JPH02164857A - New halogenated aromatic diamine and production thereof - Google Patents
New halogenated aromatic diamine and production thereofInfo
- Publication number
- JPH02164857A JPH02164857A JP63317368A JP31736888A JPH02164857A JP H02164857 A JPH02164857 A JP H02164857A JP 63317368 A JP63317368 A JP 63317368A JP 31736888 A JP31736888 A JP 31736888A JP H02164857 A JPH02164857 A JP H02164857A
- Authority
- JP
- Japan
- Prior art keywords
- halogenated aromatic
- group
- aromatic diamine
- formula
- different
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000004984 aromatic diamines Chemical class 0.000 title claims description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 150000001875 compounds Chemical class 0.000 claims abstract description 16
- -1 PREPARATION:Halogenated aromatic diol Chemical class 0.000 claims abstract description 14
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052794 bromium Inorganic materials 0.000 claims abstract description 13
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 7
- 239000001294 propane Substances 0.000 claims abstract description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims abstract description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 6
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 claims abstract description 5
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims abstract description 5
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000002798 polar solvent Substances 0.000 claims abstract description 4
- 229910000104 sodium hydride Inorganic materials 0.000 claims abstract description 4
- 239000012312 sodium hydride Substances 0.000 claims abstract description 4
- PWKNBLFSJAVFAB-UHFFFAOYSA-N 1-fluoro-2-nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1F PWKNBLFSJAVFAB-UHFFFAOYSA-N 0.000 claims abstract description 3
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 claims abstract 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 12
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 12
- 239000003054 catalyst Substances 0.000 claims description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 6
- 239000000460 chlorine Substances 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 5
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 229910000288 alkali metal carbonate Inorganic materials 0.000 claims description 2
- 150000008041 alkali metal carbonates Chemical class 0.000 claims description 2
- 229910000102 alkali metal hydride Inorganic materials 0.000 claims description 2
- 150000008046 alkali metal hydrides Chemical class 0.000 claims description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 3
- 150000001879 copper Chemical class 0.000 claims 2
- XVIRIXVOLLJIPF-UHFFFAOYSA-N 1-nitro-2-(2-nitrophenoxy)benzene Chemical compound [O-][N+](=O)C1=CC=CC=C1OC1=CC=CC=C1[N+]([O-])=O XVIRIXVOLLJIPF-UHFFFAOYSA-N 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 abstract description 20
- 229920000647 polyepoxide Polymers 0.000 abstract description 20
- 239000002994 raw material Substances 0.000 abstract description 10
- 239000003063 flame retardant Substances 0.000 abstract description 8
- 229920001721 polyimide Polymers 0.000 abstract description 8
- 239000004952 Polyamide Substances 0.000 abstract description 7
- 229920003192 poly(bis maleimide) Polymers 0.000 abstract description 7
- 229920002647 polyamide Polymers 0.000 abstract description 7
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 abstract description 5
- 239000004642 Polyimide Substances 0.000 abstract description 5
- 125000003277 amino group Chemical group 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 abstract description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 abstract description 2
- 239000000654 additive Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 14
- 239000000047 product Substances 0.000 description 12
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000005452 bending Methods 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- UMHONZRLRAFUHT-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3,5-dibromophenyl]propan-2-yl]-2,6-dibromophenoxy]aniline Chemical compound C=1C(Br)=C(OC=2C=CC(N)=CC=2)C(Br)=CC=1C(C)(C)C(C=C1Br)=CC(Br)=C1OC1=CC=C(N)C=C1 UMHONZRLRAFUHT-UHFFFAOYSA-N 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 150000004985 diamines Chemical class 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- MWAGUKZCDDRDCS-UHFFFAOYSA-N 1-nitro-4-(4-nitrophenoxy)benzene Chemical compound C1=CC([N+](=O)[O-])=CC=C1OC1=CC=C([N+]([O-])=O)C=C1 MWAGUKZCDDRDCS-UHFFFAOYSA-N 0.000 description 2
- RVHUMFJSCJBNGS-UHFFFAOYSA-N 2-[2,6-dibromo-4-[2-[3,5-dibromo-4-(2-hydroxyethoxy)phenyl]propan-2-yl]phenoxy]ethanol Chemical compound C=1C(Br)=C(OCCO)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(OCCO)C(Br)=C1 RVHUMFJSCJBNGS-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- UGNSMKDDFAUGFT-UHFFFAOYSA-N 4,4-dimethyl-2-phenyl-5h-1,3-oxazole Chemical compound CC1(C)COC(C=2C=CC=CC=2)=N1 UGNSMKDDFAUGFT-UHFFFAOYSA-N 0.000 description 1
- ABQAWYPFZVJRGM-UHFFFAOYSA-N 4-phenoxybenzene-1,3-diamine Chemical class NC1=CC(N)=CC=C1OC1=CC=CC=C1 ABQAWYPFZVJRGM-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 101150041968 CDC13 gene Proteins 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000001836 Firesetting Behavior Diseases 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical class C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000012043 crude product Substances 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000010813 municipal solid waste Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/52—Improvements relating to the production of bulk chemicals using catalysts, e.g. selective catalysts
Landscapes
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Epoxy Resins (AREA)
- Catalysts (AREA)
- Polyamides (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、反応型難燃剤あるいはエポキシ樹脂硬化剤と
して廟用で、かつポリアミド、ポリイミド、ビスイミド
などの原材料としても有用である新規なハロゲン化芳香
族ジアミンとその製造方法に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention is a novel halogenated compound which is useful as a reactive flame retardant or an epoxy resin curing agent, and is also useful as a raw material for polyamide, polyimide, bisimide, etc. This invention relates to aromatic diamines and their production methods.
(従来技術)
臭素や塩素を含有する化合物は、高分子化合物に耐炎性
を付与するための難燃剤としてよく用いられる。また複
数のアミノ基を持つジアミン類は、銅張按層板および繊
維強化用などのエポキシ樹脂の硬化剤やポリアミド、ポ
リイミド、ビスイミドなどの原材料として使用される。(Prior Art) Compounds containing bromine or chlorine are often used as flame retardants to impart flame resistance to polymeric compounds. Furthermore, diamines having multiple amino groups are used as curing agents for epoxy resins used in copper-clad laminates and fiber reinforcement, and as raw materials for polyamides, polyimides, bisimides, and the like.
。
従来、臭素や塩素などのハロゲン元素を含むハロゲン化
芳香族ジアミンとしては数種類の化合物が知られており
、難燃性、耐熱性、耐吸湿性などを向−ヒさせるために
エポキシ樹脂硬化剤やポリアミドなどの原材料に使用さ
れている。. Conventionally, several types of compounds have been known as halogenated aromatic diamines containing halogen elements such as bromine and chlorine, and they are used as epoxy resin curing agents and in order to improve flame retardancy, heat resistance, moisture absorption resistance, etc. Used in raw materials such as polyamide.
エポキシ樹脂用の硬化剤としては、特公昭49−238
4.0号公報に示されるエポキシ樹脂組成物や特開昭6
2−277435号公報に示されるエポキシ樹脂プリプ
レグの硬化剤のようなジアミノジフェニルメタン型のハ
ロゲン化芳香族ジアミンがあるが、核置換のハロゲン元
素がアミノ基に近接しているために反応性は低い。As a hardening agent for epoxy resin, Japanese Patent Publication No. 49-238
Epoxy resin compositions disclosed in Publication No. 4.0 and JP-A-6
There is a diaminodiphenylmethane type halogenated aromatic diamine such as the curing agent for epoxy resin prepreg shown in Japanese Patent No. 2-277435, but the reactivity is low because the halogen element of the nuclear substitution is close to the amino group.
また、エポキシ樹脂硬化物の接着性や耐衝撃性を向」ニ
させるためには、硬化物に可撓性を付与できるようなジ
アミンが用いられる。例えば、特開昭58−8639号
公報に示されている難燃性エポキシ樹脂銅張積層板用ワ
ニスでは、耐熱性と接着性をともに改善する硬化剤とし
て、式[III ]で表わされるエーテル結合を有する
2、2−ビス[4−(4−アミノフェノキシ)−3,5
−ジブロモフェニル]プロパンがある。Further, in order to improve the adhesion and impact resistance of a cured epoxy resin product, a diamine that can impart flexibility to the cured product is used. For example, in the flame-retardant epoxy resin varnish for copper-clad laminates disclosed in JP-A-58-8639, an ether bond represented by the formula [III] is used as a curing agent to improve both heat resistance and adhesion. 2,2-bis[4-(4-aminophenoxy)-3,5
-dibromophenyl]propane.
また、特開昭62−36422号公報に示されている繊
維強化プリプレグ用のエポキシ樹脂では、耐熱性をあま
り損なうことなく耐衝撃性を大幅に向上させる硬化剤と
して、式[IV ]・・・ [rV]
で表されるエーテル結合の他にエチレンオキシド鎖も持
つハロゲン化芳香族ジアミンがある。Furthermore, in the epoxy resin for fiber-reinforced prepreg disclosed in JP-A-62-36422, the formula [IV]... [rV] There are halogenated aromatic diamines that also have an ethylene oxide chain in addition to the ether bond.
ポリアミド樹脂の原材料としては、特開昭495989
8号に示されている自己消火性芳香族ポリアミドのハロ
ゲン化2.4−ジアミノジフェニルエーテルがあるが、
ビスイミドやポリイミド系樹脂で耐熱性と+iJ撓性に
ともに優れた硬化物を得るためには、主鎖にエーテル結
合を持つ芳香族ジアミンが用いられる。As a raw material for polyamide resin, Japanese Patent Application Laid-Open No. 495989
There is a halogenated 2,4-diaminodiphenyl ether of self-extinguishing aromatic polyamide shown in No. 8.
In order to obtain a cured product of bisimide or polyimide resin that has excellent heat resistance and +iJ flexibility, aromatic diamines having an ether bond in the main chain are used.
例えば、特公昭63−17081号公報に示されている
耐熱性ビスイミド系樹脂組成物、特公昭6 :3 37
786号公報に示されているエーテルイミド系化合物、
特開昭58−.105953号公報に示されているエー
テルシアナミド系化合物、特開昭63−172766号
公報に示されているポリエーテルアミドイミド重合体組
成物、特公昭63−205322号公報に示されている
ポリアミドゴミl−シリコーン重合体などには、原材料
の芳香族ジアミンとして、前出の式[+1[]を有する
2、2−ビス[4−(4−アミノフェノキシ)=3.5
−ジブロモフェニル]プロパンが例示されている。For example, the heat-resistant bisimide resin composition disclosed in Japanese Patent Publication No. 63-17081, Japanese Patent Publication No. 63-17081: 337
Etherimide compounds shown in Publication No. 786,
Japanese Unexamined Patent Publication No. 58-. Ether cyanamide compounds disclosed in Japanese Patent Publication No. 105953, polyether amide imide polymer compositions disclosed in Japanese Patent Publication No. 172766/1983, polyamide trash l disclosed in Japanese Patent Publication No. 205322/1983 - For silicone polymers, etc., 2,2-bis[4-(4-aminophenoxy) having the above formula [+1[] = 3.5
-dibromophenyl]propane is exemplified.
(発明が解決しようとする課題)
式[In ]で表される2、2−ビス[4−(4−アミ
ノフェノキシ)−3,5−ジブロモフェニル]プロパン
をエポキシ樹脂硬化剤に用いた場合、エーテル結合が4
人されるため硬化物には若干は可接性が付与されている
が、いまだ不十分であり、銅箔との接着性において満足
できる特性が得られないという問題点があった。(Problems to be Solved by the Invention) When 2,2-bis[4-(4-aminophenoxy)-3,5-dibromophenyl]propane represented by the formula [In] is used as an epoxy resin curing agent, 4 ether bonds
Although some adhesion properties have been imparted to the cured product due to human adhesion, it is still insufficient and there is a problem in that satisfactory adhesion properties with copper foil cannot be obtained.
また、式[IV]で表される主鎖にエーテル結合の他に
エチレンオキシド鎖も持つハロゲン化芳香族ジアミンの
場合は、耐衝撃性は十分であるが、末端のアミノフェノ
キシ基がエステル結合で結合しているため耐熱性か低下
するという問題点があった。In addition, in the case of a halogenated aromatic diamine having an ethylene oxide chain in addition to an ether bond in the main chain represented by formula [IV], the impact resistance is sufficient, but the terminal aminophenoxy group is bonded with an ester bond. Because of this, there was a problem that the heat resistance deteriorated.
ビスイミドやポリイミド系樹脂の原材料の場合も同様に
、式[II+ ]で表される2、2−ビス[4(4−ア
ミノフェノキシ)−3,5−ジブロモフェニル]プロパ
ンを用いると、耐熱性は優れているものの、可接性がい
まだ不1分なために依然として強靭性のない脆い材料に
なるという問題点があった。Similarly, in the case of raw materials for bisimide and polyimide resins, when 2,2-bis[4(4-aminophenoxy)-3,5-dibromophenyl]propane represented by the formula [II+] is used, the heat resistance is Although it is excellent, there is still a problem that it is still a brittle material with no toughness due to insufficient adhesion.
本発明は、エポキシ樹脂の硬化剤として使用した場合や
ビスイミドあるいはポリイミド系樹脂の原材料に用いた
場合に、それらに十分な可続性を=7−
付与することができる新規な化合物を提供するものであ
る。The present invention provides a novel compound that can impart sufficient fusibility to epoxy resins when used as a curing agent or as a raw material for bisimide or polyimide resins. It is.
(課題を解決するための手段)
本発明が示す新規なハロゲン化芳香族ジアミンは、−放
入[1]
%式%[]
(式中、X、〜X、のうち少なくとも一つは塩素または
臭素を示し、互いに異なっていてもよい。(Means for Solving the Problems) The novel halogenated aromatic diamine shown by the present invention has a -release[1]% formula%[] (wherein at least one of Indicates bromine and may be different from each other.
R、およびR2は水素、メチル基、エチル基、トリフル
オロメチル基またはトリクロロメチル基を示し、互いに
同しであっても異なってもよい。Iは1〜3の整数を示
す。)で表されるハロゲン化芳香族ジアミンである。R and R2 represent hydrogen, a methyl group, an ethyl group, a trifluoromethyl group, or a trichloromethyl group, and may be the same or different. I represents an integer of 1 to 3. ) is a halogenated aromatic diamine.
さらに本発明は、−放入[11]
%式%
(式中、X、〜X4のうち少なくとも一つは塩素または
臭素を示し、互いに異なっていてもよい。Furthermore, the present invention provides -Release[11]%Formula% (wherein, at least one of X and ~X4 represents chlorine or bromine, and may be different from each other.
R、およびR2は水素、メチル基、エチル基、1〜リフ
ルオロメチル基または1〜リクロロメチル基を示し、互
いに同じであっても異なってもよい。nは1〜3の整数
を示す。)で表されるハロゲン化芳香族ジオールとニト
ログロロベンゼンまたはニトロフルオロベンゼンを、非
プロトン性極性溶媒中で塩基性触媒を用いて反応させる
ことより、当該ハロゲン化芳香族ジオールのビス(二1
−口フェニルエーテル)化物を合成し、ついでその二I
〜ロ基をアミン基に還元することを特徴とする、前記−
放入[1]で表されるハロゲン化芳香族ジアミンの製造
方法にある。R and R2 represent hydrogen, a methyl group, an ethyl group, a 1-lifluoromethyl group, or a 1-lichloromethyl group, and may be the same or different from each other. n represents an integer of 1 to 3. ) and nitroglolobenzene or nitrofluorobenzene using a basic catalyst in an aprotic polar solvent, the bis(21
- phenyl ether) compound, and then the second I
- The above-mentioned - characterized in that the ~ro group is reduced to an amine group.
A method for producing a halogenated aromatic diamine represented by [1].
本発明者らは、前記−放入[n ]で表されるハロゲン
化芳香族ジオールが適当な塩基性触媒を用いてアルコラ
−1〜にすることにより、ハロゲン化ベンゼン化合物と
容易に反応して該当するフェニルエーテル化物を与える
ことを見いたし、新規なハロゲン化芳香族ジアミンを発
明するに至った。The present inventors have discovered that the halogenated aromatic diol represented by the above-mentioned -rho [n] can easily react with a halogenated benzene compound by converting it into alcohola-1~ using an appropriate basic catalyst. We found that the corresponding phenyl ether compound could be obtained, and we came to invent a new halogenated aromatic diamine.
本発明のハロゲン化芳香族ジアミンは、−放火[1]に
おいてI)の値の増加とともに可撓性を付与する効果が
大きくなるが、4以上になると耐熱性が損なわれてしま
うので好ましくない。In the halogenated aromatic diamine of the present invention, the effect of imparting flexibility becomes greater as the value of I) in -arson [1] increases, but when it is 4 or more, heat resistance is impaired, which is not preferable.
本発明の製造方法における非プロI・ン性極性溶媒は、
特にその種類を限定しないが、生成するアルコラードア
ニオンを安定化する必要があり、般にはN、N−ジメチ
ルホルムアミド、N、N−ジメチルアセトアミド、ジメ
チルスルホキシド、N−メチルピロリドン、ヘキサメチ
ルホスホリックトリアミドおよびテトラヒ1くロフラン
などが用いられる。当然ながら、反応時間を短縮するに
は高沸点の溶媒が有利であり、N−メチルピロリドンお
よびヘキサメチルホスホリックトリアミドが好ましい。The nonprone polar solvent in the production method of the present invention is
Although the type is not particularly limited, it is necessary to stabilize the generated alcoholade anion, and in general, N,N-dimethylformamide, N,N-dimethylacetamide, dimethylsulfoxide, N-methylpyrrolidone, hexamethylphosphoric acid is used. Triamides, tetrahydrofurans, and the like are used. Naturally, high-boiling solvents are advantageous in order to shorten the reaction time, with N-methylpyrrolidone and hexamethylphosphoric triamide being preferred.
塩基性触媒はアルカリ金属の炭酸塩、アルカリ金属の水
酸化物と活性剤、またはアルカリ金属水素化物よりなる
群から選ばれる少なくとも一種が用いられる。一般には
炭酸カリウム、水酸化カリウムと活性剤、あるいは水素
化ナトリウムなどが用いられる。より強い塩基性触媒の
方がフェニルエーテル化物の収率が高く、前記の群の中
では水素化す1〜リウムがもっとも好ましい。As the basic catalyst, at least one selected from the group consisting of an alkali metal carbonate, an alkali metal hydroxide and an activator, or an alkali metal hydride is used. Generally, potassium carbonate, potassium hydroxide and an activator, or sodium hydride are used. Stronger basic catalysts give higher yields of phenyl etherides, and among the above group, 1-lithium hydrides are most preferred.
塩基性触媒の量は、該当する水酸基がアルコラ−1〜に
なるのに必要な量が用いられる。すなわち、少なくとも
0.5モル当量、好ましくは1.0モル当量あるいはそ
れ以上のモル当量の塩基性触媒が用いられる。The amount of basic catalyst used is the amount necessary to convert the corresponding hydroxyl group into alcohola-1. That is, at least 0.5 molar equivalent, preferably 1.0 molar equivalent or more of the basic catalyst is used.
ビスにトロフェニルエーテル)化物の還元は、通常の一
般的な方法によって容易に行なうことができる。例えば
、Sn、Fe、Znなどの金属と塩酸あるいは酢酸など
の酸性物質によって発生する水素による反応で、二1〜
ロ基をアミノ基に還元することができる。The reduction of the bis(trophenyl ether) compound can be easily carried out by a conventional method. For example, it is a reaction between metals such as Sn, Fe, and Zn and hydrogen generated by acidic substances such as hydrochloric acid or acetic acid.
The ro group can be reduced to an amino group.
本発明のハロゲン化芳香族ジアミンをエポキシ樹脂硬化
剤として用いる場合、エポキシ樹脂の種類はなんら限定
されることはなく、また従来公知の他の芳香族ジアミン
やジシアンジアミドなどの硬化剤あるいは3級アミンや
イミダゾールなどの硬化促進剤を0[用してもよい。When the halogenated aromatic diamine of the present invention is used as an epoxy resin curing agent, the type of epoxy resin is not limited at all, and other conventionally known aromatic diamines and curing agents such as dicyandiamide, tertiary amines, etc. A curing accelerator such as imidazole may also be used.
本発明のハロゲン化芳香族ジアミンをポリアミド、ポリ
イミド、ビスイミドなどの原材料に用いる場合、カルボ
ン酸成分の種類はなんら限定されることはなく、また従
来公知の他の芳香族ジアミンを併用してもよい。When the halogenated aromatic diamine of the present invention is used as a raw material for polyamide, polyimide, bisimide, etc., the type of carboxylic acid component is not limited at all, and other conventionally known aromatic diamines may be used in combination. .
(実施例)
以下に実施例を示し、本発明をさらに具体的に説明する
。(Example) The present invention will be explained in more detail with reference to Examples below.
(実施例1)
本発明が提供する新規なハロゲン化芳香族ジアミンの製
造方法のその一例を以下に示す。(Example 1) An example of the method for producing a novel halogenated aromatic diamine provided by the present invention is shown below.
攪拌装置、コンデンサーおよび温度計を備えた300m
Lの三[1フラスコに、ファイヤガードFG−3600
(2,2−ビス[4−ヒドロキシエトキシ−3,5−ジ
ブロモフェニル]プロパン、帝人化成株式会社製商品名
)15.8gを投入し、N−メチルピロリドン100m
Lを加えて溶解した。ついで攪拌しながら含有量約60
%の水素化ナトリウム2.4gを少しづつ加え、3o分
子ift N拌した。300m with stirrer, condenser and thermometer
L no 3 [1 flask, Fire Guard FG-3600
(2,2-bis[4-hydroxyethoxy-3,5-dibromophenyl]propane, trade name manufactured by Teijin Kasei Co., Ltd.) 15.8g was added, and 100ml of N-methylpyrrolidone was added.
L was added and dissolved. Then, while stirring, the content is about 60
2.4 g of sodium hydride was added in portions and stirred.
次にp−二1−ログロルベンゼン9.5gを加えて完全
に溶解した後オイルバスにて加熱を始め、175〜18
0℃で3時間反応させた。冷却後、析出した塩化ナトリ
ウムをろ別し、梨形フラスコに移して減圧下でN−メチ
ルピロリドンを留去した(58℃/ 4− m m H
g )。Next, after adding 9.5 g of p-21-loglolbenzene and completely dissolving it, heating was started in an oil bath.
The reaction was carried out at 0°C for 3 hours. After cooling, the precipitated sodium chloride was filtered off, transferred to a pear-shaped flask, and N-methylpyrrolidone was distilled off under reduced pressure (58°C/4-mm H
g).
ついで生成物をメタノールで洗浄して樹脂成分を除去し
、ろ過および乾燥して沈120gを得た。The product was then washed with methanol to remove resin components, filtered and dried to obtain 120 g of precipitate.
沈殿物中のジ(p−ニトロフェニルエーテル)化物の含
有量は約90%であった。The content of di(p-nitrophenyl ether) compound in the precipitate was about 90%.
次にニトロ基の還元を行った。攪拌装置、コンデンサー
および温度計を備えたILの三ロフラスコに、上記ビス
(p−ニトロフェニルエーテル)化物20gを投入し、
ベンゼン500mLに溶解させた。Next, the nitro group was reduced. 20 g of the above bis(p-nitrophenyl ether) compound was charged into an IL three-loaf flask equipped with a stirrer, a condenser, and a thermometer,
It was dissolved in 500 mL of benzene.
湯浴上で攪拌しながら、予め鉄粉160gと濃塩酸40
mLで作製しておいた活性鉄を1時間かけて少しづつ加
え、その後70〜75℃で2時間反応させた。ついで水
40mL加えさらに1時間反応させた。While stirring on a hot water bath, add 160 g of iron powder and 40 g of concentrated hydrochloric acid in advance.
Activated iron prepared in mL was added little by little over 1 hour, and then reacted at 70 to 75°C for 2 hours. Then, 40 mL of water was added and the reaction was continued for an additional hour.
冷却後不溶物をろ別し、ベンゼン溶液を分液ロートに移
して2回水洗し、無水硫酸ナトリウ11で一昼夜乾燥後
ベンゼンを揮散させて、本発明のハロゲン化芳香族ジア
ミンの粗製物14. gを得た5−I―記粗製物は、メ
タノール/クロロホルム混合溶媒で再結晶を繰り返して
精製し、純度99%以−にの結晶11gを得た。After cooling, insoluble matter is filtered off, the benzene solution is transferred to a separating funnel, washed twice with water, dried over anhydrous sodium sulfate 11 for a day and night, and the benzene is volatilized to obtain the crude halogenated aromatic diamine of the present invention 14. The crude product 5-I obtained above was purified by repeated recrystallization with a methanol/chloroform mixed solvent to obtain 11 g of crystals with a purity of 99% or higher.
結晶の分析値は以下の通り。The analysis values of the crystals are as follows.
1)融点;102℃
2)元素分析値;
C:45.64% (計算値45.73%)TI:3.
76% (3,72%)
N: 3.3/1% (3,44%);3)赤外線吸
収スペクトル(KBr);345(i、3374 am
−’ (p ri−NT(、、)2972.2876c
m−’ (CI(、+ )1.238cm−’(Ar−
0−)
1、000−1−100cnv’ (−C”、、 T−
1s O−)736cm−’ (Ar−Br)
4)J−1核磁気共鳴スペク1−ル(CDC13);δ
(ppm/TMS)
7.30 (41−1,Br−Ar −H)
6.5−6.9 (8H,Ar −H)4.34
(8TL −CH2−)3.1.0
(41(、−NH2)1.60 (6I
(、−CHI )第1図および第2図に実施例1で製造
したシアミン化合物の赤外線吸収スペクトルおよび’I
(核磁気共鳴スベク1−ルをそれぞれ示す。1) Melting point; 102°C 2) Elemental analysis value; C: 45.64% (calculated value 45.73%) TI: 3.
76% (3,72%) N: 3.3/1% (3,44%); 3) Infrared absorption spectrum (KBr); 345 (i, 3374 am
-' (pri-NT(,,)2972.2876c
m-'(CI(,+)1.238cm-'(Ar-
0-) 1,000-1-100cnv'(-C",, T-
1s O-)736cm-' (Ar-Br) 4) J-1 nuclear magnetic resonance spectrum 1-(CDC13); δ
(ppm/TMS) 7.30 (41-1, Br-Ar-H)
6.5-6.9 (8H, Ar-H) 4.34
(8TL -CH2-)3.1.0
(41(,-NH2)1.60 (6I
(,-CHI) Figures 1 and 2 show the infrared absorption spectrum and 'I of the cyamine compound produced in Example 1.
(The nuclear magnetic resonance spectrum is shown respectively.
以−1ユの分析データから実施例1で得た芳香族ジアミ
ン化合物は本発明の新規な芳香族ジアミンである式[1
]
%式%[1]
を有する2、2−ビス[4,−(4−アミノフエノキシ
エ1−キシ)−3,5−ジブロモフェニル]プロパンで
あることが確認された。From the analytical data of Example 1, the aromatic diamine compound obtained in Example 1 has the formula [1], which is the novel aromatic diamine of the present invention.
It was confirmed that it was 2,2-bis[4,-(4-aminophenoxyel-1-oxy)-3,5-dibromophenyl]propane having the formula %[1].
(実施例2)
本発明の新規な芳香族ジアミンは臭素を有することから
難燃剤として有用なことは明らかであるので、次に本発
明のハロゲン化芳香族ジアミンを硬化剤として用いたと
きのエポキシ樹脂プリプレグの特性について述べる。(Example 2) Since the novel aromatic diamine of the present invention has bromine, it is clear that it is useful as a flame retardant. The characteristics of resin prepreg will be described.
エピコート1001 (ビスフェノール型エポキシ樹脂
、シェル化学株式会社製商品名)90g、実施例1に準
じて製造した2、2−ビス[4−(4−アミノフェノキ
シエ1−キシ)−3,5−ジブロモフェニルコブ°ロバ
ン41 g !;よびジシアンジアミド1gをメチルエ
チルケトン200gとN。Epicote 1001 (bisphenol type epoxy resin, trade name manufactured by Shell Chemical Co., Ltd.) 90 g, 2,2-bis[4-(4-aminophenoxyel-1-oxy)-3,5-dibromo produced according to Example 1] Phenylcob° Roban 41g! ; and 1 g of dicyandiamide with 200 g of methyl ethyl ketone and N.
N−ジメチルホルマミ+:20gの混合溶媒に溶解した
後、厚さ0.18mmのガラス布基材に付着量が40重
量%になるように含浸し、160℃で乾燥してプリプレ
グを得た。N-Dimethylformami+: After dissolving in 20 g of mixed solvent, it was impregnated onto a glass cloth base material with a thickness of 0.18 mm so that the adhesion amount was 40% by weight, and dried at 160°C to obtain a prepreg. .
つぎにプリプレグを8枚用ねて170℃、50Kg/
0m2の条件で2時間成型しエポキシ樹脂積層板を作製
した。Next, use 8 sheets of prepreg and lay it at 170℃, 50kg/
An epoxy resin laminate was produced by molding for 2 hours under conditions of 0 m2.
この積層板から幅25 rn m長さ50 m mの試
験片を切りだし、支点間圧111125mmで曲げ試験
を=16=
行った。またLJ 1.、法による耐燃性試験を行った
。A test piece with a width of 25 rnm and a length of 50 mm was cut out from this laminate, and a bending test was conducted at a pressure between the supports of 111125 mm. Also LJ 1. A flame resistance test was conducted according to the law.
(比較例1)
実施例2において、本発明の含臭素芳香族ジアミンの替
わりに、硬化剤として2,2−ビス[4−(4−アミノ
フェノキシ)−3,5−ジブロモフェニル]プロパン3
6 gを用い、それ以外は実施例2と同様にしてエポキ
シ樹脂積層板を作製し、曲げ試験およびU L法耐燃性
試験を行った。(Comparative Example 1) In Example 2, 2,2-bis[4-(4-aminophenoxy)-3,5-dibromophenyl]propane 3 was used as a curing agent instead of the bromine-containing aromatic diamine of the present invention.
An epoxy resin laminate was prepared in the same manner as in Example 2 except that 6 g was used, and a bending test and a UL method flame resistance test were conducted.
(比較例2)
比較例1と同様に硬化剤として4,4′−ジアミノジフ
ェニルメタン10gを用い、難燃剤としてデカブロモジ
フェニルエーテル20gを用いてエポキシ樹脂積層板を
作製し、曲げ試験およびU17法耐燃性試験を行−)だ
6
実施例2および比較例1.2の試験結果を表1に示す。(Comparative Example 2) Similarly to Comparative Example 1, an epoxy resin laminate was prepared using 10 g of 4,4'-diaminodiphenylmethane as a curing agent and 20 g of decabromodiphenyl ether as a flame retardant, and was tested for bending test and U17 method flame resistance. The test results of Example 2 and Comparative Example 1.2 are shown in Table 1.
表1より、本発明のハロゲン化芳香族ジアミンは難燃剤
および硬化剤としてエポキシ樹脂硬化物の難燃化、可撓
化および強靭化に有用であることが明らかである。From Table 1, it is clear that the halogenated aromatic diamine of the present invention is useful as a flame retardant and a curing agent for making cured epoxy resins flame retardant, flexible, and tough.
表1
試験結果
(実施例3)
次に本発明のハロゲン化芳香族ジアミンを原材料として
用いたときのビスイミド系重合体の特性について述べる
。Table 1 Test Results (Example 3) Next, the characteristics of the bisimide polymer when the halogenated aromatic diamine of the present invention is used as a raw material will be described.
攪拌装置、コンデンサーおよびガス導入管を備えた50
0mLの三ロフラスコに無水マレイン酸10.8gを投
入し、アセトン100 m Lに溶解した。水浴上窒素
気流fで実施例1に準じて製造した2、2−ビス[4,
−(4−アミノフェノキシエトキシ)−3,5−ジブロ
モフェニル]プロパン43.7gのアセトン溶液200
m Lを2時間かけて滴下した。 滴下終了後、室温
で8時間攪拌した。沈澱したアミック酸をろ別し、アセ
i・ンで洗浄して過剰の無水マレイン酸を除去した後、
減圧で乾燥した。50 equipped with stirring device, condenser and gas introduction tube
10.8 g of maleic anhydride was placed in a 0 mL three-Low flask and dissolved in 100 mL of acetone. 2,2-bis[4,
-(4-Aminophenoxyethoxy)-3,5-dibromophenyl]propane solution of 43.7 g in acetone 200
mL was added dropwise over 2 hours. After the dropwise addition was completed, the mixture was stirred at room temperature for 8 hours. After filtering out the precipitated amic acid and washing with acetic acid to remove excess maleic anhydride,
Dry under reduced pressure.
次に攪拌装置、コンデンサーおよびガス導入管を備えた
5 00 m Lの三l」フラスコに上記アミック酸5
2g、無水酢酸] 4 m L、トリエチルアミン7.
2mL、および酢酸ニッケル(II)4水塩1.25g
を投入し、アセトン200mLに溶解させた。Next, the above amic acid 5
2 g, acetic anhydride] 4 mL, triethylamine7.
2 mL, and 1.25 g of nickel(II) acetate tetrahydrate
was added and dissolved in 200 mL of acetone.
ついで窒素気流下で、5時間還流温度で反応させた。冷
却して反応混合物を水中で再沈澱させ、ろ通接、炭酸水
素す1〜リウム水溶液で中和し水で十分洗浄した。The reaction was then carried out at reflux temperature for 5 hours under a nitrogen stream. After cooling, the reaction mixture was reprecipitated in water, filtered, neutralized with an aqueous solution of hydrogen carbonate, and thoroughly washed with water.
減圧乾燥後、メタノール/クロロホルム混合溶媒で再結
晶を繰り返して精製し、本発明の含臭素芳香族ジアミン
のビスマレイミド化物50gを得た。After drying under reduced pressure, the product was purified by repeating recrystallization with a mixed solvent of methanol/chloroform to obtain 50 g of bismaleimide of the bromine-containing aromatic diamine of the present invention.
次にこのビスマレイミド化物の硬化物を作製し、機械特
性を測定した。Next, a cured product of this bismaleimide compound was prepared and its mechanical properties were measured.
上記ビスマレイミド化物35gを2 m m厚のテフロ
ン製スペーサをはさんだステンレス鏡板の間で、接触圧
で170℃30分、引き続き10Kg/ c m ”で
170℃2時間硬化させて、2mmX100mm角の硬
化物を得、乾燥器中で200℃1時間、最後に280℃
で1時間アフターキュアを行った。35 g of the above bismaleimide compound was cured at 170°C for 30 minutes at contact pressure between stainless steel mirror plates sandwiching a 2 mm thick Teflon spacer, and then at 170°C for 2 hours at 10 kg/cm'' to form a 2 mm x 100 mm square cured product. 200°C for 1 hour in a dryer, and finally at 280°C.
I did an after cure for 1 hour.
この硬化物から@5 m m長さ50mmの試験片を切
りだし、支点間距離30mmで曲げ試験を行った・
(比較例3)
実施例3において、本発明の含臭素芳香族ジアミンの替
わりに、2,2−ビス[4,−(4−アミノフェノキシ
)−3,5−ジブロモフェニル]プロパンをジアミン成
分として用い、それ以外は実施例3と同様にしてビスマ
レイミド化物およびその硬化物を作製し、曲げ試験を行
った。A test piece with a length of 50 mm and a length of 5 mm was cut out from this cured product, and a bending test was conducted with a distance between fulcrums of 30 mm. (Comparative Example 3) In Example 3, instead of the bromine-containing aromatic diamine of the present invention, , 2,2-bis[4,-(4-aminophenoxy)-3,5-dibromophenyl]propane was used as the diamine component, but in the same manner as in Example 3, a bismaleimide compound and a cured product thereof were prepared. Then, a bending test was conducted.
(比較例4)
比較例3と同様にジアミン成分として4,4′−ジアミ
ノジフェニルメタンを用いて、ビスマレイミド化物およ
びその硬化物を作製し、曲げ試験を行った。(Comparative Example 4) Similarly to Comparative Example 3, using 4,4'-diaminodiphenylmethane as the diamine component, a bismaleimide compound and a cured product thereof were prepared and subjected to a bending test.
実施例3および比較例3.4の試験結果を表2に示す。The test results of Example 3 and Comparative Examples 3.4 are shown in Table 2.
表2 曲げ試験結果
表2より、本発明のハロゲン化芳香族ジアミンはマレイ
ミド系硬化物の可撓化および強靭化に有用であることが
明らかである。Table 2 Bending Test Results From Table 2, it is clear that the halogenated aromatic diamine of the present invention is useful for making the maleimide-based cured product flexible and tough.
(発明の効果)
本発明によれば、ガ[燃剤あるいはエポキシも一1脂硬
化剤として有用で、かつポリアミド、ポリイミド、ビス
マレイミ1くなどの原材料としても有用な新規なハロゲ
ン化芳香族ジアミンが提供される。(Effects of the Invention) According to the present invention, a novel halogenated aromatic diamine is provided which is useful as a hardening agent for both gas and epoxy resins and is also useful as a raw material for polyamides, polyimides, bismaleimides, etc. be done.
第1図は、本発明の新規化合物である実施例1の含臭素
芳香族ジアミンの赤外線吸収スペク1〜ル、第2図は同
じ<’H核磁気共鳴スペクトルである。
1゜
2゜
3゜
手続補正書帽発)FIG. 1 shows infrared absorption spectra 1 to 1 of the bromine-containing aromatic diamine of Example 1, which is a novel compound of the present invention, and FIG. 2 shows the same <'H nuclear magnetic resonance spectrum. 1゜2゜3゜Procedural amendments issued)
Claims (1)
たは臭素を示し、互いに異なっていてもよい。R_1お
よびR_2は水素、メチル基、エチル基、トリフルオロ
メチル基またはトリクロロメチル基を示し、互いに同じ
であっても異なってもよい。nは1〜3の整数を示す。 )で表されるハロゲン化芳香族ジアミン。 2、一般式[ I ]で示される化合物が2,2−ビス[
4−(4−アミノフェノキシエトキシ)−3,5−ジブ
ロモフェニル]プロパンである請求項1に記載のハロゲ
ン化芳香族ジアミン。 3、一般式[II] ▲数式、化学式、表等があります▼・・・[II] (式中、X_1〜X_4のうち少なくとも一つは塩素ま
たは臭素を示し、互いに異なっていてもよい。R_1お
よびR_2は水素、メチル基、エチル基、トリフルオロ
メチル基またはトリクロロメチル基を示し互いに同じで
あっても異なってもよい。nは1〜3の整数を示す。)
で表されるハロゲン化芳香族ジオールとニトロベンゼン
またはニトロフルオロベンゼンを、非プロトン性極性溶
媒中で塩基性触媒を用いて反応させることより、当該ハ
ロゲン化芳香族ジオールのビス(ニトロフェニルエーテ
ル)化物を合成し、ついでそのニトロ基をアミノ基に還
元することを特徴とする、一般式[ I ] ▲数式、化学式、表等があります▼・・・[ I ] (式中、X_1〜X_4のうち少なくとも一つは塩素ま
たは臭素を示し、互いに異なっていてもよい。R_1お
よびR_2は水素、メチル基、エチル基、トリフルオロ
メチル基またはトリクロロメチル基を示し、互いに同じ
であっても異なってもよい。nは1〜3の整数を示す。 )で表されるハロゲン化芳香族ジアミンの製造方法。 4、一般式[II]で示される化合物が2,2−ビス(4
−ヒドロキシエトキシ−3,5−ジブロモフェニル)プ
ロパンである請求項3に記載のハロゲン化芳香族ジアミ
ンの製造方法。 5、塩基性触媒がアルカリ金属の炭酸塩、アルカリ金属
の水酸化物と活性銅、またはアルカリ金属水素化物より
なる群から選ばれる少なくとも一種であることを特徴と
する請求項3または4に記載のハロゲン化芳香族ジアミ
ンの製造方法。 6、塩基性触媒が炭酸カリウム、水酸化カリウムと活性
銅、または水素化ナトリウムよりなる群から選ばれる少
なくとも一種であることを特徴とする請求項3または4
に記載のハロゲン化芳香族ジアミンの製造方法。[Claims] 1. General formula [I] ▲There are mathematical formulas, chemical formulas, tables, etc.▼...[I] (In the formula, at least one of X_1 to X_4 represents chlorine or bromine, and they are different from each other. R_1 and R_2 represent hydrogen, a methyl group, an ethyl group, a trifluoromethyl group, or a trichloromethyl group, and may be the same or different from each other. n represents an integer of 1 to 3.) A halogenated aromatic diamine represented by 2. The compound represented by the general formula [I] is 2,2-bis[
The halogenated aromatic diamine according to claim 1, which is 4-(4-aminophenoxyethoxy)-3,5-dibromophenyl]propane. 3. General formula [II] ▲There are mathematical formulas, chemical formulas, tables, etc.▼... [II] (In the formula, at least one of X_1 to X_4 represents chlorine or bromine, and they may be different from each other. R_1 and R_2 represents hydrogen, a methyl group, an ethyl group, a trifluoromethyl group, or a trichloromethyl group, and may be the same or different from each other. n represents an integer of 1 to 3.)
By reacting the halogenated aromatic diol represented by nitrobenzene or nitrofluorobenzene in an aprotic polar solvent using a basic catalyst, a bis(nitrophenyl ether) compound of the halogenated aromatic diol can be obtained. General formula [I] ▲There are mathematical formulas, chemical formulas, tables, etc.▼...[I] (In the formula, at least one of X_1 to X_4 One represents chlorine or bromine, and they may be different from each other. R_1 and R_2 represent hydrogen, a methyl group, an ethyl group, a trifluoromethyl group, or a trichloromethyl group, and may be the same or different from each other. n represents an integer of 1 to 3.) A method for producing a halogenated aromatic diamine. 4. The compound represented by the general formula [II] is 2,2-bis(4
The method for producing a halogenated aromatic diamine according to claim 3, wherein the halogenated aromatic diamine is -hydroxyethoxy-3,5-dibromophenyl)propane. 5. The basic catalyst according to claim 3 or 4, wherein the basic catalyst is at least one selected from the group consisting of an alkali metal carbonate, an alkali metal hydroxide and activated copper, or an alkali metal hydride. A method for producing a halogenated aromatic diamine. 6. Claim 3 or 4, wherein the basic catalyst is at least one member selected from the group consisting of potassium carbonate, potassium hydroxide and activated copper, or sodium hydride.
The method for producing a halogenated aromatic diamine as described in .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63317368A JPH0825971B2 (en) | 1988-12-15 | 1988-12-15 | Novel halogenated aromatic diamine and method for producing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63317368A JPH0825971B2 (en) | 1988-12-15 | 1988-12-15 | Novel halogenated aromatic diamine and method for producing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02164857A true JPH02164857A (en) | 1990-06-25 |
JPH0825971B2 JPH0825971B2 (en) | 1996-03-13 |
Family
ID=18087467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63317368A Expired - Lifetime JPH0825971B2 (en) | 1988-12-15 | 1988-12-15 | Novel halogenated aromatic diamine and method for producing the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0825971B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0459826A (en) * | 1990-06-28 | 1992-02-26 | Hitachi Chem Co Ltd | Aromatic polyimide moldable in melt |
KR20010016874A (en) * | 1999-08-05 | 2001-03-05 | 주성규 | Thermal adhesive epoxy resin composition |
US7501461B2 (en) * | 2004-04-12 | 2009-03-10 | University Of North Texas | Composition of epoxy resin, aliphatic amine curing agent and halogenated amine |
-
1988
- 1988-12-15 JP JP63317368A patent/JPH0825971B2/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0459826A (en) * | 1990-06-28 | 1992-02-26 | Hitachi Chem Co Ltd | Aromatic polyimide moldable in melt |
KR20010016874A (en) * | 1999-08-05 | 2001-03-05 | 주성규 | Thermal adhesive epoxy resin composition |
US7501461B2 (en) * | 2004-04-12 | 2009-03-10 | University Of North Texas | Composition of epoxy resin, aliphatic amine curing agent and halogenated amine |
Also Published As
Publication number | Publication date |
---|---|
JPH0825971B2 (en) | 1996-03-13 |
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