JPH0918105A - Circuit connection structure for board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a circuit connection structure for board in which a high current can be fed to the joint of upper and lower patterns on the board by fixing press contact devices on the pattern and then connecting the press contact devices through a connection part. SOLUTION: Upper and lower patterns 11, 12 are formed on the upper and lower surfaces of a board 10 and electronic devices constituting a circuit are mounted thereon. At first, a press contact device 20 is mounted on the upper pattern 11 and subjected to reflow soldering 35. A connection part 30 is then inserted into press contact devices 20 soldered to the upper and lower patterns 11, 12 thus connecting the upper and lower patterns 11, 12 electrically. The connection part 30 has U-shape and made of a brass plate, for example. Since mechanical mounting and automatic soldering are realized, the quality is enhanced while allowing passage of high current.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical connection structure of a circuit board incorporated in an electronic device, and more specifically, a circuit pattern (hereinafter abbreviated as a pattern) formed on both surfaces of the board.
Regarding the connection structure between.

[0002]

2. Description of the Related Art Two typical examples of a conventional double-sided printed circuit board (hereinafter abbreviated as a board) connection structure will be described with reference to FIG. 4A and 4B are views showing a conventional connecting structure between upper and lower patterns of a substrate, FIG. 4A is a sectional view of a connecting portion by a through hole, and FIG. 4B is a sectional view of a connecting portion by a conductive wire. First, a connection structure using through holes will be described.

Reference numeral 80 denotes a substrate. A circuit 81 is formed independently of a pattern 81 formed of a conductor (copper) on the upper surface (upper side of the drawing) and a pattern 82 on the lower surface (lower side of the drawing) of the substrate 80. Upper and lower patterns 81 and 8 as required
The two are connected by a through hole 83 (a hole is formed between the upper and lower patterns 81 and 82, and the inner surface of the hole is plated with a conductor such as copper to electrically connect the upper and lower patterns 81 and 82). Let And through hole 83
In order to improve the reliability of conduction, the through holes 83 are filled with the solder 84 in a solder dip bath or the like.

Next, a connection structure using conductive wires will be described.
Reference numeral 90 denotes a substrate. On the upper surface of the substrate 90, patterns 91 made of a conductor and on the lower surface are formed independent circuits, respectively, and holes 93 are formed to insert between the upper and lower patterns 91 and 92. ing. Upper and lower patterns 91
In order to establish electrical continuity between the conductor 92 and the conductor 92, the conductor wire 94 is inserted into the hole 93, and the conductor wire 94 and the upper and lower patterns 91 and 92 are soldered to each other.
5, and the upper and lower patterns 91 and 92 are electrically connected.

[0005]

However, in the above-mentioned connection structure using the through-holes of the substrate, the through-holes are formed by the plating process, which increases the cost of the substrate. Further, in the case of a silver through hole, there is a problem that a large current cannot flow because the resistance value of the hole is large. Further, in the case of a double-sided reflow soldering substrate, in the connection structure using conductive wires, automatic soldering performed in a solder dip tank or the like is difficult to perform, and manual soldering work occurs. Therefore, the number of soldering steps is increased and the cost is increased. Further, the soldering quality may vary due to the manual soldering work.

Therefore, the present invention solves the above-mentioned problems, and allows a large current to flow through the connection portions of the upper and lower patterns of the board, and also reduces the circuit connection man-hours and connection cost of the board, and further It is an object of the present invention to provide a circuit connection structure for a substrate that enhances the reliability of the circuit connection portion.

[0007]

SUMMARY OF THE INVENTION The present invention achieves the above-mentioned object, and in a connection structure for electrically connecting patterns on both surfaces of a printed circuit board having conductor electronic circuit patterns formed on both surfaces, And a connecting part that engages with the pressure contact part and electrically connects the pressure contact parts, and fixes the pressure contact part on the pattern to connect the pressure contact parts. The feature is that they are connected by parts.

Further, in a connection structure for electrically connecting the patterns on both sides of a printed circuit board on which electronic circuit patterns of conductors are formed on both sides, a sandwiching component having a sandwiching function with a conductor and the sandwiching component engaged with the sandwiching component, It is constituted by a connecting member for electrically connecting the sandwiching parts, and the sandwiching part is fixed on the pattern, and the sandwiching parts are connected by the connecting member.

[0009]

According to the present invention, the connection parts are inserted into the pressure contact parts fixed to the patterns on both sides of the printed circuit board, and the pressure contact parts hold the connection parts under pressure. It is electrically connected.
According to the second invention, by sandwiching and fixing the connecting member to the sandwiching components respectively fixed to the patterns on both sides of the printed circuit board, the sandwiching component sandwiches and holds the connecting member. It is electrically connected.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIG. 1 is a connection structure diagram between the upper and lower patterns of the substrate,
(A) is a front view which shows the connection state between patterns, (b) is an AA sectional view. Reference numeral 10 denotes a substrate. An upper surface side pattern 11 having a circuit formed of a conductor (copper) on an upper surface (upper side in the drawing) of the substrate 10 and a lower surface side pattern 1 on a lower surface (downside in the drawing).
2 is formed, and electronic parts and the like that form a circuit are mounted.

Reference numeral 20 denotes a pressure contact component, which is internally provided with a pressure contact terminal 21 for pressure contacting a connection component 30 connecting the upper surface side pattern 11 and the lower surface side pattern 12 and holding the connection component 30. As the material, a material having excellent conductivity and elasticity, for example, a phosphor bronze plate is used. A female connector for surface mounting corresponding to the pressure contact component 20 may be used. Reference numeral 30 is a connection component, which is inserted into the pressure contact component 20 soldered and fixed to the upper and lower patterns 11 and 12 of the board,
It is a component that electrically connects the upper and lower patterns 11 and 12. The connection component 30 is U-shaped and is made of a conductive material such as a brass plate. The conductive wire may be formed in a U shape and used.

Next, the connection of the patterns on the upper surface and the lower surface will be described. First, the pressure contact component 20 is mounted on the upper surface side pattern 11 of the substrate and reflow soldering 35 is performed, and then the pressure contact component 20 is mounted on the lower surface side pattern 12 of the substrate and reflow soldering 35 is performed. The upper and lower pressure contact parts 2
The orientation of 0 is such that the connecting component 30 can be inserted into the insertion opening 22.
Mount so that they are in the same direction and fix them by soldering. Next, the connection component 30 is inserted into the upper and lower pressure contact components 20 to electrically connect the patterns 11 and 12 on the upper and lower surfaces.

As described above, according to this embodiment,
By using the press contact component 20 or the female connector for surface mounting, mechanical mounting and automatic soldering are possible, and quality can be improved. Further, it becomes possible to flow a large current. Next, a second embodiment of the present invention will be described with reference to FIG. 2 is a connection structure diagram between the upper and lower patterns of the substrate,
(A) is a front view showing a connection state between patterns, and (b) is a top view.

Reference numeral 40 denotes a substrate. An upper surface side pattern 41 on which a circuit is formed of a conductor (copper) is formed on an upper surface (upper side in the drawing) of the substrate 40 and a lower surface side pattern 42 is formed on a lower surface (downside in the drawing). Electronic parts and the like that form a circuit are mounted. Clamping component 50 for patterns on the upper surface and the lower surface of the substrate 40
An escape hole 43, which is slightly larger than the holding groove 51 of the holding component 50, is formed at the position where the solder is fixed by soldering.

The holding component 50 is plate-like and has a slit-like holding groove 51 formed from the end face toward the central portion. The groove width of the holding groove 51 is formed in such a size that the connection member 60 is press-fitted. As the material, a material having excellent conductivity and elasticity, for example, a phosphor bronze plate or a brass plate is used. The connecting member 60 is a member that electrically connects the sandwiching parts 55 soldered and fixed to the upper surface and the lower surface side pattern of the board, and a conductive wire is used. Besides, a conductive square wire or a plate material can be used.

Next, the connection of the upper and lower surface side patterns will be described. First, the sandwiching component 50 is mounted on the upper surface side pattern 11 of the substrate and reflow soldering 61 is performed, and then the sandwiching component 50 is mounted on the lower surface side pattern 12 of the substrate and reflow soldering 61 is performed. The upper and lower clamping parts 5
The orientation of 0 is the holding groove 51 so that the connecting member 60 can be inserted.
Are mounted so that the openings 52 are in the same direction and fixed by soldering. Next, the connecting member 60 is pushed into the holding groove 51 of the upper and lower holding parts 50 to hold the upper and lower holding parts 50 in a connected state. Then, if necessary, the connecting member 60 and the sandwiching component 50 are soldered to electrically connect the patterns 11 and 12 on the upper and lower surfaces.

As described above, also in this embodiment, as in the first embodiment, the quality of the circuit connecting portion of the substrate is improved, the processing man-hour is reduced, and the cost is reduced. In addition, since the conductive wire 60 is used for the connection portion of the upper substrate 11, the cost can be significantly reduced. Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 3 is a connection structure diagram between upper and lower patterns of the substrate, (a) is a front view showing a connection state between the patterns, and (b) is a top view.

The third embodiment is obtained by partially changing the shape of the holding groove portion of the second embodiment. Since the other parts are substantially the same as those of the second embodiment, the same components as those of the second embodiment have the same reference numerals. Will be described, and only the differences from the second embodiment will be described and the other description will be omitted. Reference numeral 70 denotes a holding component, and standing portions 72 are formed on both side surfaces of the holding groove 71. The groove width of the tip portion 73 of the upright portion 72 is formed in such a size that the connection member 60 is press-fitted. As the material, a material having excellent conductivity and elasticity, for example, a phosphor bronze plate or a brass plate is used.

As described above, also in this embodiment, as in the second embodiment, the quality of the circuit connecting portion of the substrate is improved, the number of processing steps can be reduced, and the cost can be reduced. In addition, by forming the erected portion 72 in the holding portion of the connecting member 60 of the holding component 70, the elastic force increases in the holding portion, and the connecting member 6
When 0 is press-fitted into the holding groove 71, the connecting member 60 can be held in a stable state.

[0020]

As described above, according to the present invention,
The circuit connection man-hours and connection costs of the board are reduced. Moreover, the reliability of the circuit connecting portion of the substrate is improved, and a large current can be passed through the circuit connecting portion.

[Brief description of the drawings]

FIG. 1 is a connection structure diagram between upper and lower patterns of a substrate showing a first embodiment of the present invention, (a) is a front view showing a connection state between patterns, and (b) is a sectional view taken along line AA.

FIG. 2 is a connection structure diagram between upper and lower patterns of a substrate showing a second embodiment of the present invention, (a) is a front view showing a connection state between patterns, and (b) is a top view.

FIG. 3 is a connection structure diagram between upper and lower patterns of a substrate showing a third embodiment of the present invention, (a) is a front view showing a connection state between patterns, and (b) is a top view.

FIG. 4 is a view showing a conventional connection structure between upper and lower patterns of a substrate, (a) is a cross-sectional view of a connection portion by a through hole,
(B) is a cross-sectional view of a connecting portion by a conductive wire.

[Explanation of symbols]

 10, 40 ... Substrate 11, 41 ... Top surface pattern 12, 42 ... Bottom surface pattern 20 ... Pressure contact part 21 ... Pressure contact terminal 22 ... Insertion port 30 ... ..Connecting parts 35,61..Soldering parts 50,70..Holding parts 51,71..Holding grooves 52..openings 60..connecting members 72 .. Department

Claims (2)

[Claims] 1. A connection structure for electrically connecting patterns on both surfaces of a printed circuit board on which conductor electronic circuit patterns are formed, wherein a pressure contact part having a pressure contact function with a conductor, A circuit connecting structure for a substrate, comprising: a connecting part for electrically connecting the pressure contacting parts, wherein the pressure contacting part is fixed on the pattern, and the pressure contacting parts are connected by the connecting part. . 2. A connection structure for electrically connecting patterns on both surfaces of a printed circuit board, on both sides of which electronic circuit patterns of conductors are formed, wherein: a clamping component having a clamping function with the conductor; A circuit connecting structure for a substrate, comprising: a connecting member for electrically connecting the sandwiching parts, wherein the sandwiching part is fixed on the pattern, and the sandwiching parts are connected by the connecting member. .