JPH02212846A - Photosensitive planographic printing plate - Google Patents
Photosensitive planographic printing plateInfo
- Publication number
- JPH02212846A JPH02212846A JP3554489A JP3554489A JPH02212846A JP H02212846 A JPH02212846 A JP H02212846A JP 3554489 A JP3554489 A JP 3554489A JP 3554489 A JP3554489 A JP 3554489A JP H02212846 A JPH02212846 A JP H02212846A
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive
- printing plate
- support
- lithographic printing
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007639 printing Methods 0.000 title claims abstract description 69
- DOUHZFSGSXMPIE-UHFFFAOYSA-N hydroxidooxidosulfur(.) Chemical compound [O]SO DOUHZFSGSXMPIE-UHFFFAOYSA-N 0.000 claims abstract description 21
- BUUPQKDIAURBJP-UHFFFAOYSA-N sulfinic acid Chemical compound OS=O BUUPQKDIAURBJP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000007864 aqueous solution Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 150000003839 salts Chemical class 0.000 claims description 5
- 150000003863 ammonium salts Chemical class 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 31
- 239000011347 resin Substances 0.000 abstract description 31
- 229910052782 aluminium Inorganic materials 0.000 abstract description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 13
- 238000012545 processing Methods 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 description 27
- -1 aromatic diazonium salt Chemical class 0.000 description 22
- 238000000034 method Methods 0.000 description 19
- 238000011282 treatment Methods 0.000 description 18
- 238000000576 coating method Methods 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 16
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 15
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 15
- 150000001875 compounds Chemical class 0.000 description 14
- 238000011161 development Methods 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 11
- 206010016807 Fluid retention Diseases 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 8
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 229920002554 vinyl polymer Polymers 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000010186 staining Methods 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- ROVRRJSRRSGUOL-UHFFFAOYSA-N victoria blue bo Chemical compound [Cl-].C12=CC=CC=C2C(NCC)=CC=C1C(C=1C=CC(=CC=1)N(CC)CC)=C1C=CC(=[N+](CC)CC)C=C1 ROVRRJSRRSGUOL-UHFFFAOYSA-N 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 150000003931 anilides Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229940043232 butyl acetate Drugs 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 150000008049 diazo compounds Chemical class 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- BJZIJOLEWHWTJO-UHFFFAOYSA-H dipotassium;hexafluorozirconium(2-) Chemical compound [F-].[F-].[F-].[F-].[F-].[F-].[K+].[K+].[Zr+4] BJZIJOLEWHWTJO-UHFFFAOYSA-H 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- XZSZONUJSGDIFI-UHFFFAOYSA-N n-(4-hydroxyphenyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NC1=CC=C(O)C=C1 XZSZONUJSGDIFI-UHFFFAOYSA-N 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229940124530 sulfonamide Drugs 0.000 description 2
- MGSRCZKZVOBKFT-UHFFFAOYSA-N thymol Chemical compound CC(C)C1=CC=C(C)C=C1O MGSRCZKZVOBKFT-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- PJMXUSNWBKGQEZ-UHFFFAOYSA-N (4-hydroxyphenyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=C(O)C=C1 PJMXUSNWBKGQEZ-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- DNJRKFKAFWSXSE-UHFFFAOYSA-N 1-chloro-2-ethenoxyethane Chemical compound ClCCOC=C DNJRKFKAFWSXSE-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- OZCMOJQQLBXBKI-UHFFFAOYSA-N 1-ethenoxy-2-methylpropane Chemical compound CC(C)COC=C OZCMOJQQLBXBKI-UHFFFAOYSA-N 0.000 description 1
- RCSKFKICHQAKEZ-UHFFFAOYSA-N 1-ethenylindole Chemical compound C1=CC=C2N(C=C)C=CC2=C1 RCSKFKICHQAKEZ-UHFFFAOYSA-N 0.000 description 1
- CTXUTPWZJZHRJC-UHFFFAOYSA-N 1-ethenylpyrrole Chemical compound C=CN1C=CC=C1 CTXUTPWZJZHRJC-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- JXFITNNCZLPZNX-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxypropoxy)propane Chemical compound CCOCC(C)OCC(C)OC JXFITNNCZLPZNX-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- VZQBDGHUOBRFAA-UHFFFAOYSA-N 2-(2,6-dihydroxyphenyl)benzaldehyde Chemical compound C1(O)=C(C(O)=CC=C1)C1=CC=CC=C1C=O VZQBDGHUOBRFAA-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- JIKJXWFVPDDJNU-UHFFFAOYSA-N 2-[2-(4-methoxyphenyl)ethenyl]-5-(trichloromethyl)-1,3,4-oxadiazole Chemical compound C1=CC(OC)=CC=C1C=CC1=NN=C(C(Cl)(Cl)Cl)O1 JIKJXWFVPDDJNU-UHFFFAOYSA-N 0.000 description 1
- WHBAYNMEIXUTJV-UHFFFAOYSA-N 2-chloroethyl prop-2-enoate Chemical compound ClCCOC(=O)C=C WHBAYNMEIXUTJV-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- WROUWQQRXUBECT-UHFFFAOYSA-N 2-ethylacrylic acid Chemical compound CCC(=C)C(O)=O WROUWQQRXUBECT-UHFFFAOYSA-N 0.000 description 1
- ZRUOTKQBVMWMDK-UHFFFAOYSA-N 2-hydroxy-6-methylbenzaldehyde Chemical compound CC1=CC=CC(O)=C1C=O ZRUOTKQBVMWMDK-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical group OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- FCYVWWWTHPPJII-UHFFFAOYSA-N 2-methylidenepropanedinitrile Chemical compound N#CC(=C)C#N FCYVWWWTHPPJII-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- KSOWMDCLEHRQPH-UHFFFAOYSA-N 4-diazocyclohexa-1,5-dien-1-amine Chemical compound NC1=CCC(=[N+]=[N-])C=C1 KSOWMDCLEHRQPH-UHFFFAOYSA-N 0.000 description 1
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical class [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 1
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 1
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- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 229960000790 thymol Drugs 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229940001496 tribasic sodium phosphate Drugs 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Printing Plates And Materials Therefor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、感光性平版印刷版に関し、更に詳しくは改良
された親木層を有する感光性平版印刷板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a photosensitive lithographic printing plate, and more particularly to a photosensitive lithographic printing plate having an improved parent layer.
従来、感光性平版印刷板、例えばポジ型感光性印刷版は
、親木層を有する支持体上にインキ受容性の感光層を設
けたもので、このような感光性平版印刷版の感光層に画
像露光を施し、ついで現像液を用いて露光ずみの感光層
を現像すると、露光部の感光層は除去されて、親水性支
持体の表面が露出する一方、露光部の感光層は支持体の
表面に残留してインキ受容性の画像部を形成し、それに
よって平版印刷版が得られる。Conventionally, a photosensitive lithographic printing plate, such as a positive-working photosensitive printing plate, has an ink-receptive photosensitive layer provided on a support having a parent layer. When image exposure is performed and the exposed photosensitive layer is then developed using a developer, the photosensitive layer in the exposed areas is removed and the surface of the hydrophilic support is exposed, while the photosensitive layer in the exposed areas is removed from the support. It remains on the surface to form ink-receptive image areas, thereby yielding a lithographic printing plate.
このような平版印刷版は水と油との反発を利用して印刷
するものである。具体的にはその版面の非画像部を水で
湿した後、版面にインキを与えると非画像部では湿し水
によりインキが反発する為、画像部にのみ選択的にイン
キが付着する。上記画像部のインキを被転写物に転写す
ると、上記画像部に対応した画像を有する印刷物が得ら
れる。Such a lithographic printing plate uses the repulsion between water and oil to perform printing. Specifically, when the non-image area of the printing plate is moistened with water and then ink is applied to the printing plate, the ink is repelled by the dampening water in the non-image area, so that the ink selectively adheres only to the image area. When the ink in the image area is transferred to a transfer object, a printed matter having an image corresponding to the image area is obtained.
したがって、このような平版印刷版を得るための支持体
としては、水の湿しt:時、親水性かつ保水性に優れて
いると共に印圧を受ける画像部となる感光層との接着性
が良好なものでなければならない。また感光層としては
、インキ受容性、露光に対して高感度を有すること等が
必要であると共に、最も大切な条件としては高耐刷力を
備えていなければならない。Therefore, as a support for obtaining such a lithographic printing plate, it is necessary to use a support that has excellent hydrophilicity and water retention properties, and also has good adhesion to the photosensitive layer that forms the image area that receives printing pressure. It must be in good condition. Furthermore, the photosensitive layer must have ink receptivity and high sensitivity to light exposure, and most importantly, it must have high printing durability.
これらの条件を満足した支持体としては、アルミニウム
板が最も優れており、このアルミニウム板と感光層との
十分な接着性を得るために、支持体表面を機械的に粗面
化する表面処理法として、例えばポールダレイニング、
ワイヤーグレイニング、ブラシグレイニング等の各方法
が特公昭50−40047号公報、特公昭5l−46(
103号公報等に記載されている。また特公昭4g−2
8123号公報、米国特許筒4.087.341号明細
書、特開昭53−67507号公報等には、塩酸浴、硝
酸浴等を用いて直流あるいは交流の電流で、アルミニウ
ム板表面に均一で緻密な砂目形状を形成させる電解粗面
化法が記載されている。更に特開昭56−150595
号公報には、支持体表面に熱水による封孔処理、珪酸塩
による封孔処理等を施すことによって支持体と感光層と
の接着性をコントロールする方法が記載されている。An aluminum plate is the best support that satisfies these conditions, and in order to obtain sufficient adhesion between the aluminum plate and the photosensitive layer, a surface treatment method is used to mechanically roughen the surface of the support. As, for example, Paul Daleining,
Various methods such as wire graining and brush graining are described in Japanese Patent Publication No. 50-40047 and Japanese Patent Publication No. 51-46 (1983).
It is described in Publication No. 103, etc. Also, special public show 4g-2
No. 8123, U.S. Pat. An electrolytic surface roughening method that forms a dense grained shape is described. Furthermore, JP-A-56-150595
The publication describes a method of controlling the adhesion between the support and the photosensitive layer by subjecting the surface of the support to a sealing treatment using hot water, a sealing treatment using a silicate, or the like.
このように支持体と感光層との間に十分な接着性をもた
せると共に、アルミニウム板のような支持体に、親水性
並びに保水性を向上させるために、更に表面処理が施さ
れ、例えば、特公昭56−22063号公報、米国特許
筒2.246.683号明細書、同第3.160.50
6号明細書には、金属表面を弗化ジルコン酸カリウムで
化学処理して被膜を形成することによりその金属表面の
親水性並びに保水性を向上できることが記載されている
。また特開昭53−13NO2号公報には、弗化ジルコ
ン酸カリウム水溶液で処理した後、珪酸ナトリウム水溶
液で処理することにより親水性並びに保水性を向上させ
た支持体が記載されている。In addition to providing sufficient adhesion between the support and the photosensitive layer, the support such as an aluminum plate is further subjected to surface treatment to improve its hydrophilicity and water retention. Publication No. 56-22063, U.S. Patent No. 2.246.683, U.S. Patent No. 3.160.50
No. 6 describes that the hydrophilicity and water retention of the metal surface can be improved by chemically treating the metal surface with potassium fluorozirconate to form a film. Further, JP-A-53-13NO2 describes a support whose hydrophilicity and water retention are improved by treating it with an aqueous solution of potassium fluorozirconate and then with an aqueous solution of sodium silicate.
しかしながら、これらの方法では1.現像処理して得ら
れた平版印刷版の非画像部の汚染防止効果を十分に良く
すると耐刷力及び耐薬品性に問題を生じ、耐刷力及び耐
処理薬品性を良くしようとするど非画像部の汚染防止効
果が十分でなくなり、非画像部の汚染防止、耐刷力及び
耐処理薬品性の王者を共に良くすることが困難であった
。However, these methods: 1. If the stain prevention effect of the non-image area of the lithographic printing plate obtained by development treatment is sufficiently improved, problems will arise in printing durability and chemical resistance, and it is difficult to improve printing durability and processing chemical resistance. The effect of preventing staining in the image area was insufficient, and it was difficult to improve the prevention of staining in the non-image area, printing durability, and treatment chemical resistance.
このような現象は、一般に耐剛力を向上させる手段とし
て良く行われているバーニング処理を行った場合−RM
著に現れ、前記方法Iこよって処理された支持体から得
られた平版印刷版は実際の印刷の使用にはもはや耐えら
れなくなってきている。Such a phenomenon occurs when burning treatment, which is commonly used as a means of improving stiffness resistance, occurs -RM
It has become increasingly clear that the lithographic printing plates obtained from supports treated according to Method I are no longer suitable for practical printing use.
そこで、本発明者等は、上述の問題点に鑑みて鋭意研究
を重ねた結果、主としてアルミニウム支持体の表面を特
定の処理を用いて処理することにより高耐刷性を保つと
同時に非画像部で十分な保水性を維持し、かつ非画像部
の汚れを生じない感光性平版印刷版が得られることを見
出し、本発明を完成するに至った。Therefore, as a result of extensive research in view of the above-mentioned problems, the inventors of the present invention have mainly treated the surface of the aluminum support using a specific treatment, thereby maintaining high printing durability while at the same time The present inventors have discovered that a photosensitive lithographic printing plate can be obtained which maintains sufficient water retention and does not cause staining in non-image areas, and has completed the present invention.
従って、本発明の第1の目的は、露光、現像後、非画像
部に感光層の成分が残留しない、所謂現像性に優れると
ともに非画像部で十分な保水性を保持する感光性平版印
刷版を提供することにある。Therefore, the first object of the present invention is to provide a photosensitive lithographic printing plate that has excellent developability, in which no components of the photosensitive layer remain in non-image areas after exposure and development, and maintains sufficient water retention in non-image areas. Our goal is to provide the following.
また、本発明の第2の目的は、耐刷性が高く、かつ非画
像部に汚れを生じない感光性平版印刷版を提供すること
にある。A second object of the present invention is to provide a photosensitive planographic printing plate that has high printing durability and does not cause stains in non-image areas.
本発明の前記の目的は、前処理された支持体の表面をス
ルフィン酸又はスルフィン酸塩を含む水溶液で処理した
後、該表面に感光層を設けたことを特徴とする感光性平
版印刷版によって達成される。The above-mentioned object of the present invention is to provide a photosensitive lithographic printing plate characterized in that the surface of a pretreated support is treated with an aqueous solution containing sulfinic acid or a sulfinate salt, and then a photosensitive layer is provided on the surface. achieved.
本発明は、支持体の表面を前処理した後、この表面を更
にスルフィン酸又はスルフィン酸塩を含む水溶液で処理
したことにより、感光性平版印刷版を現像したとき、非
画像部において、今まで強く吸着していて除去できなか
った感光層中の成分、特に樹脂成分を容易Iこ除去する
ことができるので、非画像部における保水性が十分に保
たれる。In the present invention, after the surface of the support is pretreated, this surface is further treated with an aqueous solution containing sulfinic acid or a sulfinate, so that when a photosensitive lithographic printing plate is developed, the non-image area is Components in the photosensitive layer that were strongly adsorbed and could not be removed, especially resin components, can be easily removed, so that water retention in non-image areas can be maintained sufficiently.
以下、本発明を更に具体的に説明する。 The present invention will be explained in more detail below.
本発明は、前処理された支持体の表面に感光層を設ける
前に、その表面をスルフィ7a又はスルフィン酸塩を含
む水溶液で処理した点に特徴があり、これにより非画像
部の汚れが防止されて保水性が向上する。The present invention is characterized in that before forming a photosensitive layer on the surface of a pretreated support, the surface is treated with an aqueous solution containing Sulfy 7a or a sulfinate, thereby preventing staining of non-image areas. and improves water retention.
本発明において用いられるスルフィン酸塩の例としては
、周期律表のI a s n a −II b N I
II b %DIb、IVa、rVb、VIa、■a1
■族の金属のスルフィン酸塩またはアンモニウム塩、す
なわちスルフィン酸アンモニウムが挙げられ、その金属
塩としては、例えば、Li5O,H,Na5OJ、 K
SO,H,Mg(SOzH)イCa(SO2[l)z、
Zn(SOxH)x、Al(SO!H)s、Zr(so
、tl)、、 So(Sow)I)い Cr(SOx
H)s、 Co(SJH)z、 Mn(SOzH)*、
Nj(SOJ)を等が好ましく、特に、アルカリ金属ス
ルフィン酸塩が好ましい。このようなスルフィン酸塩は
、勿論2種以上併用することができ、更にスルフィン酸
と併用することもできる。Examples of sulfinate salts used in the present invention include I a s na - II b N I of the periodic table.
II b %DIb, IVa, rVb, VIa, ■a1
Examples include sulfinates or ammonium salts of group metals, i.e., ammonium sulfinate; examples of the metal salts include Li5O, H, Na5OJ, K
SO,H,Mg(SOzH)iCa(SO2[l)z,
Zn(SOxH)x, Al(SO!H)s, Zr(so
, tl),, So(Sow)I) Cr(SOx
H)s, Co(SJH)z, Mn(SOzH)*,
Nj(SOJ) and the like are preferred, and alkali metal sulfinates are particularly preferred. Of course, two or more kinds of such sulfinate salts can be used in combination, and further, they can also be used in combination with sulfinic acid.
本発明に用いられるスルフィン酸又はスルフィン酸塩を
含む水溶液は、一般にスルフィン酸又はスルフィン酸塩
をo、ooi〜10重量%含有する水溶液である。The aqueous solution containing sulfinic acid or sulfinate salt used in the present invention is generally an aqueous solution containing o, ooi to 10% by weight of sulfinic acid or sulfinate salt.
上記処理液で支持体表面を処理する場合の処理条件とし
ては、室温から約100℃の温度範囲で、前処理された
支持体を15〜300秒の間浸漬するか、またはその処
理液を支持体に塗布するのが好ましい。When treating the surface of the support with the above treatment liquid, the treatment conditions include immersing the pretreated support for 15 to 300 seconds at a temperature range from room temperature to about 100°C, or supporting the treatment liquid. Preferably applied to the body.
本発明の好ましい実施態様として、スルフィン酸ナトリ
ウムを0.01〜2重量%含む水溶液に、50〜80℃
で30〜180秒の間支持体を浸漬する処理が挙げられ
る。スルフィン酸又はスルフィン酸塩を含む水溶液によ
って処理された支持体は、その後好ましくは乾燥される
。In a preferred embodiment of the present invention, an aqueous solution containing 0.01 to 2% by weight of sodium sulfinate is added at 50 to 80°C.
For example, the support may be immersed for 30 to 180 seconds. The support treated with an aqueous solution containing sulfinic acid or sulfinate is then preferably dried.
前記のスルフィン酸又はスルフィン酸塩を含む水溶液に
は、必要に応じて添加剤を加えることができる。例えば
水溶性高分子、界面活性剤などが挙げられる。Additives can be added to the aqueous solution containing the sulfinic acid or sulfinate salt, if necessary. Examples include water-soluble polymers and surfactants.
本発明において用いられる支持体としては、通常の平版
印刷機にセ・ノドできるたわみ性と印刷時に加わる荷重
に耐えるものが好ましく、例えばアルミニウム、マグネ
シウム、亜鉛、クロム鉄、銅ニッケル等の金属板、及び
これらの金属の合金板等が挙げられ、更にはクロム、亜
鉛、銅、二・ソケル、アルミニウム及び鉄等がメ・ツキ
または蒸着番こよって被覆されている金属板でもよい。The support used in the present invention is preferably one that is flexible enough to be run on a normal lithographic printing machine and that can withstand the load applied during printing, such as a metal plate made of aluminum, magnesium, zinc, chromium iron, copper nickel, etc. and alloy plates of these metals, and metal plates coated with chromium, zinc, copper, aluminum, iron, etc. by metal plating or vapor deposition may also be used.
これらのうち好ましい支持体は、アルミニウムまたはそ
の合金である。Among these, a preferred support is aluminum or an alloy thereof.
本発明に用いられる支持体は、スルフィン酸又はスルフ
ィン酸塩を含む水溶液によって処理される前に、前処理
を施すが、この前処理としては、この技術分野において
通常採用されている脱脂処理および砂目立処理がある。The support used in the present invention is pretreated before being treated with an aqueous solution containing sulfinic acid or a sulfinate salt. There is a noticeable treatment.
砂目立処理は、機械的に表面を粗面化するもので、いわ
ゆる機械的粗面化法といわれ、例えばポール研磨、ブラ
シ研磨、プラストケンマ、パフ研磨等・の方法がある。Graining is a method of mechanically roughening the surface, and is referred to as a so-called mechanical surface roughening method, and includes methods such as pole polishing, brush polishing, plastokenma, and puff polishing.
また電気的に表面を粗面化する、いわゆる電気的粗面化
法を利用するもでき、例えば塩酸まI;は硝酸等を含む
電界液中で交流あるいは直流によって支持体を電界処理
することもできる。It is also possible to use a so-called electrical surface roughening method that electrically roughens the surface. For example, the support can be subjected to electric field treatment using alternating current or direct current in an electrolytic solution containing hydrochloric acid, nitric acid, etc. can.
前述のような砂目立処理して得られた支持体の表面には
、スコツトが生成しているので、このスコツトを除去す
るために適宜水洗あるいはアルカリエツチング等の処理
を行うことが一般的に好ましい。このような処理として
は、例えば特公昭48−28123号公報に記載されて
いるアルカリエツチング法や特開昭53−12739号
公報に記載されている硫酸デスコツト法等の処理方法が
挙げられる。Scots are formed on the surface of the support obtained by the above-mentioned grain treatment, so in order to remove these scotts, it is generally necessary to carry out treatments such as water washing or alkali etching as appropriate. preferable. Examples of such treatments include the alkali etching method described in Japanese Patent Publication No. 48-28123 and the sulfuric acid descott method described in Japanese Patent Application Laid-open No. 53-12739.
本発明に用いられる支持体がアルミニウム支持体の場合
には、前述のような前処理を施した後、通常、耐摩耗性
、耐薬品性、保水性を向上させるために、陽極酸化によ
って支持体に酸化被膜を形成させる。この陽極酸化では
一般的に、硫酸および/または燐酸等を濃度lO〜50
%で含む水溶液を電解液として電流密度1〜IOA/d
m2で電解する方法が好ましく用いられるが、他に米国
特許第1,412.768号明細書に記載されているR
酸中で高電流密度で電解する方法や米国特許第3,51
1.661号明細書に記載されている燐酸を用いて電解
する方法がある。When the support used in the present invention is an aluminum support, after the above-mentioned pretreatment, the support is usually anodized to improve wear resistance, chemical resistance, and water retention. to form an oxide film. In this anodic oxidation, sulfuric acid and/or phosphoric acid is generally used at a concentration of lO to 50
Current density 1 to IOA/d using an aqueous solution containing % as an electrolyte
Although a method of electrolyzing with m2 is preferably used, other methods include electrolysis with R as described in US Pat. No. 1,412.768
Method of electrolysis at high current density in acid and U.S. Patent No. 3,51
There is a method of electrolysis using phosphoric acid described in the specification of No. 1.661.
本発明に用いられる最も好ましい支持体は、陽極酸化被
膜を有するアルミニウム支持体である。・前記の支持体
の感光層に対する接着性を向上させるだめの支持体自体
に施される処理は特に限定されるものでなく、必要に応
じてプライマー層等を設けることができる。The most preferred support for use in the present invention is an aluminum support with an anodized coating. - The treatment applied to the support itself to improve the adhesion of the support to the photosensitive layer is not particularly limited, and a primer layer or the like may be provided as necessary.
該プライマー層には例えばポリエステル樹脂、塩化ビニ
ル−酢酸ビニル共重合体、アクリル樹脂、塩化ビニル樹
脂、ポリアミド樹脂、ポリビニルブチラール樹脂、エポ
キシ樹脂、アクリレート系共重合体、酢酸ビニル系共重
合体、フェノキシ樹脂、ポリウレタン樹脂、ポリカーボ
ネート樹脂、ポリアクリロニトリルブタジェン、ポリ酢
酸ビニル等が挙げられる。The primer layer includes, for example, polyester resin, vinyl chloride-vinyl acetate copolymer, acrylic resin, vinyl chloride resin, polyamide resin, polyvinyl butyral resin, epoxy resin, acrylate copolymer, vinyl acetate copolymer, phenoxy resin. , polyurethane resin, polycarbonate resin, polyacrylonitrile butadiene, polyvinyl acetate, and the like.
また上記ブライマー層を構成するアンカー剤としては、
例えばシランカップリング剤、シリコーンブライマー等
を用いることができ、また有機チタネート等も有効であ
る。In addition, as the anchor agent constituting the above-mentioned brimer layer,
For example, silane coupling agents, silicone primers, etc. can be used, and organic titanates and the like are also effective.
本発明の感光性平版印刷版は、前述のようにして得られ
た支持体に感光層を設けたものであるが、この感光層中
に用いられる感光性物質は、特に限定されるものでなく
、通常、感光性平版印刷版に用いられている、例えば下
記のような各種のものが使用される。The photosensitive lithographic printing plate of the present invention has a photosensitive layer provided on the support obtained as described above, but the photosensitive material used in this photosensitive layer is not particularly limited. Various types of materials commonly used in photosensitive lithographic printing plates, such as those listed below, are used.
l)光架橋系感光性樹脂組成物
光架橋系感光性樹脂組成物中の感光成分は、分子中に不
飽和二重結合を宵する感光性樹脂からなるもので、例え
ば米国特許第3.030.208号明細書、同第3,4
35.237号明細書および同第3.622,320号
明細書等に記載されている如き、重合体主鎖中に感光基
として−CH−CH−Co−を含む感光性樹脂、および
重合体の側鎖に感光基を有するポリビニルシンナメート
等があげられる。l) Photocrosslinkable photosensitive resin composition The photosensitive component in the photocrosslinkable photosensitive resin composition is composed of a photosensitive resin having unsaturated double bonds in its molecules, for example as described in U.S. Pat. No. 3.030. .208 Specification, Nos. 3 and 4
Photosensitive resins and polymers containing -CH-CH-Co- as a photosensitive group in the polymer main chain, as described in No. 35.237 and No. 3.622,320, etc. Examples include polyvinyl cinnamate having a photosensitive group in the side chain.
2)光重合系感光性樹脂組成物
付加重合性不飽和化合物を含む光重合性組成物であって
、二重結合を有する単量体と高分子バインダーからなり
、このような組成物の代表的なものは、例えば米国特許
第2,760.863号明細書および同第2.791,
504号明細書等に記載されている。2) Photopolymerizable photosensitive resin composition A photopolymerizable composition containing an addition-polymerizable unsaturated compound, consisting of a monomer having a double bond and a polymer binder, and a typical example of such a composition. For example, US Pat. No. 2,760,863 and US Pat. No. 2,791,
It is described in the specification of No. 504, etc.
この光重合系感光性樹脂組成物には、この技術分野で通
常知られている光重合開始剤(例えばベンゾインメチル
エーテル等のベンゾイン誘導体、ベンゾフェノン等のベ
ンゾフェノン誘導体、チオキサントン誘導体、アントラ
キノン誘導体、アクリドン誘導体等)が添加される。This photopolymerizable photosensitive resin composition contains photopolymerization initiators commonly known in this technical field (for example, benzoin derivatives such as benzoin methyl ether, benzophenone derivatives such as benzophenone, thioxanthone derivatives, anthraquinone derivatives, acridone derivatives, etc.). ) is added.
3)ジアゾ化合物を含む感光性組成物
この感光性組成物中のジアゾ化合物は、例えば、好まし
くは芳香族ジアゾニウム塩とホルムアルデヒドまたはア
セトアルデヒドとの縮合物で代表されるジアゾ樹脂であ
る。特に好ましくは、p−ジアゾフェニルアミンとホル
ムアルデヒドまたはアセトアルデヒドとの縮合物の塩、
例えばヘキサフルオロホウ燐酸塩、テトラフルオロホウ
酸塩、過塩素酸塩または過ヨウ素酸塩と前記縮合物との
反応生成物であるジアゾ樹脂無機塩や、米国特許第3゜
300.309号明細書中に記載されているような、前
記縮合物とスルホン酸類との反応生成物であるジアゾ樹
脂有機塩等が挙げられる。さらにジアゾ樹脂は、好まし
くは結合剤と共に使用される。かがる結合剤としては種
々の高分子化合物を使用することができるが、好ましく
は特開昭54−98613号公報に記載されているよう
な芳香族性水酸基を有する単量体、例えばN−(4−ヒ
ドロキシフェニル)アクリルアミド、N−(4−ヒドロ
キシフェニル)メタクリルアミド、O−1飄−1または
p−ヒドロキシスチレン、O−1@−1またはp−ヒド
ロキシフェニルメタクリレート等と他の単量体との共重
合体、米国特許第4..123,276号明細書中に記
載されているようなヒドロキシエチルアクリレート単位
またはヒドロキシエチルメタクリレート単位を主な繰り
返し単位として含むポリマー シェラツク、ロジン等の
天然樹脂、ポリビニルアルコール、米国特許第3゜75
1.257号明細書中に記載されているようなポリアミ
ド樹脂、米国特許第3.660,097号明細書中に記
載されているような線状ポリウレタン樹脂、ポリビニル
アルコールの7タレート化樹脂、ビスフェノールAとエ
ピクロルヒドリンから縮合されたエポキシ樹脂、酢酸セ
ルロース、セルロースアセテートフタレート等のセルロ
ース誘導体が包含される。3) Photosensitive composition containing a diazo compound The diazo compound in this photosensitive composition is, for example, a diazo resin preferably represented by a condensate of an aromatic diazonium salt and formaldehyde or acetaldehyde. Particularly preferably, a salt of a condensate of p-diazophenylamine and formaldehyde or acetaldehyde,
For example, diazo resin inorganic salts which are reaction products of hexafluoroborophosphate, tetrafluoroborate, perchlorate or periodate with the above condensate, and US Pat. No. 3.300.309. Examples include diazo resin organic salts, which are reaction products of the above condensate and sulfonic acids, as described in . Furthermore, diazo resins are preferably used together with binders. Various polymer compounds can be used as the binding agent, but monomers having an aromatic hydroxyl group such as those described in JP-A-54-98613, such as N- (4-hydroxyphenyl)acrylamide, N-(4-hydroxyphenyl)methacrylamide, O-1@-1 or p-hydroxystyrene, O-1@-1 or p-hydroxyphenyl methacrylate, etc. and other monomers copolymer with U.S. Pat. No. 4. .. Polymers containing hydroxyethyl acrylate units or hydroxyethyl methacrylate units as a main repeating unit as described in No. 123,276 Natural resins such as shellac and rosin, polyvinyl alcohol, U.S. Pat. No. 3.75
Polyamide resins such as those described in U.S. Pat. No. 1.257, linear polyurethane resins such as those described in U.S. Pat. Epoxy resins condensed from A and epichlorohydrin, cellulose derivatives such as cellulose acetate and cellulose acetate phthalate are included.
4)0−キノンジアジド化合物を含む感光性組成物0−
キノンジアジド化合物を含む感光性組成物においては、
0・キノンジアジド化合物とアルカリ可溶性樹脂を併用
することが好ましい。4) Photosensitive composition 0- containing 0-quinonediazide compound
In a photosensitive composition containing a quinonediazide compound,
It is preferable to use the O.quinonediazide compound and the alkali-soluble resin together.
O・キノンジアジド化合物としては、例えば。−す7ト
キノンジアジドスルホン酸と、フエ、ノール類及びアル
デヒド又はケトンの重縮合樹脂とのエステル化合物が挙
げられる。Examples of O.quinonediazide compounds include: Examples include ester compounds of -su7-toquinone diazide sulfonic acid and polycondensation resins of fe, nols, and aldehydes or ketones.
前記フェノール類としては、例えば、フェノール、0−
クレゾール、雷−クレゾール、p・クレゾール、3.5
−キシレノール、カルバクロール、チモール等の一価フ
エノール、カテコール、レゾルシン、ヒドロキノン等の
二価フェノール、ピロガロール、70口グルシン等の三
価フェノール等が挙げられる。前記アルデヒドとしては
ホルムアルデヒド、ベンズアルデヒド、アセトアルデヒ
ド、クロトンアルデヒド、フルフラール等が挙げられる
。これらのうち好ましいものはホルムアルデヒド及びベ
ンズアルデヒドである。又、前記ケトンとしてはアセト
ン、メチルエチルケトン等が挙げられる。Examples of the phenols include phenol, 0-
Cresol, lightning-cresol, p-cresol, 3.5
- Monohydric phenols such as xylenol, carvacrol, and thymol, dihydric phenols such as catechol, resorcinol, and hydroquinone, and trihydric phenols such as pyrogallol and 70-glucine. Examples of the aldehyde include formaldehyde, benzaldehyde, acetaldehyde, crotonaldehyde, and furfural. Preferred among these are formaldehyde and benzaldehyde. Further, examples of the ketone include acetone and methyl ethyl ketone.
前記重縮合樹脂の具体的な例としては、フェノール−ホ
ルムアルデヒド樹脂、m−クレゾール・ホルムアルデヒ
ド樹脂、m−rp・混合クレゾール・ホルムアルデヒド
樹脂、レゾルシン・ベンズアルデヒド樹脂、ピロガロー
ル・アセトン樹脂等が挙げられる。Specific examples of the polycondensation resin include phenol-formaldehyde resin, m-cresol formaldehyde resin, m-rp mixed cresol formaldehyde resin, resorcinol benzaldehyde resin, pyrogallol acetone resin, and the like.
前記0−ナフトキノンジアジド化合物のフェノール類の
Of(基に対する0−ナフトキノンジアジドスルホン酸
の縮合率(OH基1個に対する反応率)は、15〜80
%が好ましく、より好ましくは20〜45%である。The condensation rate (reaction rate for one OH group) of 0-naphthoquinonediazide sulfonic acid with respect to Of(group of phenols of the 0-naphthoquinonediazide compound) is 15 to 80.
%, more preferably 20 to 45%.
更に本発明に用いられる0−キノンジアジド化合物とし
ては特開昭58−43451号公報に記載のある以下の
化合物も使用できる。即ち例えば1,2・ベンゾキノン
ジアジドスルホン酸エステル、l、2−ナフトキノンジ
アジドスルホン酸エステル、1,2−ベンゾキノンジア
ジドスルホン酸アミド、1.2−ナフトキノンジアジド
スルホン酸アミドなどの公知の1,2−キノンジアジド
化合物、更に具体的にはジエイ・コサール(J、Kos
ar)著「ライト・センシティブシステムJ(“Lfh
t−5ensitive Systems″)第339
〜゛352頁(1965年)、ジミン・ウィリー ・ア
ンド ・サンズ(John Wiley & 5ons
)社にューヨーク)やダブりニー・ニス・デイ−・7オ
レスト(W、S、De F。Further, as the O-quinonediazide compound used in the present invention, the following compounds described in JP-A-58-43451 can also be used. That is, for example, known 1,2-quinonediazides such as 1,2-benzoquinonediazide sulfonic acid ester, 1,2-naphthoquinonediazide sulfonic acid ester, 1,2-benzoquinonediazide sulfonic acid amide, and 1,2-naphthoquinonediazide sulfonic acid amide. compounds, more specifically J. Kossar.
ar) “Light Sensitive System J” (“Lfh
339th
〜゛352 pages (1965), John Wiley & Sons
) company in New York) and double varnish day 7 orest (W, S, De F.
rest)著「フォトレジスト」(“Photores
ist”)第50巻、 (1,975年)、マグロ−ヒ
ル(Mc Gray−Hill)社にューヨーク)に記
載されている1、2−ベンゾキノンジアジド−4−スル
ホン酸フェニルエステル、1.2.1’2′−ジー(ベ
ンゾキノンジアジド−4−スルホニル)・ジヒドロキシ
ビフェニル、l、2−ベンゾキノンジアジド−4・(N
−エチルートβ−す7チル)−スルホンアミド、1.2
−す7トキノンジアジド・5−スルホン酸シクロヘキシ
ルエステル、1−(1,2・ナフトキノンジアジド−5
−スルホニル)−3,5−ジメチルピラゾール、1.2
−す7トキノンジアジドー5・スルホン酸・4′・ヒド
ロキシジフェニル−4′−アゾ−β−す7トールエステ
ル、N、N−ジー(l、2−す7トキノンジアジドー5
・スルホニル)−アニリン、2′・(l、2−ナフトキ
ノンジアジド−5−スルホニルオキシ)・l−ヒドロキ
シ−アントラキノン゛、1.2・す7トキノンジアジド
ー5−スルホン酸−2゜4・ジヒドロキシベンゾフェノ
ンエステル、l、2−ナフトキノンジアジド−5−スル
ホンff2−2.3.4− トリヒドロキシベンゾフェ
ノンエステル、 1.2−ナフトキノンジアジド−5−
スルホン酸クロリド2モルと4.4’−ジアミノベンゾ
フェノン1モルの縮合物、1.2−ナフトキノンジアジ
ド−5−スルホン酸クロリド2モルと4,4′−ジヒド
ロキシ−1,1′−ジフェニルスルホン1モルの縮合物
、l、2・す7トキノンジアジド・5−スルホン酸クロ
リド1モルとプルプロガリン1モルの縮合物、1,2・
す7トキノンジアジドー5−(N−ジヒドロアビエチル
)−スルホンアミドなどの1.2−キノンジアジド化合
物を例示することができる。又、特公昭37・1953
号、同37・3627号、同37−13109号、同4
0−26126号、同40−3801号、同45・56
04号、同45−27345号、同51−13013号
、特開昭48−96575号、同48−63802号、
同48・63803号各公報に記載されたl、2−キノ
ンジアジド化合物をも挙げることができる。``Photoresist'' (rest)
1,2-benzoquinonediazide-4-sulfonic acid phenyl ester, 1.2. 1'2'-di(benzoquinonediazide-4-sulfonyl)・dihydroxybiphenyl, l,2-benzoquinonediazide-4・(N
-ethyroot β-su7tyl)-sulfonamide, 1.2
-su7toquinonediazide 5-sulfonic acid cyclohexyl ester, 1-(1,2・naphthoquinonediazide-5
-sulfonyl)-3,5-dimethylpyrazole, 1.2
-su7toquinonediazide 5・sulfonic acid・4′・hydroxydiphenyl-4′-azo-β-su7toll ester, N,N-di(l,2-su7toquinonediazide 5
・Sulfonyl)-aniline, 2′・(l,2-naphthoquinonediazide-5-sulfonyloxy)・l-hydroxy-anthraquinone゛, 1.2・7toquinonediazide 5-sulfonic acid-2゜4・dihydroxybenzophenone ester, l,2-naphthoquinonediazide-5-sulfoneff2-2.3.4-trihydroxybenzophenone ester, 1,2-naphthoquinonediazide-5-
Condensate of 2 moles of sulfonic acid chloride and 1 mole of 4,4'-diaminobenzophenone, 2 moles of 1,2-naphthoquinonediazide-5-sulfonic acid chloride and 1 mole of 4,4'-dihydroxy-1,1'-diphenylsulfone A condensate of 1 mol of 1,2-7toquinonediazide 5-sulfonic acid chloride and 1 mol of purpurogalin, 1,2.
Examples include 1,2-quinonediazide compounds such as 7-toquinonediazide and 5-(N-dihydroabiethyl)-sulfonamide. Also, special public service 37/1953
No. 37-3627, No. 37-13109, No. 4
No. 0-26126, No. 40-3801, No. 45/56
No. 04, No. 45-27345, No. 51-13013, JP-A No. 48-96575, No. 48-63802,
Also included are l,2-quinonediazide compounds described in Patent Publications No. 48/63803.
上記0−キノンジアジド化合物のうち、■、2−ベンゾ
キノンジアジドスルホニルクロリド又は1.2・す7ト
キノンジアジドスルホニルクロリドとピロガロール・ア
セトン縮合樹脂又は2.3.4− トリヒドロキシベン
ゾフェノンを反応させて得られる0−キノンジアジドエ
ステル化合物が特に好ましい。Among the above-mentioned 0-quinonediazide compounds, -Quinone diazide ester compounds are particularly preferred.
本発明に用いられる0−キノンジアジド化合物としては
上記化合物を各々巣独で用いてもよいし、2種以上組合
せて用いてもよい。As the O-quinonediazide compound used in the present invention, each of the above compounds may be used alone, or two or more thereof may be used in combination.
本発明に用いられる0−キノンジアジド化合物の感光性
組成物中に占める割合は、5〜641%が好ましく、特
に好ましくは、10〜50重量%である。The proportion of the 0-quinonediazide compound used in the present invention in the photosensitive composition is preferably 5 to 641%, particularly preferably 10 to 50% by weight.
本発明の感光性組成物の中に用いられるアルカリ可溶性
樹脂としては、ノボラック樹脂、フェノール性水酸基を
有するビニル系重合体、特開昭55−57841号公報
に記載されている多価フェノールとアルデヒド又はケト
ンとの縮合樹脂等が挙げられる。Examples of the alkali-soluble resin used in the photosensitive composition of the present invention include a novolak resin, a vinyl polymer having a phenolic hydroxyl group, a polyhydric phenol and an aldehyde described in JP-A-55-57841, or Examples include condensation resins with ketones.
本発明に使用されるノボラック樹脂としては、例えばフ
ェノール−ホルムアルデヒド樹脂、クレゾール・ホルム
アルデヒド樹脂、特開昭55−57841号公報に記載
されているようなフェノール・クレゾール・ホルムアル
デヒド共重縮合体樹脂、特開昭55−127553号公
報に記載されているようなp・置換フェノールとフェノ
ールもしくは、クレゾールとホルムアルデヒドとの共重
縮合体樹脂等が挙げられる。Examples of the novolac resin used in the present invention include phenol-formaldehyde resin, cresol-formaldehyde resin, phenol-cresol-formaldehyde copolycondensate resin as described in JP-A No. 55-57841, and JP-A-55-57841. Examples include copolycondensate resins of p-substituted phenol and phenol or cresol and formaldehyde as described in Japanese Patent Publication No. 127553/1982.
前記ノボラック樹脂の分子量(ポリスチレン標準)は、
好ましくは数平均分子量Mnが3.00X 10”〜7
.50X 10’、重量平均分子量Myが1.00X
10’〜3.00X 10’、より好ましくはMnが5
.00X 10”〜4.00XlO’、Myが3.OO
x 103〜2.00x 104テある。The molecular weight (polystyrene standard) of the novolak resin is:
Preferably, the number average molecular weight Mn is 3.00X 10” to 7
.. 50X 10', weight average molecular weight My is 1.00X
10' to 3.00X 10', more preferably Mn is 5
.. 00X 10"~4.00XlO', My is 3.OO
There are x 103 to 2.00x 104 te.
上記ノボラック樹脂は単独で用いてもよいし、2種以上
組合せて用いてもよい。The above novolak resins may be used alone or in combination of two or more.
上記ノボクックsinの本発明の感光性I!成初物中占
める割合は5〜95!を量%である。Photosensitivity I of the present invention of the above-mentioned Novocook sin! The proportion of the first fruits is 5 to 95! is the amount%.
又、本発明に用いられるフェノール性水酸基を有するビ
ニル系重合体としては、該フェノール性水酸基を有する
単位を分子構造中に有する重合体であり、下記一般式C
I)〜(V)の少なくとも1つの構造単位を含む重合体
が好ましい。Furthermore, the vinyl polymer having a phenolic hydroxyl group used in the present invention is a polymer having a unit having a phenolic hydroxyl group in its molecular structure, and has the following general formula C.
Polymers containing at least one structural unit of I) to (V) are preferred.
一般式(I)
一般式〔■〕
(CR+ R! CRs )
COO(A %B−OH
一般式(Ill)
一般式〔■〕
わ
H
一般式(V)
式中、R,及びR6はそれぞれ水素原子、アルキル基又
はカルボキシル基を表し、好ましくは水素原子である。General formula (I) General formula [■] (CR+ R! CRs) COO(A %B-OH General formula (Ill) General formula [■] WaH General formula (V) In the formula, R and R6 are each hydrogen It represents an atom, an alkyl group or a carboxyl group, preferably a hydrogen atom.
R3は水素原子、ハロゲン原子又はアルキル基を表し、
好ましくは水素原子又はメチル基、エチル基等のアルキ
ル基である。R1は水素原子、アルキル基、アリール基
又はアラルキル基を表し、好ましくは水素原子である。R3 represents a hydrogen atom, a halogen atom or an alkyl group,
Preferred is a hydrogen atom or an alkyl group such as a methyl group or an ethyl group. R1 represents a hydrogen atom, an alkyl group, an aryl group or an aralkyl group, preferably a hydrogen atom.
Aは窒素原子又は酸素原子と芳香族炭素原子とを連結す
る、置換基を有してもよいアルキレン基を表し、■は0
〜10の整数を表し、Bは置換基を有してもよいフェニ
レン基又は置換基を有してもよいす7チレン基を表す。A represents an alkylene group that may have a substituent and connects a nitrogen atom or an oxygen atom with an aromatic carbon atom, and ■ is 0
represents an integer of ~10, and B represents a phenylene group that may have a substituent or a 7-tyrene group that may have a substituent.
本発明の感光性組成物に用いられる重合体としては共重
合体型の構造を有するものが好ましく、前記一般式(I
)〜〔v〕でそれぞれ示される構造本位と組合せて用い
ることができる単量体単位としては、例えばエチレン、
プロピレン、インブチレン、ブタジェン、イソプレン等
のエチレン系不飽和オレフィン類、例えばスチレン、α
−メチルスチレン、p・メチルスチレン、p−クロロス
チレン等のスチレン類、例えばアクリル酸、メタクリル
酸等のアクリル酸類、例えばイタコン酸、マレイン酸、
無水マレイン酸等の不飽和脂肪族ジカルボン酸類、例え
ばアクリル酸メチル、アクリル酸エチル、アクリル酸n
−ブチル、アクリル酸イソブチル、アクリル酸ドデシル
、アクリル酸2−クロロエチル、アクリル酸フェニル、
a−クロロアクリル酸メチル、メタクリル酸メチル、メ
タクリル酸エチル、エタクリル酸、エチル等のグーメチ
レン脂肪族モノカルボン噛のエステル類、例えばアクリ
ロニトリル、メタアクリロニトリル等のニトリル類、例
えばアクリルアミド等のアミド類、例えばアクリルアニ
リド、p−クロロアクリルアニリド、I・ニトロアクリ
ルアニリド、−メトキシアクリルアニリド等のアニリド
類、例えば酢酸ビニル、プロピオン酸ビニル、ベンジェ
酸ビニル、酪酸ビニル等のビニルエステル類、例えばメ
チルビニルエーテル、エチルビニルエーテル、イソブチ
ルビニルエーテル、β−クロロエチルビニルエーテル等
のビニルエーテル類、塩化ビニル、ビニリデンクロライ
ド、ビニリデンシアナイド、例えばl・メチルートメト
キシエチレン、1.1−ジメトキシエチレン、1.2−
ジメトキシエチレン、1,1−ジメトキシカルボニルエ
チレン、1−メチル−1・ニトロエチレン等のエチレン
誘導体類、例えばN・ビニルビロール、N・ビニルカル
バゾール、N・ビニルインドール、N・ビニルビロール
ン、N−ビニルビσリドン等のN−ビニル化合物、等の
ビニル系単量体がある。これらのビニル系単量体は不飽
和二重結合が開裂した構造で高分子化合物中に存在する
。The polymer used in the photosensitive composition of the present invention preferably has a copolymer-type structure, and is preferably of the general formula (I
) to [v], which can be used in combination with the structural principles respectively, include, for example, ethylene,
Ethylenically unsaturated olefins such as propylene, imbutylene, butadiene, isoprene, etc., such as styrene, α
- Styrenes such as methylstyrene, p-methylstyrene and p-chlorostyrene; acrylic acids such as acrylic acid and methacrylic acid; e.g. itaconic acid and maleic acid;
Unsaturated aliphatic dicarboxylic acids such as maleic anhydride, such as methyl acrylate, ethyl acrylate, acrylic acid n
-butyl, isobutyl acrylate, dodecyl acrylate, 2-chloroethyl acrylate, phenyl acrylate,
a-Gumethylene aliphatic monocarboxylic esters such as methyl chloroacrylate, methyl methacrylate, ethyl methacrylate, ethacrylic acid, and ethyl; nitrites such as acrylonitrile and methacrylonitrile; amides such as acrylamide; Anilides such as anilide, p-chloroacrylanilide, I-nitroacrylanilide, -methoxyacrylanilide, vinyl esters such as vinyl acetate, vinyl propionate, vinyl benzoate, vinyl butyrate, such as methyl vinyl ether, ethyl vinyl ether, Vinyl ethers such as isobutyl vinyl ether and β-chloroethyl vinyl ether, vinyl chloride, vinylidene chloride, vinylidene cyanide, such as l-methylthomethoxyethylene, 1.1-dimethoxyethylene, 1.2-
Ethylene derivatives such as dimethoxyethylene, 1,1-dimethoxycarbonylethylene, 1-methyl-1-nitroethylene, such as N-vinylpyrrole, N-vinylcarbazole, N-vinylindole, N-vinylvirolne, N-vinylviny There are vinyl monomers such as N-vinyl compounds such as lydone. These vinyl monomers exist in polymer compounds with a structure in which unsaturated double bonds are cleaved.
上記の単量体のうち、脂肪族モノカルボン酸のエステル
類、ニトリル類が本発明の目的に対して優れた性能を示
し、好ましい。Among the above monomers, aliphatic monocarboxylic acid esters and nitriles exhibit excellent performance for the purpose of the present invention and are therefore preferred.
これらの単量体は本発明の重合体中にブロック又はラン
ダムのいずれの状態で結合していてもよい。These monomers may be bound in the polymer of the present invention in either a block or random manner.
本発明に用いられるビニル系重合体の感光性組成物中に
占める割合は0゜5〜70重量%である。The proportion of the vinyl polymer used in the present invention in the photosensitive composition is 0.5 to 70% by weight.
本発明に用いられるビニル系重合体は上記重合体を単独
で用いてもよいし、又2種以上組合せて用いてもよい。As the vinyl polymer used in the present invention, the above-mentioned polymers may be used alone or in combination of two or more.
又、他の高分子化合物等と組合せて用いることもできる
。Moreover, it can also be used in combination with other polymer compounds.
感光性組成物には、露光により可視画像を形成させるプ
リントアウト材料を添加することができる。プリントア
ウト材料は露光により酸もしくは遊離基を生成する化合
物とこれと相互作用を有することによってその色調を変
える有機染料より成るもので露光により酸もしくは遊離
基を生成する化合物としては、例えば特開昭50−36
209号公報に記載の0−ナフトキノンジアジド−4−
スルホン酸ハロゲニド、特開昭53−36223号公報
に記載のトリハロメチル−2−ビaンやトリハロメチル
−トリアジン、特開昭55−6244号公報に記載され
ている。−ナフトキノンジアジド−4−スルホン酸クロ
ライドと電子吸引性置換基を有するフェノール類、また
はアニリン酸とのエステル化合物またはアミド化合物、
特開昭55−77742号、特開昭59−148784
号に記載のハロメチルビニルオキサジアゾール化合物及
びジアゾニウム塩等が挙げられる。A printout material can be added to the photosensitive composition that causes the formation of a visible image upon exposure to light. The printout material is composed of a compound that generates an acid or a free radical when exposed to light, and an organic dye that changes its color tone by interacting with the compound. 50-36
0-Naphthoquinonediazide-4- described in Publication No. 209
Sulfonic acid halogenides, trihalomethyl-2-avian and trihalomethyl-triazine described in JP-A No. 53-36223 and trihalomethyl-triazine, are described in JP-A-55-6244. - an ester compound or amide compound of naphthoquinone diazide-4-sulfonic acid chloride and a phenol having an electron-withdrawing substituent, or anilic acid;
JP-A-55-77742, JP-A-59-148784
Examples include halomethylvinyloxadiazole compounds and diazonium salts described in No.
また前記の有機染料としては、ビクトリアピュアブルー
BO)l (保止ケ谷化学(株)製)、パテントピュア
ブルー(住友三国化学(株)製)、オイルブルー# 6
03 (オリエント化学工業(株)製)、スーダンブル
ーt[(BASE製)、クリスタルバイオレット、マラ
カイトグリーン、ツクシン、メチルバイオレット、エチ
ルバイオレット、メチルオレンジ、ブリリアントグリー
ン、フンゴーレット、エオシン、ローダミン6G等を挙
げることができる。また感光性組成物には上記の素材の
他、必要に応じて可!IJ剤、界面活性剤、有機酸、酸
無水物などを添加することができる。Examples of the organic dyes include Victoria Pure Blue BO) (manufactured by Hodogaya Chemical Co., Ltd.), Patent Pure Blue (manufactured by Sumitomo Mikuni Chemical Co., Ltd.), and Oil Blue #6.
03 (manufactured by Orient Kagaku Kogyo Co., Ltd.), Sudan Blue T [ (manufactured by BASE), crystal violet, malachite green, Tsukusin, methyl violet, ethyl violet, methyl orange, brilliant green, fungolet, eosin, rhodamine 6G, etc. Can be done. In addition to the above materials, the photosensitive composition can be used as needed! IJ agents, surfactants, organic acids, acid anhydrides, etc. can be added.
更に本発明の感光性組成物には、該感光性組成物の感脂
性を向上するために例えば、p−tert・ブチルフェ
ノールホルムアルデヒド樹脂やp−n・オクチルフェノ
ールホルムアルデヒド樹脂や、これらが0・キノンジア
ジド化合物で部分的にエステル化されt;樹脂などを添
加することもできる。Furthermore, in order to improve the oil sensitivity of the photosensitive composition, the photosensitive composition may contain, for example, p-tert-butylphenol formaldehyde resin, p-n-octylphenol formaldehyde resin, or 0-quinonediazide compound. It is also possible to add partially esterified resins and the like.
これらの各成分を下記の溶媒に溶解させ、本発明の支持
体表面に塗布乾燥させることIこより、感光性層を設け
て、本発明の感光性平版印刷版を製造することができる
。The photosensitive lithographic printing plate of the present invention can be produced by dissolving each of these components in the following solvent, coating and drying the solution on the surface of the support of the present invention to provide a photosensitive layer.
本発明の感光性組成物の各成分を溶解する際に使用し得
る溶媒としては、メチルセロンルブ、メチルセロソルブ
アセテート、エチルセロソルブ、メチルセロソルブアセ
テート、ジエチレングリコール七ツメチルエーテル、ジ
エチレングリコールモノエチルエーテル、ジエチレング
リコールジメチルエーテル、ジエチレングリコールメチ
ルエチルエーテル、ジエチレングリコールジエチルエー
テル、ジェチルグリコールモノイソプロビル二一チル、
プロピレングリコール、プロピレングリコールモノメチ
ルエーテルアセテート、フロピレンゲリコールモノエチ
ルエーテルアセテート、プロピレングリコールモノブチ
ルエーテル、シクロピレングリコールモノメチルエーテ
ル、ジプロピレングリコールジメチルエーテル、ジプロ
ピレングリコールメチルエチルエーテル、ギ酸エチル、
ギ酸プロピル、ギ酸ブチ、ル、ギ酸アミル、酢酸メチル
、酢酸エチル、酢酸プロピル、酢酸ブチル、プロピオン
酸メチル、プロピオン酸エチル、酪酸メチル、酪酸エチ
ル、ジメチルホルムアミド、ジメチルスルホキシド、ジ
オキサン、アセトン、メチルエチルケトン、シクロヘキ
サノン、メチルシクロヘキサノン、ジアセトンアルコー
ル、アセチルアセトン、γ−ブチロラクトン等が挙げら
れる。Examples of solvents that can be used to dissolve each component of the photosensitive composition of the present invention include methyl selonlube, methyl cellosolve acetate, ethyl cellosolve, methyl cellosolve acetate, diethylene glycol 7-methyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, Diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, diethyl glycol monoisoprobyl dimonthyl,
Propylene glycol, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether, cyclopylene glycol monomethyl ether, dipropylene glycol dimethyl ether, dipropylene glycol methyl ethyl ether, ethyl formate,
Propyl formate, butylacetate, amyl formate, methyl acetate, ethyl acetate, propyl acetate, butyl acetate, methyl propionate, ethyl propionate, methyl butyrate, ethyl butyrate, dimethylformamide, dimethyl sulfoxide, dioxane, acetone, methyl ethyl ketone, cyclohexanone , methylcyclohexanone, diacetone alcohol, acetylacetone, γ-butyrolactone, and the like.
これら溶媒は、単独或いは2種以上混合して使用するこ
とができる。These solvents can be used alone or in combination of two or more.
本発明に用いられる感光性組成物を支持体表面に塗布す
る際に用いる塗布方法としては、従来公知の方法、例え
ば、回転塗布、ワイヤーバー塗布、デイツプ塗布、エア
ーナイフ塗布、ロール塗布、ブレード塗布及びカーテン
塗布等が可能である。The coating method used in coating the surface of the support with the photosensitive composition used in the present invention includes conventionally known methods, such as spin coating, wire bar coating, dip coating, air knife coating, roll coating, and blade coating. And curtain coating etc. are possible.
この際塗布量は用途により異なるが、例えば固形分とし
て0.05〜5.0g/m”が好ましい。At this time, the coating amount varies depending on the application, but is preferably 0.05 to 5.0 g/m'' in terms of solid content.
こうして得られた感光性平版印刷版の使用に際しては、
従来から常用されている方法が適用され得、例えば線画
像、網点画像などを有する透明原画を感光面に密着して
露光し、次いでこれを適当な現像液を用いて非画像部の
感光性層を除去することによりレリーフ像が得られる。When using the photosensitive lithographic printing plate thus obtained,
Conventional methods can be applied, such as exposing a transparent original image having a line image, halftone image, etc. in close contact with the photosensitive surface, and then using a suitable developer to make the non-image areas photosensitive. By removing the layer a relief image is obtained.
露光に好適な光源としては、水銀灯、メタルハライドラ
ンプ、キセノンランプ、ケミカルランプ、カーボンアー
ク灯などが使用される。As a light source suitable for exposure, a mercury lamp, a metal halide lamp, a xenon lamp, a chemical lamp, a carbon arc lamp, etc. are used.
現像に使用される現像液としてはアルカリ水溶液が好ま
しく、珪酸ナトリウム、珪酸カリウム、水酸化ナトリウ
ム、水酸化カリウム、第三リン酸ナトリウム、第ニリン
酸ナトリウム、炭酸ナトリウム、炭酸カリウムなどの水
溶液のようなアルカリ水溶液がある。このときのアルカ
リ水溶液の濃度は、感光性組成物及びアルカリの種類に
より異なるが、概して0.1〜10!量%の範囲が適当
であり、又酸アルカリ水溶液には必要に応じ界面活性剤
やアルコールなどのような有機溶媒を加えることもでき
る。The developer used for development is preferably an alkaline aqueous solution, such as an aqueous solution of sodium silicate, potassium silicate, sodium hydroxide, potassium hydroxide, tribasic sodium phosphate, dibasic sodium phosphate, sodium carbonate, potassium carbonate, etc. There is an aqueous alkaline solution. The concentration of the alkaline aqueous solution at this time varies depending on the photosensitive composition and the type of alkali, but is generally 0.1 to 10! The amount range is appropriate, and a surfactant or an organic solvent such as alcohol may be added to the acid-alkali aqueous solution as required.
以下に本発明を実施例により具体的に説明するが、本発
明はその要旨を超えない限りこれらの実施例に限定され
るものではない。EXAMPLES The present invention will be specifically explained below using Examples, but the present invention is not limited to these Examples unless the gist thereof is exceeded.
実施例1〜5
支持体−1の作製
厚さO−3+aIMのアルミニウム板(材質1050.
調質H16)を5%苛性ソーダ水溶液中で65℃で1分
間脱脂処理を行った後、水洗し、lO%硝酸水溶液中で
25℃、1分間浸漬し、中和した後水洗した。このアル
ミニウム板を0.3モル/aのMM水溶液中30℃で交
流電流密度50A /dta”で30秒間電電解面化を
行っt;後、5%苛性ソーダ水溶液中で60 ’011
0秒間のデスマット処理を行う。その後20%硫酸溶液
申で温度20℃、電気密度3A/da”、処理時間1分
の条件で陽極酸イヒ処理を行い、更に80″Cの熱水で
20秒間熱水封孔処理した。Examples 1 to 5 Preparation of Support-1 An aluminum plate with a thickness of O-3+aIM (material: 1050.
Tempered H16) was degreased in a 5% caustic soda aqueous solution at 65°C for 1 minute, then washed with water, immersed in a 10% nitric acid aqueous solution at 25°C for 1 minute, neutralized, and then washed with water. This aluminum plate was subjected to electrolytic surface treatment in a 0.3 mol/a MM aqueous solution at 30°C for 30 seconds at an alternating current density of 50 A/dta;
Performs a 0 second desmut process. Thereafter, an anodic acid treatment was performed using a 20% sulfuric acid solution at a temperature of 20° C., an electric density of 3 A/da'', and a treatment time of 1 minute, followed by hot water sealing treatment for 20 seconds with hot water at 80''C.
上記処理を行ったアルミニウム板を1%スルフィン酸ナ
トリウム水溶液中において80℃で30秒間浸漬を行っ
た。水洗後80℃で5分間乾燥した。The aluminum plate subjected to the above treatment was immersed in a 1% aqueous sodium sulfinate solution at 80° C. for 30 seconds. After washing with water, it was dried at 80°C for 5 minutes.
支持体−2,3,4,5の作製
支持体重の作製における1%スルフィン酸ナトリウム水
溶液の代りに下記の水溶液を用いた以外は支持体−1と
すべて同様にして支持体−2,3゜4.5を得た。Preparation of Supports-2, 3, 4, and 5 Supports-2, 3° were prepared in the same manner as Support-1 except that the following aqueous solution was used instead of the 1% sodium sulfinate aqueous solution in the preparation of the support weight. I got 4.5.
支持体−21%スルフィン酸カリウム水溶液tt
3 1%スルフィン酸カルシウム水溶液
// 4 1%スルフィン酸アンモニウム水溶液
tt 5 1%スルフィン酸ニッケル、12感光性
平版印刷版試料I−1の作製
前記のように作製した支持体−1に下記組成の感光性組
成物塗布液(1)をワイヤーバーを用いて塗布し、80
℃で2分間乾燥した。塗布膜厚は2.2g/Is″であ
った。露光は、2kwメタルハライドランブを使用して
8 mL/am”で60秒間照射した。現像は市販現像
液5DR−1(コニカ(株)製)の5倍希釈液を用い、
現像時間30秒、現像温度25℃により行ない平版印刷
版試料i−+を得た。Support - 21% potassium sulfinate aqueous solution tt
3 1% calcium sulfinate aqueous solution // 4 1% ammonium sulfinate aqueous solution Apply the photosensitive composition coating solution (1) using a wire bar,
Dry for 2 minutes at °C. The coating film thickness was 2.2 g/Is''. Exposure was performed using a 2 kW metal halide lamp at 8 mL/am'' for 60 seconds. For development, a 5-fold dilution of commercially available developer 5DR-1 (manufactured by Konica Corporation) was used.
A lithographic printing plate sample i-+ was obtained using a development time of 30 seconds and a development temperature of 25°C.
(感光性組成物塗布液(1)組成)
ノボラック樹脂※A 6.7go
−キノンジアジド化合物※B 1.5g界面
活性剤※CO,2g
ビクトリアピュアブルーBO)]
(床土ケ谷化学(株)製) 0.08g
ハロゲン遊離基を生成する化合物※D O,15g5g
メチルセロソルブ 100■Q感光性平
版印刷版試料I−2,3,4,5の作製支持体−1の代
わりに支持体−2,3,4,5をそれぞれ用いI;ほか
は、前記感光性平版印刷版試料1−1と同様にして感光
性平版印刷版試料I−2,3,4,5を作製した。(Photosensitive composition coating liquid (1) composition) Novolak resin *A 6.7go
-Quinonediazide compound *B 1.5g Surfactant *CO, 2g Victoria Pure Blue BO)] (manufactured by Toko Tsuchigaya Chemical Co., Ltd.) 0.08g
Compound that generates halogen free radicals *D O, 15g5g
Methyl cellosolve 100 ■ Q Preparation of photosensitive lithographic printing plate samples I-2, 3, 4, and 5 Supports -2, 3, 4, and 5 were used in place of support -1; Photosensitive lithographic printing plate samples I-2, 3, 4, and 5 were prepared in the same manner as lithographic printing plate sample 1-1.
これらの試料について、前記感光性平版印刷版1−1の
場合と同様に露光及び現像し平版印刷版試料1−2.3
,4.5を得た。These samples were exposed and developed in the same manner as in the case of photosensitive planographic printing plate 1-1, and planographic printing plate sample 1-2.3 was prepared.
, 4.5 was obtained.
比較例1.2
支持体−6,7の作製
支持体−1の作製における1%スルフィン酸ナトリウム
水溶液の代わりに下記水溶液を用いt:ほかは支持体−
工と同様にして支持体−6,7を得た。Comparative Example 1.2 Preparation of Supports-6 and 7 The following aqueous solution was used instead of the 1% sodium sulfinate aqueous solution in the preparation of Support-1.
Supports 6 and 7 were obtained in the same manner as described above.
支持体−61%硫酸ナトリウム水溶液
支持体−71%酢酸バリウム水溶液
感光性平版印刷版試料I −6,7の作製支持体として
前記支持体−6,7を用いたほかは感光性平版印刷版試
料!−1と同様にして感光性平版印刷版試料I−6,7
を作製した。Support - 61% sodium sulfate aqueous solution Support - 71% barium acetate aqueous solution Preparation of photosensitive lithographic printing plate samples I-6 and 7. Photosensitive lithographic printing plate samples except that the supports 6 and 7 were used as supports. ! Photosensitive lithographic printing plate samples I-6 and 7 in the same manner as -1.
was created.
これらの試料を感光性平版印刷版試料1−1の場合と同
様にして露光及び現像し平版印刷版試料r −6,7を
得た。These samples were exposed and developed in the same manner as in the case of photosensitive lithographic printing plate sample 1-1 to obtain lithographic printing plate samples r-6 and 7.
実施例6〜10
前記支持体−1上に下記組成の感光性組成物塗布液(2
)をホワラーにより塗布し、90℃で1分間乾燥しI;
。塗布膜厚は1.7g/m’であった。これを感光性平
版印刷版試料ll−1とする。Examples 6 to 10 A photosensitive composition coating solution (2) having the following composition was applied onto the support-1.
) was applied with a whirler and dried at 90°C for 1 minute.
. The coating film thickness was 1.7 g/m'. This is designated as photosensitive planographic printing plate sample 11-1.
(感光性組成物塗布液(2)組成)
共重合体※E 5.0gジア
ゾ樹脂※F O,5gジュリ
マーAC−1OL (日本紬薬(株)Il) 0.0
5gビクトリアピュアブルーBOH
(床土ケ谷化学(株)製) 0.1gメ
チルセロソルブ 100■αこの
試料に対し露光は2kwメタルノ1ライドランプを使用
して8鵬W/am”で60秒間照射し、現像は市販現像
液5DN−21(コニカ(株)製)の6倍希釈液を用い
、現像時間20秒、現像温度27°Cで行い、平版印刷
版試料n−iを得た。(Photosensitive composition coating liquid (2) composition) Copolymer *E 5.0g Diazo resin *FO, 5g Jurimer AC-1OL (Nippon Tsumugi Co., Ltd. Il) 0.0
5 g Victoria Pure Blue BOH (manufactured by Toko Tsuchigaya Kagaku Co., Ltd.) 0.1 g Methyl Cellosolve 100 ■α This sample was exposed to light at 8 W/am for 60 seconds using a 2 kW Metal No. 1 Ride lamp, and then developed. Using a 6-fold dilution of commercially available developer 5DN-21 (manufactured by Konica Corp.), development was carried out at a development time of 20 seconds and a development temperature of 27°C to obtain a lithographic printing plate sample n-i.
感光性平版印刷版試料ll−2,3,4,5の作製前記
支持体−2,3,4,5上に、前記感光性組成物塗布液
(2)を感光性平版印刷版試料r1−1と同様にして塗
布し感光性平版印刷版試料■−2゜3.4.5を作製し
た。Preparation of photosensitive lithographic printing plate samples ll-2, 3, 4, 5 The photosensitive composition coating solution (2) was applied onto the supports -2, 3, 4, 5 as photosensitive lithographic printing plate samples r1-. A photosensitive lithographic printing plate sample ■-2°3.4.5 was prepared by coating in the same manner as in 1.
これらの試料について感光性平版印刷版試料■lと同様
に露光及び現像し平版印刷版試料■−2,3,4,5を
得た。These samples were exposed and developed in the same manner as photosensitive lithographic printing plate sample 1 to obtain lithographic printing plate samples 2, 3, 4, and 5.
比較例3.4
前記支持体−6,7の上に前記感光性組成物塗布液(2
)を感光性平版印刷版試料n−tと同様にして塗布し、
感光性平版印刷版試料n−6,7を作製した。Comparative Example 3.4 The photosensitive composition coating liquid (2
) was applied in the same manner as the photosensitive lithographic printing plate sample n-t,
Photosensitive lithographic printing plate samples n-6 and 7 were prepared.
これらの試料について、前記感光性平版印刷版試料n−
tと同様にして露光及び現像し平版印刷版試料I[−6
,7を得た。Regarding these samples, the photosensitive lithographic printing plate sample n-
Lithographic printing plate sample I [-6
,7 was obtained.
※A ノボラック樹脂
フェノールと1−クレゾールとp−クレゾールとホルム
アルデヒドとの共重縮合樹脂(フェノール、■−クレゾ
ール及びp−クレゾールの各々のモル比が2.0 :
4.8 : 3.2、My−6500SMy/Mn=5
.4)※Bo−キノンジアジド化合物
n
※C界面活性剤
エマルゲン120(化工(株)製)
ポリオキシエチレンラウリルエーテル
※D ハロゲン遊離基を生成する化合物2−トリクロロ
メチル−5−(p−メトキシスチリル)−1,3,4−
オキサジアゾール(特開昭54−74728号公報実施
例1に記載の化合物)
※E 共重合体
p−ヒドロキシフェニルメタクリルアミド/アクリロニ
トリル/エチルアクリレート/メタクリル酸−10/
30/ 60/ 6の組成の共重合体Mv=60000
※F ジアゾ樹脂
評価方法
残脂による汚れテスト
前記露光現像条件により得られた平版印刷版に5本(5
m1lX 15c+m)の画像部を形成させる。消去液
(SIR−15、コニカ(株)製)により画像部を消去
した。消去時間を5水準(表1に示す)に分け、そのと
きの消去によるフリンジ汚れを現像インク(SPO−1
コニカ(株)製)盛りをして確認した。*A Novolak resin A copolycondensation resin of phenol, 1-cresol, p-cresol, and formaldehyde (the molar ratio of each of phenol, ■-cresol, and p-cresol is 2.0:
4.8: 3.2, My-6500SMy/Mn=5
.. 4) *Bo-quinonediazide compound n *C surfactant Emulgen 120 (manufactured by Kako Co., Ltd.) Polyoxyethylene lauryl ether *D Compound that generates halogen free radicals 2-trichloromethyl-5-(p-methoxystyryl)- 1,3,4-
Oxadiazole (compound described in Example 1 of JP-A-54-74728) *E Copolymer p-hydroxyphenylmethacrylamide/acrylonitrile/ethyl acrylate/methacrylic acid-10/
Copolymer with a composition of 30/60/6 Mv = 60000 *F Diazo resin evaluation method Stain test due to residual fat 5 (5
An image area of m1lX 15c+m) is formed. The image area was erased using an erasing liquid (SIR-15, manufactured by Konica Corp.). The erasing time is divided into five levels (shown in Table 1), and the fringe stains caused by erasing at that time are treated with developing ink (SPO-1).
This was confirmed using a plate (manufactured by Konica Corporation).
O:良好
△ :消去跡が、現れる (インキは着肉しないが、残
膜が目視で明らかに確認できる)。O: Good △: Erased marks appear (the ink does not adhere, but the residual film is clearly visible).
X :汚れる (インキが着肉する)。X: Smudged (ink adheres to the surface).
耐処理薬品性
上記露光、現像条件により製版したのち、現像インキ盛
り用のインキ (SPO−1コニカ(株)社製、Pl
富士写真フィルム(株)社製)、印刷時に使用するプ
レートクリーナー (UPCABCケミカル社製)Jこ
一定時間浸漬させ、その時の板上の感光層の状況を評価
した。Processing Chemical Resistance After plate making under the above exposure and development conditions, ink for development ink (SPO-1 manufactured by Konica Co., Ltd., Pl.
(manufactured by Fuji Photo Film Co., Ltd.) and a plate cleaner (manufactured by UPCA ABC Chemical Company) J used during printing were immersed for a certain period of time, and the condition of the photosensitive layer on the plate at that time was evaluated.
O:変化なし。O: No change.
Δ:べ夕部表面が浸食される。Δ: The surface of the bed is eroded.
× :べ夕部が剥がれる。×: The base part peels off.
網点再現性
前記方法により得られt二乎版印刷版を印刷機(ハイデ
ルGTO)において、コート紙印刷インキ (東洋イン
キ製造(株)社製二ニーブライト紅)及び浸し水 (S
EU−3,2,5%、コニカ(株)社製)を使用し、印
刷を行なった。印刷物を25@のルーペで網点画像の#
部(#I!点面積率97%)の網点再現を評価しtこ
。Halftone dot reproducibility The Ni-ni-plate printing plate obtained by the above method was injected with coated paper printing ink (Ni-ni-bright red manufactured by Toyo Ink Manufacturing Co., Ltd.) and soaking water (S) in a printing machine (Heidel GTO).
Printing was performed using EU-3.2.5% (manufactured by Konica Corporation). # of the halftone image of the printed matter with a 25@ loupe
Evaluate the halftone reproduction of the area (#I! point area ratio 97%).
.
0 :再現(からみ無し)。0: Reproduction (no entanglement).
× ;再現しない(からみ有り)。× ; Does not reproduce (entanglement occurs).
耐刷性
上記条件の印刷I:おいて印刷物の画像部のベタ部に着
肉不良が現れるが又は非画像部にインキが着肉するまで
印刷を続け、その時の印刷枚数を数え l二 。Printing Durability Printing under the above conditions I: Printing is continued until poor ink adhesion appears in the solid area of the image area of the printed matter or until the ink adheres to the non-image area, and the number of prints is counted at that time.
表
以上の実験結果から、本発明による感光性平版印刷版は
従来の技術によるものに比較して現像処理の残膜による
汚れ及び耐刷力が共に優れていることが分かる。From the experimental results shown in the table above, it can be seen that the photosensitive lithographic printing plates according to the present invention are superior in both staining due to residual film from development processing and printing durability compared to those made by the conventional technology.
本発明によれば、残膜による汚れの発生、及び耐刷力が
共に優れた感光性平版印刷版を得ることができる。According to the present invention, it is possible to obtain a photosensitive lithographic printing plate which is excellent in both the occurrence of stains due to residual film and printing durability.
Claims (1)
フィン酸塩を含む水溶液で処理した後、該表面に感光層
を設けたことを特徴とする感光性平版印刷版。 2)前記のスルフィン酸塩が金属塩又はアンモニウム塩
であることを特徴とする特許請求の範囲第1項記載の感
光性平版印刷版。[Scope of Claims] 1) A photosensitive lithographic printing plate, characterized in that the surface of a pretreated support is treated with an aqueous solution containing sulfinic acid or a sulfinate salt, and then a photosensitive layer is provided on the surface. 2) The photosensitive lithographic printing plate according to claim 1, wherein the sulfinate is a metal salt or an ammonium salt.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3554489A JPH02212846A (en) | 1989-02-14 | 1989-02-14 | Photosensitive planographic printing plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3554489A JPH02212846A (en) | 1989-02-14 | 1989-02-14 | Photosensitive planographic printing plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02212846A true JPH02212846A (en) | 1990-08-24 |
Family
ID=12444672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3554489A Pending JPH02212846A (en) | 1989-02-14 | 1989-02-14 | Photosensitive planographic printing plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02212846A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103625145A (en) * | 2012-08-23 | 2014-03-12 | 温州市华彩印刷器材有限公司 | Treatment technology for thermosensitive positive CTP plate manufacturing substrate |
-
1989
- 1989-02-14 JP JP3554489A patent/JPH02212846A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103625145A (en) * | 2012-08-23 | 2014-03-12 | 温州市华彩印刷器材有限公司 | Treatment technology for thermosensitive positive CTP plate manufacturing substrate |
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