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JPH09272176A - Production of metal foil polyimide laminated board - Google Patents

Production of metal foil polyimide laminated board

Info

Publication number
JPH09272176A
JPH09272176A JP8413096A JP8413096A JPH09272176A JP H09272176 A JPH09272176 A JP H09272176A JP 8413096 A JP8413096 A JP 8413096A JP 8413096 A JP8413096 A JP 8413096A JP H09272176 A JPH09272176 A JP H09272176A
Authority
JP
Japan
Prior art keywords
metal foil
polyimide
laminated
hot air
laminating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8413096A
Other languages
Japanese (ja)
Inventor
Nobuyuki Sudo
信行 須藤
Kazunori Kojima
一記 小島
Masanao Kobayashi
正尚 小林
Koichi Aizawa
相沢  浩一
Shigeyuki Shishido
重之 宍戸
Takaaki Tsushima
敬章 津嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP8413096A priority Critical patent/JPH09272176A/en
Publication of JPH09272176A publication Critical patent/JPH09272176A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To prepare in a short time and inexpensively a large amt. of high quality metal foil polyimide laminated boards by a method wherein metal foils are laminated through a polyimide layer dried with hot air in a hot-air drying oven and they are contact-bonded and laminated together by means of pressure rollers. SOLUTION: A copper foil 10 and a stainless steel thin sheet 11 between which a polyimide film 12 is placed are fed into a hot air drying oven 22 and they are contact-bonded by means of pressure rollers 20 and 21 but before that, as they are heated with dry hot air at 250 deg.C blown out from a hot air blowing apparatus and are dehumidified and dried, the copper foil 10 and the stainless steel thin sheet 11 are strongly bonded and laminated to obtain a continuous laminated board 1a, which is transferred to a width adjusting device 3. A shearing device 4 cuts a width-adjusted laminated sheet 1c forwarded from the width adjusting device 3 to a specified length by means of a cutter 40 and a number of metal foil polyimide laminated boards 1 with a definite length are forwarded outside.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、金属箔層とポリイ
ミド層とから成る金属箔ポリイミド積層板を製造する方
法に関する。
TECHNICAL FIELD The present invention relates to a method for producing a metal foil-polyimide laminate comprising a metal foil layer and a polyimide layer.

【0002】[0002]

【従来の技術】二枚の金属箔をポリイミド層を介してラ
ミネートして成る金属箔ポリイミド積層板は公知であ
り、可撓性があって薄く軽量である上、強靱であるので
広く用いられている。この金属箔ポリイミド積層板の使
用例としては、印刷回路基板、面状発熱体、電磁シール
ド材料、サスペンション材料、フラットケーブル、包装
材料等が挙げられる。
2. Description of the Related Art A metal foil-polyimide laminate made by laminating two metal foils via a polyimide layer is known, and is widely used because it is flexible, thin and lightweight, and tough. There is. Examples of use of this metal foil polyimide laminate include printed circuit boards, sheet heating elements, electromagnetic shield materials, suspension materials, flat cables, packaging materials and the like.

【0003】従来公知のこの金属箔ポリイミド積層板を
製造する場合、貼り合わせる金属箔の何れか一方に接着
剤として有用なポリイミドワニスを塗布乾燥させ、次い
で、その接着剤が塗布された金属箔と、他方の金属箔と
をそれぞれ所定のサイズに剪断し、それらを重ね合わせ
た後、乾燥工程及び真空プレス工程を経て製品を得てい
たものである。また、別の製造方法として、二枚の金属
箔及びポリイミドフィルムをそれぞれ所定のサイズに剪
断し、それらを重ね合わせた後、上記と同様にして製品
を得る方法があった。
In the case of producing this conventionally known metal foil polyimide laminate, a polyimide varnish useful as an adhesive is applied to one of the metal foils to be bonded and dried, and then the metal foil coated with the adhesive is used. The other metal foil was sheared to a predetermined size, and after overlapping them, the product was obtained through a drying process and a vacuum pressing process. Further, as another manufacturing method, there is a method in which two metal foils and a polyimide film are each sheared to a predetermined size, and these are superposed, and then a product is obtained in the same manner as above.

【0004】しかしながら、これらの製造方法では、二
枚の金属箔やポリイミドフィルムを重ね合わせる作業は
自動化が困難であり、熟練した工員の手作業に頼ってい
るので効率が悪いので生産性が低いと共に、位置合わせ
の精度も低く、また、重ね合わせの際に切断屑や塵等が
間に挟まって欠陥製品となる割合が高くなり、製造費が
嵩むという問題があった。
However, in these manufacturing methods, it is difficult to automate the work of superposing two metal foils or polyimide films, and it depends on the manual work of a skilled worker so that the efficiency is low and the productivity is low. However, there is a problem in that the positioning accuracy is low, and that the rate of defective products due to cutting chips or dust being sandwiched between them at the time of superposition increases, resulting in an increase in manufacturing cost.

【0005】また、上記の製造方法によるときは、乾燥
工程及び真空プレス工程によって、ポリイミド接着剤や
ポリイミドフィルムのキュアに先立って、その含有水分
を除去すると共に、各層間に存在する気体を吸引除去し
て、ポリイミド層をキュアし、これにより接着力を強化
する必要があった。しかし、二枚の金属箔をポリイミド
層を介して積層した後に乾燥及び気体の除去を行うこと
は非常に効率が悪く、これら両工程には長時間を要する
ため、製造時間が長くなってしまうという問題があっ
た。
Further, according to the above manufacturing method, the moisture contained in the polyimide adhesive or the polyimide film is removed and the gas existing between the layers is removed by suction by a drying step and a vacuum pressing step prior to the curing of the polyimide adhesive or the polyimide film. Then, it was necessary to cure the polyimide layer and thereby strengthen the adhesive force. However, it is very inefficient to perform drying and removal of gas after stacking two metal foils via a polyimide layer, and it takes a long time for both of these steps, resulting in a long manufacturing time. There was a problem.

【0006】[0006]

【発明が解決しようとする課題】本発明は上記の問題点
を解決するためなされたものであり、その目的とすると
ころは、簡単な装置により、完全に自動的又は半自動的
に実行され、熟練した人手を要せず、製造不良が少な
く、短時間で安価に多量の高品質の製品を提供できる金
属箔ポリイミド積層板の製造方法を提供することにあ
る。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to be carried out completely automatically or semi-automatically by a simple device. Another object of the present invention is to provide a method for producing a metal foil-polyimide laminate, which can provide a large amount of high-quality products at low cost in a short time with less manufacturing defects, requiring less labor.

【0007】[0007]

【課題を解決するための手段】上記の目的は、多数の長
尺の金属箔を、ポリイミド層を挟んで、又は、一枚の長
尺の金属箔と長尺のポリイミドフィルムが重なり合うよ
う熱風乾燥炉内に連続的に供給し、ポリイミドを加熱、
乾燥させてからそれらを熱風乾燥炉内に設けられた圧着
ローラーで圧着し、その積層板シートを、指定された寸
法に剪断し、これを多数積み重ねてプレスにより加圧、
接着強度と共に平坦度を高めることにより達成される。
[Means for Solving the Problems] The above object is to dry a large number of long metal foils by sandwiching a polyimide layer, or by hot air drying so that one long metal foil and a long polyimide film are overlapped with each other. It is continuously supplied into the furnace to heat the polyimide,
After they are dried, they are pressure-bonded with a pressure roller provided in a hot-air drying furnace, the laminated sheet is sheared to a specified size, and a large number of these are stacked and pressed by a press,
This is achieved by increasing the flatness together with the adhesive strength.

【0008】而して、上記の二枚の金属箔をラミネート
するときは、それぞれの金属箔の間にポリイミドフィル
ムを挟むようにすることが推奨されるが、金属箔の対向
面の少なくとも一方にポリイミドワニスを塗布し、これ
ら金属箔を重ねて圧着するようにしても良いものであ
る。
When laminating the two metal foils described above, it is recommended that a polyimide film be sandwiched between the metal foils, but it is recommended that at least one of the opposing surfaces of the metal foils be laminated. It is also possible to apply a polyimide varnish, stack these metal foils, and press-bond them.

【0009】[0009]

【発明の実施の形態】以下、図面により本発明の詳細を
説明する。図1は本発明方法において順次実行される工
程順序の一実施例を説明する説明図である。図1中、1
は銅箔10及びステンレス薄板11を、ポリイミドフィ
ルム12を介して重ね合わせて成る金属箔ポリイミド積
層板、2はローラー圧接装置、3は整幅装置、4は剪断
装置、5はプレス装置、6は検査装置である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory view for explaining an embodiment of a process sequence sequentially executed in the method of the present invention. In FIG. 1, 1
Is a metal foil polyimide laminated plate formed by stacking a copper foil 10 and a stainless steel thin plate 11 via a polyimide film 12, 2 is a roller pressure welding device, 3 is a width adjusting device, 4 is a shearing device, 5 is a pressing device, and 6 is It is an inspection device.

【0010】ポリイミドフィルム12は、高耐熱性ポリ
イミドフィルムの両面に熱可塑性ポリイミドを塗布した
ものである。銅箔10、ステンレス薄板11及びポリイ
ミドフィルム12はそれぞれ長尺のものであって、予め
これらを巻き取ってそれぞれ銅箔コイル100、ステン
レス薄板コイル110及びポリイミドフィルムロール1
20としておく。
The polyimide film 12 is a high heat resistant polyimide film coated with thermoplastic polyimide on both sides. The copper foil 10, the stainless steel thin plate 11 and the polyimide film 12 are long ones, and they are wound up in advance to form the copper foil coil 100, the stainless steel thin plate coil 110 and the polyimide film roll 1, respectively.
I will set it to 20.

【0011】ローラー圧接装置2は、表面がテトラクロ
ロエチレン樹脂でコートされた一対の圧着ローラー2
0、21を具備する熱風乾燥炉22から成る。図では省
略したが、熱風乾燥炉22の外部には銅箔コイル10
0、ステンレス薄板コイル110及びポリイミドフィル
ムロール120を装着するための装置が設けられ、銅箔
10、及びステンレス薄板11はポリイミドフィルム1
2を挟んで熱風乾燥炉22に供給され、圧着ローラー2
0、21で圧着されるが、その前に、図示しない熱風吹
出装置から吹き出す250℃の乾燥した熱風によって加
熱され、除湿、乾燥されるので、銅箔10及びステンレ
ス薄板11は強固に接着され、ラミネートされ、長尺の
積層板シート1aとなり、整幅装置3に送られることと
なる。
The roller pressure contact device 2 comprises a pair of pressure-bonding rollers 2 whose surfaces are coated with tetrachloroethylene resin.
It consists of a hot air drying oven 22 equipped with 0 and 21. Although not shown in the drawing, the copper foil coil 10 is provided outside the hot air drying furnace 22.
0, a device for mounting the stainless thin plate coil 110 and the polyimide film roll 120 is provided, and the copper foil 10 and the stainless thin plate 11 are the polyimide film 1
It is supplied to the hot-air drying oven 22 with 2 sandwiched between it and the pressure roller 2
Although it is pressure-bonded with 0 and 21, before that, it is heated by the dry hot air of 250 ° C. blown from a hot air blower (not shown), dehumidified and dried, so that the copper foil 10 and the stainless thin plate 11 are firmly bonded, The long laminated sheet 1a is laminated and sent to the width adjusting device 3.

【0012】整幅装置3は、ローラー圧接装置2によっ
て製造された長尺の積層板シート1aを内部に引き込
み、回転カッター30でそのみみ1bを落として積層板
シート1aの幅を整え、所定幅の整幅積層板シート1c
として外部に送り出すと共に、切り落としたみみ1bを
回収する。この整幅装置3は、回転カッター30の周囲
の空気を吸引し、回転カッター30による切断屑が整幅
積層板シート1cに付着するのを防ぐための吸気装置3
1を有する。剪断装置4は、整幅装置3から送出された
整幅積層板1cを内部に引き込み、カッター40で指定
された長さに切断し、多数の定寸の金属箔ポリイミド積
層板1として外部に送り出すものであり、整幅装置3と
同様に切断屑を除去するための吸気装置41を有する。
The width adjusting device 3 draws the long laminated sheet 1a manufactured by the roller pressure welding device 2 into the inside, and trims the ridge 1b with the rotary cutter 30 to adjust the width of the laminated sheet 1a to a predetermined width. Width width laminated sheet 1c
And the cut-out pit 1b is collected. The width adjusting device 3 sucks the air around the rotary cutter 30 and prevents the cutting scraps of the rotary cutter 30 from adhering to the width adjusting laminated sheet 1c.
One. The shearing device 4 draws the width-adjusting laminated plate 1c sent from the width-adjusting device 3 into the inside, cuts it into a length specified by a cutter 40, and sends it out as a large number of metal foil polyimide laminated plates 1 of a fixed size. Like the width adjusting device 3, it has an air intake device 41 for removing cutting chips.

【0013】プレス装置5は、固定熱板50aを保持す
る門型の枠体50と、固定熱板50aの下側に、それと
平行、かつ、それぞれ所定範囲を上下方向に移動可能に
保持された三枚の可動熱板51、52、53と、最下層
の可動熱板53の下側に設けられ、その可動熱板53を
上方に0.5kg/cm2の圧力で押し上げる昇降装置54と
を具備する。
The pressing device 5 is held below the fixed heat plate 50a and a gate-shaped frame 50 for holding the fixed heat plate 50a so as to be movable in a vertical direction in parallel with each other and in a predetermined range. The three movable hot plates 51, 52, 53 and the elevating device 54 which is provided below the lowermost movable hot plate 53 and pushes the movable hot plate 53 upward with a pressure of 0.5 kg / cm 2. To have.

【0014】固定熱板50a及び可動熱板51、52、
53は、図示しない加熱装置により275℃に保たれる
ものである。このプレス装置5は、金属箔ポリイミド積
層板1を複数枚積み重ね、その上下面にゴムマットを配
したものを、熱板の各間隙に三段に分散して格納するも
のであり、各熱板を加熱しながら昇降装置54を作動さ
せることによって各熱板で金属箔ポリイミド積層板1を
プレスするものである。検査装置6は、プレス装置5で
プレスし終わった金属箔ポリイミド積層板1を一枚一枚
検査し、図示しない装置によって不良品を分別するもの
である。このようにして得られる金属箔ポリイミド積層
板1は、印刷回路基板として好適なものである。
Fixed hot plate 50a and movable hot plates 51, 52,
53 is maintained at 275 ° C. by a heating device (not shown). This pressing device 5 is a device for stacking a plurality of metal foil polyimide laminated plates 1 and arranging rubber mats on the upper and lower surfaces thereof and storing them in the respective gaps of the heating plates in three steps. By operating the elevating device 54 while heating, the metal foil polyimide laminate 1 is pressed by each hot plate. The inspection device 6 inspects the metal foil polyimide laminates 1 pressed by the pressing device 5 one by one, and separates defective products by a device (not shown). The metal foil polyimide laminate 1 thus obtained is suitable as a printed circuit board.

【0015】[0015]

【実施例1】塗工機を用いて、市販の厚さ18μmの銅
ニッケル合金箔に、ポリアミド酸溶液を均一かつ連続的
に直接流延塗布し、加熱してポリアミド酸溶液の溶媒除
去すると共にイミド化し、ポリイミド塗布金属箔を得、
それを巻き取ってコイルとした。このポリイミド塗布金
属箔の厚さは28μmであった。
Example 1 Using a coating machine, a commercially available copper-nickel alloy foil having a thickness of 18 μm was directly and uniformly cast by casting a polyamic acid solution and heated to remove the solvent of the polyamic acid solution. Imidize to obtain polyimide coated metal foil,
It was wound into a coil. The thickness of the polyimide-coated metal foil was 28 μm.

【0016】このポリイミド塗布金属箔コイルと、厚さ
18μmのSUS304箔コイルとを使用し、ポリイミ
ド塗布金属箔のポリイミド層側にSUS304箔が接す
るようにして、上記の方法によって、温度220℃、線
圧力20kgf/cmの条件でラミネートし、整幅及び剪断を
行い、245℃、75kg/cm2の条件で1時間プレスし、
金属箔ポリイミド積層板を得た。この金属箔ポリイミド
積層板のピール強さは、SUS304層とポリイミド層
の間で0.9kgf/cm、銅ニッケル合金層とポリイミド層
の間で0.5kgf/cmであり、反り、ねじれ、しわ、傷や
ごみ等の欠陥は認められなかった。また、288℃、6
0秒間の半田浴浸漬後もフクレやハガレは全く見られな
かった。
Using this polyimide-coated metal foil coil and a SUS304 foil coil having a thickness of 18 μm, the SUS304 foil was brought into contact with the polyimide layer side of the polyimide-coated metal foil and the temperature was 220 ° C. Laminated under the condition of pressure 20kgf / cm, sized and sheared, and pressed under the condition of 245 ° C and 75kg / cm 2 for 1 hour,
A metal foil polyimide laminate was obtained. The peel strength of this metal foil polyimide laminate is 0.9 kgf / cm between the SUS304 layer and the polyimide layer, 0.5 kgf / cm between the copper-nickel alloy layer and the polyimide layer, and warps, twists, wrinkles, No defects such as scratches and dust were observed. 288 ° C, 6
No swelling or peeling was observed even after immersion in the solder bath for 0 second.

【0017】[0017]

【実施例2】塗工機を用いて、市販の厚さ18μmの銅
箔に、ポリアミド酸溶液を均一かつ連続的に直接流延塗
布し、加熱してポリアミド酸溶液の溶媒を除去すると共
にイミド化し、ポリイミド塗布金属箔を得、それを巻き
取って二本のコイルとした。このポリイミド塗布金属箔
の厚さは28μmであった。
Example 2 A commercial copper foil having a thickness of 18 μm was directly and evenly and continuously cast onto a commercially available 18 μm thick copper foil by a coating machine, and the solvent of the polyamic acid solution was removed by heating to remove the imide. To obtain a polyimide-coated metal foil, which was wound into two coils. The thickness of the polyimide-coated metal foil was 28 μm.

【0018】この二本のポリイミド塗布金属箔コイルを
使用し、それぞれのポリイミド層が接するようにして、
実施例1と同様にして金属箔ポリイミド積層板を得た。
この金属箔ポリイミド積層板のピール強さは、いずれの
銅層とポリイミド層との間でも0.6kgf/cmであり、反
り、ねじれ、しわ、傷やごみ等の欠陥は認められなかっ
た。また、288℃、60秒間の半田浴浸漬後もフクレ
やハガレは全く見られなかった。
Using these two polyimide-coated metal foil coils, the respective polyimide layers are in contact,
A metal foil polyimide laminate was obtained in the same manner as in Example 1.
The peel strength of this metal foil polyimide laminate was 0.6 kgf / cm between any of the copper layers and the polyimide layer, and defects such as warpage, twisting, wrinkling, scratches and dust were not recognized. In addition, no blistering or peeling was observed at all after the solder bath immersion at 288 ° C. for 60 seconds.

【0019】[0019]

【実施例3】塗工機を用いて、市販の厚さ12.5μm
のポリイミドフィルム(商品名:アピカルNPI、鐘淵
化学)の両面に、ポリアミド酸溶液を均一かつ連続的に
直接流延塗布し、加熱してポリアミド酸溶液の溶媒を除
去すると共にイミド化し、長尺のポリイミドフィルムを
得、それを巻き取ってコイルとした。この加工ポリイミ
ドフィルムの厚さは18μmであった。
Example 3 Using a coating machine, a commercially available thickness of 12.5 μm
Polyimide film (trade name: Apical NPI, Kanegafuchi Chemical Co., Ltd.) is uniformly and continuously cast directly on both sides of the polyimide film, and heated to remove the solvent of the polyamic acid solution and to imidize it, and to lengthen it. To obtain a polyimide film, which was wound into a coil. The thickness of this processed polyimide film was 18 μm.

【0020】このポリイミドフィルムと、厚さ18μm
の銅ニッケル合金箔と、厚さ18μmのSUS304箔
とを使用し、銅ニッケル合金箔とSUS304箔が、加
工ポリイミドフィルムを介して重なるようにして、実施
例1と同様にして金属箔ポリイミド積層板を得た。この
金属箔ポリイミド積層板のピール強さは、SUS304
層とポリイミド層の間で0.9kgf/cm、銅ニッケル合金
層とポリイミド層の間で0.5kgf/cmであり、反り、ね
じれ、しわ、傷やごみ等の欠陥は認められなかった。ま
た、288℃、60秒間の半田浴浸漬後もフクレやハガ
レは全く見られなかった。
This polyimide film and a thickness of 18 μm
Using the copper-nickel alloy foil and the SUS304 foil having a thickness of 18 μm, the copper-nickel alloy foil and the SUS304 foil are overlapped with each other with the processed polyimide film interposed therebetween, and the metal foil-polyimide laminate is prepared in the same manner as in Example 1. Got The peel strength of this metal foil polyimide laminate is SUS304.
It was 0.9 kgf / cm between the layer and the polyimide layer, and 0.5 kgf / cm between the copper-nickel alloy layer and the polyimide layer, and defects such as warp, twist, wrinkle, scratch and dust were not recognized. In addition, no blistering or peeling was observed at all after the solder bath immersion at 288 ° C. for 60 seconds.

【0021】[0021]

【実施例4】塗工機を用いて、市販の厚さ25μmのポ
リイミドフィルム(商品名:UPILEX−S、宇部興
産)の両面に、ポリイミドワニスを均一かつ連続的に直
接流延塗布し、加熱してポリイミドワニスの溶媒を除去
すると共にイミド化し、長尺状加工ポリイミドフィルム
を得、それを巻き取ってコイルとした。この加工ポリイ
ミドフィルムの厚さは37μmであった。
[Example 4] Using a coating machine, a polyimide varnish was cast directly and continuously on both surfaces of a commercially available polyimide film having a thickness of 25 µm (trade name: UPILEX-S, Ube Industries) and heated. Then, the solvent of the polyimide varnish was removed and at the same time imidized to obtain a long-sized processed polyimide film, which was wound into a coil. The thickness of this processed polyimide film was 37 μm.

【0022】このポリイミドフィルムと、厚さ18μm
のベリリウム銅合金箔と、厚さ18μmの電解銅箔とを
使用し、ベリリウム銅合金箔と電解銅箔が、加工ポリイ
ミドフィルムを介して重なるようにして、実施例1と同
様にして金属箔ポリイミド積層板を得た。この金属箔ポ
リイミド積層板のピール強さは、電解銅層とポリイミド
層の間で0.9kgf/cm、ベリリウム銅合金層とポリイミ
ド層の間で0.4kgf/cmであり、反り、ねじれ、しわ、
傷やごみ等の欠陥は認められなかった。また、288
℃、60秒間の半田浴浸漬後もフクレやハガレは全く見
られなかった。
This polyimide film and a thickness of 18 μm
The beryllium copper alloy foil and the electrolytic copper foil having a thickness of 18 μm were used, and the beryllium copper alloy foil and the electrolytic copper foil were overlapped with each other with the processed polyimide film interposed therebetween. A laminated board was obtained. The peel strength of this metal foil polyimide laminate is 0.9 kgf / cm between the electrolytic copper layer and the polyimide layer, 0.4 kgf / cm between the beryllium copper alloy layer and the polyimide layer, and warps, twists, and wrinkles. ,
No defects such as scratches and dust were observed. Also, 288
No blistering or peeling was observed even after immersion in a solder bath at 60 ° C. for 60 seconds.

【0023】本発明の要旨とするところは、使用する材
料として長尺のものを用いること、及び、使用するポリ
イミドを、接着に使用する直前に乾燥炉で加熱、除湿す
ることにある。従って、本発明は叙上の実施例に限定さ
れるものではなく、例えば、ローラー圧接機やプレス装
置における加熱温度及び圧力は使用されるポリイミドの
組成に応じて変えることができ、圧着ローラーの表面の
材質は、一方又は両方を耐熱ゴムその他の材料としても
よく、又、熱風乾燥炉と圧着ローラーとを分離して設け
てもよいものである。又、上記のような平板状の積層板
を更にプレス加工して製品を製造する場合、中間工程を
省略し、長尺の積層板を直接プレス加工して製品を成形
することも可能である。
The gist of the present invention is to use a long material as a material to be used and to heat and dehumidify the polyimide to be used in a drying oven immediately before using it for bonding. Therefore, the present invention is not limited to the above examples, for example, the heating temperature and pressure in the roller pressure welding machine and the pressing device can be changed according to the composition of the polyimide used, and the surface of the pressure roller. One or both of the materials may be heat-resistant rubber or other materials, and the hot air drying furnace and the pressure roller may be separately provided. Further, when a product is manufactured by further pressing the flat plate-like laminated plate as described above, it is possible to omit the intermediate step and directly press the long laminated plate to form the product.

【0024】また、上記実施例では、二枚の金属箔をポ
リイミド層を介してラミネートしているが、一枚の金属
箔の片面又は両面にポリイミドフィルムをラミネートし
ても、三枚以上の金属箔をポリイミド層を介してラミネ
ートしてもよく、また、金属箔の表面にポリアミド酸溶
液を塗布する場合、性質の異なった数種類のポリアミド
酸溶液を層状に塗り重ねるようにしてもよい。
In the above embodiment, two metal foils are laminated with a polyimide layer interposed between them. However, if a polyimide film is laminated on one or both sides of one metal foil, three or more metal foils are laminated. The foil may be laminated via a polyimide layer, and when the polyamic acid solution is applied to the surface of the metal foil, several kinds of polyamic acid solutions having different properties may be applied in layers.

【0025】また、金属箔の材料としては、例えば、
銅、鉄、アルミ、ニッケル、ベリリウム、モリブデン、
クロム、亜鉛、鉛、銀、金、白金、バラジウム及びこれ
らの合金が挙げられる。これらの合金は、高張力合金、
高電導性合金、高透磁率合金、軽量合金、形状記憶合金
などである。また、金属箔及びポリイミド層の厚さは上
記実施例に限定されるものではなく、本発明は上記の説
明から当業者が容易に相当し得る総ての変更実施例を包
摂するものである。
Further, as the material of the metal foil, for example,
Copper, iron, aluminum, nickel, beryllium, molybdenum,
Examples include chromium, zinc, lead, silver, gold, platinum, valladium and alloys thereof. These alloys are high tensile alloys,
Highly conductive alloys, high permeability alloys, lightweight alloys, shape memory alloys, etc. Further, the thicknesses of the metal foil and the polyimide layer are not limited to the above embodiments, and the present invention covers all modified embodiments that can be easily equivalent to those skilled in the art from the above description.

【0026】[0026]

【発明の効果】本発明に係る金属箔ポリイミド積層板を
製造する方法は叙上の如く構成されるので、本発明によ
るときは、操作する人の熟練度に拘わらず、連続的に高
品質の製品を提供できる。
Since the method for producing a metal foil polyimide laminate according to the present invention is constructed as described above, according to the present invention, regardless of the skill of the operator, it is possible to continuously obtain high quality. Can provide products.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明方法において順次実行される工程順序の
一実施例を説明する説明図である。
FIG. 1 is an explanatory diagram illustrating an example of a process sequence sequentially executed in a method of the present invention.

【符号の説明】[Explanation of symbols]

1・・・・・金属箔ポリイミド積層板 1a・・・・長尺積層板シート 1b・・・・みみ 1c・・・・整幅積層板シート 10・・・・銅箔 100・・・銅箔コイル 11・・・・ステンレス薄板 110・・・ステンレス薄板コイル 12・・・・ポリイミドフィルム 120・・・ポリイミドフィルムロール 2・・・・・ローラー圧接装置 20・・・・圧着ローラー 21・・・・圧着ローラー 22・・・・熱風乾燥炉 3・・・・・整幅装置 30・・・・回転カッター 31・・・・吸気装置 4・・・・・剪断装置 40・・・・カッター 41・・・・吸気装置 5・・・・・プレス装置 50・・・・枠体 50a・・・固定熱板 51・・・・可動熱板 52・・・・可動熱板 53・・・・可動熱板 54・・・・昇降装置 6・・・・・検査装置 1 ... Metal foil polyimide laminate 1a ... Long laminate sheet 1b ... Mimi 1c ... Width-varying laminate sheet 10 ... Copper foil 100 ... Copper foil Coil 11 ・ ・ ・ ・ Stainless steel thin plate 110 ・ ・ ・ Stainless steel thin plate Coil 12 ・ ・ ・ ・ Polyimide film 120 ・ ・ ・ Polyimide film roll 2 ・ ・ ・ Roller pressure welding device 20 ・ ・ ・ ・ ・ ・ Crimping roller 21 ・ ・ ・Crimping roller 22 ··· Hot air drying furnace 3 ·· Width adjusting device 30 ··· Rotating cutter 31 ··· Intake device 4 ·· Shearing device 40 ··· Cutter 41 ·· ..Air intake device 5 ... Press device 50 ... Frame body 50a ... Fixed hot plate 51 ... Movable hot plate 52 ... Movable hot plate 53 ... Movable hot plate 54 ... Elevating device 6 ... Inspection device

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 // B29K 79:00 105:06 (72)発明者 相沢 浩一 神奈川県横浜市栄区笠間町1190番地 三井 東圧化学株式会社内 (72)発明者 宍戸 重之 神奈川県横浜市栄区笠間町1190番地 三井 東圧化学株式会社内 (72)発明者 津嶋 敬章 神奈川県横浜市栄区笠間町1190番地 三井 東圧化学株式会社内─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 6 Identification number Internal reference number FI technical display location // B29K 79:00 105: 06 (72) Inventor Koichi Aizawa 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Mitsui Toatsu Chemicals Co., Ltd. (72) Inventor Shigeyuki Shishido 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Mitsui Toatsu Chemicals Co., Ltd. (72) Keisho Tsushima 1190 Kasama-cho, Sakae-ku, Yokohama, Kanagawa Mitsui Toatsu Inside Chemical Co., Ltd.

Claims (9)

【特許請求の範囲】[Claims] 【請求項1】下記の(a)ないし(e)から成る工程を
順次実行することを特徴とする金属箔ポリイミド積層板
を製造する方法。 (a)少なくとも一種の金属箔コイル(100、11
0)を多数製造する工程。 (b)上記工程aによって製造された金属箔コイル(1
00、110)からそれぞれ金属箔(10、11)を引
き出し、熱風乾燥炉(22)内でそれぞれの間に熱風乾
燥したポリイミド層を介して重ね合わせ、回転する少な
くとも二本の圧着ローラー(20、21)により圧着、
貼り合わせるラミネート工程。 (c)上記ラミネート工程によって得られた長尺の積層
板シート(1a)を指定された寸法に切断し、積層板
(1)を得る剪断工程。 (d)上記剪断工程によって得られた定寸の積層板
(1)を多数積み重ね、プレスして接着強度と共に平坦
度を高める仕上工程。
1. A method of manufacturing a metal foil polyimide laminate, which comprises sequentially performing the following steps (a) to (e). (A) At least one metal foil coil (100, 11
0) A number of steps for manufacturing. (B) The metal foil coil (1
00, 110) to draw out the metal foils (10, 11) from each other, and stack them in the hot-air drying oven (22) with a hot-air-dried polyimide layer therebetween, and rotate at least two pressure-bonding rollers (20, 21) crimping,
Laminating process for laminating. (C) A shearing step of obtaining the laminate (1) by cutting the long laminate sheet (1a) obtained by the above-mentioned laminating step into specified dimensions. (D) A finishing step of stacking a large number of laminated plates (1) of fixed size obtained by the shearing step and pressing to increase the adhesive strength and the flatness.
【請求項2】ラミネート工程が、金属箔の対向面の少な
くとも一方にポリイミドワニスを塗布し、乾燥させる工
程と、これら金属箔を重ねて熱風乾燥炉内で回転する圧
着ローラー(20、21)により圧着、貼り合わせる工
程とから成る請求項1に記載の金属箔ポリイミド積層板
を製造する方法。
2. The laminating step comprises a step of applying a polyimide varnish to at least one of the opposing surfaces of the metal foil and drying it, and a step of laminating these metal foils and rotating them in a hot air drying oven by a pressure roller (20, 21). The method for producing a metal foil polyimide laminate according to claim 1, comprising a step of pressure bonding and laminating.
【請求項3】ラミネート工程が、重ね合わせられる複数
の金属箔(10、11)の間にポリイミドフィルム(1
2)を挟み、これらを熱風乾燥炉内で回転する圧着ロー
ラー(20、21)により圧着、貼り合わせることから
成る請求項1に記載の金属箔ポリイミド積層板を製造す
る方法。
3. A lamination process, wherein a polyimide film (1) is provided between a plurality of metal foils (10, 11) to be superposed.
The method for producing a metal foil polyimide laminate according to claim 1, which comprises sandwiching 2) and pressing and laminating these with a pressing roller (20, 21) rotating in a hot air drying oven.
【請求項4】ポリイミドフィルム(12)が、高耐熱性
ポリイミドフィルムの両面に熱可塑性ポリイミド層を設
けたものである請求項3に記載の金属箔ポリイミド積層
板を製造する方法。
4. The method for producing a metal foil polyimide laminate according to claim 3, wherein the polyimide film (12) is a high heat resistant polyimide film provided with thermoplastic polyimide layers on both sides.
【請求項5】最外層の金属箔の外側面にポリイミド層を
設ける工程を含む請求項1ないし4のいずれか一に記載
の金属箔ポリイミド積層板を製造する方法。
5. The method for producing a metal foil-polyimide laminate according to claim 1, including the step of providing a polyimide layer on the outer surface of the outermost metal foil.
【請求項6】下記の(a)ないし(e)から成る工程を
順次実行することを特徴とする金属箔ポリイミド積層板
を製造する方法。 (a)一本の金属箔コイルを製造する工程。 (b)ポリイミドフィルムロールを製造する工程。 (c)上記工程aによって製造された金属箔コイルから
金属箔を、上記工程bによって製造されたポリイミドフ
ィルムロールからポリイミドフィルムを引き出し、熱風
乾燥炉内で金属箔と熱風乾燥したポリイミドフィルムと
を重ね合わせ、回転する少なくとも二本の圧着ローラー
により圧着、貼り合わせるラミネート工程。 (d)上記ラミネート工程によって得られた長尺の積層
板シートを指定された寸法に切断し、積層板を得る剪断
工程。 (e)上記剪断工程によって得られた定寸の積層板を多
数積み重ね、プレスして接着強度と共に平坦度を高める
仕上工程。
6. A method for producing a metal foil polyimide laminate, which comprises sequentially performing the following steps (a) to (e). (A) A step of manufacturing one metal foil coil. (B) A step of producing a polyimide film roll. (C) A metal foil is drawn from the metal foil coil manufactured in the above step a, a polyimide film is pulled out from the polyimide film roll manufactured in the above step b, and the metal foil and the hot air dried polyimide film are superposed in a hot air drying oven. A laminating process in which at least two pressure rollers that combine and rotate are pressed and bonded. (D) A shearing step of cutting the long laminated sheet obtained by the above laminating step into specified dimensions to obtain a laminated board. (E) A finishing step of stacking a large number of fixed-size laminated plates obtained by the shearing step and pressing to increase the adhesive strength and the flatness.
【請求項7】剪断工程が、ラミネート工程によって得ら
れた長尺の積層板シート(1a)のみみ落としを行う整
幅工程と、整幅工程によって所定幅に整幅された積層板
シート(1c)から指定された長さの積層板(1)を多
数切り取る剪断工程とから成る請求項1又は6に記載の
金属箔ポリイミド積層板を製造する方法。
7. A shearing step, a width-adjusting step of removing only the long laminated sheet (1a) obtained by the laminating step, and a laminate sheet (1c) adjusted to a predetermined width by the width-adjusting step. 7. A method for producing a metal foil polyimide laminate according to claim 1 or 6, further comprising a shearing step of cutting a large number of laminates (1) having a length specified by the above.
【請求項8】熱風乾燥炉(22)内の圧着ローラー(2
0、21)の少なくとも一本の表面がゴムである請求項
1ないし7のいずれか一に記載の金属箔ポリイミド積層
板を製造する方法。
8. A pressure roller (2) in a hot air drying oven (22).
The method for producing a metal foil-polyimide laminate according to any one of claims 1 to 7, wherein at least one surface of (0, 21) is rubber.
【請求項9】熱風乾燥炉(22)内の圧着ローラー(2
0、21)の少なくとも一本の表面がテトラクロロエチ
レン樹脂である請求項1ないし7のいずれか一に記載の
金属箔ポリイミド積層板を製造する方法。
9. A pressure roller (2) in a hot air drying oven (22).
The method for producing a metal foil polyimide laminate according to any one of claims 1 to 7, wherein at least one surface of (0, 21) is a tetrachloroethylene resin.
JP8413096A 1996-04-05 1996-04-05 Production of metal foil polyimide laminated board Pending JPH09272176A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8413096A JPH09272176A (en) 1996-04-05 1996-04-05 Production of metal foil polyimide laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8413096A JPH09272176A (en) 1996-04-05 1996-04-05 Production of metal foil polyimide laminated board

Publications (1)

Publication Number Publication Date
JPH09272176A true JPH09272176A (en) 1997-10-21

Family

ID=13821934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8413096A Pending JPH09272176A (en) 1996-04-05 1996-04-05 Production of metal foil polyimide laminated board

Country Status (1)

Country Link
JP (1) JPH09272176A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1041866A2 (en) * 1999-04-02 2000-10-04 Gisulfo Baccini Device to produce electronic circuits

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1041866A2 (en) * 1999-04-02 2000-10-04 Gisulfo Baccini Device to produce electronic circuits
EP1041866A3 (en) * 1999-04-02 2000-12-27 Gisulfo Baccini Device to produce electronic circuits
US6595134B2 (en) 1999-04-02 2003-07-22 Baccini Gisulfo Device to produce electronic circuits
US6711997B1 (en) 1999-04-02 2004-03-30 Gisulfo Baccini Device to produce electronic circuits

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