JPH02125796A - Ic card - Google Patents

Abstract

PURPOSE:To enhance mechanical strength by preventing the destruction of an integrated circuit or wiring by arranging an integrated circuit at a position avoiding lines having large strain present therein and applying wiring so as to avoid the center part where the lines having large strain are conc. CONSTITUTION:An integrated circuit 2 is arranged to an IC card at a position avoiding lines having large strain present in the IC card. Therefore, the integrated circuit 2 is arranged so as to cross four lines 5 and wiring 3 is applied between input/output terminals 4 and the integrated circuit 2 to enhance the strength of the IC card 1. Further, the integrated circuit 2 is arranged near to the short side of a rectangle more reduced in strain. The wiring 3 connecting the input/output terminals 4 and integrated circuit 4 on the IC card 1 is also applied so as to pass through a route avoiding the center part where the lines having large strain is conc. and not to cross the lines 5 having large strain as possible. By this method, the bending strength of the IC card 1 is enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC card, and particularly to an IC card that takes into consideration the layout and wiring of integrated circuits.

[Conventional technology]

In the current cashless era, magnetic cards have a wide range of uses and are considered very important, as seen in cash cards, credit cards, various membership cards, and the like. IC cards appeared in this era of cards, and have recently been in the spotlight. An IC card is a plastic card with a built-in semiconductor integrated circuit; for example, an 8-bit CPU and a 1-bit CPU for information control.
There is one with a 6-bit ROM. I like this
The C card has several problems, the first being electrostatic damage to the memory circuit, and the second being the mechanical strength of the card. Countermeasures have been taken to address the former problem, such as using carbon materials, metal foil, etc. to protect the chip, but for the latter issue, the two-chip configuration of a microprocessor chip and a memory chip has been replaced with a single-chip configuration to prevent bending. It increases strength and alleviates the problem of wire breakage.

FIG. 3 is a plan view of an IC card with the top surface removed to explain an example of such a conventional IC card.

As shown in FIG. 3, the IC card 1 has an integrated circuit 2 in the center, and wiring 3 is connected between the integrated circuit 2 and the input/output terminal 4 provided on the side surface.
It is connected with

This IC card 1 is rectangular and very thin, and has the property of being easily bent. Therefore, when the IC card 1 is used, there are some parts where the IC card 1 is curved, causing particularly large distortions compared to when the IC card is flat.

When the IC card 1 is used, it is considered that the IC card 1 is most often bent when the following four types of forces are applied. There are two cases in which a force is applied in the direction connecting the points on each side of two opposite sides, and two cases in which a force is applied in the direction connecting the end points on the same diagonal. In most cases, force is applied along the bending line, and the portion where the maximum distortion occurs is line 5 shown by the four dotted lines in FIG.

As shown by the dotted line, this IC card 1 has a line 5 which is highly distorted due to bending, and the above-mentioned integrated circuit 2 is arranged at the center where the lines 5 converge.

[Problem to be solved by the invention]

The above-mentioned conventional IC cards have the disadvantage that although there is some consideration given to the chip structure in terms of mechanical strength, there is still no consideration given to IC cards where mechanical stress is likely to be applied to the integrated circuit portion. . In other words, in such an IC card, the integrated circuit portion is present in a portion where lines with large bending distortion extend in all directions, that is, in the central portion of the card that is most susceptible to bending.
In this regard, the problem of mechanical strength has not been resolved. Therefore, if an IC card is used for a long time and mechanical force is applied to the integrated circuit, it may cause wire breakage in the integrated circuit and impair the IC function. This will lead to destruction. In addition, the wiring that connects the integrated circuit and the input/output terminals may not be routed along lines that are subject to large bending distortions, or may not be routed to avoid the central area where bending distortion lines are concentrated. This means that the influence is large and the wire is likely to break.

An object of the present invention is to provide an IC card that prevents damage to such integrated circuits and wiring and improves mechanical strength.

[Means to solve the problem]

The IC card of the present invention has an integrated circuit disposed inside and an input/output terminal disposed on the side surface and wired to the integrated circuit. It is constructed by arranging integrated circuits and performing the wiring while avoiding the center area where the lines with large distortions are concentrated.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view with the top surface of an IC card removed for explaining a first embodiment of the present invention.

As shown in FIG. 1, in this embodiment, the integrated circuit 2 is placed at a position avoiding the line 5 with large distortion that exists inside the IC card 1. Of course, it is natural to avoid placing it in the center where the distortion is greatest.

Therefore, if the integrated circuit 2 is arranged so as not to straddle the four lines 5 shown in the figure, and the wiring 3 is provided between it and the input/output terminals 4, the strength of the IC card 1 will be the same as above. It goes without saying that the integrated circuit 2 does not straddle the line 5, which is subject to large distortion due to bending, and is also arranged on the shorter side of the rectangle, where the distortion is smaller. Also, the wiring 3 connecting the input/output terminal 4 on the IC card 1 and the integrated circuit 2 should be routed through a route that avoids the central part where the lines 5 with large distortions are concentrated, and should also straddle the lines 5 with large distortions as much as possible. Wiring 3 is provided to prevent this. This increases the strength of the IC card 1 against bending.

FIG. 2 is a plan view of the IC card with the top surface removed for explaining a second embodiment of the present invention.

As shown in FIG. 2, this embodiment is the same as the first practical example described above in that the integrated circuit 2 is placed at a position avoiding the line 5 where the distortion due to bending of the IC card 1 is large. ,
The arrangement is not limited to the short side or long side of the IC card 1, but it can be placed near the input/output terminal 4.

By arranging the integrated circuit 2 and the input/output terminal 4 in this manner, the wiring distance connecting the integrated circuit 2 and the input/output terminal 4 can be shortened, and the wiring distance between the integrated circuit 2 on the card and the Both wires 3 are less susceptible to bending.

〔Effect of the invention〕

As explained above, the IC card of the present invention is arranged so that the integrated circuit part does not overlap the line where distortion is large due to bending with respect to the card due to the card shape and its material. By wiring as closely as possible and avoiding the center where lines with large distortions are concentrated, it is possible to avoid the influence of distortion and increase mechanical strength.

[Brief explanation of drawings]

FIG. 1 is a plan view of an IC card with the top surface removed for explaining a first embodiment of the present invention, and FIG. 2 is a plan view of an IC card for explaining a second embodiment of the present invention. FIG. 3 is a plan view of an IC card with the top surface removed, for illustrating a conventional example. l...IC card, 2...integrated circuit, 3...wiring, 4...input/output terminal, 5...line with large distortion due to bending.

Claims (1)

[Claims] In an IC card having an integrated circuit disposed inside and an input/output terminal disposed on a side surface and wired to the integrated circuit, the integrated circuit is disposed at a position avoiding a line with large distortion existing inside; An IC card characterized in that the wiring is arranged avoiding the central part where lines with large distortions are concentrated.