JPH09162269A - Chuck table - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a chuck table which is composed of a frame and an attracting body and capable of vacuum-chucking a wafer or the like preventing the attracting body floating from the frame. SOLUTION: A chuck table 4 is composed of a frame 1 and an attracting body 2 and capable of vacuum-chucking a wafer or the like, wherein a pressing part 1a and a pressed part 2b are provided between a contacting surface between the frame 1 and the attracting body 2. The outer peripheral surface of the attracting body 2 and the inner peripheral surface of the frame 1 are tapered, and the attracting body 2 is pressed by the frame 1. The chuck table 4 is composed of the frames 1 and the attracting bodies 2 which are concentrically arranged to properly vacuum-chuck a work corresponding to its diameter, wherein the frames 1 and the attracting bodies 2 are so structured as to alternately press each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chuck table that holds a wafer or the like by suction.

[0002]

2. Description of the Related Art A dicer for cutting a wafer or a surface grinder for grinding a surface is shown in FIG.
As shown in (b), the chuck table T ₁ for sucking and holding the wafer W or the like is mounted, and the suction member B is placed in the concave portion of the frame A _1.
1 has been fitted. In addition, Fig. 6 (a), (b)
As shown in FIG. 3, a plurality of frame bodies A ₂ and suction bodies B ₂ are concentrically arranged so that the suction area can be selectively used according to the diameter of a workpiece such as a wafer. ₂ also exists conventionally.

[0003]

In the conventional chuck table T ₁ described above, the adsorbent B ₁ is adhered to the concave portion of the frame A ₁ , but a part of the adhesive layer peels off due to aging and is adsorbed. The body B ₁ floats up, which not only deteriorates the suction function, but may adversely affect precision cutting and precision polishing. Similarly, in the chuck table T ₂ , the adsorbents B ₂ arranged concentrically are adhered to the frame A ₂ , but a part of the adhesive layer peels off and the adsorbent B ₂ floats. There is. The present invention has been made to solve such conventional problems, and an object of the present invention is to provide a chuck table capable of preventing lifting of an adsorbent due to peeling of an adhesive layer.

[0004]

As a means for technically solving the above-mentioned problems, the present invention provides a chuck table for sucking and holding a wafer or the like composed of a frame body and a suction body. The gist is a chuck table in which at least a pressing portion and a pressed portion are formed in the contact portion with the suction body. Further, by forming the outer peripheral surface of the adsorbent body and the inner peripheral surface of the frame body in a taper shape and pressing the adsorbent body by the frame body, the plurality of frame bodies and the adsorbent body are concentrically arranged, The gist is that the frame body and the suction body are alternately pressed in a chuck table for appropriately suction-holding a workpiece according to the diameter.

[0005]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIGS. 1 (a) and 1 (b) show the first embodiment, which has a frame body 1 formed in a ring shape, an adsorption body 2 and a receiving plate 3, and the frame body 1 has an inner periphery thereof. The surface is formed in a tapered shape to provide a holding portion 1a, and the suction body 2 is formed in a tapered shape corresponding to the holding portion 1a of the frame body 1 to be provided with a pressed portion 2b. Further, the receiving plate 3 is formed in a disk shape, a plurality of suction holes 3a are provided, and a plurality of mounting holes 3b are provided in the peripheral portion.

The adsorbent 2 is attached to the base 4a of the chuck table 4 via the frame 1 and the receiving plate 3.
That is, as shown in FIG. 1B, the receiving plate 3 is placed on the upper surface of the base 4a, the adsorbent 2 is placed thereon, the frame 1 is covered from above, and the set screw 5 is attached to the flange of the frame 1. It can be mounted by inserting it from the mounting hole 1c formed in the portion 1b into the mounting hole 3b of the receiving plate 3 and screwing it into the screw hole 4b of the base 4a. At this time, the suction holes 3 of the receiving plate 3
a and the suction path 6 provided on the base 4a communicate with each other.

When the chuck table 4 is formed in this manner, the held portion 2b of the outer peripheral surface of the suction body 2 is held by the holding portion 1a of the inner peripheral surface of the frame body 1, and the holding portion 1a of the frame body 1 is As described above, since the taper shape is formed so that the diameter decreases toward the upper surface side, it is possible to reliably prevent the suction member 2 from rising.

FIG. 2 shows a second embodiment of the present invention, which has a ring-shaped frame body 11, an adsorbing body 12 and a receiving plate 13, and the inner peripheral surface of the frame body 11 is stepped. And a pressing portion 11a is provided on the outer peripheral surface of the suction body 12 in a stepped shape corresponding to the pressing portion 11a of the frame body 11.
b is provided. The receiving plate 13 is formed in the same disk shape as the receiving plate 3, a plurality of suction holes 13a are provided, and a plurality of mounting holes 13b are provided in the peripheral portion.

Also in this case, the suction body 12 is provided with the base 11a of the chuck table 14 via the frame 11 and the receiving plate 13.
The suction hole 13a of the receiving plate 13 and the suction path 16 arranged in the base 14a are connected to each other by a set screw 15.

In the chuck table 14 formed in this manner, the suction body 12 has a stepped portion 12b.
Is pressed by the stepped pressing portion 11a of the frame body 11,
Moreover, since the hole diameter of the upper surface of the frame body 11 is formed smaller than the hole diameter of the lower surface by the pressing portion 11a, the lifting of the suction body 12 can be reliably prevented.

FIG. 3 shows a third embodiment of the present invention, which is a chuck table 24 of a type in which a plurality of suction bodies 22 and a plurality of frames 21 and 27 are concentrically arranged. The adsorbent 22 and the frames 21 and 27 are disc-shaped receiving plates 2
It is configured to be fixed to the base 24a of the chuck table 24 with the setscrew 25 through 3. At this time, the suction holes 23a of the receiving plate 23 and the suction paths 26 arranged in the base 24a communicate with each other.

In this case, the frame body 21 is provided with a tapered pressing portion 21a on the inner peripheral surface thereof similarly to the frame body 1, and the suction body 2 is provided.
2 and the ring-shaped frame 27 have tapered pressed portions 22b and 27b formed on the outer peripheral surface and tapered pressed portions 22a and 27a formed on the inner peripheral surface, respectively, and the outer peripheral surfaces are alternately formed. At the same time as the outer member is pressed, the inner peripheral surface is pressed against the inner member.

The chuck table 2 formed in this way
Since 4 has a structure in which the suction body 22 and the ring-shaped frame body 27 are both pressed by the tapered pressing portion, it is possible to reliably prevent the suction body 22 from rising.

FIG. 4 shows a fourth embodiment of the present invention, which also includes a plurality of adsorbent bodies 32 and a plurality of frame bodies 31, 37.
Is a chuck table 34 arranged concentrically, and the suction body 32 and the frames 31 and 37 are disc-shaped receiving plates 3
It is fixed to the base 34a of the chuck table 34 by means of a set screw 35. Also at this time, the suction holes 33a of the receiving plate 33 and the suction passages 36 arranged in the base 34a communicate with each other.

In this case, the frame body 31 is provided with a step-like pressing portion 31a on the inner peripheral surface thereof similarly to the frame body 11, and the step portion is provided on the outer peripheral surfaces of the suction body 32 and the ring-shaped frame body 37. -Shaped pressed portions 32b and 37b are formed, and stepped pressing portions 32a and 37a are formed on the inner peripheral surface, and the outer peripheral surface is alternately pressed from the outer member and at the same time the inner peripheral surface is pressed. Is configured to hold down the inner member.

The chuck table 3 formed in this way
4 has a structure in which both the suction body 32 and the ring-shaped frame body 37 are pressed by the stepped pressing portion, and therefore, the suction body 3
It is possible to surely prevent the floating of No. 2.

In each of the above-mentioned embodiments, the adsorbent and the non-adsorbent are merely pressed, but they are adhered to each other or to the frame or the receiving plate to further improve the fixed state. It is also possible.

[0018]

As described above, according to the present invention,
In a chuck table that holds wafers by suction,
Since the adsorbent is configured to be held down by the frame, it is possible to reliably prevent the adsorbent from being lifted up, which prevents the adsorption function from deteriorating, and has the excellent effect of ensuring precise cutting or polishing. Play.

[Brief description of the drawings]

FIG. 1 shows a first embodiment of the present invention;
(A) is an exploded perspective view of a main part, and (B) is a schematic sectional view of a chuck table.

FIG. 2 is a schematic cross-sectional view of a chuck table showing a second embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view of a chuck table showing a third embodiment of the present invention.

FIG. 4 is a schematic sectional view of a chuck table showing a fourth embodiment of the present invention.

FIG. 5 shows a conventional chuck table.
Is a perspective view of the upper part, and (b) is a schematic sectional view.

FIG. 6 shows another conventional chuck table,
(A) is a perspective view of the upper part, and (B) is a schematic sectional view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Frame body 1a ... Holding part 1b ... Flange part 1c ... Mounting hole 2 ... Adsorption body 2b ... Pressed part 3 ... Receiving plate 3a ... Suction hole 3b ... Mounting hole 4 ... Chuck table 4a ... Base 4b ... Screw hole 5 ... Set screw 6 ... Suction path

Claims (3)

[Claims] 1. A chuck table for sucking and holding a wafer or the like composed of a frame body and a suction body, in which at least a pressing portion and a pressed portion are formed at a contact portion between the frame body and the suction body. . 2. The chuck table according to claim 1, wherein the outer peripheral surface of the suction body and the inner peripheral surface of the frame body are formed in a tapered shape, and the suction body is pressed by the frame body. 3. A chuck table in which a plurality of frame bodies and a suction body are concentrically arranged, and a workpiece is suction-held appropriately in accordance with the diameter of the workpiece, the frame body and the suction body are The chuck table according to claim 1 or 2, which can be pressed alternately.