JPH09307288A - Electronic parts mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To execute various works with one device by providing plural work heads and allocating the work tools of different functions such as a nozzle sucking electronic parts, a camera a dispenser applying adhesive to the respective work heads and installing them. SOLUTION: The nozzle 43 for vacuum-sucking the electronic parts is arranged at the tip of the work head 5, the camera 51 at the work head 6 and the dispenser 42 applying adhesive and the like at the work head 7. The parts recognition camera for recognizing the forms and the positions of the electronic parts which the nozzle 43 sucks is provided for a base 23. When a substrate 13 is fixed, the work head 7 applies adhesive fixing the electronic parts and the like. Then, the camera 51 of the work head 6 inspects the applying state of adhesive, position deviation and the like. Then, the work head 5 adsorbs the electronic parts and the parts recognition camera recognizes the forms of the electronic parts. Then, the electronic parts are mounted on the substrate 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, as an electronic component mounting apparatus, there has been one described in Japanese Patent Application Laid-Open No. 6-216583. 9 is an external view thereof, and FIG. 10 is a diagram showing a process of mounting an electronic component on a substrate.

In FIGS. 9 and 10, the three component mounting heads 8a, 8b and 8c are magnetically coupled to the plane plate 9 by a plane linear motor, respectively, and can freely move within the plane plate 9. Each component mounting head 8a, 8
Nozzles 10 for adsorbing electronic components are provided at the tips of b and 8c. The electronic component adsorbed by the nozzle 10 is recognized by the fixed camera 12 fixed between the component supply device 11 and the positionally fixed substrate 13 for the outer dimensions, the lead pitch, the number, the bending, the positional deviation, and the like. . Then, based on the recognized data, the mounting position is corrected by a control device (not shown), and the mounted device is mounted on the printed circuit board 13.

As shown in FIG. 10, these three component mounting heads sequentially go through the steps of suction, recognition and mounting.
That is, after the component mounting head 8a has picked up an electronic component from the component supply unit 11, it moves in the direction of arrow X, moves to the station where the component mounting head 8b is currently located, and the fixed camera 12 performs the above-mentioned recognition. To the position of the component mounting head 8c in the arrow Y direction
An electronic component is mounted on 3, and the electronic component of the component supply unit 11 is sucked again in the direction of arrow Z. In the meantime, the component mounting head 8b moves to the position of the component mounting head 8c, and the component mounting head 8c moves to the position of the component mounting head 8a to perform the mounting or the suction operation, respectively, and the component mounting heads 8a and 8b.
a, 8b, and 8c were moving clockwise.

[0005]

However, in the electronic component mounting apparatus as described above, the plurality of work heads mounted have only a component mounting function. Therefore, along with the change of the mounting process,
A device having the above function when incorporating a process such as a printed solder paste appearance inspection process for inspecting the state or deviation of cream solder, or a component appearance inspection process for inspecting the positional deviation or missing parts of the components mounted on the board. Need to be separately connected to the pre-process or post-process of the component mounting apparatus, and it has been very difficult to change the layout such as moving the existing apparatus or increasing the installation space.

The present invention has been made to solve the above-mentioned problems, and various work can be carried out by one device by mounting work tools having various functions on a plurality of work heads. It is an object to provide a multifunctional electronic component mounting device.

[0007]

In order to achieve this object, an electronic component mounting apparatus according to a first aspect of the present invention is a planar linear device provided above a base mounted on a base mounted on the base. Aiming to mount an electronic component by a nozzle mounted on a working head that uses a motor as a drive source, in particular, a nozzle that is provided with a plurality of the working heads and that sucks and mounts the electronic component on each working head , Work tools having different functions are allocated and mounted among work tools such as a camera for recognizing electronic parts and the like, a dispenser for applying an adhesive to a place on the board where the electronic parts are mounted. Therefore, after moving the camera to a desired position by a working head equipped with a camera, the position of the substrate is confirmed by the camera, and after moving the dispenser to a desired position by a working head equipped with a dispenser, The adhesive is applied to the substrate, the nozzle is moved to the position where the electronic component is housed by the working head having the nozzle, the electronic component is sucked, and the electronic component is moved to the position where the adhesive is applied. After being moved in a suctioned state, the electronic component is mounted on the position where the adhesive is applied.

According to a second aspect of the present invention, there is provided an electronic component mounting apparatus in which the image on the back surface of the electronic component which is attracted to the nozzle mounted on the base and mounted on the working head is reflected in the horizontal direction. A reflecting mirror and a second reflecting mirror that is arranged on the base and that reflects the image of the first reflecting mirror upward are provided. Therefore, the working head on which the camera is mounted is moved above the second reflecting mirror, and the working head sucking the electronic component by the nozzle is moved above the first reflecting mirror so that the rear surface of the electronic component is removed. Images can be input to the camera.

According to another aspect of the electronic component mounting apparatus of the present invention, the first reflection mirror that reflects the image of the back surface of the electronic component adsorbed by the nozzle in the horizontal direction and the first reflection mirror reflects the image. A second reflecting mirror for reflecting the image in the vertical direction, and the first reflecting mirror for inputting the image of the back surface of the electronic component reflected by the first reflecting mirror to the camera via the second reflecting mirror. And a mirror holding part that supports the second reflecting mirror and is fixed to a work head on which the camera is mounted.
Therefore, by moving the first reflecting mirror to the back surface of the electronic component without moving the work head that has sucked the electronic component to a predetermined position, the image on the back surface of the electronic component is moved to the first reflecting mirror, Input to the camera via a two-reflection mirror.

Further, in the electronic component mounting apparatus according to the fourth aspect, the second reflecting mirror is a half mirror. Therefore, an image of an electronic component or a positioning mark on the substrate below the second reflection mirror can be transmitted through the second reflection mirror and input to the camera.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the electronic component mounting apparatus of the present invention will be described below with reference to the drawings.

FIG. 1 is an overall perspective view of an electronic component mounting apparatus 1 according to the first embodiment. As shown in FIG. 1, the apparatus main body 1 includes a base 23, four columns 21 provided at four corners of the base 23, and a top plate portion 22 supported by the four columns 21. It comprises work heads 5, 6 and 7 mounted on the top plate portion 22.

On the base 23, a conveyor 24 for carrying the substrate 13 and component supply units 25 and 26 (shown in FIG. 2) arranged on both sides of the conveyor 24 are shown. Has been done.

A platen 32 is attached to the lower surface of the top plate 22 so as to face the conveyor 24. The platen 32 is provided with three movers 35a, 35b, 35c magnetically coupled to the platen 32, and can freely move around in the platen 32. The platen 32 and the movers 35a, 3
A plane linear motor is constituted by 5b and 35c.

The movers 35a, 35b and 35c are
Work benches 41a, 41b, 41c are mounted respectively.

Further, as shown in FIG. 3, the platen 3 is
No. 2 is formed by forming teeth 71 on the surface of a steel plate 70 which is a magnetic material at equal intervals in the XY axis directions, and filling the grooves 72 of the teeth 71 with a non-magnetic material, for example, epoxy resin 73. .

The working head 5 has a nozzle 43 as a working tool for vacuum-sucking an electronic component at its tip, a driving means (not shown) for moving the nozzle 43 up and down, and a drive for rotating the nozzle 43. It comprises means (not shown) and the workbench 41a.

The work head 6 is composed of a camera 51 as a work tool for recognizing the state of a board mark, cream solder, and an adhesive printed on the board, an illumination device (not shown), and the work table 41b. There is.

The work head 7 is composed of a dispenser 42 as a work tool for applying cream solder or an adhesive for fixing electronic components to a substrate, and the work table 41c.

The conveyer 24 extends in the left-right direction in FIG. 1, and is configured to convey the substrate 13 from the carry-in position at the right end to the carry-out position at the left end.
A substrate positioning means (not shown) for positioning and fixing the substrate is provided at an intermediate portion of the conveyor 24. When the substrate is supported at this position, the work heads 5, 6, 7 are provided. It is possible to work with.

As shown in FIG. 2, the base 23 is located between the conveyor 24 and the component supply unit 25 and recognizes the shape and position of the electronic component sucked by the nozzle 43. A component recognition camera 45 for doing this is provided.

A plurality of component supply devices 31 can be installed in the component supply units 25 and 26. Each of the component supply devices 31 is of a type that supplies components with component tapes containing components arranged at a fixed pitch, but since this type of supply device is well known, description thereof will be omitted.

Next, the operation of the electronic component mounting apparatus 1 of the first embodiment will be described.

First, the board 13 carried by the conveyor 24 is positioned and fixed by the board positioning means. Next, the work head 6 recognizes one or a plurality of substrate marks provided on the substrate 13 and calculates the position of the substrate 13 by a controller (not shown). After that, the work head 7 applies cream solder or an adhesive to the position on the substrate 13 where the electronic component is mounted. After that, the work head 6 inspects the state of the cream solder or the adhesive applied on the substrate 13 or the positional deviation. After the inspection, the work heads 6 and 7
The work heads 5 move to a position where they do not collide with each other.

Next, the work head 5 moves to the upper part of the component supply unit 25 or 26 and sucks the electronic component from the component supply device 31. The work head 5 moves to the upper part of the component recognition camera 45 while adsorbing the electronic component, and recognizes the shape and position of the adsorbed electronic component. After the recognition is completed, the work head 5 corrects the position of the sucked electronic component by a control device (not shown), and mounts the electronic component on the substrate 1.
Installed in 3. When the scheduled parts mounting work is completed,
The work head 5 is retracted to a position where it does not collide with the work heads 6 and 7, and the conveyor 24 sends out the worked substrate 13. Then, the newly loaded substrate 13 is positioned and fixed, and the above-mentioned mounting work is repeated.

As is apparent from the above description, in the electronic component mounting apparatus 1 according to the first aspect, the camera 51 is moved to a desired position by the work head 6 having the camera 51 mounted thereon, and then the camera 51. The position of the substrate 13 is confirmed by the work head, and the work head 7 having the dispenser 42 is moved to the desired position, and then cream solder or adhesive is applied to the substrate 13 and the work head having the nozzle 43 is mounted. 5, the nozzle 43 is moved to the position where the electronic component is housed, the electronic component is sucked, and the electronic component is moved to the position where the cream solder or the adhesive is applied, In order to mount the electronic component at the position where the cream solder or the adhesive is applied, one machine can perform various functions. Can.

Next, the electronic component mounting apparatus 2 of the second embodiment will be described in detail with reference to FIG. The same components as those in FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted.

The electronic component mounting apparatus 2 includes a work head 5,
6 is mounted.

The working head 5 has a nozzle 43 for vacuum-sucking an electronic component at its tip, a driving means (not shown) for moving the nozzle 43 up and down, and a driving means (not shown) for rotating the nozzle 43. And a workbench 41a.

A camera 51 mounted on the working head 6
Serves as a work tool for recognizing the board mark printed on the board and the electronic component sucked by the nozzle 43.

Further, the conveyor 24 on the base 23
And the component supply unit 25, a pair of reflection mirrors 4
7, 48 are attached. The reflection mirror 47
Serves as a first reflecting mirror that horizontally reflects the image of the back surface of the sucked electronic component above the reflecting mirror 47. The reflection mirror 48 functions as a second reflection mirror that reflects the image reflected in the horizontal direction by the reflection mirror 47 upward (in the vertical direction) of the reflection mirror 48.

The electronic component mounting apparatus 2 does not require the camera 45 provided on the base 23.

Next, the operation of the electronic component mounting apparatus 2 according to the second embodiment will be described in detail with reference to FIG.

First, the carried-in substrate 13 is positioned and fixed by a substrate positioning means (not shown). Next, the work head 8 is provided on the substrate 13
Individual or plural substrate marks are recognized, and the position of the substrate 13 is calculated by a controller (not shown). When the above-mentioned recognition is completed, the work head 8 moves to a position above the reflection mirror 48 and stands by as it is.

Next, the work head 5 moves to the upper part of the component supply unit 25 or 26 and sucks the electronic component from the component supply device 31. After that, the work head 5 is moved to the reflection mirror 47.
Move to the position above. At this position, the image of the sucked electronic component is taken into the camera 51 of the work head 6 by the reflection mirrors 47 and 48, and the shape and position of the sucked component are recognized. FIG. 5 is a schematic diagram showing a state at the time of recognizing an electronic component. After the recognition is completed, the work head 5 corrects the position of the sucked electronic component based on the data calculated by the control device (not shown), and mounts the electronic component on the substrate 13. When the scheduled component mounting work is completed, the work head 5 is retracted to a position where it does not collide with the work head 6, and the conveyor 24 sends out the worked substrate 13. Then, the newly loaded substrate 13 is positioned and fixed, and the above-mentioned mounting work is repeated.

As described above, since the recognition of the board mark and the recognition of the parts can be performed by one camera 51, the apparatus can be provided at a low cost.

Next, the electronic component mounting apparatus 3 of the third embodiment will be described with reference to FIGS. 6 and 7. The same components as those in FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted.

The electronic component mounting apparatus 3 includes a work head 8,
9 is mounted.

The working head 9 is a camera 6 for recognizing the shape and position of the electronic component sucked by the nozzle 43.
0, a pair of reflection mirrors 61 and 62, a mirror holding portion 63 for supporting the reflection mirrors 61 and 62, a workbench 41e, and an illumination device (not shown).

The working head 8 has a nozzle 43 as a working tool for vacuum-adsorbing an electronic component at its tip, a drive means (not shown) for moving the nozzle 43 up and down, and a drive for rotating the nozzle 43. It comprises means (not shown), a workbench 41d, a camera 44 as a work tool for recognizing the board mark, and an illumination device (not shown).

The reflection mirror 62 horizontally reflects the image on the back surface of the electronic component adsorbed by the nozzle 43.
Functions as a reflection mirror. The reflection mirror 61 reflects the image reflected in the horizontal direction by the reflection mirror 62 to the upper side (the vertical direction) of the reflection mirror 61.
Functions as a reflection mirror.

The mirror holding portion 63 is formed in a substantially L-shaped tubular shape and is fixed to the work table 41e. A camera 60 is housed inside the mirror holding portion 63, and at the lower corner of the camera 60, the reflection mirror 61 vertically reflects an image reflected by the reflection mirror 62 in the horizontal direction. It is fixed so that it can be tilted.

Further, FIG. 7A of the mirror holding portion 63.
An opening 64 is provided at the upper left end so that the image of the back surface of the electronic component sucked by the nozzle 43 can be seen through the opening 64. Further, the mirror holder 6
A reflection mirror 62 for reflecting the image of the back surface of the electronic component adsorbed by the nozzle 43 on the reflection mirror 61 is tilted and fixed inside 3 and below the opening 64.

In the electronic component mounting apparatus 3, a camera 45 provided on the base 23 of the electronic component mounting apparatus 1
Do not need.

Next, the operation of the electronic component mounting apparatus 3 according to the third embodiment will be described in detail with reference to FIG.

First, the board 13 carried by the conveyor 24 is positioned and fixed by the board positioning means. Next, the camera 4 provided on the work head 8
4, one or a plurality of board marks provided on the board 13 are recognized, and the position of the board 13 is calculated by a controller (not shown). Next, the nozzle 43 of the work head 8 is moved to the component supply device 31 of the component supply unit 25 or 26 by the mover 35d. After that, the electronic component housed in the component supply device 31 is sucked by the nozzle 43, and the sucked electronic component is moved toward the position on the substrate 13 to be mounted. At the same time, the work head 9 is moved so that the electronic component sucked by the nozzle 43 is located above the opening 64 (FIG. 7A).

The work head 9 keeps a fixed position with the work head 8 so that the camera 60 can always capture the suction posture of the components even when the work head 8 is moving until the recognition by the camera 60 is completed. Move while holding. At this time, as shown in FIG. 7B, the back surface of the electronic component sucked by the nozzle 43 is reflected by the reflection mirror 62 in the direction of the reflection mirror 61, and further, the reflection mirror 61.
Is reflected in the direction of the camera 60. In this way, the image of the back surface of the electronic component sucked by the nozzle 43 can be input to the camera 60, and after recognizing the shape and position of the electronic component, the work head 9 equipped with the camera 60 or the like can , Away from the work head 8 on which the nozzle 43 is mounted (FIG. 7C). The working head 8 mounts the electronic component on the substrate 13 after the mounting position is corrected by a controller (not shown).

As described above, since the work head 8 can pick up electronic components from the component supply device 31 and move them until they are mounted on the substrate 13, the work head 9 can perform the component recognition work. The installed tact can be significantly shortened.

Next, an electronic component mounting apparatus according to the fourth embodiment will be described with reference to FIG. The same components as those in FIG. 7 are designated by the same reference numerals. Further, the working heads used in the electronic component mounting apparatus according to claim 4 are the working head 5 according to claim 1 and a working head 10 described later, and like the electronic component mounting apparatus 3, electronic component mounting is performed. A camera 45 provided on the base 23 of the device 1
Do not need.

The working head 10 recognizes the shape and position of the electronic component sucked by the nozzle 43 and recognizes the board mark, a pair of reflecting mirrors 69 and 62, and the reflecting mirror 69. , 62, a workbench 41f, and a plurality of LEDs 70 as a lighting device.

The reflection mirror 62 horizontally reflects the image on the back surface of the electronic component adsorbed by the nozzle 43.
Functions as a reflection mirror. The reflection mirror 69 reflects the image reflected in the horizontal direction by the reflection mirror 61 to the upper side (vertical direction) of the reflection mirror 61.
It functions as a reflection mirror and is composed of a half mirror.

The mirror holding portion 50 is formed in a substantially L-shaped cylindrical shape and is fixed to the workbench 41f. A camera 60 is housed inside the mirror holding unit 50, and at the lower corner portion of the camera 60, the reflection mirror 69 vertically reflects the image reflected by the reflection mirror 62 in the horizontal direction. It is fixed so that it can be tilted. The reflection mirror 6 of the mirror holder 50
An opening 67 is provided in the lower portion of the camera 9 for allowing an image below the camera 60 to pass through the reflection mirror 69 and be taken into the camera 60.

An opening 64 is provided at the upper right end of the mirror holding portion 50 in FIG. 8 so that an image of the back surface of the electronic component sucked by the nozzle 43 can be seen through the opening 64. Further, a reflection mirror 62 for reflecting the image of the back surface of the electronic component adsorbed by the nozzle 43 to the reflection mirror 69 is tilted and fixed inside the mirror holding unit 50 and below the opening 64. ing. In addition, around the openings 64 and 67, the L
An ED 70 is provided.

Next, the operation of the electronic component mounting apparatus of the fourth embodiment will be described. FIG. 8 shows the substrate 1 by the camera 60.
It is explanatory drawing at the time of reading the mark 65 of 3.

In the electronic component mounting apparatus 3 of claim 3, the camera 44 provided on the work head 8 is used to read the mark 65 on the substrate 13. However, the electronic component mounting of claim 4 is performed. In the apparatus, it can be performed by a camera 60 provided on the working head 10. This is because the image of the substrate 13 is the opening 6 provided in the mirror holding unit 50.
7 is taken in, transmitted through the reflection mirror 69, and the camera 6
Input to 0. The electronic component sucked by the nozzle 43 is input to the camera 60 via the opening 64, the reflection mirror 62, and the reflection mirror 69, as in FIG. 7. The other operations are the same as those of the electronic component mounting apparatus 3 according to the third aspect, and thus the description thereof will be omitted.

As is apparent from the above description, in the above-described electronic component mounting apparatus, the substrate below the reflection mirror 69 constituted by a half mirror, the electronic components, etc. are reflected by the reflection mirror 6.
Since the light passes through 9 and is input to the camera 60, the image of the back surface of the electronic component sucked by the nozzle 43 at a desired position can be input by one camera 60, and the reflection mirror 69 such as a mark on the substrate The lower part can also be input to the camera 60.

[0057]

As is apparent from the above description, the electronic component mounting apparatus according to the first aspect of the invention has the nozzle for adsorbing and mounting the electronic component on each work head, the camera for recognizing the electronic component, and the like on the substrate. Since different work tools can be allocated and loaded from work tools such as dispensers that apply an adhesive to a place where electronic components are mounted, a single device can be easily multi-functionalized. Also, the assembly process can be easily changed by replacing the work head as necessary. In addition, by mounting the board mark recognition camera and the component recognition camera on a work head different from the work head that picks up and mounts the component, the tact time can be significantly reduced.

According to another aspect of the electronic component mounting apparatus of the present invention, the working head on which the camera is mounted is moved above the second reflecting mirror, and the working head sucking the electronic component by the nozzle is attached to the first reflecting mirror. Since the image of the back surface of the electronic component can be moved upward and input to the camera to recognize the suction state of the electronic component, the suction state of the component and the positioning mark of the board can be read by one camera.

Further, in the electronic component mounting apparatus according to the third aspect of the present invention, the working head mounted with the camera together with the mirror holding portion holding the first reflecting mirror without moving the working head sucking the electronic component to a predetermined position. Is moved to the back surface of the electronic component so that the image on the back surface of the electronic component is input to the camera via the first reflection mirror and the second reflection mirror, so that the work head equipped with the nozzle is moved to the position where the camera is located every time. There is no need to move it, and electronic components can be mounted on the shortest path.

Further, the work head equipped with the camera can be moved together with the work head equipped with the nozzle for sucking the electronic parts, and the mounting time can be shortened.

Further, in the electronic component mounting apparatus according to the fourth aspect, an image of a substrate, an electronic component or the like below the second reflecting mirror formed of a half mirror can be input to the camera through the half mirror. Therefore, it is possible to input the image of the back surface of the electronic component sucked by the nozzle at a desired position with one camera, and to input the component under the half mirror such as a mark on the substrate to the camera. And so on.

[Brief description of drawings]

FIG. 1 is a diagram showing an appearance of an electronic component mounting apparatus according to a first embodiment.

FIG. 2 is a plan view of a base of the electronic component mounting apparatus according to the first embodiment as viewed from above.

FIG. 3 is a partial perspective view showing a configuration of a platen.

FIG. 4 is a diagram showing an appearance of an electronic component mounting apparatus according to a second embodiment.

FIG. 5 shows an electronic component mounting apparatus according to a second embodiment,
It is a state diagram when recognizing an electronic component sucked by a nozzle.

FIG. 6 is a diagram showing an appearance of an electronic component mounting apparatus according to a third embodiment.

FIG. 7 shows an electronic component mounting apparatus according to a third embodiment,
It is a state diagram when recognizing an electronic component sucked by a nozzle.

FIG. 8 shows an electronic component mounting apparatus according to a fourth embodiment,
It is a state diagram when recognizing a positioning mark of a substrate.

FIG. 9 is an external view of a conventional electronic component mounting apparatus.

FIG. 10 is a diagram showing a process of mounting an electronic component on a board in a conventional electronic component mounting apparatus.

[Explanation of symbols]

 1 Main body 5 Working head 6 Working head 7 Working head 35a Movable element 35b Movable element 35c Movable element 41a Working table 41b Working table 41c Working table 42 Dispenser 43 Nozzle 51 Camera

Claims (4)

[Claims] 1. An electronic component mounting apparatus for mounting an electronic component on a substrate mounted on a base by a nozzle mounted on a work head having a planar linear motor provided above the base as a drive source. A plurality of working heads are provided, a nozzle for adsorbing and mounting electronic components on each working head, a camera for recognizing electronic components, etc., and an adhesive is applied to a portion on the substrate where the electronic components are mounted. The electronic component mounting apparatus is characterized in that work tools having different functions are allocated and mounted among the work tools such as dispensers. 2. A first reflecting mirror, which is arranged on the base and horizontally reflects an image of the back surface of the electronic component adsorbed by a nozzle mounted on the working head, and a first reflection mirror arranged on the base and A second reflection mirror that reflects the image of the first reflection mirror upward; and a work head that mounts the camera, moves the work head above the second reflection mirror, and sucks an electronic component by the nozzle. 2. The electronic component mounting apparatus according to claim 1, wherein the image of the back surface of the electronic component is input to the camera by moving it above the first reflecting mirror. 3. A first reflecting mirror that horizontally reflects an image of the back surface of the electronic component adsorbed to the nozzle, and a second reflecting mirror that vertically reflects the image reflected by the first reflecting mirror. Supporting the first reflecting mirror and the second reflecting mirror so that an image of the back surface of the electronic component reflected by the first reflecting mirror is input to the camera via the second reflecting mirror, and the camera The electronic component mounting apparatus according to claim 1, further comprising: a mirror holding unit fixed to a work head on which is mounted. 4. The electronic component mounting apparatus according to claim 3, wherein the second reflecting mirror is a half mirror.