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JPH0220681A - Focusing method for laser beam - Google Patents

Focusing method for laser beam

Info

Publication number
JPH0220681A
JPH0220681A JP63168492A JP16849288A JPH0220681A JP H0220681 A JPH0220681 A JP H0220681A JP 63168492 A JP63168492 A JP 63168492A JP 16849288 A JP16849288 A JP 16849288A JP H0220681 A JPH0220681 A JP H0220681A
Authority
JP
Japan
Prior art keywords
laser beam
cylindrical lens
optical axis
adjusted
focused
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63168492A
Other languages
Japanese (ja)
Inventor
Takeshi Yamamoto
剛 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP63168492A priority Critical patent/JPH0220681A/en
Publication of JPH0220681A publication Critical patent/JPH0220681A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Lasers (AREA)

Abstract

PURPOSE:To focus a laser beam to a regular energy density distribution by allowing the laser beam which is adjusted through a beam diameter adjusting lens group to pass through a cylindrical lens provided so as to be turnable centering around an optical axis. CONSTITUTION:A laser beam 3 which is outputted from a laser oscillator 1 is allowed to pass through a beam diameter adjusting lens group 2 for moving along its optical axis 4 and its diameter is adjusted. Subsequently, the laser beam 3 whose diameter is adjusted is allowed to pass through a cylindrical lens 6 provided so as to be turnable centering around said optical axis 4. As a result, the laser beam 3 is focused to an elliptic shape 7 of a prescribed size. As for this focusing beam of an elliptic shape, its energy density does not go to an irregular multi-mode distribution, and such working as cutting, etc. by a laser beam can be executed exactly. Also, by turning said cylindrical lens 6, working in a desired direction can be executed easily.

Description

【発明の詳細な説明】 〔概要〕 レーザビームを所定の大きさの長円形に集束するレーザ
ビームの集束方法に関し、 レーザビームの集束に際して、エネルギ密度の分布に不
規則な分布が生じることのないようにすることを目的と
し1、 ビーム径調整レンズ群によって調整されたレーザビーム
が入射されるシリンドリカルレンズを光軸を中心に回動
可能に設け、該シリンドリカルレンズを介して該レーザ
ビームを所定の大きさの長円形に集束すると共に、該シ
リンドリカルレンズを必要に応じて回動させることで該
長円形の向きが所定方向に変えられるように構成する。
[Detailed Description of the Invention] [Summary] Regarding a laser beam focusing method for focusing a laser beam into an ellipse of a predetermined size, the present invention relates to a laser beam focusing method that does not cause irregular distribution of energy density when focusing the laser beam. 1. A cylindrical lens into which the laser beam adjusted by the beam diameter adjustment lens group is incident is provided rotatably around the optical axis, and the laser beam is directed to a predetermined position through the cylindrical lens. The light is focused into an oval shape, and the direction of the oval shape can be changed in a predetermined direction by rotating the cylindrical lens as necessary.

〔産業上の利用分野〕[Industrial application field]

本発明はレーザビームを所定の大きさの長円形に集束す
るレーザビームの集束方法に関する。
The present invention relates to a laser beam focusing method for focusing a laser beam into an oval shape of a predetermined size.

電子機器に広く用いられているプリント基板を改造など
によってそのプリント基板のパターン配線を切断する場
合、最近ではレーザビームの照射によることで行われる
When cutting the pattern wiring of a printed circuit board that is widely used in electronic devices due to modification or the like, it is recently done by irradiating the circuit board with a laser beam.

このようなレーザビームの照射はパターン配線の幅より
長い長さで所定の幅を有するようにスリット状に集束さ
れることで切断すべきパターン配線の所定箇所に行われ
、その照射によってパターン配線の切断が行われる。
Irradiation of such a laser beam is performed at a predetermined location of the pattern wiring to be cut by focusing it into a slit shape with a length longer than the width of the pattern wiring and having a predetermined width. A disconnection is made.

したがって、このようなレーザビームの集束は、プリン
ト基板に張架されたパターン配線の切断を容易に行うこ
とができるエネルギ密度が得られるように形成されるこ
とが重要となる。
Therefore, it is important that such a laser beam is focused so as to obtain an energy density that can easily cut the patterned wiring stretched over the printed circuit board.

〔従来の技術〕[Conventional technology]

従来は第3図の従来の構成図に示すように構成されてい
た。第3図の(a)は説明図、(b)は斜視図である。
Conventionally, the configuration was as shown in the conventional configuration diagram shown in FIG. FIG. 3(a) is an explanatory view, and FIG. 3(b) is a perspective view.

第3図の(a)に示すように、レーザ発振器1は励起ラ
ンプICより発光された光がレーザ結晶ユニソ目Bに照
射されることでレーザ結晶ユニットIBより光軸4を有
するレーザビーム3が発生され、更に、レーザ結晶ユニ
ットIBより発生したレーザビームはレーザ結晶ユニッ
I−IBの前後に配設された全反射ミラーIAと、半反
射ミラーIEとによって増幅され、半反射ミラーIE側
からレーザビーム3の出力が行われるように形成されて
いる。
As shown in FIG. 3(a), the laser oscillator 1 generates a laser beam 3 having an optical axis 4 from the laser crystal unit IB by irradiating the laser crystal unit B with light emitted from the excitation lamp IC. The laser beam generated by the laser crystal unit I-B is amplified by a total reflection mirror IA and a half-reflection mirror IE arranged before and after the laser crystal unit I-IB, and the laser beam is emitted from the half-reflection mirror IE side. It is formed so that the output of beam 3 is carried out.

また、このようなレーザビーム3は内設された円形の貫
通穴IFを有するアパーチャIDによって所定の円形の
断面形状となるビーム径りのレーザビームされたパター
ン配線11の所定箇所にレーザビーム3を集束させ、パ
ターン配線11の切断を行う場合は、前述のアパーチャ
IDを幅TIの長さB1のスリソ目2Aが設けられたア
パーチャ12に置換し、スリット12Aの形状に形成さ
れたレーザビーム3八はビーム径調整レンズ群2の凸レ
ンズと凹レンズとの互いの距離間を変えることで幅T2
で長さB2の大きさにする調整が行われていた。
Further, such a laser beam 3 is directed to a predetermined location of the patterned wiring 11 with a beam radius having a predetermined circular cross-sectional shape by an aperture ID having a circular through hole IF provided therein. When converging and cutting the pattern wiring 11, the aperture ID described above is replaced with the aperture 12 provided with the slits 2A having the width TI and the length B1, and the laser beam 38 formed in the shape of the slit 12A is used. The width T2 can be adjusted by changing the distance between the convex lens and the concave lens of the beam diameter adjustment lens group 2.
An adjustment was made to make the length B2.

したがって、幅TIの長さB1のレーザビーム3Aはビ
ーム径調整レンズ群2の調整によって幅T2の長さB2
の長方形13の形状に集束されることが行われていた。
Therefore, the laser beam 3A having the width TI and the length B1 is adjusted by the beam diameter adjusting lens group 2 to have the width T2 and the length B2.
The beams were focused in the shape of a rectangle 13.

この場合、レーザビーム3Aによる照射が切断すべきパ
ターン配線11以外の箇所に行われると、切断の必要の
ないプリント基板10の表面を焼損させることになるた
め、レーザビーム3Aの集束による長さB2はパターン
配線11の幅すより多少大きくなるように集束され、レ
ーザビーム3Aの照射によって幅すのパターン配線11
の切断を行っていた。
In this case, if the laser beam 3A is irradiated to a location other than the pattern wiring 11 to be cut, the surface of the printed circuit board 10 that does not need to be cut will be burned out. is focused to be slightly larger than the width of the pattern wiring 11, and the pattern wiring 11 of the width is focused by irradiation with the laser beam 3A.
The amputation was carried out.

また、パターン配線11の張架方向によって長方形13
の方向を縦または横方向に向きを変えたい場合が生じる
ため、この場合は、パターン配線11の張架方向によっ
てアパーチャ12を矢印Aのように回動させることによ
り長方形13の向きが変えられるように配慮されている
Also, depending on the direction in which the pattern wiring 11 is stretched, the rectangle 13
In this case, the direction of the rectangle 13 can be changed by rotating the aperture 12 in the direction of arrow A depending on the stretching direction of the pattern wiring 11. is taken into consideration.

したがって、ビーム径調整レンズ群2の凸レンズと凹レ
ンズとの互いの間隔を変える矢印C方向のスライドと、
アパーチャ12の矢印A方向の回動とによってパターン
配線11の切断すべき箇所に対して、所定の大きさの長
方形13を形成するようにレーザビーム3Aを調整させ
ることでパターン配線11の所定箇所の切断が行われて
いた。
Therefore, sliding in the direction of arrow C to change the mutual distance between the convex lens and the concave lens of the beam diameter adjustment lens group 2;
By rotating the aperture 12 in the direction of arrow A, the laser beam 3A is adjusted so that a rectangle 13 of a predetermined size is formed at the part of the pattern wiring 11 to be cut. An amputation was taking place.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

通常、このようなレーザ発振器1より出力されるレーザ
ビーム3は第4図の従来のレーザビームのエネルギ分布
グラフの(a)に示すように、所定の位置Sにおける直
径りのレーザビーム3のエネルギ密度Pは中央部ではピ
ークになり、両端では低くなるガウス分布になるよう出
力さる。
Normally, the laser beam 3 output from such a laser oscillator 1 has an energy distribution of the diameter of the laser beam 3 at a predetermined position S, as shown in (a) of the conventional laser beam energy distribution graph in FIG. The density P is output so as to have a Gaussian distribution with a peak at the center and a low density at both ends.

すように、長方形13を形成するとによって、干渉など
によるエネルギの減衰が生じ、レーザビーム3Aのエネ
ルギ密度Pがマルチモード分布となり、不規則な分布と
なる。
By forming the rectangle 13 in this manner, energy attenuation occurs due to interference, etc., and the energy density P of the laser beam 3A becomes a multimode distribution, resulting in an irregular distribution.

したがって、前述のようなようなパターン配線11の切
断に、例えば、Poのエネルギ密度が必要な場合は長方
形13に形成されたレーザビーム3AではPoのエネル
ギ密度が得られない箇所が生じ、パタ−ン配線11を完
全に切断できなくなる問題を有していた。
Therefore, if, for example, the energy density of Po is required to cut the pattern wiring 11 as described above, there will be a portion where the energy density of Po cannot be obtained with the laser beam 3A formed in the rectangular shape 13, and the pattern wiring 11 will be cut. However, there was a problem in that the connection wiring 11 could not be completely cut.

そこで、本発明では、レーザビームの集束に際して、エ
ネルギ密度の分布に不規則な分布が生じることのないよ
うにすることを目的とする。
Therefore, an object of the present invention is to prevent irregular distribution of energy density from occurring when focusing a laser beam.

〔課題を解決するための手段〕[Means to solve the problem]

第1図は本発明の原理説明図である。 FIG. 1 is a diagram explaining the principle of the present invention.

第1図に示すように、ビーム径調整レンズ群によって調
整されたレーザビームが入射されるシリンドリカルレン
ズを光軸を中心に回動可能に設け、該シリンドリカルレ
ンズを介して該レーザビームを所定の大きさの長円形に
集束すると共に、該シリンドリカルレンズを必要に応じ
て回動させることで該長円形の向きが所定方向に変えら
れるように構成する。
As shown in FIG. 1, a cylindrical lens into which the laser beam adjusted by the beam diameter adjustment lens group is incident is provided rotatably around the optical axis, and the laser beam is adjusted to a predetermined size through the cylindrical lens. The light is focused into an oval shape with a diameter of about 100 mm, and the direction of the oval shape can be changed in a predetermined direction by rotating the cylindrical lens as necessary.

このように構成することによって前述の課題は解決され
る。
With this configuration, the above-mentioned problem is solved.

〔作用〕[Effect]

即ち、ビーム径調整レンズ群を透過したレーザビームが
照射されるシリンドリカルレンズを設けることで、レー
ザビームの集束がシリンドリカルレンズによって所定の
向きの長円形に行われるようにしすると共に、集束され
た長円形の向きがシリンドリカルレンズの回動によって
変えることができるように形成したものである。
That is, by providing a cylindrical lens on which the laser beam transmitted through the beam diameter adjustment lens group is irradiated, the laser beam is focused into an oval shape in a predetermined direction by the cylindrical lens, and the focused oval shape is The direction of the cylindrical lens can be changed by rotating the cylindrical lens.

したがって、このようなシリンドリカルレンズによって
集束を行うと、レーザビームのエネルギ密度の分布は、
従来のスリット有するアパーチャによって長方形に形成
した場合のような不規則なマルチモード分布となること
がな(、比較的均一な分布が得られ、前述のようなエネ
ルギ不足によってパターン配線の切断が行われなくなる
ようなこを防ぐことができる。
Therefore, when focusing is performed using such a cylindrical lens, the energy density distribution of the laser beam is
Unlike the case of forming a rectangular aperture with a conventional slit aperture, an irregular multi-mode distribution is not obtained (a relatively uniform distribution is obtained, and the pattern wiring is not cut due to the lack of energy as described above). You can prevent it from disappearing.

〔実施例〕〔Example〕

以下本発明を第2図を参考に詳細に説明する。 The present invention will be explained in detail below with reference to FIG.

第2図は本発明による一実施例の説明図で(a)は斜視
図、(b)はレーザビームのエネルギ分布グラフである
。全図を通じて、同一符号は同一対象物を示す。
FIG. 2 is an explanatory diagram of an embodiment according to the present invention, in which (a) is a perspective view and (b) is an energy distribution graph of a laser beam. The same reference numerals indicate the same objects throughout the figures.

第2図の(a)に示すように、レーザ発振器1より出力
される直径りのレーザビーム3が移動機構8によって移
動されるビーム径調整レンズ群2と回動機構9によって
回動されるシリンドリカルレンズ6によって長円形7に
集束され、集束された長円形7によってプリント基板1
0のパターン配線11の照射が行われるように構成した
ものである。
As shown in FIG. 2(a), a laser beam 3 having a diameter output from a laser oscillator 1 is moved by a beam diameter adjusting lens group 2 by a moving mechanism 8, and a cylindrical lens is rotated by a rotating mechanism 9. It is focused into an oval 7 by the lens 6, and the printed circuit board 1 is focused by the focused oval 7.
The structure is such that 0 pattern wiring 11 is irradiated.

また、移動機構8はモータ8Aの駆動によってギヤ8B
を介して移動体8Cが回転され、ガイド棒8Dが移動体
8Cの外周に設けられたヘリカル溝8Eに沿って移動す
ることで、移動体8Cに収納されたビーム径調整レンズ
群2を光軸4に沿って矢印C方向にスライドさせ、シリ
ンドリカルレンズ6とパターン配線11との距離の移動
を行うように形成され、回動機構9はモータ9Aの駆動
によってギヤ9Bを介して回転体9Cが回転され、回転
体9Cに収納されたシリンドリカルレンズ6を光軸4を
中心に矢印A方向に回転させるように形成さている。
Further, the moving mechanism 8 is driven by the gear 8B by the drive of the motor 8A.
The moving body 8C is rotated through the moving body 8C, and the guide rod 8D moves along the helical groove 8E provided on the outer periphery of the moving body 8C, thereby aligning the beam diameter adjustment lens group 2 housed in the moving body 8C with the optical axis. 4 in the direction of arrow C to move the distance between the cylindrical lens 6 and the pattern wiring 11, and the rotation mechanism 9 rotates the rotating body 9C via the gear 9B by driving the motor 9A. The cylindrical lens 6 housed in the rotating body 9C is rotated in the direction of arrow A around the optical axis 4.

更に、移動機構8と回動機構9との間にはスラストベア
リング14が設けられ、互いの回動が自在に行われるよ
うに形成されている。
Furthermore, a thrust bearing 14 is provided between the moving mechanism 8 and the rotation mechanism 9, and is formed so that they can rotate freely with respect to each other.

この場合、照射する長円形7はビーム径調整レンズ群2
によって調整された所定のビーム径が、更に、シリンド
リカルレンズ6によって集束されることになるため、長
円形7の長手方向の大きさはビーム径調整レンズ群2に
よって調整され、幅方向の大きさは矢印C方向のスライ
ドによってシリンドリカルレンズ6の焦点に近づけるこ
とで狭く、また、遠くすることで広げ、所定の幅に集束
させることができる。
In this case, the ellipse 7 to be irradiated is the beam diameter adjusting lens group 2.
Since the predetermined beam diameter adjusted by is further focused by the cylindrical lens 6, the lengthwise size of the oval 7 is adjusted by the beam diameter adjusting lens group 2, and the widthwise size is By sliding in the direction of arrow C, the focal point of the cylindrical lens 6 can be brought closer to the focal point of the cylindrical lens 6, and by moving it further away, it can be widened and focused to a predetermined width.

そこで、プリント基板10の張架されたパターン配線1
1に長円形7が直交するように回動機構9によってシリ
ンドリカルレンズ6を回動させ、移動機構8によってビ
ーム径調整レンズ群2をスライドさせ、所定の幅Bの長
円形7が形成されるようにレーザビーム3の調整を行う
ことができる。
Therefore, the stretched pattern wiring 1 of the printed circuit board 10
The rotating mechanism 9 rotates the cylindrical lens 6 so that the oval 7 is perpendicular to the cylindrical lens 1, and the moving mechanism 8 slides the beam diameter adjustment lens group 2 so that an oval 7 with a predetermined width B is formed. The laser beam 3 can be adjusted accordingly.

したがって、長円形7に調整されたレーザビーム3をパ
ターン配線11に照射することで、切断箇所11Aに示
す切断を行うことができる。
Therefore, by irradiating the pattern wiring 11 with the laser beam 3 adjusted to have an oval shape 7, the cutting shown at the cutting location 11A can be performed.

この場合、シリンドリカルレンズ6によって幅ピークと
なり、理想とするエネルギ密度の分布であるガウス分布
が得られる。
In this case, a width peak is created by the cylindrical lens 6, and a Gaussian distribution, which is an ideal energy density distribution, is obtained.

したがって、このようにシリンドリカルレンズ6による
構成によって幅Bの長円形7に集束されたレーザビーム
3では全ての箇所でパターン配線11を切断するのに必
要なエネルギ密度P0が得られ、長円形7に集束された
レーザビーム3の照射によってパターン配線11を完全
に切断させることができる。
Therefore, the laser beam 3 focused on the oval 7 of width B by the configuration of the cylindrical lens 6 has the energy density P0 necessary to cut the pattern wiring 11 at all locations, and the laser beam 3 is focused on the oval 7 of width B. The pattern wiring 11 can be completely cut by irradiation with the focused laser beam 3.

〔発明の効果〕〔Effect of the invention〕

\ 以上説明したように、本発明によれば、シリンドリカル
レンズによって長円形に、しかも、その長円形の向きを
自在に変えるようにレーザビームを集束することができ
、その集束されたレーザビームはエネルギ密度の分布が
均一な分布にすることができる。
\ As explained above, according to the present invention, a laser beam can be focused into an ellipse using a cylindrical lens, and the direction of the ellipse can be freely changed, and the focused laser beam has energy. The density distribution can be made uniform.

したがって、従来のようなスリットを有するアパーチャ
を用いることでエネルギ密度の分布が不規則となことは
防げ、パターン配線の切断に際して、切断が不完全とな
ることが避けられ、パターン配線の切断を確実に行うこ
とができ、実用的効果は大である。
Therefore, by using an aperture with a slit like the conventional one, it is possible to prevent the energy density distribution from becoming irregular, and when cutting the pattern wiring, it is possible to avoid incomplete cutting, and to ensure that the pattern wiring is cut. This can be done in many ways and has great practical effects.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の原理説明図。 第2図は本発明による一実施例の説明図で、(a)は斜
視図、(b)はレーザビームのエネルギ分布グラフ。 第3図は従来の構成図。 第4図は従来のレーザビームのエネルギ分布グラフを示
す。 図において、 1はレーザ発振器。 2はビーム径調整レンズ群。 3.3Aはレーザビーム。 4は光軸。 6はシリンドリカルレンズ。 7は長円形を示す。 木f:明によう一実)5例の言え甥! 第 2 m と濃1) ル −ゾづC坂碧ま 徒/1./)購入図 第3m 木全萌を二よろ一賞方ヒ弁慟言之明図(’fの2)−5
位L (a) 一5位I 0時
FIG. 1 is a diagram explaining the principle of the present invention. FIG. 2 is an explanatory diagram of an embodiment according to the present invention, in which (a) is a perspective view and (b) is an energy distribution graph of a laser beam. FIG. 3 is a conventional configuration diagram. FIG. 4 shows an energy distribution graph of a conventional laser beam. In the figure, 1 is a laser oscillator. 2 is a beam diameter adjustment lens group. 3.3A is a laser beam. 4 is the optical axis. 6 is a cylindrical lens. 7 indicates an oval shape. Tree f: Akira Yo Kazumi) 5 cases of nephew! 2nd m and dark 1) Ruzozu C Saka Ao Makuto/1. /)Purchase drawing No. 3m Kimata Moe wo niyoroichisho Kata Hibenkyo no Meizu ('f 2)-5
Place L (a) 15th place I 0 o'clock

Claims (1)

【特許請求の範囲】 レーザビーム(3)を出力するレーザ発振器(1)と、
該レーザビーム(3)の光軸(4)に沿って移動し、該
レーザビームの径を調整するビーム径調整レンズ群(2
)とを備え、該レーザビーム(3)を所定箇所に集束さ
せるレーザビームの集束方法において、 前記ビーム径調整レンズ群(2)によって調整された前
記レーザビーム(3)が入射されるシリンドリカルレン
ズ(6)を前記光軸(4)を中心に回動可能に設け、該
シリンドリカルレンズ(6)を介して該レーザビーム(
3)を所定の大きさの長円形(7)に集束すると共に、
該シリンドリカルレンズ(6)を必要に応じて回動させ
ることで該長円形(7)の向きが所定方向に変えられる
ことを特徴とするレーザビームの集束方法。
[Claims] A laser oscillator (1) that outputs a laser beam (3);
a beam diameter adjustment lens group (2) that moves along the optical axis (4) of the laser beam (3) and adjusts the diameter of the laser beam;
), the laser beam focusing method comprises: a cylindrical lens ( 6) is provided to be rotatable around the optical axis (4), and the laser beam (
3) into an oval (7) of a predetermined size,
A method for focusing a laser beam, characterized in that the direction of the oval (7) can be changed in a predetermined direction by rotating the cylindrical lens (6) as necessary.
JP63168492A 1988-07-05 1988-07-05 Focusing method for laser beam Pending JPH0220681A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63168492A JPH0220681A (en) 1988-07-05 1988-07-05 Focusing method for laser beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63168492A JPH0220681A (en) 1988-07-05 1988-07-05 Focusing method for laser beam

Publications (1)

Publication Number Publication Date
JPH0220681A true JPH0220681A (en) 1990-01-24

Family

ID=15869091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63168492A Pending JPH0220681A (en) 1988-07-05 1988-07-05 Focusing method for laser beam

Country Status (1)

Country Link
JP (1) JPH0220681A (en)

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US5968383A (en) * 1992-06-26 1999-10-19 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus having beam expander
US6002101A (en) * 1992-06-26 1999-12-14 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device by using a homogenized rectangular laser beam
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US5410123A (en) * 1992-10-22 1995-04-25 Rancourt; Yvon Process and apparatus for welding annular bellows
US5478983A (en) * 1992-10-22 1995-12-26 Rancourt; Yvon Process and apparatus for welding or heat treating by laser
EP0594210A1 (en) * 1992-10-23 1994-04-27 Mitsui Petrochemical Industries, Ltd. Method and apparatus for welding material by laser beam
US5624585A (en) * 1992-10-23 1997-04-29 Mitsui Petrochemical Industries, Ltd. Method and apparatus for welding material by laser beam
US6159777A (en) * 1993-02-04 2000-12-12 Semiconductor Energy Laboratory Co., Ltd. Method of forming a TFT semiconductor device
US6229115B1 (en) * 1997-05-30 2001-05-08 Hauni Maschinenbau Ag Method of and apparatus in a filter tipping machine for manipulating in a web
WO2003004213A1 (en) 2001-07-03 2003-01-16 L'air Liquide, Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and installation for laser welding with an ar/he gas mixture, the ar/he content being controlled according to the laser power
JP2003158086A (en) * 2001-09-10 2003-05-30 Semiconductor Energy Lab Co Ltd Laser processor
US7682949B2 (en) 2001-09-10 2010-03-23 Semiconductor Energy Laboratory Co., Ltd. Laser treatment device, laser treatment method, and semiconductor device fabrication method
EP1371446A1 (en) 2002-06-14 2003-12-17 L'Air Liquide S. A. à Directoire et Conseil de Surveillance pour l'Etude et l'Exploitation des Procédés Georges Claude Use helium/nitrogen gas mixtures in laser welding of abutted flanks
WO2007010810A1 (en) * 2005-07-15 2007-01-25 Matsushita Electric Industrial Co., Ltd. Laser processing apparatus and method for adjusting same
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