JPH01288557A - Intermittently transporting device for long lead frame - Google Patents
Intermittently transporting device for long lead frameInfo
- Publication number
- JPH01288557A JPH01288557A JP63120133A JP12013388A JPH01288557A JP H01288557 A JPH01288557 A JP H01288557A JP 63120133 A JP63120133 A JP 63120133A JP 12013388 A JP12013388 A JP 12013388A JP H01288557 A JPH01288557 A JP H01288557A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- longitudinal direction
- tooth
- long lead
- spur gears
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 19
- 238000000465 moulding Methods 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000037433 frameshift Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Advancing Webs (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ＩＣ等の半導体部品の製造に際して使用する
長尺状のリードフレームを、一定ピ・ノチの間隔て間欠
的に移送する装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a device that intermittently transfers a long lead frame used in the manufacture of semiconductor components such as ICs at regular pitch intervals. It is something.
〔従来の技術と発明が解決しようとする課題〕一般に、
長尺状のリードフレームを使用しての半導体部品の製造
は、前記長尺状のリードフレームを、一定ピンチの間隔
で間欠的に移送する途次において、半導体チップのリー
ドフレーム□に対するダイボンディング、半導体チップ
とり一ト部との間のワイヤーホンディング、及び合成樹
脂のモールド等の各種の加工を施すようにしていること
は周知の通りである。[Problems to be solved by conventional techniques and inventions] Generally,
The production of semiconductor components using a long lead frame includes die bonding of the semiconductor chip to the lead frame □ while the long lead frame is intermittently transferred at regular pinch intervals; It is well known that various processes such as wire bonding between the semiconductor chip and the semiconductor chip mounting portion and synthetic resin molding are performed.
そして、従来、前記長尺状リードフレームの間欠的な移
送は、第８図及び第９図に示すように、リードフレーム
１に各半導体部品１ａのピッチＰで穿設した丸型の送り
孔１ｂに、送り車２の外周面に植設した丸型の送りビン
２ａを噛合し、前記送り車２を間欠的に回転駆動するこ
とによって行うようにしている。Conventionally, the intermittent transfer of the elongated lead frame is carried out using round feed holes 1b bored in the lead frame 1 at a pitch P of each semiconductor component 1a, as shown in FIGS. 8 and 9. A round feeding bottle 2a installed on the outer peripheral surface of the feeding wheel 2 is engaged with the feeding wheel 2, and the feeding wheel 2 is driven to rotate intermittently.
しかし、この従来の移送装置は、送り車２における丸帯
の送りピン２ａを、リードフレーム１における丸帯の送
り孔１ｂに対して噛合しての送りであるから、以下に述
べるように、リードフレーム１を、前記各種の加工箇所
において、加工装置に対して正確に位置決めできないと
云う問題がある。However, in this conventional transfer device, the round-shaped feed pin 2a of the feed wheel 2 is engaged with the round-shaped feed hole 1b of the lead frame 1, and therefore, as described below, the lead frame 1 There is a problem in that it is not possible to accurately position the above-mentioned various processing locations with respect to the processing equipment.
すわなち、送り車２における各送りピン２ａの直径は、
当該送りピン２ａを送り車２の回転に伴いリードフレー
ム１における送り孔１ｂに対して順次スムースに噛合さ
せる関係上、送り孔１ｂの内径よりも可成り小径にしな
ければならないから、リードフレーム１は、前記送り孔
１ｂの内径と送りピン２ａの直径との差だけ、加工装置
に対して、当該リードフレーム１の長手方向と直角の方
向にすれ動くのである。しかも、送りピン２ａと送り孔
１ｂとは、何れも丸帯で円周上における点接触であって
、リードフレーム１がその長手方向と直角の方向にずれ
動くと、前記点接触の位置が円周上に沿って変位するこ
とにより、リードフレーム１は、加工装置に対して、当
該リードフレーム１の長手方向にもずれるのである。That is, the diameter of each feed pin 2a in the feed wheel 2 is
In order for the feed pin 2a to mesh smoothly with the feed hole 1b of the lead frame 1 as the feed wheel 2 rotates, the diameter must be considerably smaller than the inner diameter of the feed hole 1b. , the lead frame 1 slides in a direction perpendicular to the longitudinal direction of the lead frame 1 relative to the processing device by the difference between the inner diameter of the feed hole 1b and the diameter of the feed pin 2a. Moreover, the feed pin 2a and the feed hole 1b are both round bands and point contact on the circumference, and when the lead frame 1 shifts in a direction perpendicular to its longitudinal direction, the position of the point contact changes around the circumference. By displacing along the top, the lead frame 1 is also displaced in the longitudinal direction of the lead frame 1 with respect to the processing device.
そこで従来は、各種の加工装置の箇所に、例えば、特公
昭５６−３５０２２号公報等に記載されているような位
置決め装置を設けることにより、リードフレームの長手
方向と直角方向のすれ、及び長手方向のずれを矯正し、
リードフレームを、加工装置に対して正確に位置決めす
るようにしている。Therefore, in the past, positioning devices such as those described in Japanese Patent Publication No. 56-35022, etc., were provided at various processing devices to prevent misalignment in the longitudinal direction and the perpendicular direction of the lead frame, as well as in the longitudinal direction. Correct the misalignment,
The lead frame is accurately positioned with respect to processing equipment.
ところが、このように、各種加工装置の箇所に、位置決
め装置を各々設けることは、装置の構造が著しく複雑に
なると共に、装置が著しく高価になるのであり、しかも
、リードフレームの移送速度が、前記各加工装置の箇所
における位置決めのために遅（なるのであった。However, providing positioning devices at each location of each type of processing equipment in this way makes the structure of the equipment extremely complicated and extremely expensive, and furthermore, the transfer speed of the lead frame is It was slow due to the positioning of each processing device.
本発明は、長尺状リードフレームを、各種加工装置の箇
所において正確に位置決めできる状態で移送するように
した装置を提供することを目的とするものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a device that can transport a long lead frame in a state where it can be accurately positioned at various processing devices.
この目的を達成するために、本発明は、互いに同期して
同し方向に同じ角度づつ間欠回転する少なくとも二つの
平歯車を、長尺状リードフレームの長手方向に沿って適
宜距離を隔てた部位に、当該各平歯車の軸線を前記長尺
状リードフレームの長手方向と直角にして配設し、該各
平歯車における各歯をインボリュート歯形に形成し、こ
の各歯を、前記長尺状リードフレームにおける各半導体
部品の間に形成されている矩形状の抜き孔、又は長尺状
リードフレームに適宜間隔で穿設した矩形状の送り孔に
噛合し、且つ、前記各歯車における歯幅寸法を、前記抜
き孔又は送り孔におけるり−１′フレームの長手方向と
直角方向の内幅寸法に近い値に設定する構成にした。In order to achieve this object, the present invention provides at least two spur gears that rotate intermittently at the same angle in the same direction in synchronization with each other at positions separated by an appropriate distance along the longitudinal direction of a long lead frame. The axis of each of the spur gears is arranged perpendicular to the longitudinal direction of the elongated lead frame, and each tooth of each of the spur gears is formed into an involute tooth profile. It meshes with rectangular punch holes formed between each semiconductor component in the frame or rectangular feed holes drilled at appropriate intervals in the long lead frame, and the face width dimension of each of the gears is , the punch hole or the feed hole is configured to be set to a value close to the inner width dimension in the direction perpendicular to the longitudinal direction of the RI-1' frame.
このように、長尺状リードフレームにおける各半導体部
品の間に形成されている矩形状の抜き孔、又は、長尺状
リードフレームに各半導体部品の間隔で穿設した矩形状
の送り孔に、間欠回転する少なくとも二つの平歯車にお
ける歯を噛合すると、各平歯車の歯における歯面が、長
尺状リードフレームの各抜き孔又は送り孔における四つ
の内側面のうち長尺状リードフレームの長手方向と直角
の一つの内側面に対して線接触するから、長尺状リード
フレームを、各平歯車の間欠回転により、その長手方向
に沿って間欠的に移送することができる。In this way, the rectangular punch holes formed between each semiconductor component in the long lead frame or the rectangular feed holes bored in the long lead frame at intervals between the semiconductor components, When the teeth of at least two intermittently rotating spur gears are meshed, the tooth surface of each spur gear is aligned with the longitudinal side of the elongated lead frame among the four inner surfaces of each punch hole or feed hole of the elongated lead frame. Since the lead frame is in line contact with one inner surface perpendicular to the direction, the elongated lead frame can be intermittently transported along its longitudinal direction by the intermittent rotation of each spur gear.
この場合、前記平歯車の各歯をインボリュート歯形に成
形したことにより、リードフレームにおける抜き孔又は
送り孔に対する各歯の噛合は、前記従来のように、丸帯
の送り孔に対する丸帯ピンの噛合よりもスムースであり
、しかも、このスムースな噛合状態ば、各平歯車の各歯
における歯幅寸法を、前記矩形状の抜き孔又は送り孔に
おけるリードフレームの長手方向と直角方向の内幅寸法
に近い値に設定しても確保することができるから、リー
ドフレームが、各歯車に対して、当該リードフレームの
長手方向と直角の方向にずれ動くのを極めて僅少にとど
めることができるのである。−方、平歯車の各歯におけ
る歯面と、リードフレー−６＝
ムにおける抜き孔又は送り孔との接触は、前記したよう
に、リードフレームの長手方向と直角方向の線に沿って
延びる線接触であって、リードフレームがその長手方向
と直角にずれ動いても、その線接触の位置が、前記従来
の丸帯送り孔に対する丸帯送りピンの接触のように、リ
ードフレームの長手方向に変位することはないから、リ
ードフレームが、各歯車に対して、当該リードフレーム
の長手方向に沿ってすれるのを防止することができる。In this case, since each tooth of the spur gear is formed into an involute tooth profile, the meshing of each tooth with the punch hole or feed hole in the lead frame is better than the meshing of the round band pin with the round band feed hole as in the conventional case. Moreover, with this smooth meshing state, the face width dimension of each tooth of each spur gear can be set to a value close to the inner width dimension in the direction perpendicular to the longitudinal direction of the lead frame in the rectangular punch hole or feed hole. This can be ensured even if the lead frame is set to , so that the lead frame can be kept from shifting relative to each gear in a direction perpendicular to the longitudinal direction of the lead frame to an extremely small amount. On the other hand, as described above, the contact between the tooth surface of each tooth of the spur gear and the punching hole or feed hole in the lead frame is a line extending along a line perpendicular to the longitudinal direction of the lead frame. Even if the lead frame shifts at right angles to the longitudinal direction of the contact, the position of the line contact is displaced in the longitudinal direction of the lead frame, like the contact of the round band feed pin with the conventional round band feed hole. Therefore, it is possible to prevent the lead frame from sliding against each gear in the longitudinal direction of the lead frame.
従って、前記少なくとも二つの平歯車の間に、グイボン
ディング装置、ワイヤーボンディング装置又は合成樹脂
モールド装置等の各種の加工装置を配設することにより
、これら各種の加工装置に対する長尺状リードフレーム
の間欠移送と、各種の加工装置に対するり−Ｆフレーム
の位置決めとを同時に行うことができるのである。Therefore, by disposing various processing devices such as a wire bonding device, a wire bonding device, or a synthetic resin molding device between the at least two spur gears, the long lead frame can be connected to these various processing devices intermittently. Transfer and positioning of the F frame relative to various processing devices can be performed at the same time.
すなわち、本発明によると、長尺状リードフレームを、
各種の加工装置に対して正しく位置決めした状態で移送
することができ、従来、各種の加工装置の箇所に設けら
れている位置決め装置を一部廃止することが可能である
から、装置の構造を簡単化できると共に、装置の設備費
を著しく低減でき、しかも、長尺状リードフレームの移
送速度の向上を図ることができる効果を有する。That is, according to the present invention, the long lead frame is
The structure of the equipment can be simplified because it can be transferred to various processing devices while being correctly positioned, and it is possible to eliminate some of the positioning devices conventionally installed at various processing devices. This has the effect that it is possible to significantly reduce the equipment cost of the apparatus, and to improve the transport speed of the long lead frame.
以下、本発明の実施例を図面（第１図〜第５図）につい
て説明すると、図において符号１は、帯状の金属板から
打ち抜き形成した長尺状のリードフレームを示し、この
リードフレーム１には、適宜ピッチＰの間隔で半導体部
品１ａが形成され、該半導体部品１ａの間には、当該半
導体部品１ａを形成するために、リードフレーム１の長
手方向の内幅寸法がＳで、リードフレーム１の長手方向
と直角方向の内幅寸法がＴである矩形状の抜き孔ＩＣが
穿設されている。Hereinafter, embodiments of the present invention will be explained with reference to the drawings (Figs. 1 to 5). In the drawings, reference numeral 1 indicates a long lead frame punched out of a band-shaped metal plate. In this example, semiconductor components 1a are formed at an appropriate pitch P, and between the semiconductor components 1a, in order to form the semiconductor components 1a, the inner width dimension in the longitudinal direction of the lead frame 1 is S, and the lead frame A rectangular punch hole IC having an inner width dimension of T in a direction perpendicular to the longitudinal direction is bored.
図中符号３．４は、前記長尺状リードフレーム１の長手
方向に沿って適宜距離りを隔てた部位に、軸線をリード
フレーム１の長手方向と直角にして配設した一対の平歯
車を示し、該両歯車３．４は、その各々におけるパルス
モータ５，６にて互いに同期して同じ方向に同じ角度づ
つ間欠的に回転駆動されるように構成されている。Reference numeral 3.4 in the figure denotes a pair of spur gears disposed at appropriate distances apart along the longitudinal direction of the long lead frame 1 with their axes perpendicular to the longitudinal direction of the lead frame 1. Both gears 3.4 are configured to be rotated intermittently in the same direction and at the same angle in synchronization with each other by pulse motors 5 and 6 in each gear.
また、図中符号７は、前記両歯車３，４の間の部位に配
設したダイボンディング装置、ワイヤーボンディング装
置又は合成樹脂モールド装置等の各種の加工装置を示す
。Further, reference numeral 7 in the figure indicates various processing devices such as a die bonding device, a wire bonding device, or a synthetic resin molding device, which are disposed between the gears 3 and 4.
そして、前記両歯車３．４における歯３ａ、４ａを、イ
ンボリュー１〜歯形に成形し、且つ、この両歯車３，４
における歯３ａ、４ａのモジュールを、そのピンチ円周
上における歯間ピッチｐが前記リードフレーム１におけ
る各半導体部品１ａのピッチＰと等しい値になるように
選定すると共に、前記両歯車３，４における歯幅寸法ｔ
を、前記抜き孔ＩＣにおけるリードフレーム１の長手方
向と直角方向の内幅寸法Ｔに近い値に設定することによ
り、この両歯車３，４における各歯３ａ、４ａを、前記
リードフレーム１における抜き孔ＩＣに各々噛合する。The teeth 3a and 4a of both gears 3.4 are formed into an involute 1 to tooth shape, and the teeth 3a and 4a of both gears 3.4 are
The modules of the teeth 3a, 4a are selected so that the pitch p between the teeth on the pinch circumference is equal to the pitch P of each semiconductor component 1a in the lead frame 1, and Face width dimension t
By setting T to a value close to the inner width dimension T in the direction perpendicular to the longitudinal direction of the lead frame 1 in the punching hole IC, the teeth 3a and 4a of both gears 3 and 4 can be Each meshes with the hole IC.
このように構成すると、両手歯車３，４の歯３ａ、４ａ
における歯面３ｂ、４ｂが、長尺状リードフレーム１の
抜き孔１ｃにおける四つの内側面のうち長尺状リードフ
レームの長手方向と直角の一つの内側面１ｄに対して線
接触するから、長尺状リードフレーム１を、両手歯車３
，４の間欠回転により、その長手方向に沿って間欠的に
移送することができるのである。With this configuration, the teeth 3a, 4a of the two-handed gears 3, 4
Since the tooth surfaces 3b and 4b in the long lead frame 1 are in line contact with one inner surface 1d perpendicular to the longitudinal direction of the long lead frame among the four inner surfaces in the punched hole 1c of the long lead frame 1, A square lead frame 1 is connected to a two-handed gear 3.
, 4, it is possible to intermittently transport it along its longitudinal direction.
なお、両歯車３．４における各歯間ピッチｐを、リード
フレーム１における抜き孔１ｃのピッチＰ、つまり、リ
ードフレーム１における各半導体部品１ａのピンチに一
致するには、モジュールの選定に加えて、両歯車３，４
を、ランク工具の基準ピッチ線を歯車の基準ピンチ円半
径から半径方向に適宜寸法だけずらせて創成して成るい
わゆる転位歯車に構成しても良いのであり、また、両歯
車３゜４における各歯３ａ、４ａの厚さＳが、前記抜き
孔ＩＣにおり一るリードフレーム１の長手方向の内幅寸
法Ｓよりも大きい場合には、各歯山３ａ、４ａを、第５
図に二点鎖線で示すように薄歯に形成すれば良いのであ
る。Note that in order to match the pitch p between each tooth in both gears 3.4 to the pitch P of the punched holes 1c in the lead frame 1, that is, the pinch of each semiconductor component 1a in the lead frame 1, in addition to the selection of the module. , both gears 3, 4
It is also possible to create a so-called shifted gear by shifting the standard pitch line of the rank tool by an appropriate dimension from the standard pinch circle radius of the gear in the radial direction. When the thickness S of 3a, 4a is larger than the inner width dimension S in the longitudinal direction of the lead frame 1 passing through the punch hole IC, each tooth 3a, 4a is
It is sufficient to form thin teeth as shown by the two-dot chain line in the figure.
第６図及び第７図は、伯の実施例を示し、この実施例は
、両歯車によるリードフレームの移送に、当該リードフ
レームに穿設されている矩形状の抜き孔ＩＣを利用する
ことに代えて、長尺状のリードフレーム１１に、その各
半導体部品１．１２のピッチＰと同じピンチで、矩形状
の送り孔１１ｃを穿設し、この送り孔１１ｃに、前記実
施例と同様にリードフレーム１１の長手方向に適宜距離
を隔てて配設した両歯車１３．１４におけるインボリュ
ーＩ−歯形の各歯１３ａ、１４．ａを噛合したものであ
り、この場合においても、両歯車１３．１４における各
歯間ピッチを、リードフレーム１１における送り孔１１
ＣのピッチＰ、つまり、リードフレーム１１におりる各
半導体部品１ ］、 ａのピッチに一致するには、モジ
ュールの選定に加えて、両歯車１３．１４を、転位歯車
に構成することを採用することができることは言うまで
もない。FIG. 6 and FIG. 7 show an embodiment of the present invention, in which a rectangular punch hole IC drilled in the lead frame is used to transfer the lead frame by both gears. Instead, a rectangular feed hole 11c is bored in the elongated lead frame 11 with the same pinch as the pitch P of each semiconductor component 1.12, and this feed hole 11c is filled in the same way as in the previous embodiment. Each of the teeth 13a, 14. of the involume I-tooth profile on both gears 13.14 are disposed at an appropriate distance in the longitudinal direction of the lead frame 11. In this case as well, the pitch between each tooth in both gears 13 and 14 is set to the feed hole 11 in the lead frame 11.
In order to match the pitch P of C, that is, the pitch of each semiconductor component 1 on the lead frame 11, a, in addition to selecting the module, it is necessary to configure both gears 13 and 14 as shifted gears. It goes without saying that you can.
第１図〜第７図は本発明の実施例を示し、第１図は第１
実施例の斜視図、第２図は第１図の拡大平面図、第３図
は第１図のｍ−ｍ視拡大断面図、第４図は第３図のＩＶ
−ＩＶ視視向面図第５図はり一ドフレームのピンチと歯
車における歯間ピッチとの関係を示す図、第６図は他の
実施例を示す平面図、第７図は第６図の■−■視断面断
面図８図は従来例を示す平面図、第９図は第８図のＩＸ
−ＩＸ視断面図である。
■、１１・・・・長尺状リードフレーム、１ａ、１１ａ
・・・・半導体部品、１ｃ・・・・抜き孔、１ ］、
Ｃ・・・・送り孔、３． ４． １３． １４・・・・
歯車、３ａ。
４ａ、１３ａ、１４ａ・・・・歯、５．６・・・・パル
スモータ、７・・・・加工装置。
特許出願人 ローム 株式会社
区1 to 7 show embodiments of the present invention, and FIG. 1 is a first embodiment of the present invention.
A perspective view of the embodiment, FIG. 2 is an enlarged plan view of FIG. 1, FIG. 3 is an enlarged sectional view taken along the mm line of FIG. 1, and FIG. 4 is an IV of FIG. 3.
-IV side view Figure 5 is a diagram showing the relationship between the pinch of the beam fixed frame and the tooth pitch of the gear, Figure 6 is a plan view showing another embodiment, and Figure 7 is the same as that of Figure 6. ■-■ cross-sectional view Figure 8 is a plan view showing the conventional example, Figure 9 is the IX of Figure 8.
-IX sectional view. ■, 11... Long lead frame, 1a, 11a
... Semiconductor component, 1c... Punch hole, 1 ],
C...Spring hole, 3. 4. 13. 14...
Gear, 3a. 4a, 13a, 14a...teeth, 5.6...pulse motor, 7...processing device. Patent applicant: ROHM Ku Co., Ltd.
Claims (1)
転する少なくとも二つの平歯車を、長尺状リードフレー
ムの長手方向に沿って適宜距離を隔てた部位に、当該各
平歯車の軸線を前記長尺状リードフレームの長手方向と
直角にして配設し、該各平歯車における各歯をインボリ
ュート歯形に形成し、この各歯を、前記長尺状リードフ
レームにおける各半導体部品の間に形成されている矩形
状の抜き孔、又は長尺状リードフレームに適宜間隔で穿
設した矩形状の送り孔に噛合し、且つ、前記各歯車にお
ける歯幅寸法を、前記抜き孔又は送り孔におけるリード
フレームの長手方向と直角方向の内幅寸法に近い値に設
定したことを特徴とする長尺状リードフレームの間欠移
送装置。(1) At least two spur gears that rotate intermittently at the same angle in the same direction in synchronization with each other are placed at appropriate distances apart along the longitudinal direction of the elongated lead frame, and the axis of each spur gear is disposed perpendicular to the longitudinal direction of the elongated lead frame, each tooth on each of the spur gears is formed into an involute tooth profile, and each tooth is formed between each semiconductor component on the elongated lead frame. The gear meshes with a rectangular punch hole or a rectangular feed hole drilled at appropriate intervals in a long lead frame, and the face width dimension of each gear is set to the lead in the punch hole or feed hole. An intermittent transfer device for a long lead frame, characterized in that the width is set to a value close to the inner width dimension in a direction perpendicular to the longitudinal direction of the frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63120133A JP2542420B2 (en) | 1988-05-16 | 1988-05-16 | Intermittent transfer device for long lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63120133A JP2542420B2 (en) | 1988-05-16 | 1988-05-16 | Intermittent transfer device for long lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01288557A true JPH01288557A (en) | 1989-11-20 |
| JP2542420B2 JP2542420B2 (en) | 1996-10-09 |
Family
ID=14778786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63120133A Expired - Fee Related JP2542420B2 (en) | 1988-05-16 | 1988-05-16 | Intermittent transfer device for long lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2542420B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5372972A (en) * | 1992-08-06 | 1994-12-13 | Mitsubishi Denki Kabushiki Kaisha | Method of and an apparatus for processing a lead frame |
| JP2006216881A (en) * | 2005-02-07 | 2006-08-17 | Toppan Printing Co Ltd | Embedded lead frame, manufacturing method thereof and semiconductor device |
| CN103862512A (en) * | 2012-12-10 | 2014-06-18 | 昆山市嘉美兴业电子材料有限公司 | Electronic material processing locating method and applications thereof |
| WO2018073927A1 (en) * | 2016-10-20 | 2018-04-26 | 日高精機株式会社 | Transport device for fin molded body for flat tube |
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| WO2018073928A1 (en) * | 2016-10-20 | 2018-04-26 | 日高精機株式会社 | Transport device for fin molded body for heat exchanger |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5932078A (en) * | 1982-08-17 | 1984-02-21 | Toshiba Corp | Character detecting and segmenting device |
-
1988
- 1988-05-16 JP JP63120133A patent/JP2542420B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5932078A (en) * | 1982-08-17 | 1984-02-21 | Toshiba Corp | Character detecting and segmenting device |
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|---|---|---|---|---|
| US5372972A (en) * | 1992-08-06 | 1994-12-13 | Mitsubishi Denki Kabushiki Kaisha | Method of and an apparatus for processing a lead frame |
| JP2006216881A (en) * | 2005-02-07 | 2006-08-17 | Toppan Printing Co Ltd | Embedded lead frame, manufacturing method thereof and semiconductor device |
| JP4506491B2 (en) * | 2005-02-07 | 2010-07-21 | 凸版印刷株式会社 | Imposition lead frame, manufacturing method thereof, and semiconductor device |
| CN103862512A (en) * | 2012-12-10 | 2014-06-18 | 昆山市嘉美兴业电子材料有限公司 | Electronic material processing locating method and applications thereof |
| CN109641712A (en) * | 2016-10-20 | 2019-04-16 | 日高精机株式会社 | For the delivery heat transfer device device of finned blade forming body |
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| WO2018073928A1 (en) * | 2016-10-20 | 2018-04-26 | 日高精機株式会社 | Transport device for fin molded body for heat exchanger |
| WO2018073931A1 (en) * | 2016-10-20 | 2018-04-26 | 日高精機株式会社 | Transport device for fin molded body for heat exchanger |
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| WO2018073927A1 (en) * | 2016-10-20 | 2018-04-26 | 日高精機株式会社 | Transport device for fin molded body for flat tube |
| CN109689548A (en) * | 2016-10-20 | 2019-04-26 | 日高精机株式会社 | For the delivery heat transfer device device of finned blade forming body |
| WO2018073930A1 (en) * | 2016-10-20 | 2018-04-26 | 日高精機株式会社 | Transport device for fin molded body for heat exchanger |
| US20200115180A1 (en) * | 2016-10-20 | 2020-04-16 | Hidaka Seiki Kabushiki Kaisha | Apparatus for conveying molded body for flattened tube fins |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2542420B2 (en) | 1996-10-09 |
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