JPH0220338A - Preparation of laminated sheet - Google Patents
Preparation of laminated sheetInfo
- Publication number
- JPH0220338A JPH0220338A JP17160288A JP17160288A JPH0220338A JP H0220338 A JPH0220338 A JP H0220338A JP 17160288 A JP17160288 A JP 17160288A JP 17160288 A JP17160288 A JP 17160288A JP H0220338 A JPH0220338 A JP H0220338A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- impregnated base
- impregnated
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 31
- 239000011888 foil Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 238000000465 moulding Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 15
- 239000011347 resin Substances 0.000 abstract description 15
- 238000000034 method Methods 0.000 abstract description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 6
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 239000011521 glass Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000004744 fabric Substances 0.000 abstract description 3
- 239000000835 fiber Substances 0.000 abstract description 3
- 229910052742 iron Inorganic materials 0.000 abstract description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010425 asbestos Substances 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229930003836 cresol Natural products 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000004745 nonwoven fabric Substances 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 229910052895 riebeckite Inorganic materials 0.000 abstract description 2
- 239000012209 synthetic fiber Substances 0.000 abstract description 2
- 229920002994 synthetic fiber Polymers 0.000 abstract description 2
- 239000004925 Acrylic resin Substances 0.000 abstract 1
- 229920000178 Acrylic resin Polymers 0.000 abstract 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気機器、電子機器、通信機器、計算機器等に
用いられる積層板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a laminate used in electrical equipment, electronic equipment, communication equipment, computing equipment, etc.
積層板に用いられる樹脂含浸基材の基材は長さが紙基材
で約３０００ ｍ 、ガラス布基材で約２０００ ｍあ
シ、巾は約１ｍ強又は２ｍ強あシ、各れも樹脂ワニスを
含浸、乾燥した後、１×１ｍ強又はｌ×２ｍ強になるよ
うに二辺又は四辺を切断して樹脂含浸基材とし、該樹脂
含浸基材と金属箔とを組合せた積層体を積層成形後に１
×１ｍに切断して積層板を得るものであるが、樹脂含浸
基材の切断面から発生する切断粉が積層成形時に金属箔
に外観不良となって発生することは避けられなｈことで
あった。又樹脂含浸基材を所要枚数重ねて積層成形する
と四辺からの放熱のため四辺外縁部は樹脂硬化が遅くな
り、樹脂がパリとなって流出し、得られた積層板の板厚
は中心部よシ四辺外縁部が薄くなることは避けられない
ことであった。The length of the resin-impregnated base material used for the laminate is approximately 3000 m for the paper base material, approximately 2000 m for the glass cloth base material, and approximately 1 m or 2 m wide for the resin-impregnated base material. After impregnating with varnish and drying, cut two or four sides to a size of 1 x 1 m or 1 x 2 m to obtain a resin-impregnated base material, and then create a laminate that combines the resin-impregnated base material and metal foil. 1 after lamination molding
Although the laminate is obtained by cutting the resin-impregnated base material into pieces of 1 m, it is unavoidable that cutting powder generated from the cut surface of the resin-impregnated base material will cause a poor appearance on the metal foil during lamination molding. Ta. Furthermore, when the required number of resin-impregnated base materials are layered and laminated, the resin cures slowly at the outer edges of the four sides due to heat dissipation from the four sides, and the resin turns into flakes and flows out. It was inevitable that the outer edges of the four sides would become thinner.
従来の技術で述べたように端部を切断したままの樹脂含
浸基材をそのまま用いると積層板の板厚精度が低下し、
外観不良率が増加する。本発明は従来の技術における上
述の問題点に鑑みてなされたもので、その目的とすると
ζろは、板厚精度のよい、且つ外観不良のない積層板の
製造方法を提供することにある。As described in the conventional technology, if the resin-impregnated base material with the ends cut is used as is, the thickness accuracy of the laminate will decrease.
Appearance defect rate increases. The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide a method for manufacturing a laminate with good thickness accuracy and no appearance defects.
本発明は切断面を再溶融固化した樹脂含浸基材を所要枚
数重ねた上面及び又は下面に金属箔を配設した積層体を
積層成形することを特徴とする積層板の製造方法のため
、樹脂含浸基材からの切断粉発生がないので外観不良が
なく、且つ樹脂含浸基材四辺からのパリ発生が殆んどな
くなるので板厚精度を向上させることができたもので、
以下本発明の詳細な説明する。The present invention is a method for manufacturing a laminate, which is characterized by laminating and molding a laminate in which a required number of resin-impregnated base materials whose cut surfaces have been remelted and solidified are stacked and metal foil is arranged on the upper and/or lower surfaces. Since there is no cutting powder generated from the impregnated base material, there is no appearance defect, and since there is almost no occurrence of flakes from the four sides of the resin-impregnated base material, the plate thickness accuracy can be improved.
The present invention will be explained in detail below.
本発明に用いる樹脂含浸基材の樹脂としては、フェノー
ル樹脂、クレゾール樹脂、エポキシ樹脂、不飽和ポリエ
ステル樹脂、メラミン樹脂、ポリイミド、ポリブタジェ
ン、ポリアミド、ポリアミドイミド、ポリスルフォン、
ポリフェニレンサルファイド、ポリフェニレンオキサイ
ド、ポリブチレンテレフタレート、ポリエーテルエーテ
ルケトン、弗化樹脂等の単独、変性物、混合物等が用い
られ必要に応じて粘度調整に水、メチルアルコール、ア
セトン、シクロヘキサノン、スチレン等の溶媒を添加し
たもので、基材としてはガラス、アスベスト等の無機繊
維やポリエステル、ポリアミド、ポリビニルアルコール
、アクリル等の有機合成繊維や木綿等の天然繊維からな
る織布、不織布、マット或は紙又はこれらの組合せ基材
等である。上記基材に上記樹脂を含浸、乾燥して得る樹
脂含浸基材の長さ方向及び必要に応じて巾方向両端部を
切断した切断面を電気ゴテ、熱風ヒーター、遠赤外線、
レーザー等で加熱し再溶融固化しておくものである。再
溶融固化は切断面端部よシ内側に２〜１０ｔＩＩが好ま
しい。金属箔としては銅、アルミニウム、鉄、ニッケル
、亜鉛等の単独、合金、複合品からなる金属箔で必要に
応じてその片面に接着剤層を設けておくこともできる。Examples of resins for the resin-impregnated base material used in the present invention include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone,
Polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used, and if necessary, solvents such as water, methyl alcohol, acetone, cyclohexanone, styrene, etc. are used to adjust the viscosity. The base material is woven fabric, non-woven fabric, mat or paper made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and natural fibers such as cotton. It is a combination base material etc. The resin-impregnated base material obtained by impregnating the base material with the resin and drying the resin-impregnated base material is cut at both ends in the length direction and, if necessary, in the width direction, using an electric trowel, a hot air heater, far infrared rays,
It is heated with a laser or the like to re-melt and solidify it. Re-melting and solidification is preferably performed at 2 to 10 tII on the inner side of the cut surface end. The metal foil may be made of copper, aluminum, iron, nickel, zinc, etc. alone, alloy, or composite, and an adhesive layer may be provided on one side of the foil if necessary.
積層成形としては多段プレス法、マルチロール法、ダブ
ルベルト法、真空成形法等が用いられ、特に限定するも
のではない。As the lamination molding, a multi-stage press method, a multi-roll method, a double belt method, a vacuum forming method, etc. are used, and there are no particular limitations.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例１乃至３
エポキシ樹脂（シェル化学株式会社製、品番エピコー）
１００１ ） Ｚｏｏ重量部Ｃ以下単に部と記す）に
対してジシアンジアミド４部、ベンジルジメチルアミン
０．２部、メチルオキシトール１００部ヲ加えてなるエ
ポキシ樹脂フェスに、長さ２０００ ｍ 、巾１１００
ｆｆ、厚み０．２１１のガラス布を乾燥後の樹脂量が団
重量９６（以下単に％と記す）になるように含浸、乾燥
して得た樹脂含浸基材を長さ１０５０ＪＥＩ毎に、巾方
向についても両端部を切断して１０５０＃ｌ・にして、
１０５０ Ｘ １０５０ ＨＨの四辺を切断した樹脂含
浸基材を得た。次に該樹脂含浸基材の切断面を３００℃
の電気ゴテで再溶融固化した後、７枚を重ねその上下面
に厚み０．０３５ ｆｆＯ銅箔を夫々配設してから成形
圧力４０榛り、１６５”Ｑで１２０分間積層成形して厚
み１．６ Ｍの両面鋼張積層板を得た。Examples 1 to 3 Epoxy resin (manufactured by Shell Chemical Co., Ltd., product number Epicor)
1001) An epoxy resin face made by adding 4 parts of dicyandiamide, 0.2 parts of benzyldimethylamine, and 100 parts of methyloxytol to Zoo (weight part C), a length of 2000 m and a width of 1100 m.
ff, a resin-impregnated base material obtained by impregnating and drying a glass cloth with a thickness of 0.211 so that the amount of resin after drying is 96 (hereinafter simply referred to as %), was prepared in the width direction for every 1050 JEI length. Also, cut both ends to make it 1050#l.
A resin-impregnated base material having dimensions of 1050 x 1050 HH cut on four sides was obtained. Next, the cut surface of the resin-impregnated base material was heated to 300°C.
After re-melting and solidifying with an electric trowel, 7 sheets were stacked and 0.035 ffO copper foil was placed on the top and bottom surfaces respectively, and laminated and molded for 120 minutes at a molding pressure of 40 mm and 165"Q to a thickness of 1. A double-sided steel clad laminate of .6M was obtained.
比較例
実施例の樹脂含浸基材の切断面を再溶融固化せずそのま
ま用いた以外は実施例と同様に処理して厚み１．６１１
の両面鋼張積層板を得た。Comparative Example The resin-impregnated base material of Example was treated in the same manner as in Example except that the cut surface of the resin-impregnated base material was used as it was without being remelted and solidified.
A double-sided steel clad laminate was obtained.
実施例及び比較例の積層板の外観不良率、板厚精度は第
１表のようである。Table 1 shows the appearance defect rate and plate thickness accuracy of the laminates of Examples and Comparative Examples.
第 １
表
本発明は上述した如く構成されている。特許請求の範囲
第１項に記載した構成を有する積層板の製造方法におい
ては、外観不良率が低下し、板厚精度が向上する効果を
有している。Table 1 The present invention is constructed as described above. The method for manufacturing a laminate having the structure described in claim 1 has the effect of reducing the appearance defect rate and improving the plate thickness accuracy.
Claims (1)
重ねた上面及び又は下面に金属箔を配設した積層体を積
層成形することを特徴とする積層板の製造方法。(1) A method for producing a laminate, which comprises laminating and molding a laminate in which a required number of resin-impregnated base materials whose cut surfaces have been remelted and solidified are stacked and metal foil is disposed on the upper and/or lower surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17160288A JPH0220338A (en) | 1988-07-08 | 1988-07-08 | Preparation of laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17160288A JPH0220338A (en) | 1988-07-08 | 1988-07-08 | Preparation of laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0220338A true JPH0220338A (en) | 1990-01-23 |
Family
ID=15926210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17160288A Pending JPH0220338A (en) | 1988-07-08 | 1988-07-08 | Preparation of laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0220338A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8002926B2 (en) | 2005-03-22 | 2011-08-23 | Quickstep Technologies Pty Ltd. | Composite tube production |
| US8580176B2 (en) * | 2001-01-25 | 2013-11-12 | Quickstep Technology Pty Ltd. | Method of producing composite or bonded metal components |
| US8741092B2 (en) | 2000-03-03 | 2014-06-03 | Quickstep Technologies Pty Ltd. | Production, forming, bonding, joining and repair systems for composite and metal components |
-
1988
- 1988-07-08 JP JP17160288A patent/JPH0220338A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8741092B2 (en) | 2000-03-03 | 2014-06-03 | Quickstep Technologies Pty Ltd. | Production, forming, bonding, joining and repair systems for composite and metal components |
| US8580176B2 (en) * | 2001-01-25 | 2013-11-12 | Quickstep Technology Pty Ltd. | Method of producing composite or bonded metal components |
| US8002926B2 (en) | 2005-03-22 | 2011-08-23 | Quickstep Technologies Pty Ltd. | Composite tube production |
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