JPH0945813A - Surface mount electronic part and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable surface mount electronic part, which is suitable for a large current, which can be manufactured at low cost by simplifying the structure of a ceramic package without using wire bonding, and provide further its manufacturing method. SOLUTION: An intermediate insulating board 22, on which a through hole 21 is provided almost in the center of the main surface, and the electronic part such as a semiconductor pellet 23 to be housed in the through hole of the insulating board, are fixed to the side of both main surfaces of the intermediate insulating board 22, a pair of external insulating boards 24 and 25, having conductive layers 26a and 26b provided in such a manner that it come in contact with the electronic part, are provided, the conductive layers 26a and 26b are extended to the edge part of the external insulating boards 24 and 25, and a metal electrode is formed on both ends of the external insulating boards 24 and 25. For forming the surface mounting electronic part 20 for one unit, a laminated body, in which an intermediate insulating aggregate plate and an external insulating aggregate plate are used, is formed and it is individually divided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type electronic component having a structure in which an electronic component chip such as a semiconductor pellet is enclosed in a ceramic package and a method for manufacturing the same.

[0002]

2. Description of the Related Art A conventional structure of this type of chip-type electronic component will be described with reference to FIGS. In the electronic component 1 of FIG. 13, the semiconductor pellet 3 is soldered to the end of the lead 2a, and the upper surface of the pellet 3 is connected to one end of the other lead 2b by the bonding wire 4. Then, a part of the leads 2a and 2b, the semiconductor pellet 3, and the bonding wire 4 are sealed with a resin 5. Next, the unnecessary portions of the leads 2a and 2b are separated from the lead frame, and finally,
As shown in the figure, the leads 2a and 2b are bent to the back side so that the corners of the resin 5 are rolled up, and the predetermined electronic component 1 is completed.

The structure of the chip type electronic component shown in FIG. 14 is, for example, as disclosed in Japanese Patent Laid-Open No. 61-22638.
The structure is such that the semiconductor pellet 3 is enclosed in a ceramic package 10. The semiconductor pellet 3 is soldered to the substrate 11 on the bottom surface of the package 10 and is connected to the metallized portion 12 by the bonding wire 4 from the upper surface of the semiconductor pellet 3. The metallized portion 12 is formed so as to penetrate the side surface of the ceramic package 10 to reach the outer surface on the side, and to wrap up its corner portion to a part of the back surface side of the substrate 11. Also, ceramic package 1
The upper surface of 0 is closed by a ceramic lid 14 fixed by a low melting point glass 13. Each of the structures shown in FIGS. 13 and 14 is used as a surface mount electronic component.

[0004]

By the way, the electronic component shown in FIG. 13 has the following problems to be solved. Since it is a resin-sealed type, there is some difficulty in reliability. Since the plate-shaped leads 2a and 2b are relatively thin, their mechanical strength is weak. Since one of the electrodes is wire-bonded, it is not suitable for large currents. Breakage of the bonding wire 4 is likely to occur. Further, the electronic component having the structure shown in FIG. 14 has the following problems to be solved. Since the metallized portions 12 are formed on both sides and side surfaces of the ceramic substrate 11, the package 10 becomes expensive. There are many wire bonding processes. The height (size in the thickness direction) of the electronic component becomes large.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in order to solve each of the problems described above, does not use wire bonding at all, and can be expected to have high reliability. It is an object of the present invention to provide a surface mount type electronic component for large current and a method for manufacturing the same at low cost.

[0006]

SUMMARY OF THE INVENTION A surface mount type electronic component of the present invention comprises an intermediate insulating plate having a through hole at a substantially central portion of a main surface, and a semiconductor pellet housed in the through hole of the insulating plate. An electronic component chip and a pair of outer insulating plates each having a conductive layer that is fixed to both main surface sides of the intermediate insulating plate and is in contact with or soldered to the electronic component chip, The conductive layer extends to an end portion of the outer insulating plate, and metal electrodes electrically connected to respective electrodes of the electronic component are formed at both ends of the outer insulating plate. Is.

Further, a method of manufacturing a surface mount type electronic component is as follows.
One unit of the intermediate insulating plate has a plurality of intermediate insulating aggregate plates integrally formed in the plane direction, and one main surface has a conductive layer extending from a substantially central portion to one end portion and the other main surface. For the surface, an outer insulating assembly plate having a plurality of conductive layers integrally formed in the planar direction at both ends, and an electronic component chip having metal electrodes formed by solder layers on both main surfaces are prepared. Placing the intermediate insulating aggregate plate on one main surface of the plate, and then,
A step of accommodating electronic component chips in each through hole of the intermediate insulating aggregate plate, and then stacking the other outer insulating aggregate plate with one main surface thereof facing the intermediate insulating aggregate plate, A step of fixing between the insulating aggregate plate and the intermediate insulating aggregate plate, then a step of cutting and separating them into parts for each unit, and forming a metal electrode by solder dipping both ends of the separated parts And a step of performing.

[0008]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 is an assembly view of a surface mount electronic component of the present invention, FIG. 2 is a perspective view showing its completed state, FIG. 3 is its sectional view, and FIG. 4 is its plan view. In these drawings, the surface-mounted electronic component 20 has an intermediate insulating plate 22 having a through hole 21 formed in a substantially central portion thereof, and the through hole 21 of the intermediate insulating plate 22 is formed in, for example, a diode structure. The semiconductor pellet 23 is accommodated. FIG. 7 shows a plan view of the intermediate insulating plate 22 and FIG. 8 shows a sectional view taken along line XX thereof. The shape and size of the through holes 21 are determined by the shape and size of the semiconductor pellets 23 accommodated therein. In short, the shape and size of the semiconductor pellets 23 accommodated in the through holes 21 are not limited as long as the semiconductor pellets 23 can be positioned.

Outside insulating plates 24 and 25 are bonded to both sides of the intermediate insulating plate 22. These outer insulation plates 24,
Reference numeral 25 is the same part, and the front and back sides are opposite to each other and used as shown in the figure. 5 and 6 show a plan view and a side view of one outer insulating plate 24, and FIGS. 9 and 10 show a plan view and a side view of the other outer insulating plate 25, respectively. As is apparent from these figures, conductive layers 26a having a constant width are formed on both ends of the outer insulating plates 24 and 25 in the longitudinal direction. That is, assuming that the front surface side shown in FIG. 5 is the A surface and the back surface side is the B surface, the A conductive layer has a wide conductive layer with a diagonal line portion from one end to the other in the width direction. 26b is formed by a metallizing process. On the other hand, the conductive layers 26a are formed on the B surface side at both ends in the width direction as described above. The other outer insulating plate 25 is opposite to the above outer insulating plate 24 in the front and back surfaces, and the wide conductive layer 26b is formed symmetrically in the width direction as shown in FIG. It is the same part, and it is used by changing the direction of the front and back.

The above intermediate insulating plate 22, outer insulating plate 24,
25 are stacked, an electronic component chip such as a semiconductor pellet 23 is housed in the through hole 21 of the intermediate insulating plate 22, and an adhesive agent, for example, a polyimide adhesive agent, is provided between the insulating plates 22, 24, 25. Or, it is adhered by low melting point glass. Then, both ends in the width direction of the laminated body are solder-dipped, and an anode electrode 27 and a cathode electrode 28 are formed as in the completed product of FIG. The surface mount electronic component 20 thus completed is shown in a perspective view in FIG.

[0011]

EXAMPLE A large number of the surface mount electronic components 20 as described above are mass-produced in a lump, and are individually cut in the final step to be completed as one unit. Next, an example will be described. To do. FIG. 11 shows a ceramic insulating assembly plate 29 having a length L1 = 14.5 mm, a width L2 = 13.5 mm, and a plate thickness of 0.3 mm.
4 (25) are integrally formed in the plane direction. In the figure, one unit of the outer insulating plate 24 (2
5) is an outer insulating aggregate plate 29 having a total of 45 pieces of 2.9 mm × 1.5 mm. This assembly board 29
On one surface (A surface), a conductive layer 26a having a width L3 = 0.5 mm is formed by a metallizing process as illustrated. On the other surface (B surface), the width L4 = 1.0 m
Conductive layers 26b each having a length m and a length L5 = 2.05 mm are formed.

In FIG. 12, one unit is width L6 = 1.5 mm,
The length L7 is 2.9 mm, the thickness is 0.4 mm, and the intermediate insulating aggregate plate 30 has a 1 mm square through-hole 21 formed in the approximate center thereof. This one unit is the outer insulating plate 24
A total of 45 pieces are formed in a plane so as to correspond to (25). No conductive layer is formed on the intermediate insulating aggregate plate 30.

Next, a method of manufacturing a surface mount type electronic component using the above-described assembly plate will be described.
First, the side of the outer insulating aggregate plate 29 on which the conductive layer 26b is formed faces upward, and the intermediate insulating aggregate plate 30 to which the adhesive agent made of polyimide resin or low-melting glass is applied in advance is stacked on the side. Next, the semiconductor pellets 23 having the metal electrodes formed on the both main surfaces by the solder layers in advance are housed in the through holes 21 of the intermediate insulating aggregate plate 30. Next, the outer insulating aggregate plate 29 is superposed on the upper surface of the intermediate insulating aggregate plate 30 so that the side on which the conductive layer 26b is formed contacts the semiconductor pellet 23. At this time, the two outer insulating assembly plates 2 are arranged so that the conductive layers 26b are in opposite directions.
9 are superposed with the intermediate insulating aggregate plate 30 sandwiched therebetween. In the above-mentioned state, the adhesive applied to the intermediate insulating aggregate plate 30 is melted by putting it in a heating furnace in an inert gas atmosphere and then cooled to solidify them integrally. At this time, the solder layers previously formed on both main surfaces of the semiconductor pellet 23 may be melted and fixed to the conductive layer 26b.

Next, the semiconductor pellet 23 containing 3
The laminated body made of sheets is cut into units. This cutting method may be a known method, for example, cutting with a diamond blade, cutting with a wire saw, or the like is performed to divide into individual pieces. Next, the conductive layers 26a and 26b at both ends of the outer insulating plates 24 and 25 in the individually divided laminated body are solder-dipped, and as shown in FIG.
7 and the other is the cathode electrode 28.

[0015]

As described above, since the surface mount type electronic component and the method of manufacturing the same according to the present invention are configured as described above, the following advantageous effects can be obtained. Since it constitutes a ceramic package, it can be expected to have high reliability and strong environmental conditions. Since it has no lead wire, there is no bending or bending of the lead. Since no bonding wire is used, it can be applied to relatively large current applications. Due to the above, there is no risk of disconnection. It can be manufactured at low cost with less work man-hours. Since the height (thickness) of the entire electronic component can be reduced, the mounting density when using this component can be increased. Line devices such as chip capacitors and chip resistors can be used. Paper tape can be used for packaging, which keeps packaging costs low.

[Brief description of drawings]

FIG. 1 is a perspective view of an assembly component of a surface mount type electronic component of the present invention.

FIG. 2 is a perspective view showing a finished surface mount electronic component of the present invention.

FIG. 3 is a central vertical cross-sectional view of the surface mount electronic component.

FIG. 4 is a plan view of the surface mount electronic component.

FIG. 5 is a plan view of one outer insulating plate in one unit of the surface mount electronic component.

FIG. 6 is a side view of the outer insulating plate of FIG.

FIG. 7 is a plan view of an intermediate insulating plate in one unit of the surface mount electronic component.

FIG. 8 is a sectional view taken along line XX in FIG.

FIG. 9 is a plan view of the other outer insulating plate in one unit of the surface mount electronic component.

FIG. 10 is a side view of the outer insulating plate of FIG.

FIG. 11 is a plan view of an outer insulating collective plate used when manufacturing the surface mount electronic component of the present invention.

FIG. 12 is a plan view of an intermediate insulating aggregate plate used when manufacturing the surface mount electronic component of the present invention.

FIG. 13 is a cross-sectional view showing the structure of a conventional surface mount electronic component of this type.

FIG. 14 is a sectional view showing another conventional structure.

[Explanation of symbols]

 20 Surface Mounted Electronic Components 21 Through Hole 22 Intermediate Insulating Plate 23 Semiconductor Pellets 24, 25 Outer Insulating Plates 26a, 26b Conductive Layer 27 Anode Electrode 28 Cathode Electrode 29 Outer Insulating Assembly Plate 30 Intermediate Insulating Assembly Plate

Claims (6)

[Claims] 1. An intermediate insulating plate having a through hole in a substantially central portion of a main surface, an electronic component chip such as a semiconductor pellet housed in the through hole of the insulating plate, and both main surfaces of the intermediate insulating plate. A pair of outer insulating plates having conductive layers provided so as to be in contact with the electronic component chips or to be soldered to the electronic component chips, the conductive layers extending to the end portions of the outer insulating plates. A surface mount electronic component, wherein metal electrodes electrically connected to respective electrodes of the electronic component are formed at both ends of the outer insulating plate. 2. The outer electrode plate has one main surface having a wide conductive layer extending from a substantially central portion to one end, and the other main surface having a narrow conductive layer formed at both ends thereof. The surface mount electronic component according to claim 1, wherein 3. A solder layer is provided between a conductive layer provided at both ends of an outer surface of an outer insulating plate facing each other through the intermediate insulating plate and a conductive layer in contact with an electronic component chip housed in the through hole. 3. The surface-mounted electronic component according to claim 1, wherein the surface-mounted electronic component is electrically connected by. 4. The surface mount electronic component according to claim 1, wherein each of the insulating plates is made of a ceramic material. 5. A unit of the intermediate insulating plate, a plurality of intermediate insulating collective plates integrally formed in the plane direction, and one main surface, the conductive layer extends from substantially the central portion to one end portion. On the other main surface, an outer insulating aggregate plate having a plurality of conductive layers integrally formed on both ends in the planar direction, and an electronic component chip having metal electrodes formed by solder layers on both main surfaces are prepared. A step of placing the intermediate insulating aggregate plate on one main surface of the outer insulating aggregate plate, a step of accommodating electronic component chips in each through hole of the intermediate insulating aggregate plate, and then another sheet A step of laminating one of the main surfaces of the outer insulating aggregate plate so as to face the intermediate insulating aggregate plate, and fixing the outer insulating aggregate plate and the intermediate insulating aggregate plate together; The process of cutting and separating into separate parts, and dipping both ends of each separated part with a solder Surface mount electronic component manufacturing method characterized by comprising the steps of forming an electrode, the. 6. The method of manufacturing a surface mount electronic component according to claim 5, wherein the outer insulating aggregate plate and the intermediate insulating aggregate plate are fixed to each other with a heat resistant adhesive.