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JPH01113394U - - Google Patents

Info

Publication number
JPH01113394U
JPH01113394U JP801888U JP801888U JPH01113394U JP H01113394 U JPH01113394 U JP H01113394U JP 801888 U JP801888 U JP 801888U JP 801888 U JP801888 U JP 801888U JP H01113394 U JPH01113394 U JP H01113394U
Authority
JP
Japan
Prior art keywords
printed circuit
ventilation
circuit board
dummy
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP801888U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP801888U priority Critical patent/JPH01113394U/ja
Publication of JPH01113394U publication Critical patent/JPH01113394U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の原理説明図、第2図は本考案
による一実施例の説明図で、aは斜視図、bはダ
ミープリント基板の斜視図、第3図は従来の説明
図で、aは斜視図、bは要部斜視図を示す。 図において、1はプリント基板、2は半導体素
子、3は筺体、4はダミープリント基板、5は通
風口、6は通風、7はダクト、4Aは基板を示す
Fig. 1 is an explanatory diagram of the principle of the present invention, Fig. 2 is an explanatory diagram of an embodiment according to the present invention, a is a perspective view, b is a perspective view of a dummy printed circuit board, and Fig. 3 is a conventional explanatory diagram. A shows a perspective view, and b shows a perspective view of main parts. In the figure, 1 is a printed circuit board, 2 is a semiconductor element, 3 is a housing, 4 is a dummy printed circuit board, 5 is a ventilation hole, 6 is a ventilation, 7 is a duct, and 4A is a board.

Claims (1)

【実用新案登録請求の範囲】 半導体素子2を実装したプリント基板1または
ダミープリント基板4のそれぞれが所定間隔Pで
配列され、それぞれが挿脱可能に収納された筺体
3を備え、該間隔Pのそれぞれに通風6を行うこ
とで該半導体素子2の冷却を行う冷却構造におい
て、 前記ダミープリント基板4側の通風が隣接した
前記プリント基板1の実装面1Aに案内されるよ
う前記ダミープリント基板4の基板4Aに通風口
5を設けると共に、該通風口5に前記通風6を案
内するダクト7が該ダミープリント基板4に係止
されて成ることを特徴とする冷却構造。
[Claims for Utility Model Registration] Printed circuit boards 1 or dummy printed circuit boards 4 on which semiconductor elements 2 are mounted are arranged at a predetermined interval P, and each is provided with a housing 3 in which it is removably housed, In the cooling structure in which the semiconductor element 2 is cooled by providing ventilation 6 to each of the dummy printed circuit boards 4, the dummy printed circuit board 4 is arranged such that the ventilation on the dummy printed circuit board 4 side is guided to the mounting surface 1A of the adjacent printed circuit board 1. A cooling structure characterized in that a ventilation hole 5 is provided on the board 4A, and a duct 7 for guiding the ventilation 6 to the ventilation hole 5 is locked to the dummy printed circuit board 4.
JP801888U 1988-01-25 1988-01-25 Pending JPH01113394U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP801888U JPH01113394U (en) 1988-01-25 1988-01-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP801888U JPH01113394U (en) 1988-01-25 1988-01-25

Publications (1)

Publication Number Publication Date
JPH01113394U true JPH01113394U (en) 1989-07-31

Family

ID=31213523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP801888U Pending JPH01113394U (en) 1988-01-25 1988-01-25

Country Status (1)

Country Link
JP (1) JPH01113394U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374082A (en) * 2001-06-13 2002-12-26 Hitachi Kokusai Electric Inc Cooling structure of electronic apparatus
JP2013138130A (en) * 2011-12-28 2013-07-11 Fujitsu Ltd Cooling unit, housing of cooling unit, and electronic apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374082A (en) * 2001-06-13 2002-12-26 Hitachi Kokusai Electric Inc Cooling structure of electronic apparatus
JP4562317B2 (en) * 2001-06-13 2010-10-13 株式会社日立国際電気 Electronic equipment cooling structure
JP2013138130A (en) * 2011-12-28 2013-07-11 Fujitsu Ltd Cooling unit, housing of cooling unit, and electronic apparatus

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