JPH09229963A - Contact body for inspecting electronic parts, manufacture thereof, and inspecting method using the contact body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve a low manufacturing cost and a short manufacturing period and to prevent the damage of electronic parts in electrical inspection. SOLUTION: External terminals 12 are provided in the vicinity or an electronic part 10. Element electrodes 11 or the electronic part 10 and the outer terminals 12 undergo ball bonding by Au wires 13. Furthermore, the Au wires 13 and the parts of the outer terminals 12 are molded with a high-elasticity resin 15. The electronic part 10 is released from the high-elasticity resin 15, and the parts of Au balls 14 facing the element electrodes 11 are exposed from the high-elasticity resin 15. In the inspection of the electronic part 10, a measuring instrument is connected to the exposed part of the outer terminal 12, the exposed part of each Au ball 14 is brought into contact with the element electrode 11 of the electronic part 10, the high-elasticity resin 15 is compressed and the electrical inspection of the electronic part 10 is performed by the measuring instrument.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact body for inspecting an electronic component in an inspection device used for electrically inspecting an electronic component such as a semiconductor chip, a method of manufacturing the same, and an inspection method using the same. Is.

[0002]

2. Description of the Related Art Conventionally, electrical inspection of a semiconductor LSI has been
It was performed in a wafer state. However, in order to reduce the size and increase the functionality of mounted devices, electronic device manufacturers directly obtain a single bare semiconductor chip instead of a packaged semiconductor LSI and use the semiconductor chip as a circuit board of the electronic device. Bare chip mounting, which is directly mounted, is adopted.

On the other hand, a semiconductor maker divides the produced semiconductor wafer into individual semiconductor chips, inspects them for electrical characteristics, and supplies them to electronic equipment makers. Against this background, the membrane sheet 30 shown in FIG. 3 is used for the inspection of the individual semiconductor chips. As shown in FIG. 3A, the membrane sheet 30 includes a sheet 31 and a protruding electrode 32 formed on the sheet 31.
And the wiring layer 33 extending from the protruding electrode 32. The sheet 31 is formed of, for example, polyimide having heat resistance and insulation. Further, the protruding electrode 32 is provided at a position facing the element electrode 35 of the semiconductor chip 34, as shown in FIG.

The electrical inspection of the semiconductor chip 34 is shown in FIG.
As shown in FIG. 3B, the protruding electrodes 32 formed on the sheet 31 and the element electrodes 35 of the semiconductor chip 34 are aligned with each other, and the sheet 31 is moved downward as shown in FIG. And the element electrode 35 are brought into contact with each other, the sheet 31 is pressed by the pressing means 36, and in that state, the wiring layer 3
Semiconductor chip 3 by a measuring device (not shown) connected to
4. Conduct electrical inspection.

[0005]

However, the membrane sheet 30 used for the inspection of the bare semiconductor chip 34 is used.
Then, it had the following problems. In the manufacturing process of the membrane sheet 30, the protruding electrodes 32 facing the minute element electrodes 35 of the semiconductor chip 34
Since the fine wiring layer 33 extending from the bump electrode 32 must be formed with high precision, a photomask for wiring etching and a photosensitive material for patterning the wiring are required. ， Development equipment is required. In addition, a plating technique or plating equipment for forming the minute protruding electrodes 32 with high accuracy is required,
Manufacturing costs rise significantly.

Since the manufacturing process of the membrane sheet 30 is diverse, the manufacturing period becomes long. Since the protruding electrode 32 that comes into contact with the device electrode 35 of the semiconductor chip 34 is made of a material having a relatively high hardness such as Ni, the protruding electrode 32 of the membrane sheet 30 and the device electrode 35 of the semiconductor chip 34 are contacted and applied. When pressed, the element electrode 35 of the semiconductor chip 34 is damaged and the semiconductor chip 34
In some cases, the bonding strength of the wire bonding may be deteriorated, the reliability of the electronic device may be significantly reduced, and the silicon substrate immediately below the element electrode 35 of the semiconductor chip 34 may be damaged to significantly reduce the yield of the semiconductor chip 34. It was

Therefore, an object of the present invention is to provide a contact body for inspecting an electronic component, which has a low manufacturing cost, a short manufacturing period, and in which an electronic component is not damaged by an electrical inspection, a method for manufacturing the same, and a method for manufacturing the same. It is to provide an inspection method.

[0008]

A contact body for inspecting electronic parts according to claim 1 is a contact body for inspecting electronic parts in an inspection device for electrically inspecting electronic parts, comprising an elastic resin.
An external terminal partially embedded in the elastic resin, and an Au wire connected to the external terminal and embedded in the elastic resin and having an Au ball formed at the tip and exposed from the elastic resin and facing the element electrode of the electronic component are provided. It is a thing.

The contact body for inspecting electronic parts according to claim 2 is
In Claim 1, the exposed portion of the Au ball is polished and finished. The method of manufacturing a contact body for inspecting electronic parts according to claim 3, wherein an external terminal is installed in the vicinity of the electronic part, and the element electrode of the electronic part and the external terminal are ball-bonded with an Au wire to form the Au wire and the external terminal. A part is molded with an elastic resin, the electronic component is separated from the elastic resin, and a part of the Au ball facing the element electrode is exposed from the elastic resin.

According to the contact body for inspecting electronic parts and the manufacturing method thereof, the element electrodes of the electronic part and the external terminals are ball-bonded with Au wires and molded with elastic resin. Then, the electronic component is peeled off to form an electronic component inspection contact body. Therefore, the plating process for forming the minute and minute protruding electrodes, the photomask for wiring etching and the photosensitive material for patterning the wiring, which were required in the conventional manufacturing process of the membrane sheet, are not required, and the exposure The need for large-scale manufacturing equipment such as development is eliminated, and the contact body can be formed extremely easily and highly accurately.

An inspection method according to a fourth aspect is an inspection method using the contact body for inspecting an electronic component according to the first or second aspect, wherein a measuring device is connected to the exposed portion of the external terminal, and Au is used.
The exposed portion of the ball is brought into contact with the element electrode of the electronic component, the elastic resin is pressed against the electronic component side, and the electrical inspection of the electronic component is performed with a measuring instrument. According to the method for inspecting an electronic component using the contact body according to claim 4, since the electrode contacting the element electrode of the electronic component is composed of an Au ball having a low hardness, the element is pressed when the electronic component is pressed and measured. The electrodes are not damaged, and there is no damage to the silicon substrate directly below the device electrodes. Further, since the Au wire and the external terminal are molded by the elastic resin, the entire surface of the electronic component is pressed by the elastic resin at the time of pressurizing and measuring the electronic component, and concentrated stress does not act on the element electrode. Moreover, since the mold resin is made of an elastic resin, it is possible to prevent the surface of the electronic component from being damaged by the mold resin when the electronic component is pressed and measured.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows a method for manufacturing an electronic component inspection contact body (hereinafter referred to as a contact body) in an inspection device that electrically inspects an electronic component.
In FIG. 1, 10 is a semiconductor chip which is an electronic component, 11 is an element electrode formed on the semiconductor chip 10, 16 is a contact body, and the contact body 16 is an external terminal 12, Au wire 13, Au.
The ball 14 and the high elastic resin 15 are used.

First, in FIG. 1A, an external terminal 12 which serves as an external electrode of the contact body 16 is provided in the vicinity of the semiconductor chip 10.
And the individual element electrodes 11 of the semiconductor chip 10 and the external terminals 12 are ball-bonded using the Au wires 13. In ball bonding, the tip of the Au wire 13 is heated and melted to form a ball shape, and the Au ball 14 is bonded to the element electrode 11 of the semiconductor chip 10.
The bonding force between the Au ball 14 and the device electrode 11 at this time is determined by optimizing the ball bonding condition and extracting the condition that the semiconductor chip 10 is easily peeled at the time of subsequent peeling. The element electrode 11 and the external terminal 12 are ball-bonded.

In FIG. 1B, after all the element electrodes 11 of the semiconductor chip 10 and the external terminals 12 are ball-bonded, the Au wires 13 including the Au ball portions 14 and a part of the external terminals 12 are made of a highly elastic resin. Mold at 15. As the high-elasticity resin 15, for example, a release silicone resin that is chemically stable and has a high elastic modulus is used. After the high-elasticity resin 15 is cured, the Au balls 14 bonded to the device electrodes 11 in FIG. 1C are easily separated by optimizing the bonding conditions, and the device electrodes 11 of the semiconductor chip 10 are removed.
It becomes a state of being embedded in the high-elasticity resin 15 opposite to. Therefore, the surface a of the high-elasticity resin 15 is in the state of a replica in which the surface of the semiconductor chip 10 is transferred. Also,
On the a surface of the high-elasticity resin 15, Au balls 14 corresponding to the arrangement of the device electrodes 11 of the semiconductor chip 10 are slightly exposed, and a contact body 16 for a semiconductor chip in which a contact electrode connected to the external terminal 12 is formed. Is configured. The exposed portion of the Au ball 14 may be polished and finished.

Next, a method of electrically inspecting the semiconductor chip 10 by the inspecting apparatus having the contact body 16 will be described with reference to FIG. In FIG. 2A, in order to align the element electrode 11 of the semiconductor chip 10 to be inspected with the Au ball 14 of the contact body 16, the contact body 16 is moved in the XY direction (arrow b direction), and the position is changed. Make adjustments.

After the alignment of the two is completed, the contact body 16 is lowered (in the direction of arrow c), and the element electrode 11 of the semiconductor chip 10 and the Au ball 1 of the contact body 16 are shown in FIG. 2B.
4, and the high-elasticity resin 15 is pressed against the semiconductor chip 10 side (arrow d direction). In that state, the semiconductor chip 1 is measured by a measuring device (not shown) connected to the external terminal 12.
Conduct an electrical test of 0.

After the electrical inspection of the semiconductor chip 10 is completed, in FIG. 2C, the contact body 16 is raised (in the direction of arrow e), and an electrical inspection of a new semiconductor chip 10 is performed in the same manner. The electronic component inspection contact body 1 configured as described above
6 and the manufacturing method thereof, the element electrode 11 of the semiconductor chip 10 and the external terminal 12 are ball-bonded with the Au wire 13 and molded with the high-elasticity resin 15, and the semiconductor chip 10 is peeled off to form a contact body. 16 is formed. Therefore, the plating process for forming the minute and minute protruding electrodes, the photomask for wiring etching and the photosensitive material for patterning the wiring, which were required in the conventional manufacturing process of the membrane sheet, are not required, and the exposure , Large-scale manufacturing equipment such as development is not required, and the contact body 16 can be formed extremely easily and highly accurately.
The manufacturing cost and the manufacturing period of the contact body 16 can be significantly reduced. Therefore, it is possible to flexibly deal with semiconductor chips such as microcomputers and gate arrays, which have a short development cycle, and to quickly and accurately prepare the bare chip supply system.

Further, according to the inspection method using the electronic component inspection contact body 16, since the electrode contacting the element electrode 11 of the semiconductor chip 10 is composed of the Au ball 14 having low hardness, the semiconductor chip 10 of The element electrode 11 is not damaged during the pressurization / measurement, the bonding strength of wire bonding is not deteriorated when the electronic device is mounted, a high quality semiconductor chip 10 can be realized, and the reliability of the electronic device can be improved. Further, the silicon substrate immediately below the element electrode 11 of the semiconductor chip 10 is not damaged at all, and the yield of the semiconductor chips 10 in the inspection process of the semiconductor chips 10 can be improved.

Furthermore, since the Au wire 13 and the external terminal 12 are molded with the high-elasticity resin 15, the entire surface of the electronic component 10 is pressed with the high-elasticity resin 15 when the electronic component 10 is pressed and measured. The concentrated stress does not act on the electrode 11, and the element electrode 11 can be prevented from being damaged.
Moreover, since the molding resin is made of the highly elastic resin 15,
It is possible to prevent the surface of the electronic component 10 from being damaged by the molding resin when the electronic component 10 is pressed and measured.

[0020]

According to the contact body for inspecting electronic parts and the method for manufacturing the same of claims 1, 2 and 3, the element electrodes of the electronic part and the external terminals are ball-bonded with Au wires and the elastic resin is formed. And the electronic component is peeled off to form an electronic component inspection contact body. Therefore, the plating process for forming the minute and minute protruding electrodes, the photomask for wiring etching and the photosensitive material for patterning the wiring, which were required in the conventional manufacturing process of the membrane sheet, are not required, and the exposure The need for large-scale manufacturing equipment such as development is eliminated, the contact body can be formed extremely easily and highly accurately, and the manufacturing cost and the manufacturing period of the contact body can be greatly reduced.

According to the method for inspecting an electronic component using the contact body according to the fourth aspect, since the electrode contacting the element electrode of the electronic component is formed of Au balls having low hardness, the pressure applied to the electronic component The element electrode is not damaged during the measurement, the bonding strength of wire bonding is not deteriorated when the electronic device is mounted, a high quality electronic component can be realized, and the reliability of the electronic device can be improved. Further, damage to the silicon substrate directly below the device electrode is eliminated, and the yield of electronic components in the electronic component inspection process can be improved. Also, since the Au wire and the external terminal are molded with elastic resin,
Since the entire surface of the electronic component is pressed by the elastic resin, concentrated stress does not act on the element electrode, and damage to the element electrode can be prevented. In addition, since the mold resin is made of an elastic resin, it is possible to prevent the surface of the electronic component from being damaged by the mold resin when the electronic component is pressed and measured.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a manufacturing process of a contact body according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a step of inspecting a semiconductor chip according to the embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a semiconductor chip inspection process in a conventional example.

[Explanation of symbols]

 10 Semiconductor Chip (Electronic Component) 11 Element Electrode 12 External Terminal 13 Au Wire 14 Au Ball 15 High Elasticity Resin 16 Contact Body

Claims (4)

[Claims] 1. A contact body for inspecting an electronic component in an inspection device for electrically inspecting an electronic component, comprising: an elastic resin, an external terminal partially embedded in the elastic resin, and an external terminal connected to the external terminal. A contact body for inspecting an electronic component, comprising an Au wire embedded in the elastic resin and having a tip exposed from the elastic resin and having an Au ball facing the element electrode of the electronic component. 2. The contact body for inspecting electronic parts according to claim 1, wherein the exposed portion of the Au ball is finished by polishing. 3. A step of installing an external terminal in the vicinity of an electronic component, a step of ball-bonding an element electrode of the electronic component and the external terminal with an Au wire, and a step of forming a part of the Au wire and the external terminal. A method of manufacturing a contact body for inspecting an electronic component, comprising: a step of molding with an elastic resin; and a step of peeling the electronic component from the elastic resin and exposing a part of an Au ball facing the element electrode from the elastic resin. . 4. An inspection method using the contact body for inspecting electronic parts according to claim 1 or 2, wherein a measuring device is connected to the exposed part of the external terminal, and the exposed part of the Au ball is connected to the electronic part. An inspection method in which an elastic resin is brought into contact with an element electrode to apply pressure to the electronic component side, and the electronic instrument is electrically inspected by the measuring device.