JPH0121584Y2 - - Google Patents

Description

[Detailed description of the invention] This proposal relates to packaging containers for semiconductor wafers.
Semiconductor wafers are easily damaged and require a high degree of cleanliness, and the packaging containers in which they are transported and stored must be sufficiently designed to prevent damage and maintain cleanliness.

This proposal relates to such a packaging container. Conventional packaging containers for semiconductor wafers hold the wafers in the packaging container body, which has a large number of V-shaped grooves extending from both sides to the bottom, and the lid is covered with a fin-shaped or comb-shaped wafer holder. In order to elastically fix the wafer, and to prevent minute dust floating in the outside air from entering the packaging container and contaminating the wafer, adhesive tape is attached to the boundary between the lid and the main body. I was wandering around. However, adhesive tape has little effect on the intrusion of outside air, which has a large effect on the surface cleanliness of wafers, and when stored for a long time, the adhesive tape itself deteriorates and deteriorates, which is critical for maintaining wafer quality. have a significant impact. Furthermore, opening and closing of the lid must be done manually due to the nature of the work, and the taping work at that time is complicated. Furthermore, in order to maintain the delicate characteristics of semiconductor wafers as described above, the materials for packaging containers are extremely limited.

In other words, the material is chemically stable, does not adversely affect the surface quality of the wafer, has excellent chemical resistance and abrasion resistance, and can be applied with the injection molding method, which is suitable for mass production of complex shapes. Plastics such as polypropylene and polyethylene are suitable. However, the plastic has a characteristically small bending elastic modulus and is easily bent by external forces. Further, as a sealing method, a simple and highly reliable gasket sealing method is suitable. However,
Even if only a gasket seal is applied, the sealing portion of the packaging container will be greatly bent by the repulsive force from the gasket, resulting in incomplete sealing and making it impossible to maintain the quality of the wafer. In order to avoid this, reinforcement such as convex ribs is applied to the rib reinforcement part 14 to increase the moment of inertia of the area and improve the rigidity. In the limited space of a packaging container, it is extremely difficult to keep the amount of deflection below the limit of the collapse margin of the gasket, which will be described later, in response to a predetermined external force such as a change in air pressure after setting. Another property of plastic is the creep phenomenon, which causes it to warp over time and tend to lose its sealing properties.

In order to solve the above problems, this proposal has a large longitudinal elastic modulus,
In addition, there is almost no creep phenomenon at room temperature, and the shape and dimensions are designed with the moment of inertia of area taken into consideration.
For example, the rib reinforcement portion 14 of the packaging container seal portion 13
This problem was solved by using a reinforcing frame 6 that is built into the thick inside of the frame and is completely sealed by welding or insert molding, which will be described later.

The gist of the present invention is that the seal portion 13 of the lid 2 is a gasket seal, and the reinforcing frame 6 is embedded and reinforced inside the thick rib reinforcing portion 14. '', the present invention provides a plastic semiconductor wafer packaging container with a box structure in which semiconductor wafers are loaded and stored in a plurality of grooves vertically provided at appropriate intervals on the side surface of the box. and the container body 1 as a gasket seal,
In addition, a reinforcing frame 6 is completely embedded and reinforced inside the rib reinforcing portion 14 of the lid edge, and one clamp 9 that engages with the container body 1 is provided on each outer side of the opposite side of the lid 2. The main points are as follows.

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 shows an external view of an embodiment of a semiconductor wafer packaging container. FIG. 2 shows a partial vertical sectional view of an embodiment of the semiconductor wafer packaging container according to the present invention. FIG. 3 shows a partially enlarged cross-section of the gasket seal and rib reinforcement in FIG. 2. The lid 2 is fitted with the container body 1 at the seal portion 13,
It is tightened by a clamp 9. The seal portion 13
It has a gasket 12 for maintaining airtightness and a reinforcing frame 6 for preventing deflection of the seal portion 13 and reinforcing it. The reinforcing frame 6 is embedded within the thickness of the rib reinforcing portion 14 so that no exposed portion is exposed. In order to manufacture the rib reinforcement part 14, the shape of the reinforcement frame 6 is made in advance from stainless steel or a material with high rigidity which will be described later, and it is fixed to a mold during injection molding and incorporated into the wall thickness of the rib reinforcement part 14. . The portions that cannot be completely enclosed by injection molding in order to fix the reinforcing frame 6 may be sealed later by ultrasonic welding or the like.

It is preferable to completely seal the reinforcing frame 6 in this way. In order to suppress the deflection of the container due to the repulsive force of the gasket when the container is set and the change in atmospheric pressure after the container is set to a maximum of 0.1 mm, for example, when the reinforcing frame 6 is made of stainless steel, the cross-sectional dimensions of the frame are It is sufficient if the length is 6 mm and the width is 1 mm.
Further, the shape thereof is preferably rectangular in cross section, but of course other shapes can also be used.

As the material of the reinforcing frame 6, stainless steel, phosphor bronze, aluminum alloy, reinforced phenolic resin, reinforced melamine resin, reinforced polypropylene, and other plastics can be used.

As for the material of the gasket to be used next, it is preferable to use fluorine rubber, which does not contaminate the wafer due to volatile gases, or silicone rubber or urethane rubber, whose volatile gases are controlled. Further, for example, the shape of the gasket 12 is preferably oval in cross section, but other shapes may be used. Incidentally, the total repulsive force of the gasket 12 is about 14 kg, and the amount of collapse of the gasket is about 0.6 mm.

When the packaging container according to the present invention is used, as described above, as a result of using the reinforcing frame 6, the container can be sufficiently reinforced, making it possible to prevent bending and making the container extremely airtight. As a result, the quality of the semiconductor wafers could be maintained well. Additionally, as a result of eliminating the need for taping and other operations, the workability was significantly improved and automatic packaging became easier.

[Brief explanation of the drawing]

FIG. 1 shows an external view of an embodiment of a semiconductor wafer packaging container. FIG. 2 shows a partial vertical sectional view of an embodiment of the semiconductor wafer packaging container according to the present invention.
FIG. 3 shows a partially enlarged cross-section of the gasket seal and rib reinforcement in FIG. 2. DESCRIPTION OF SYMBOLS 1... Container body, 2... Lid, 6... Reinforcement frame, 9... Clamp, 10... Wafer, 12...
...Gasket, 13...Seal part, 14...Rib reinforcement part.

Claims (1)

[Scope of Claim for Utility Model Registration] (1) A plastic semiconductor wafer packaging container having a box structure in which semiconductor wafers are loaded and stored in a plurality of grooves provided vertically at appropriate intervals on the side surface of the box, 2 and the container body 1 as a gasket seal, a reinforcing frame 6 is completely embedded and reinforced inside the rib reinforcement portion 14 of the lid edge, and a clamp 9 that engages with the container body 1 is provided. A packaging container for semiconductor wafers, which is provided on the outside of opposite sides of a lid 2. (2) The reinforcing frame 6 is made of a material selected from among stainless steel, phosphor bronze, aluminum alloy, reinforced phenolic resin, reinforced melamine resin, and reinforced polypropylene. ) Packaging containers for semiconductor wafers. (3) The reinforcing frame 6 is made of metal or highly rigid plastic, and the dimensions of the reinforcing frame are:
A packaging container for semiconductor wafers according to claim (1) of claim 1, wherein the amount of deflection of the container in response to a predetermined external force applied thereto is within the limit of the crushing margin of the gasket.