JPH01218035A - Inspection of semiconductor device - Google Patents

Abstract

PURPOSE:To enhance the productivity by a method wherein two or more semiconductor devices in a state of a lead frame prior to a molding operation are arranged on a tray equipped with a positioning mechanism and a probe is brought into contact with a lead in order to electrically inspect the semiconductor devices as semifinished products. CONSTITUTION:Two or more semiconductor devices 3 as semifinished products in a state that an electrode pad of a semiconductor chip has been connected to a lead of a substrate are arranged on a tray equipped with a positioning mechanism. A probe 4 is brought into contact with the lead of a lead frame 3a; the semiconductor devices 3 as the semifinished products are inspected electrically. Then, a defect which has been caused after an inspection in a state of a semiconductor wafer such as a defect of a wire-bonded part or the like can be detected before a molding operation. By this setup, the productivity can be enhanced.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a method for testing a semiconductor device.

(Prior Art) Generally, a semiconductor device is manufactured by the following steps.

That is, first, a large number of semiconductor chips are formed on a semiconductor wafer by precision phototransfer technology or the like, and then the semiconductor wafer is cut into individual semiconductor chips. Then, this semiconductor chip is placed on a base having leads, such as a lead frame, and the electrode pads of the semiconductor chip and the leads of the lead frame are connected by, for example, wire bonding or the like. Thereafter, a protector for the semiconductor chip is formed by, for example, molding, and a semiconductor device is obtained. Note that, for example, TAB (tape
There are also semiconductor devices in which a semiconductor chip is mounted on a substrate using an automated bonding method or the like.

In general, in the semiconductor device manufacturing process as described above, the semiconductor wafer is inspected using a probe device, and the finished semiconductor device is inspected using a handler, a substrate inspection device, or the like.

The inventors of the present invention also proposed a method for inspecting a finished semiconductor device by placing it on a tray in Japanese Patent Application No. 61-29964.
6. It has been proposed in Japanese Patent Application No. 158924/1984.

(Problem 8 to be Solved by the Invention) As described above, conventionally, the state of semiconductor wafers and finished semiconductor devices have been inspected. Therefore, defects such as defects in wire bonding, which occur after the semiconductor wafer is inspected, cannot be discovered until after the semiconductor wafer is completed, which poses a problem of lowering productivity.

In addition, when inspecting the finished product, the lead portion of the finished product is bent, so there is a problem in that production is delayed in the handler that continuously inspects the product, even though the percentage of product defects due to molding is small.

The present invention has been made in response to such conventional circumstances, and enables efficient inspection of a semi-finished semiconductor device in which the electrode pads of the semiconductor chip and the leads of the base body are connected. It is an object of the present invention to provide a semiconductor device testing method that can improve productivity in comparison.

[Structure of the Invention] (Means for Solving the Problems) That is, the present invention provides a method for arranging a plurality of semi-finished semiconductor devices in which the electrode pads of the semiconductor chip and the leads of the base are connected on a tray having a positioning mechanism. After that, the tray is transported and positioned, and then the semi-finished semiconductor device is electrically inspected by bringing a probe into contact with the lead.

(Function) In the semiconductor device inspection method of the present invention having the above configuration, a semi-finished semiconductor device in which the electrode pads of the semiconductor chip and the leads of the base are connected, for example, a semiconductor device in a lead frame state before molding, is inspected. A plurality of devices are arranged on a tray having a positioning mechanism, the tray is transported and positioned, and a probe is brought into contact with a lead to electrically test a semi-finished semiconductor device.

Therefore, defects such as wire bonding defects that occur after inspection of the semiconductor wafer can be detected before molding, and productivity can be improved compared to the conventional method. Further, since a plurality of semi-finished semiconductor devices are arranged on the tray, it is possible to efficiently inspect the semiconductor devices using, for example, a probe device for large substrates.

Furthermore, it is possible to prevent inspection from being stopped due to lead bending, resulting in improved productivity.

(Example) Hereinafter, an example of the semiconductor device testing method of the present invention will be described with reference to the drawings.

For example, the tray 1 formed into a rectangular plate shape is made of an insulating material and has a predetermined size, for example, the same size as a board that can be inspected by a large board probe device. are set up in a row.

These recesses 2 are formed in a semi-finished semiconductor device in which the electrode pads of the semiconductor chip and the leads of the base are connected, for example, the leads of the lead frame 3a and the electrode pads of the semiconductor chip 3b are bonded by wires 30. It is configured to accommodate a semi-finished semiconductor device 3 and to position the semiconductor device 3 in a lead frame state with a predetermined accuracy, for example, to an accuracy that allows a probe to touch a lead using a probe device for large substrates. There is.

Then, semi-finished semiconductor devices 3 are placed in each recess 2 of the tray 1, and transported and positioned using, for example, a probe device for large substrates.As shown in FIG. The semi-finished semiconductor device 3 is electrically inspected by bringing the probe 4 into contact with the semi-finished semiconductor device 3.

Therefore, defects such as wire bonding defects that occur after the semiconductor wafer is inspected can be detected before the semiconductor wafer is inspected, and productivity can be improved compared to the conventional method. Since a plurality of semi-finished semiconductor devices 3 are placed on top and tested using a probe device for large substrates, testing can be carried out efficiently without the need for a special testing device.

In the above embodiment, the semi-finished semiconductor device 3 in which the leads of the lead frame 3a and the electrode pads of the semiconductor chip 3b are bonded with the wire 3C has been described, but other semi-finished semiconductor devices, such as A semiconductor device is a semi-finished product after bonding is performed by TAB and the tape is cut, or a COB (chlp on b) is a semiconductor device with a semiconductor chip mounted directly on the substrate.
Semi-finished semiconductor devices and the like can also be inspected in the same manner. Furthermore, when inspecting a COB semi-finished semiconductor device, it is possible to inspect it without using the tray 1 depending on the size of the substrate.

Furthermore, it is also possible to inspect the finished product by placing the molded finished product in the tray.

[Effects of the Invention] As described above, the semiconductor device testing method of the present invention can efficiently test a semi-finished semiconductor device in which the electrode pads of the semiconductor chip and the leads of the base are connected. , it is possible to improve productivity compared to the conventional method.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a tray for explaining a semiconductor device testing method according to an embodiment of the present invention, and FIG. 2 shows a semi-finished semiconductor device placed on the tray shown in FIG. FIG. 3 is a side view showing a state in which they are in contact. 1...Tray, 2...Recess, 3...
...Semi-finished semiconductor device. Tube 1 Wa surprise 22

Claims (1)

[Claims] (1) A plurality of semi-finished semiconductor devices with the electrode pads of the semiconductor chip and the leads of the base body connected are placed on a tray having a positioning mechanism, and then the tray is transported;
1. A method for testing a semiconductor device, which comprises positioning and then electrically testing the semi-finished semiconductor device by bringing a probe into contact with the lead.