自在に支持されている。
The upper end of the suction cylinder 13 is fitted into the lower end of the rotating cylinder 20, and is locked with an elastic locking member 19 so that it can be easily replaced when the inside of the suction chamber 16 becomes dirty. Rotating tube 2
0 is bearings 21a and 2 arranged on the outer periphery of the upper and lower parts.
It is rotatably supported by a support cylinder part 23 provided on the movable body 22 via 1b.

吸引筒13の外周には可動体22に設けられた吸引外筒
24−が嵌合している。この吸引夕)筒24の内周には
吸引開口17に対向して環状溝25が形成され、この環
状溝25に図示しない吸引手段が接続される吸引口26
が開口されている。又、吸引筒13外周の吸引開口17
の両側にシール用のOリング27a、27bが配置され
ている。
A suction outer cylinder 24 - provided on the movable body 22 is fitted onto the outer periphery of the suction cylinder 13 . An annular groove 25 is formed on the inner periphery of the suction cylinder 24 facing the suction opening 17, and a suction port 26 to which a suction means (not shown) is connected to the annular groove 25.
is opened. In addition, a suction opening 17 on the outer periphery of the suction cylinder 13
O-rings 27a and 27b for sealing are arranged on both sides of.

透光板15の吸引室16側の表面に接近して吸引筒13
に周方向に適当間隔おきに複数の通孔28が形成され、
吸引外筒24にはこれら通孔28に対向するようにその
一側部に空気吹込み口2つが、他側部に空気吸込み口3
0が形成され、透光板15の表面に沿ってエアカーテン
を形成するように構成されている。
The suction cylinder 13 is placed close to the surface of the transparent plate 15 on the suction chamber 16 side.
A plurality of through holes 28 are formed at appropriate intervals in the circumferential direction,
The suction outer cylinder 24 has two air blowing ports on one side facing these through holes 28, and an air suction port 3 on the other side.
0 is formed, and is configured to form an air curtain along the surface of the transparent plate 15.

回転筒20の」二端部には、プーリ3]が固定され、図
示しない駆動源にて回転駆動される。また、可動体22
はZ軸テーブル4に沿って昇降駆動される昇降体34に
設けられたガイド32に沿って適当範囲にわたって上下
に可動でかつばね33にて弾性的に支持されている。
A pulley 3 is fixed to two ends of the rotary cylinder 20, and is rotationally driven by a drive source (not shown). In addition, the movable body 22
is movable up and down over a suitable range along a guide 32 provided on an elevating body 34 that is driven up and down along the Z-axis table 4, and is elastically supported by a spring 33.

35は、回転筒20の上方に同一軸心状態で配置された
CCDカメラ等の認識手段であり、その光学系鏡筒36
の下部にハーフミラ−37が配置され、側部に配設され
た照明具38からの照明光を吸着ノズル11に向かって
照射するように成されている。
Reference numeral 35 denotes recognition means such as a CCD camera disposed above the rotating barrel 20 in a state of the same axis, and the optical system lens barrel 36
A half mirror 37 is disposed at the bottom of the suction nozzle 11, and is configured to irradiate illumination light from a lighting fixture 38 disposed on the side toward the suction nozzle 11.

部品供給部6には、第1図に示すように、多数の電子部
品Pのテープ状体に一列状に収容して構成された電子部
品集合体41が装着され、かつこの電子部品集合体41
を電子部品Pの配置ピッチで、1ピツチづつ吸着位置に
向かって送り出すように構成された複数の部品供給カセ
ット40が並列して配置されている。又、各電子部品集
合体41に収容されている電子部品Pはそれぞれ同一種
類のものであり、各電子部品Pにはその種類を表すマー
ク42が付されている。
As shown in FIG. 1, the component supply section 6 is equipped with an electronic component assembly 41 configured by housing a large number of electronic components P in a tape-like body in a row, and this electronic component assembly 41
A plurality of component supply cassettes 40 are arranged in parallel, and are configured to feed the electronic components P one pitch at a time toward the suction position at the arrangement pitch of the electronic components P. Further, the electronic components P housed in each electronic component assembly 41 are of the same type, and each electronic component P is marked with a mark 42 indicating the type.

マーク42としては、第2図a−dに示すように、バー
コード42a、ドツトコード42b等の2値化の容易な
記号や、文字42cや、文字と各種記号の組み合わせ4
2dなど、任意の種類のマークを採用できる。
The mark 42 may be a symbol that can be easily binarized such as a bar code 42a or a dot code 42b, a character 42c, or a combination 4 of characters and various symbols, as shown in FIGS.
Any type of mark can be used, such as 2d.

又、第5図に示すように、吸着ノズル11は制御手段4
3にて制御されるY軸、X軸、Z軸テーブル2a、2b
、3.4に配設された各モータなどの駆動手段44にて
駆動され、制御手段43には入力手段45や認識手段3
5から信号が入力されている。制御手段43には、部品
供給部6にお1ノる電子部品の配列状態を記憶する部品
データ記憶手段46が接続されている。
Further, as shown in FIG. 5, the suction nozzle 11 is connected to the control means 4
Y-axis, X-axis, Z-axis tables 2a, 2b controlled by 3
, 3.4, and the control means 43 includes an input means 45 and a recognition means 3.
A signal is input from 5. Connected to the control means 43 is a component data storage means 46 that stores the arrangement state of one electronic component in the component supply section 6 .

次に、動作を説明する。電子部品Pの装着に先立って部
品供給部6における部品の配置状態に関するデータを部
品データ記憶手段46に対して入力する。入力手段45
から制御手段43に部品データ入力指令が出されると、
吸着ノズル11が第1図に示すように、第1番目の部品
供給カセット40の部品吸着位置に移動し、認識手段3
5にて電子部品Pのマーク42を読み取ってその電子部
品Pの種類を判別し、部品データ記憶手段46に記憶さ
れる。次に、第1図に仮想線で示すように、吸着ノズル
11が次の部品供給カセット40の部品吸着位置に移動
し、上記と同様に電子部品Pのマーク42を読み取って
その電子部品Pの種類を判別し、部品データ記憶手段4
6に記憶させる。次いで、最終の部品供給カセット40
か否かの判断を行い、最終の部品供給カセット40でな
い場合には最終の部品供給カセット40まで以上の動作
を繰り返すことによってすべての部品供給カセット40
について電子部品Pの種類を記憶させる。
Next, the operation will be explained. Prior to mounting the electronic component P, data regarding the placement state of the component in the component supply section 6 is input to the component data storage means 46. Input means 45
When a parts data input command is issued to the control means 43,
The suction nozzle 11 moves to the component suction position of the first component supply cassette 40 as shown in FIG.
At step 5, the mark 42 on the electronic component P is read to determine the type of the electronic component P and stored in the component data storage means 46. Next, as shown by the imaginary line in FIG. 1, the suction nozzle 11 moves to the component suction position of the next component supply cassette 40, reads the mark 42 of the electronic component P in the same way as above, and selects the electronic component P. Determine the type and parts data storage means 4
6 to be memorized. Next, the final parts supply cassette 40
If the component supply cassette 40 is not the final component supply cassette 40, the above operation is repeated until the final component supply cassette 40 is reached.
The type of electronic component P is memorized.

次に、電子部品Pの装着動作を説明する。装着すべき任
意の種類の電子部品Pが収容されている部品供給カセッ
ト40の配置位置を制御手段43にて部品データ記憶手
段46から読み出し、駆動手段44にて吸着ノズル11
を指定された部品供給カセット40の吸着位置の上方に
対向位置させ、認識カメラ35にて透光材から成る吸着
ノズル11及び透光板15を通して吸着位置の電子部品
Pのマーク42と形状を認識し、部品の供給されている
方向を判別する。次に、昇降体34が下降して吸着ノズ
ル11にて電子部品Pを吸着し、再び上昇した後、間違
った方向に部品が供給されていた場合はプーリ31を回
転駆動し所定の方向に修正する。その後、X軸テーブル
3及びY軸テーブル2a、2bが作動して吸着ノズル1
1にて吸着した電子部品Pを回路基板Bの所定の装着位
置の上方に位置させる。このとき、吸着した電子部品P
の位置を認識カメラ35にて正確に認識し、X方向及び
Y方向の偏心量及び電子部品Pの装着姿勢に対する傾き
角θが検出され、その補正がX軸テーブル3、Y軸テー
ブル2a、2bの移動量の補正とプーリ31の回転によ
って行われる。その後、昇降体34が下降することによ
って電子部品Pは回路基板Bの所定位置に正確に装着さ
れる。
Next, the mounting operation of the electronic component P will be explained. The control means 43 reads out the placement position of the component supply cassette 40 in which an arbitrary type of electronic component P to be mounted is stored from the component data storage means 46, and the drive means 44 reads out the placement position of the component supply cassette 40 that accommodates an arbitrary type of electronic component P to be mounted, and the drive means 44 reads out the placement position of the component supply cassette 40 in which an arbitrary type of electronic component P to be mounted is stored.
is positioned opposite to above the suction position of the designated component supply cassette 40, and the recognition camera 35 recognizes the mark 42 and shape of the electronic component P at the suction position through the suction nozzle 11 made of a transparent material and the transparent plate 15. and determine the direction in which the parts are being fed. Next, the elevating body 34 descends and picks up the electronic component P with the suction nozzle 11, and after rising again, if the component is being fed in the wrong direction, it rotates the pulley 31 to correct it in the predetermined direction. do. After that, the X-axis table 3 and the Y-axis tables 2a and 2b operate to remove the suction nozzle 1.
The electronic component P picked up in step 1 is positioned above the predetermined mounting position of the circuit board B. At this time, the electronic component P
The position of is accurately recognized by the recognition camera 35, the amount of eccentricity in the X direction and the Y direction, and the tilt angle θ with respect to the mounting posture of the electronic component P are detected. This is performed by correcting the amount of movement and rotating the pulley 31. Thereafter, the elevating body 34 descends, and the electronic component P is accurately mounted at a predetermined position on the circuit board B.

以上の動作を繰り返すことによって回路基板B上の電子
部品装着位置に順次に適正な電子部品Pが効率的に装着
される。
By repeating the above operations, appropriate electronic components P are sequentially and efficiently mounted at the electronic component mounting positions on the circuit board B.

発明の効果 本発明によれば、部品装着時において、認識した部品が
間違った方向に供給されていた場合、方向修正をしてか
ら装着をすることができるので部品を無駄にすることな
く、高機能、高付加価値部品の場合に効果が大きい等、
大なる効果が得られる。
Effects of the Invention According to the present invention, when a part is being mounted, if a recognized part is being fed in the wrong direction, it is possible to correct the direction and then mount it. The effect is great for functional and high value-added parts, etc.
A great effect can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第1図〜第5図は本発明の一実施例を示し、第1図は部
品データ入力時の動作を説明する斜視図、第2図a −
dは部品に付されるマークの例を示す平面図、第3図は
部品装着装置の全体概略斜視図、第4図は装着ヘット部
の縦断正面図、第5図は制御部のブロック図、第6図は
従来の装着動作を示す斜視図である。 6・・・・・・部品供給部、1]・・・・・・吸着ノズ
ル、35・・・・・・認識手段、40・・・・・・部品
供給カセット、42・・・・・・マーク、43・・・・
・・制御手段、46・・・・・・部品データ記憶手段、
P・・・・・・電子部品。 冊 第 図
1 to 5 show an embodiment of the present invention, FIG. 1 is a perspective view explaining the operation when inputting component data, and FIG. 2 a-
d is a plan view showing an example of a mark attached to a component, FIG. 3 is a schematic perspective view of the entire component mounting device, FIG. 4 is a longitudinal sectional front view of the mounting head section, and FIG. 5 is a block diagram of the control section. FIG. 6 is a perspective view showing a conventional mounting operation. 6... Parts supply unit, 1]... Suction nozzle, 35... Recognition means, 40... Parts supply cassette, 42... Mark, 43...
...control means, 46...parts data storage means,
P...Electronic parts. Book number

Claims (1)

【特許請求の範囲】[Claims]  種類別にマークを付された部品を種類毎に供給する部
品供給部と、吸着した部品を透視可能な吸着ノズルと、
部品を吸着ノズルを通して認識する認識手段と、前記部
品供給部における各部品の種類を記憶する記憶手段と、
前記認識手段にて各部品のマークを認識して判明した部
品の方向が所定の方向ではない時に方向修正を行う制御
手段を備えたことを特徴とする部品装着装置
a parts supply unit that supplies parts marked by type, and a suction nozzle that can see through the suctioned parts;
recognition means for recognizing the component through the suction nozzle; storage means for storing the type of each component in the component supply section;
A component mounting device characterized by comprising a control means for correcting the direction of the component when the direction of the component determined by recognizing the mark of each component by the recognition means is not a predetermined direction.
JP1108803A 1989-04-27 1989-04-27 Component mounting device Pending JPH02285700A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1108803A JPH02285700A (en) 1989-04-27 1989-04-27 Component mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1108803A JPH02285700A (en) 1989-04-27 1989-04-27 Component mounting device

Publications (1)

Publication Number Publication Date
JPH02285700A true JPH02285700A (en) 1990-11-22

Family

ID=14493879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1108803A Pending JPH02285700A (en) 1989-04-27 1989-04-27 Component mounting device

Country Status (1)

Country Link
JP (1) JPH02285700A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152797A (en) * 1991-11-26 1993-06-18 Sanyo Electric Co Ltd Component mounting apparatus
JPH09192951A (en) * 1995-12-29 1997-07-29 Lg Electronics Inc Assembly device and assembly method suitable for hologram module assembly device
JPH10256793A (en) * 1997-03-10 1998-09-25 Matsushita Electric Ind Co Ltd Electronic component mounting method and apparatus
JP2006202794A (en) * 2005-01-18 2006-08-03 Taiyo Kikai Seisakusho:Kk Component mounter

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61224395A (en) * 1985-03-28 1986-10-06 富士機械製造株式会社 Method and apparatus for mounting flat package type electronic component
JPS62297035A (en) * 1986-06-18 1987-12-24 Hitachi Ltd Automatic work device
JPS6373592A (en) * 1986-09-16 1988-04-04 富士通株式会社 Electronic component mounting position detection method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61224395A (en) * 1985-03-28 1986-10-06 富士機械製造株式会社 Method and apparatus for mounting flat package type electronic component
JPS62297035A (en) * 1986-06-18 1987-12-24 Hitachi Ltd Automatic work device
JPS6373592A (en) * 1986-09-16 1988-04-04 富士通株式会社 Electronic component mounting position detection method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152797A (en) * 1991-11-26 1993-06-18 Sanyo Electric Co Ltd Component mounting apparatus
JPH09192951A (en) * 1995-12-29 1997-07-29 Lg Electronics Inc Assembly device and assembly method suitable for hologram module assembly device
JPH10256793A (en) * 1997-03-10 1998-09-25 Matsushita Electric Ind Co Ltd Electronic component mounting method and apparatus
JP2006202794A (en) * 2005-01-18 2006-08-03 Taiyo Kikai Seisakusho:Kk Component mounter

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