JPH0926662A - Substrate for exposure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate judgement of whether or not chip data inside a reticle is accurately formed and to lighten a burden imposed on an operator by providing a mark for measuring size formed on a chip data area and a mark for detecting a position formed in the specified peripheral area of the mark for measuring the size. SOLUTION: This substrate is provided with the mark for measuring the size 21 formed inside the chip data area 12 and the mark for detecting the position 22 formed in the peripheral area 13 of the reticle 11. The mark 22 is formed as a mark for easily searching the mark 21 and formed on the extension of the mark 21 in a direction X or on the extension thereof in a direction Y or in the peripheral area 13 on the extensions both in the directions X and Y. In the case of measuring the size, the mark 22 is specified first and scanning is performed by a measuring device such as a microscope from the mark 22 in the direction X or Y, thereby easily specifying the mark 21.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure substrate used as an original image in a reduction projection exposure apparatus when a semiconductor substrate is exposed with a predetermined pattern.

[0002]

2. Description of the Related Art In the process of forming a desired transistor pattern, wiring pattern, etc. on a semiconductor substrate, a photosensitive agent such as photoresist is formed on the semiconductor substrate, and a specific pattern is formed on the photosensitive agent from a reduction projection exposure apparatus. The exposure step of transferring In this exposure step, an exposure substrate (hereinafter, referred to as a reticle) on which specific chip data is formed is used as an original image of a pattern, and the exposure light of a predetermined wavelength is irradiated from the reticle to expose the data. The pattern corresponding to is transferred to the photoresist on the semiconductor substrate.

This reticle is formed by forming a thin film of a metal or oxide that blocks ultraviolet rays on a transparent substrate such as glass, and removing the thin film by etching the pattern by a photolithography method or the like. To form a patterned pattern. Therefore, since the pattern formed on the reticle corresponds to the pattern formed on the semiconductor substrate, particularly precision is required in manufacturing the reticle as the pattern becomes finer.

As a reticle that has been conventionally used, the one shown in the schematic views of FIGS. 5 and 6 can be mentioned. still,
Details of the actual chip data are omitted in FIGS. 5 and 6 for the sake of explanation.

For example, the reticle 111 shown in FIG. 5 is used for simultaneously transferring a plurality of patterns onto a semiconductor substrate, and a plurality of chip data 112 is formed on one reticle. Further, with the recent increase in the size of semiconductor substrates and the increase in chip size due to high integration, as shown in FIG. 6, one or more reticles can accommodate about one or two chips. A reticle on which one or two pieces of chip data 121 are formed is used.

After the step of forming a predetermined pattern on the reticle as shown in FIGS. 5 and 6, the pattern formed on the reticle is finished to the size as designed or the value is set to the standard. The inspection process of whether or not there is is performed.

In this inspection process, in the reticle 111 as shown in FIG. 5, a plurality of dimension measuring marks 114 as shown in an enlarged view of FIG. 7 are previously provided in the scribe area 113 between the chip data 112. After being formed, the operator uses a microscope or the like to measure and evaluate the dimension of the dimension measuring mark 114 to judge whether or not the chip data is accurately formed.

Further, in the reticle 121 as shown in FIG. 6, since the chip data 122 is formed in the central portion thereof, only the peripheral area 123 of the reticle is shown in FIG.
A plurality of dimension measuring marks 114 as shown in the enlarged view of FIG. 4 are formed, and this is measured by the same method as the dimension measurement in the reticle shown in FIG.
However, as mentioned above, the reticle standard has become stricter due to the recent miniaturization of semiconductor elements, and the inspection that sufficiently satisfies this standard can only be judged by the dimension measurement mark only in the peripheral area of the reticle as in the past. It is becoming difficult to perform the process, and it is becoming difficult to manufacture the reticle with high accuracy. That is, even if it is determined that the dimension measurement mark 124 formed in the peripheral area of the reticle 121 is accurately formed, an error may occur in the chip data at the center of the reticle 121.

In order to solve this problem, conventionally, in the chip data, locations for measuring the dimensions are determined in advance in each of the central portion and the peripheral portion, the determined locations are specified, and the locations of the locations are determined. By measuring the dimension and evaluating whether this value is as designed or not by comparing it with a design drawing or the like, it is determined whether or not the chip data is accurately formed.

However, in such an evaluation method,
There are the following problems. That is, even if the dimension measurement location is specified in advance in the chip data, it takes a lot of time to specify this location on the reticle on which the pattern is actually formed. Even if the location where the dimension is to be measured can be specified, it is troublesome because it is necessary to prepare materials and the like to determine whether the location meets the standard if the dimension of the location is large. In particular, a logic product or the like having a less regular pattern has a problem in that it is difficult to specify the measurement point and it takes time for evaluation.

[0011]

As described above, with the recent increase in the size of the semiconductor substrate and the increase in the chip size, one or more chips can be accommodated on one reticle. Reticles on which one or two chip data are formed have been used. Therefore, in the reticle inspection process, it is becoming difficult to judge whether or not the reticle is accurately formed, and as a result, it is becoming difficult to manufacture the reticle with high accuracy.

For this reason, conventionally, the reticle is evaluated by previously specifying a portion of the chip data whose dimension is to be measured and measuring the dimension of the portion. However, it takes a lot of time to specify this part on the reticle on which the chip data is actually formed, and even if the part to be sized can be specified, if the size of the part is large, There is a problem that it takes time and effort to prepare materials for judging whether or not the standard is satisfied.

As described above, the conventional reticle evaluation method has a problem in that the burden on the operator and the time for the inspection process increase, which increases the manufacturing cost of the semiconductor product.

[0014]

In order to solve the above problems, the following means are used in the present invention. That is, the first aspect of the present invention is, in an exposure substrate having a chip data area in which chip data is formed and a peripheral area of the chip data area, a dimension measurement mark formed in the chip data area, and a dimension of the dimension measurement mark. And a position detection mark formed in the peripheral region on an extension line of the measurement substrate in the X direction or the Y direction of the exposure substrate.

A second aspect of the present invention is, in an exposure substrate having a chip data area in which chip data is formed and a peripheral area of the chip data area, a part of the chip data formed in the chip data area. And a position detecting mark formed in the peripheral region on an extension line of the position specifying mark in the X direction or the Y direction of the exposure substrate.

[0016]

In the present invention, the dimension measurement mark or the position specifying mark for specifying the measurement point is formed in the chip data area, and these marks are easily specified by the position detecting mark formed in the peripheral area of the reticle. Therefore, it is possible to easily evaluate and judge whether or not the chip data is accurately formed. Further, by forming an information mark indicating a numerical value of an originally desired size around these marks, this evaluation and judgment can be further facilitated. Therefore, it is possible to reduce the burden on the operator involved in the inspection process and the time for the inspection process, and thus to reduce the manufacturing cost of the semiconductor product.

[0017]

Embodiments of the present invention will be described with reference to the drawings. In FIG. 1, reference numeral 11 in the drawing is a schematic view of a reticle in the first embodiment of the present invention, and a chip data area 1 in which a pattern to be transferred to a semiconductor substrate (not shown) is formed.
2 and a peripheral region 13 of the reticle 11.
The actual chip data is omitted for the sake of explanation. The pattern can be formed in regions 12 and 13. Further, the peripheral area 13 has a dimension measuring mark 14 for measuring and evaluating the dimensions of the peripheral area. The above configuration is similar to that of the conventional reticle.

In the present invention, in addition to the above-mentioned structure, the dimension measuring mark 21 formed inside the chip data area 12 and the dimension measuring mark 21 are formed in the peripheral area 13 of the reticle in order to specify the formation location. The position detection mark 22 is provided.

The dimension measuring mark 21 formed in the chip data area 12 is an area in which no pattern is formed in the chip data area, and further affects the operating characteristics of elements such as transistors manufactured using this reticle. It is formed in the area without. That is, the chip data area 12
Although chip data (not shown) for forming a wiring layer, a diffusion layer, etc. on the semiconductor substrate is formed therein, these patterns are not formed on the entire surface of the chip data area 12. There are areas where no pattern is formed. The dimension measuring mark 21 according to the present invention is formed in this area by utilizing the area where the pattern is not formed.

As an example, this dimension measuring mark 21
An enlarged view of is shown in FIG. Dimension measurement mark 21
By forming as a pattern in which each side has the same width, it becomes possible to easily perform dimension measurement and evaluation. Further, the shape may be such that it can be immediately recognized as a dimension measurement mark. Of course, when a plurality of chip data are formed as in the prior art, they may be formed in the same manner as the marks formed in the scribe area as shown in FIG.

Further, as shown in FIG. 3, in the area around the dimension measuring mark 21, as shown in FIG.
The information mark 23 having the numerical value of the original size of 1 may be formed. For example, when the side of the dimension measurement mark 21 to be measured is designed to have a width of 3.0 μm, the dimension measurement mark 21 can be formed by forming a mark as shown in the peripheral region. When the dimension is measured, it is possible to immediately compare the dimension actually formed and the dimension at the time of design, and thus it is possible to immediately determine whether or not the chip data is accurately formed.

The position detection mark 22 formed in the peripheral region 13 of the reticle 11 is the dimension measurement mark 11
Is formed as a mark for easily finding out. Therefore, the dimension measurement mark 21 is formed in the peripheral region on the extension line in the X direction, the peripheral region on the extension line in the Y direction, or the peripheral region on the extension lines in both the X direction and the Y direction.

In the dimension measurement, first, the position detecting mark 22 formed in the peripheral region 13 is specified, and as shown by the broken line in FIG. 1, from the position detecting mark 22 in the X direction or the Y direction, The dimension measurement mark 21 can be easily specified by scanning a measuring device such as a microscope. The shape of the position detection mark 22 is an arrow shape, a triangle shape, a convex shape, or the like so that the extension line in the X direction or the Y direction can be easily imagined in order to easily specify the dimension measurement mark 21. The thing of is desirable. As an example, an enlarged view of this position detection mark is shown in FIG.
(B).

Around the position detection mark 22 may be formed the information mark 23 shown in FIG. 3 as described above with the numerical value itself of the dimension of the dimension measurement mark 22. Further, the information mark 23 is not limited to the formation of the dimension value, but may be formed as a mark indicating information such as the order of measurement. By forming these information marks 23 around the dimension measuring marks 21 or the position detecting marks 22, the measurement procedure, the arrangement of the measurement results, and the evaluation of whether or not the chip data are formed correctly can be performed. It is possible to make a judgment immediately.

Next, the second embodiment of the present invention will be described with reference to FIG.
A description will be given with reference to the schematic diagrams of (a) and (b). FIG.
The same reference numerals are given to the same configurations as those, and the description of the configurations not directly related to the description of the present embodiment is omitted.

In the second embodiment, when the chip data area does not have a sufficient area for forming the dimension measuring marks shown in the first embodiment, or particularly in the chip data, dimensional accuracy is required. This is effective when it is desired to directly measure the dimensions of the pattern. That is, the dimension of the chip data itself is measured to evaluate whether or not the pattern is accurately formed.

In this case, FIG. 4B (FIG. 4B corresponds to FIG.
It is an enlarged view near the circle in (a). ), A position specifying mark 32 for specifying a measurement location of a pattern 31 such as a gate electrode of a transistor which is an object of measurement is provided with a pattern 31 which is an object of dimension measurement.
Is formed in the vicinity of the so as to point to the pattern 31. Further, in order to specify the position specifying mark 32, the position detecting mark 22 is formed in the peripheral portion of the chip data area as in the first embodiment. Of course, the information mark 23 as shown in FIG. 3 may be formed around the position specifying mark 22.

Therefore, when the actual pattern 31 is measured, the position detecting mark 21 formed in the peripheral region 13 of the reticle 11 is specified and the measuring device such as a microscope is scanned in the X direction or the Y direction. The position specifying mark 32 can be easily detected, and the pattern 31 to be measured can be specified.

As described above, in the present invention, when the chip data formed on the reticle becomes large, the dimension measurement mark or the position specifying mark is formed in the area where the pattern is not formed. Further, in order to easily detect the dimension measuring mark or the position specifying mark, the position detecting mark is used in the peripheral portion of the chip data area. In the reticle inspection process, first, in addition to measuring the dimension measurement marks formed in the peripheral area of the reticle,
Detects the dimension measuring mark or the position specifying mark formed in the center of the chip data area from the position detecting mark, measures the dimension of the specific portion, and evaluates whether the reticle was formed correctly, Make a decision.

Therefore, as compared with the conventional reticle, the dimensional measurement mark or the position specifying mark for specifying the measurement position is formed in the chip data area, and these marks are formed in the peripheral area of the reticle. By this, since it is possible to easily specify, it is possible to easily evaluate and judge whether or not the chip data is accurately formed. Further, by forming an information mark indicating a numerical value of an originally desired size around these marks, this evaluation and judgment can be further facilitated.

Therefore, it is possible to reduce the burden on the operator in the inspection process and the time for the inspection process, and thus to reduce the manufacturing cost of the semiconductor product.
As a secondary effect of the present invention, each mark formed for the reticle inspection step is also formed on the semiconductor substrate by the exposure step. Each mark formed on this semiconductor substrate can also be used as a mark for inspecting whether the semiconductor substrate is formed according to the reticle chip data.

[0032]

According to the present invention, it is possible to easily judge whether or not the chip data inside the reticle is accurately formed, as compared with the conventional reticle, and the burden on the operator and the time for the inspection process can be saved. Therefore, the manufacturing cost of the semiconductor product can be reduced.

[Brief description of drawings]

FIG. 1 is a schematic diagram illustrating a first embodiment of the present invention.

FIG. 2 is an enlarged view for explaining details of the first embodiment of the present invention.

FIG. 3 is an enlarged view for explaining details of the first embodiment of the present invention.

FIG. 4 is a schematic diagram illustrating a second embodiment of the present invention.

FIG. 5 is a schematic diagram illustrating a conventional example.

FIG. 6 is a schematic diagram illustrating a conventional example.

FIG. 7 is an enlarged view illustrating details of a conventional example.

[Explanation of symbols]

 11, 111, 121 Reticle 12 Chip data area 13, 123 Peripheral area 14, 21, 114, 124 Dimension measurement mark 22 Position detection mark 23 Information mark 31 Gate electrode pattern 32 Position identification mark 112, 122 Chip data 113 scribe area

Claims (7)

[Claims] 1. An exposure substrate, comprising: a first mark formed in a chip data area; and a second mark formed in a peripheral area of the chip data area corresponding to the first mark. 2. The exposure substrate according to claim 1, wherein the first mark is a dimension measurement mark formed for evaluating chip data formed in the chip data area. 3. The exposure substrate according to claim 1, wherein the first mark is a position specifying mark that indicates a part of chip data formed in the chip data area. 4. The exposure substrate according to claim 1, wherein the second mark is formed on an extension line of the first mark in the X direction or the Y direction of the exposure substrate. 5. The exposure substrate according to claim 1, further comprising an information mark in which character information is written around the first mark or the second mark. 6. An exposure substrate having a chip data area in which chip data is formed and a peripheral area of the chip data area, wherein a dimension measuring mark formed in the chip data area and the dimension measuring mark are formed. And a position detection mark formed in the peripheral region on an extension line of the exposure substrate in the X direction or the Y direction. 7. An exposure substrate having a chip data area in which chip data is formed and a peripheral area of the chip data area, wherein a position specifying mark formed in the chip data area and pointing to a part of the chip data. And a position detection mark formed in the peripheral region on an extension line of the position specifying mark in the X direction or the Y direction of the exposure substrate.