Nothing Special   »   [go: up one dir, main page]

JPH02148795A - Connecting method for lead of hybrid module - Google Patents

Connecting method for lead of hybrid module

Info

Publication number
JPH02148795A
JPH02148795A JP63302024A JP30202488A JPH02148795A JP H02148795 A JPH02148795 A JP H02148795A JP 63302024 A JP63302024 A JP 63302024A JP 30202488 A JP30202488 A JP 30202488A JP H02148795 A JPH02148795 A JP H02148795A
Authority
JP
Japan
Prior art keywords
lead
external connection
connection terminal
lead wire
envelope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63302024A
Other languages
Japanese (ja)
Inventor
Shigekichi Inokoshi
猪越 重吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP63302024A priority Critical patent/JPH02148795A/en
Publication of JPH02148795A publication Critical patent/JPH02148795A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To desirably connect a lead without junction peeling by a thermal stress, etc. by welding or soldering the lead in a state for mechanically holding it at the connection part of an external connection terminal. CONSTITUTION:The end of an external connection terminal 8 is previously bent in an enclosure 4, and the other end of a lead 6 connected to a hybrid circuit 2 is held and supported. The holding part is held by a pair of welding electrodes 9a, 9b used also as pressers, and welded. Thus, the connection of the terminal 8 to the body can be effectively and stably conducted to improve its reliability and yield.

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明は、ハイブリッドモジュールのリード接続方法に
係り、特に外囲器に設けられた外部接続用端子と前記外
囲器に内装されたノ1イブリッド回路本体に一端が電気
的に接続したリード線との接続方法の改良に関する。
[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a lead connection method for a hybrid module, and particularly relates to a lead connection method for a hybrid module, and in particular, a method for connecting leads to an external connection terminal provided in an envelope and The present invention relates to an improvement in a method of connecting a lead wire whose one end is electrically connected to an internal hybrid circuit body.

(従来の技術) 例えば、ベース板上に所要のハイブリッド回路本体を配
設するとともに、前記ハイブリッド回路本体を囲むよう
に樹脂製筒状体の一端を前記ベス板に接着し、所要のリ
ード接続を行った後、前記筒状体の開口端を蓋体で封止
した構造のハ・rグリッドモジュールが知られている。
(Prior art) For example, a required hybrid circuit body is disposed on a base plate, one end of a resin cylindrical body is adhered to the base plate so as to surround the hybrid circuit body, and the required lead connections are made. A C/R grid module is known which has a structure in which the open end of the cylindrical body is sealed with a lid after the cylindrical body is heated.

即ち、第4図にその構成例を斜視的に示すように、IC
素子1などを実装したハイブリッド回路本体2をベース
板3上に配設する一方、前記ハイブリッド回路本体2を
囲むように配設した外囲器4の一部を成す筒状体4a壁
に、予め貫挿配設されている外部接続用端子5と前記ハ
イブリッド回路本体2に一端が電気的に接続されたリー
ド端子(リード線)6とを例えば、半田付けまたは溶接
により一体化して電気的に接続した後に、外囲器4の一
部を成す所要の蓋体を(図示せず)配設し、封止して成
るハイブリッドモジュールが実用にはされている。
That is, as shown in perspective in FIG. 4, an IC
While the hybrid circuit main body 2 on which the element 1 and the like are mounted is arranged on the base plate 3, a wall of the cylindrical body 4a forming a part of the envelope 4 arranged so as to surround the hybrid circuit main body 2 is preliminarily installed. The external connection terminal 5 which is inserted through and arranged through the hybrid circuit main body 2 and the lead terminal (lead wire) 6 whose one end is electrically connected to the hybrid circuit main body 2 are integrated and electrically connected, for example, by soldering or welding. After that, a necessary lid (not shown) forming a part of the envelope 4 is provided and sealed, and a hybrid module is put into practical use.

ところで、この種のハイブリッドモジュールにおける外
部接続用端子5と、ハイブリッド回路本体2のリード線
6との接続は、次のように行なわれている。つまり、外
囲器4の一部を成す筒状体4a壁に貫挿配設されている
板状の外部接続用端子5面上に対接し得るように、ハイ
ブリッド回路本体2に一端が接続したリード線6の先端
側を予め折曲加工しておき、前記外部接続用端子5とリ
ド線6先端側とを位置合せし、この位置合せした部分を
例えば溶接電極7で挟み所要の溶接処理もしくは半田付
処理を行い一体的に接合し、電気的に接続している。第
5図は上記外部接続用端子5とリード線6との溶接状態
を模式的に示す一部切欠断面図である。
By the way, the connection between the external connection terminal 5 and the lead wire 6 of the hybrid circuit main body 2 in this type of hybrid module is performed as follows. That is, one end is connected to the hybrid circuit main body 2 so that it can come into contact with the surface of the plate-shaped external connection terminal 5 that is inserted through the wall of the cylindrical body 4a that forms a part of the envelope 4. The tip side of the lead wire 6 is bent in advance, the external connection terminal 5 and the tip side of the lead wire 6 are aligned, and the aligned portion is sandwiched between, for example, welding electrodes 7 and subjected to the necessary welding process or They are joined together by soldering and electrically connected. FIG. 5 is a partially cutaway sectional view schematically showing the state of welding the external connection terminal 5 and the lead wire 6. As shown in FIG.

(発明が解決しようとする課題) しかし、上記外部接続用端子5およびリード線6の先端
側を互いに対接させた状態で溶接などを行いリード接続
した場合は、次のような不都合がしばしば認められる。
(Problem to be Solved by the Invention) However, when the leads are connected by welding or the like with the tips of the external connection terminal 5 and the lead wire 6 facing each other, the following inconveniences are often observed. It will be done.

すなわち、上記リードの接続方法を採って構成したハイ
ブリッドモジュールを、たとえば−50℃と 150℃
の低温、高温の温度サイクル環境に置いたとき、外部接
続用端子5とリード端子(リード線)6の熱膨脹差によ
って半田が劣化したり、また、樹脂製外囲器4やリード
線6の熱膨脹差による半田に応力が生じ、半田の劣化を
招きもって接合部の剥離がしばしば起きる。一方、溶接
接合の場合は、接合面が比較的小さいため、−船釣に機
械的強度が劣り接合部の破壊がおこり易(、ときには接
合が不十分で熱応力に対して更に不利な状態を呈する場
合もあって、信頼性の点で問題がある。
That is, a hybrid module constructed using the lead connection method described above can be heated to -50°C and 150°C, for example.
When placed in a temperature cycle environment of low and high temperatures, the solder may deteriorate due to the difference in thermal expansion between the external connection terminal 5 and the lead terminal (lead wire) 6, or the thermal expansion of the resin envelope 4 and the lead wire 6 may occur. The difference causes stress in the solder, which leads to deterioration of the solder and often causes peeling of the joint. On the other hand, in the case of welded joints, the joint surface is relatively small, so the mechanical strength is inferior to that of boat fishing, and the joint is prone to fracture (and sometimes the joint is insufficient, making it even more disadvantageous against thermal stress). This poses a problem in terms of reliability.

[発明の構成] (課題を解決するための手段) 本発明は、上記事情に鑑みなされたもので、外囲器内に
内装封止されたハイブリッド回路本体のリード線と外囲
器内で接続するため、前記外囲器壁に貫挿配設された外
部接続用端子の構成について、特に考慮を払い、前記外
部接続用端子の接続部でリード線を機械的に挟持しうる
ように、外部接続用端子の接続部を構成し、前記リード
線を機械的に挟持した状態で溶接もしくは半[■付し、
所要の接続を行うものである。
[Structure of the Invention] (Means for Solving the Problems) The present invention has been made in view of the above circumstances, and provides a method for connecting the lead wires of the hybrid circuit body internally sealed within the envelope with the lead wires inside the envelope. Therefore, special consideration was given to the structure of the external connection terminal inserted through the wall of the envelope, and the external The connection part of the connection terminal is formed by welding or semi-welding with the lead wire mechanically clamped.
It makes the necessary connections.

(作 用) 上記のように、本発明方法によれば、外部接続用端子に
よってリード線は機械的に挟持され、この挟持により一
次的に固定(接続)されながら更に、溶接もしくは半田
付によって所要の接続がなされる。つまり、外部接続用
端子とリード線とは機械的な接続と溶接もしくは半田付
とにより二重に接続一体化される形となる。したがって
、熱応力などにより溶接領域や半田が劣化などした場合
も接合剥離等もなく、所要の電気的な接続を保持しうる
(Function) As described above, according to the method of the present invention, the lead wire is mechanically clamped by the external connection terminal, and while being temporarily fixed (connected) by this clamping, the lead wire can be further fixed (connected) as required by welding or soldering. connection is made. In other words, the external connection terminal and the lead wire are doubly connected and integrated by mechanical connection and welding or soldering. Therefore, even if the welded area or solder deteriorates due to thermal stress or the like, the required electrical connection can be maintained without bond peeling or the like.

(実施例) 以下第1図および第2図を参照して本発明の詳細な説明
する。
(Example) The present invention will be described in detail below with reference to FIGS. 1 and 2.

第1図はハイブリッドモジュールの一部を成す樹脂製外
囲器4壁に貫挿配設された外部接続用端子8と、前記外
囲器4内に配設されたハイブリッド回路本体2の入出力
端子2aに一端が接続されたリード線6とを対接させた
状態を、斜視的に示したものである。すなわち、本発明
方法においては、外部接続用端子8の外囲器4内に突設
させた先端側を折曲げて前記リード線6を挟持しつる構
造乃至形状に予め加工設定しである。つまり、前記外部
接続用端子8先端部は、外囲器4内において前記ハイブ
リッド回路本体2に一端が電気的に接続したリード線6
の他端側を挟着支持出来るよう予め折曲げである。一方
、前記外囲器4内に配設されたハイブリッド回路本体2
に接続するリード線6は、その先端側が前記外部接続用
端子8のリド線6挟持部(折曲部)にて挟持されるよう
に適宜折曲げ等によって成形し、前記外部接続用端子8
の挟持部(折曲部)にて挟持させる。このように、外部
接続用端子8でリード線6を挟持させた後、第2図にて
上面状態を示すように抑圧体を兼ねる一対の溶接電極9
a、9bで前記挟持部を挟み所要の溶接作業を行う。こ
の溶接作業において、前記溶接電極9a、9bを押圧体
(加圧体)兼用とせずに別途抑圧体(加圧体)を設置し
てもよい。
FIG. 1 shows an external connection terminal 8 inserted through the wall of a resin envelope 4 forming a part of the hybrid module, and input/output of the hybrid circuit main body 2 disposed inside the envelope 4. This is a perspective view showing a state in which a lead wire 6 whose one end is connected to the terminal 2a is in contact with the terminal 2a. That is, in the method of the present invention, the tip side of the external connection terminal 8 protruding into the envelope 4 is bent to form a structure or shape in which the lead wire 6 is clamped. That is, the tip of the external connection terminal 8 is connected to a lead wire 6 whose one end is electrically connected to the hybrid circuit main body 2 in the envelope 4.
The other end is bent in advance so that it can be supported by pinching. On the other hand, the hybrid circuit main body 2 disposed within the envelope 4
The lead wire 6 to be connected to the external connection terminal 8 is formed by bending or the like as appropriate so that its tip side is held by the lead wire 6 holding part (bending part) of the external connection terminal 8.
It is clamped at the clamping part (bending part). After the lead wire 6 is sandwiched between the external connection terminals 8 in this way, a pair of welding electrodes 9 which also serve as a suppressor are inserted as shown in the top view in FIG.
A and 9b sandwich the sandwiching portion and perform the necessary welding work. In this welding work, instead of using the welding electrodes 9a and 9b as pressing bodies (pressing bodies), a separate suppressing body (pressing body) may be installed.

なお、上記実施例では外部接続用端子8の先端側を折曲
てリード線6を挟持しうるようにしたが、たとえば、第
3図(A) 、 (B)に各々斜視的に示すように、外
部接続用端子8の先端側に複数の切込みを入れ隣接する
切片を交互に曲げて前記リード線6を挟持しうるように
構成してもよい。しかして、前記外部接続用端子8の先
端側でリード線6を挟持した後の二次的な接合(接続)
は溶接によらず、半田付によって行ってもよい。また、
本発明方法においては、外部接続用端子8がたとえばF
e、Cuもしくは真鍮等を基体としその表面にNi、S
n、  または半田等のメツキ層を被覆形成したものの
場合、更にリード線6がFeやNi1体としたり、Cu
を基体とし表面に前記のようなメツキ層を被覆形成した
ものの場合などいずれの場合も適用できる。
In the above embodiment, the tip side of the external connection terminal 8 is bent so that the lead wire 6 can be held, but for example, as shown in perspective in FIGS. 3(A) and 3(B), Alternatively, a plurality of cuts may be made on the tip side of the external connection terminal 8 and adjacent sections may be bent alternately so that the lead wire 6 can be held therebetween. Therefore, secondary bonding (connection) after the lead wire 6 is clamped on the tip side of the external connection terminal 8
may be done by soldering instead of welding. Also,
In the method of the present invention, the external connection terminal 8 is, for example, F
The base is made of e, Cu or brass, and the surface is made of Ni, S.
If the lead wire 6 is coated with a plating layer such as solder or solder, the lead wire 6 may be made of Fe or Ni, or may be made of Cu.
It can be applied to any case, such as a case where the substrate is coated with a plating layer as described above.

[発明の効果] 上記説明からも分るように、本発明方法によれば、ハイ
ブリッドモジュールのリード接続において、互いに接続
する外部接続用端子とハイブリッド回路本体との接続を
リード線によって確実かつ安定した状態で所要の電気的
な接続を行いうる。
[Effects of the Invention] As can be seen from the above description, according to the method of the present invention, in the lead connection of a hybrid module, the connection between the external connection terminals and the hybrid circuit body that are connected to each other can be established reliably and stably using the lead wire. The required electrical connections can be made in this state.

つまり、上記リード接続によれば、温度サイクルなどに
よる熱応力は挟持部がほとんど受持ち電気的接続機能を
溶接や半田付で補強する形を採っている。しかして、上
記リード接続して構成したハイブリッドモジュールにつ
いて、−55℃、150℃の間の温度サイクル条件下で
試験し、前記リード接続部の破壊乃至離脱情況を調べて
みたところ、従来技術の場合に比べ約10倍であった(
従来の場合10.000〜50,000サイクルでリー
ド接続部の破壊乃至離脱)。かくして本発明方法は、構
成されたハイブリッドモジュールの、電気的接続におけ
る安定性乃至信頼性の高さ、さらに量産における歩留の
改善、向上環に大きく寄与しつるり一ド接続方法と言え
る。
In other words, according to the above-mentioned lead connection, thermal stress due to temperature cycles and the like is mostly taken care of by the holding part, and the electrical connection function is reinforced by welding or soldering. The hybrid module configured with the above-mentioned lead connections was tested under temperature cycle conditions between -55°C and 150°C, and the occurrence of breakage or detachment of the lead connections was investigated. It was about 10 times higher than (
In the conventional case, the lead connection part broke or came off after 10,000 to 50,000 cycles). Thus, the method of the present invention can be said to be a swivel connection method that greatly contributes to high stability and reliability in electrical connection of the configured hybrid module, as well as to improvement of yield in mass production.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第3図(^)、(B)は本発明方法におい
て、外部接続用端子にてハイブリッド回路本体に一端が
接続するリード線を挟持接続した状態を説明するための
模式的な斜視図、第2図は同じく本発明方法において、
外部接続用端子にてハイブリッド回路本体に一端が接続
するリード線を挟持し溶接する状態を示すと上面図、第
4図は従来のハイブリッドモジュールの内部構成例を示
す斜視図、第5図は従来のハイブリッドモジュールのリ
ード接続法を説明するための模式的な側面図である。 2 ・・・ハイブリッド回路本体・ 4 ・・・外囲器 6 ・・・リード線 8 ・・・外部接続用端子 出願人      株式会社 東芝
Figures 1 and 3 (^) and (B) are schematic perspective views for explaining the state in which a lead wire, one end of which is connected to the hybrid circuit main body, is clamped and connected at an external connection terminal in the method of the present invention. Figure 2 also shows the method of the present invention,
A top view shows a state in which a lead wire, one end of which connects to the hybrid circuit main body, is clamped and welded by an external connection terminal, Figure 4 is a perspective view showing an example of the internal configuration of a conventional hybrid module, and Figure 5 is a conventional diagram. FIG. 3 is a schematic side view for explaining a lead connection method of the hybrid module. 2... Hybrid circuit body 4... Envelope 6... Lead wire 8... Terminal for external connection Applicant: Toshiba Corporation

Claims (1)

【特許請求の範囲】 外囲器壁を貫挿配設された外部接続用端子と、前記外囲
器に内装されたハイブリッド回路本体に一端が接続する
リード線とを接続する方法において、 前記外部接続用端子の外囲器内に突出した先端側は前記
リード端子を挟持可能に構成し、ハイブリッド回路本体
に一端が接続するリード線の他端側を前記外部接続用端
子先端側にて挟持させ、このリード端子挟持部を溶接も
しくは半田付して電気的に接続することを特徴とするハ
イブリッドモジュールのリード接続方法。
[Scope of Claims] A method for connecting an external connection terminal inserted through an envelope wall and a lead wire whose one end is connected to a hybrid circuit body housed in the envelope, comprising: The tip side of the connection terminal protruding into the envelope is configured to be able to hold the lead terminal, and the other end side of the lead wire, one end of which is connected to the hybrid circuit main body, is held by the tip side of the external connection terminal. A method for connecting leads of a hybrid module, characterized in that the lead terminal clamping portions are electrically connected by welding or soldering.
JP63302024A 1988-11-29 1988-11-29 Connecting method for lead of hybrid module Pending JPH02148795A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63302024A JPH02148795A (en) 1988-11-29 1988-11-29 Connecting method for lead of hybrid module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63302024A JPH02148795A (en) 1988-11-29 1988-11-29 Connecting method for lead of hybrid module

Publications (1)

Publication Number Publication Date
JPH02148795A true JPH02148795A (en) 1990-06-07

Family

ID=17903979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63302024A Pending JPH02148795A (en) 1988-11-29 1988-11-29 Connecting method for lead of hybrid module

Country Status (1)

Country Link
JP (1) JPH02148795A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04279825A (en) * 1991-03-08 1992-10-05 Kubota Corp Truck scale
JPH04134812U (en) * 1991-06-05 1992-12-15 三洋電機株式会社 flyback transformer
JPH05241332A (en) * 1992-02-26 1993-09-21 Tokyo Ohka Kogyo Co Ltd Resist material
US5452841A (en) * 1993-07-23 1995-09-26 Nippondenso Co., Ltd. Wire bonding apparatus and method
JP2004087151A (en) * 2002-08-23 2004-03-18 Nihon Kaiheiki Industry Co Ltd Illumination tilting switch
JP2006505103A (en) * 2002-10-31 2006-02-09 エフシーアイ Method of electrically connecting contact element and conductive wire
JP2009049150A (en) * 2007-08-20 2009-03-05 Oonanba Kk Method for mounting diode on terminal panel
JP2020519031A (en) * 2017-05-12 2020-06-25 モダ−イノチップス シーオー エルティディー choke coil

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04279825A (en) * 1991-03-08 1992-10-05 Kubota Corp Truck scale
JPH04134812U (en) * 1991-06-05 1992-12-15 三洋電機株式会社 flyback transformer
JPH05241332A (en) * 1992-02-26 1993-09-21 Tokyo Ohka Kogyo Co Ltd Resist material
US5452841A (en) * 1993-07-23 1995-09-26 Nippondenso Co., Ltd. Wire bonding apparatus and method
JP2004087151A (en) * 2002-08-23 2004-03-18 Nihon Kaiheiki Industry Co Ltd Illumination tilting switch
JP2006505103A (en) * 2002-10-31 2006-02-09 エフシーアイ Method of electrically connecting contact element and conductive wire
JP2009049150A (en) * 2007-08-20 2009-03-05 Oonanba Kk Method for mounting diode on terminal panel
JP2020519031A (en) * 2017-05-12 2020-06-25 モダ−イノチップス シーオー エルティディー choke coil
JP2020519033A (en) * 2017-05-12 2020-06-25 モダ−イノチップス シーオー エルティディー choke coil

Similar Documents

Publication Publication Date Title
CN105706236B (en) The manufacturing method of electrode terminal, power semiconductor device and power semiconductor device
US6437412B1 (en) Surface acoustic wave device having a package including a conductive cap that is coated with sealing material
JPH05283462A (en) Structure of semiconductor device having heat sink and plastic main body
JPH07202241A (en) Solar battery, mounting method and manufacture thereof
JPH02148795A (en) Connecting method for lead of hybrid module
WO2011030368A1 (en) Semiconductor device and method for manufacturing same
JPH03142847A (en) Semiconductor integrated circuit device
JP2538657B2 (en) Hybrid module
JP2666988B2 (en) Lead connection method
JPH034556A (en) Lead connection of hybrid module
JP3201946B2 (en) Semiconductor package
JP2576796B2 (en) TAB inner lead joining method
JP2000022013A (en) Manufacture of electronic component
JPH09191058A (en) Surface mount container
JPH11274892A (en) Piezoelectric vibrator and production thereof
JP2748180B2 (en) Manufacturing method of integrated circuit package
JPS62198140A (en) Semiconductor device
JP2531441B2 (en) Semiconductor device
JP2663936B2 (en) Method of manufacturing connector device
JPH0127572Y2 (en)
JPH05110154A (en) Piezoelectric actuator
JPH0287611A (en) Manufacture of solid electrolytic capacitor containing fuse and lead frame used for manufacturing same
JPH01181452A (en) Aging method and semiconductor device used therefor
JPS63305534A (en) Manufacture of hermetic-seal cover
JPH04209564A (en) Package for integrated circuit with test pad