JPH0113438Y2 - - Google Patents

Description

[Detailed Description of the Invention] (1) Technical Field of the Invention The present invention relates to a semiconductor delivery device, and in particular, it prevents damage to ceramic semiconductor devices during transportation by allowing more time for receiving and sending out semiconductor devices. The present invention also relates to a semiconductor delivery device that increases delivery speed to the next process.

(2) Background of the technology In the manufacturing process of semiconductor devices, there are processing steps such as automatically marking the semiconductor device and cutting the leads using an automatic lead cutting machine, and measurement steps such as measuring the characteristics of the semiconductor device. There is. In order to transport semiconductors from each of these processes to the next, multiple semiconductor devices are stored in containers (storage containers).
It is stored in.

Generally, containers are stacked on a storage container stacking means called a stacker, and the containers are taken out one by one from the bottom layer, and the semiconductor devices in the containers are sequentially delivered to an intermediate transportation container, and then sent through the transportation container to the marking process. is being sent to.

Although it is possible to increase the semiconductor delivery speed with such a configuration, it has the disadvantage that ceramic semiconductor devices in particular may be damaged or cracked due to collisions between semiconductor devices within the storage container.

(3) Prior Art and Problems A conventional configuration for eliminating such problems will be explained with reference to FIG.

FIG. 1 is a perspective view showing a conventional inclined drop type semiconductor delivery device. Reference numeral 1 denotes a pedestal, and a display pedestal 2 including a display panel for displaying errors of various sensors is mounted on the pedestal. A substrate 3 is provided on the display stand,
Container receiving blocks 4 are arranged in parallel on the substrate 3, and stackers 6a and 6b, which are approximately U-shaped pull-out members that hold both ends of the containers 5, are erected on both sides of the blocks 4, and the containers 5 are stacked. A storage container stacking means is constructed. Of course, a plurality of semiconductor devices are accommodated in the container 5 in parallel.

Although such stacked containers 5 are not shown, they are pushed out from the bottom of the storage container stacking means in the direction of arrow A by a push-out mechanism such as a cylinder, and moved along the container receiving block 4 to a position 5' shown by an imaginary dotted line. move it. Next, by similarly moving the piston 7 upward using a pressing mechanism such as a cylinder and lifting one end of the container 5', the container is tilted as shown at 5''. The devices are sent out in sequence,
It is inserted into an intermediate transport container 9 disposed on a transport base 8 having a similar inclination angle.

The semiconductor device inserted into the intermediate transport container 9 collides with a stopper pin 10 made of an elastic body provided at the end of the transport container 9 and is stopped.

The semiconductor devices inserted into the transport container 9 are sent one by one to the marking container 11 by the vertical movement of the stopper pin 10, and the semiconductor devices are marked on the semiconductor surface by the marking device 12, and the semiconductor devices are placed in the storage container 13. It will be stored.

The stackers 14a and 14b for storing empty containers sequentially send empty containers 13' from the bottom layer to store semiconductor devices. Full containers are sent out to the left.

However, according to this configuration, after the semiconductor devices are placed in the container (rail) 9 by tilting the container 5'', the semiconductor devices in the container (rail) 9 are empty until the next container 5'' is set. Not only is there a huge time loss, but
If the speed of conveyance and tilting of the container 5'' is increased, it has disadvantages such as damage and cracks.

(4) Purpose of the invention In view of the above-mentioned drawbacks of the conventional method, the present invention
It is an object of the present invention to provide a semiconductor delivery device that can simultaneously receive and send out semiconductor devices while slowing down the inclination speed to prevent damage to the semiconductor devices.

(5) Structure of the invention According to the invention, the object is to provide a container stacking means for stacking containers containing semiconductor devices, a container distributing means for distributing the stacked containers alternately to the left and right, and a container distributing means for distributing the stacked containers alternately to the left and right, and first and second transport means for transporting semiconductor devices sent out from each container to the next process; buffer means provided at a plurality of locations within the first and second transport means; The conveying means are moved alternately to the left and right positions, and at each moving position, semiconductor devices are sent out from the container to one of the conveying means, and semiconductor devices are sent to the next process from the other conveying means. This is achieved by providing a semiconductor delivery device characterized in that it is equipped with a moving means for sending out.

(6) Embodiments of the invention Hereinafter, embodiments of the invention will be described with reference to the drawings.

FIG. 2 is an overall oblique view showing the semiconductor delivery device of the present invention, and the same parts as in FIG. Stackers 6a and 6b which are container stacking means for stacking containers 5
is disposed approximately in the center of the container receiving blocks 4, 4, and the containers are alternately discharged from the bottom surface of the stacker in the directions of arrows A and A' by two cylinder mechanisms (not shown) serving as container sorting means.
They are arranged in parallel at left and right positions 5' and 5'' of the container receiving block 4.

Next, the container 5'' placed at the 5'' position is tilted by the upward movement of the piston 7 of the cylinder mechanism, and the semiconductor devices in the container 5'' fall naturally to the container 5'' placed on the transfer base 8. For example, it is stored in the first transport container 9a of the transport containers 9a and 9b which are the first and second transport means.The transport container has a rubber or the like penetrating through the container as shown in FIG. Stopper pins 10a, 10a', 10a'' and 1 made of elastic material
0b, 10b', 10b'' are arranged as buffer means,
The stopper pin is connected to the cylinders 15a, 15b, 1
5c, the semiconductor devices 16, 16, which are configured to move up and down as indicated by the arrow C-C' and have been inserted into the transport containers 9a, 9b, are bufferedly stopped by the first stopper pins 10a, 10b. . When the first cylinder 15a is moved upward in this state, the semiconductor device 16 is moved to the second stopper pins 10a' and 10a.
It collides with b′ in a similar manner and stops. By performing the same operation with the third stopper pins 10a'' and 10b'', the semiconductor devices ejected from the container 5'' due to free fall are buffered one after another, preventing damage or cracks even if the semiconductor devices are made of ceramic or the like. Does not occur.

In this way, from the container 5'' to the first transport container 9
While the semiconductor device is being delivered to the container a, the third stopper pin 10b'' is moved upward from the second transport container 9b to eject the semiconductor device into the stamping container 11.
Next, the second stopper pin 10b' is moved upward and the semiconductor device 16 interposed between the first and second stopper pins is lowered and ejected, thereby preventing cracking of the semiconductor device during ejection. obtain.

Next, the photosensor detects that there is no semiconductor device in the second transport container 9b that has been discharged into the stamp container 11, and the first and second transport containers including the base 8 are moved to the arrow D in FIG. When moving in the direction, the semiconductor receiving port of the second transport container 9b is brought to the discharge port position of the container 5', and the discharge port of the first transport container 9a is brought to the receiving port position of the stamping container 11. .

As a moving means for moving the base 8 in the D direction, as shown in FIG.
7, the movable plate 18 integrated with the base may be moved in the ◯ direction. Reference numeral 19 denotes a presser plate interposed between the frame and the frame.

In such a state, while the semiconductor device is being discharged from the first transport container 9a into the stamping container 11, the container 5' is moved upward by a piston and tilted, and the semiconductor device is slowly inserted into the second transport container 9b. It is possible to do so.

In the above embodiments, the case where a semiconductor device is transported to a marking process has been described, but it is clear that these can be used to transport a semiconductor device to a lead cutting process or a measurement process.

Furthermore, although the method for discharging semiconductors has been described using a natural fall method, the present invention can also be applied to cases where semiconductors are carried out in a horizontal plane.

(7) Effects of the invention As explained above in detail, the semiconductor delivery device of the invention does not cause damage when sending out ceramic semiconductor devices, and the containers are distributed to the left and right sides of the stacker and discharged, making the marking speed faster than before. It is possible to achieve the same or higher speed than when using a high-speed configuration, which has a great practical effect.

[Brief explanation of the drawing]

Figure 1 is a perspective view of a conventional semiconductor delivery device;
The figure is a perspective view of the semiconductor delivery device of the present invention, and FIG. 3 is a partial sectional view of the present invention showing a transport container arranged on a base and a movement mechanism for the base. 1... mount, 2... display stand, 3... board, 4...
... Container receiving block, 5, 5', 5'' ... Container, 6a, 6b ... Stacker, 7 ... Piston, 8 ... Transport base, 9 ... Transport container, 9a, 9
b...first and second transport containers, 10, 10a,
10a', 10a'', 10b, 10b', 10b''... Stopper pin, 11... Stamping container, 12... Stamping device, 13... Storage container.

Claims (1)

[Scope of Claim for Utility Model Registration] Container stacking means 6a and 6b for stacking containers containing a plurality of semiconductor devices in a row, containers stacked on the container stacking means,
Container sorting means for sequentially and alternately distributing semiconductors to first and second positions on the left and right sides of the container stacking means, and semiconductors corresponding to the containers sorted to the first and second positions and sequentially delivered from the containers. First and second conveying means 9a and 9b for conveying the apparatus to the receiving port of the next process; , buffer means 10a, 10a', 10a'', 10 for transporting the semiconductor devices in the second transport means while sequentially temporarily stopping them.
b, 10b', 10b'' and the first and second conveying means are simultaneously moved so that the receiving opening of the first conveying means faces the outlet of the container at the first position, and the a first movement position where the outlet of the second conveyance means faces the reception opening of the next process; and a first movement position where the outlet of the first conveyance means faces the reception opening of the next process and the second conveyance moving means 17 and 18 for alternately moving the container to a second moving position opposite to the outlet of the container in which the receiving opening of the means is at the second position; When in the first moving position, the semiconductor devices in the container at the first position are sent to the first transport means, and the semiconductor devices in the second transport means are sent to the receiving port for the next process. Further, when the first and second transport means are at the second moving position, the semiconductor device in the container at the second position is sent to the second transport means, and the semiconductor device is transported to the second transport means. 1. A semiconductor delivery device, characterized in that the semiconductor devices in the first transport means are delivered to the receiving port for the next step.