JPH09121557A - Electronic parts cooling structure for rotary equipment and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the heat transmitting ability of a cooling structure so as to improve the cooling ability of the structure by fixing heat generating electronic parts to a heat-conductive thin plate through an insulating substrate. SOLUTION: A substrate 20 mounted with a heat generating chip 16 is directly fitted to the upper opening end side of a liquid-cooled heat sink 12 through an O-ring 18 which is an airtight securing means. Since an untifreezing solution circularly supplied to the heat sink 12 by means of a pump directly comes into contact with the bottom face of the substrate 20 and absorbs the heat generated from the chip 16 and a radiator radiates the heat, the chip 16 is cooled. The chip 16 is incorporated with a semiconductor switching element, a diode, a capacitor, etc. Since the radiator is positioned at a distance from the chip 16, the heat radiated from the radiator does not raise the ambient temperature of the chip 16.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for cooling electronic parts of rotating equipment and a method for manufacturing the same, and more particularly to a structure for cooling electronic parts suitable for cooling electronic parts of an inverter for controlling the speed of rotating equipment and a method for manufacturing the same. It is about.

[0002]

2. Description of the Related Art In a rotating machine using an electric motor as a drive source, a semiconductor device forming a control device for the electric motor generates heat, so that a cooling means is required. For example, in an electric vehicle, a power conversion inverter that converts a battery power source into an AC power source, a driving electric motor, a torque command calculation unit that determines a torque command of the electric motor according to an accelerator opening degree, a torque command, and a torque command and It is provided with a slip frequency calculating means for calculating the slip frequency based on the rotation speed of the electric motor, and a signal generating means for generating a signal to be applied to the inverter based on the output of the calculating means. This inverter is IGB
It includes a chip called T, a diode, and other semiconductor parts. Since this semiconductor part generates heat during power conversion, it is mounted on a power head and cooled.

Generally, regarding cooling of a power head for an electric vehicle, an air cooling system as described in JP-A-47-31317 is known.

However, with the improvement of the driving characteristics of the electric vehicle, a sufficient cooling effect cannot be obtained by the air cooling system. Therefore, a liquid cooling system using cooling water has also been proposed. For example, in Japanese Unexamined Patent Publication No. 6-303704, a copper heat diffusion plate having a thickness of about 5 mm is attached to one end of a water-cooled heat sink, and a board on which heat-generating electronic components of an inverter are mounted is fixed with a bolt on the heat diffusion plate. It is configured to do.
A water passage for circulating cooling water is provided in the water-cooled heat sink, and the heat of the electronic component is transmitted to the cooling water through the heat diffusion plate and the heat sink.

On the other hand, as an example of the cooling means for stationary equipment, in Japanese Patent Laid-Open No. 7-106478, heat generating electronic parts are mounted on the bottom surface of a cooling tank in which the liquid refrigerant is sealed, and the boiling liquid refrigerant is cooled in the cooling tank. It is shown that a heat-generating electronic component is cooled by a boiling cooling system in which a tube and fins provided in the upper portion cool the same.

[0006]

According to the above water cooling system, the cooling effect is greatly enhanced as compared with the air cooling system. However, with further improvement in the driving characteristics of the electric vehicle, there is a demand for a lightweight and compact cooling device having a higher cooling capacity for the heating element of the inverter.

On the other hand, in the above boiling cooling system, the tubes and fins of the cooling tank located above the electronic parts are large, and the weight of the entire cooling tank is large. When the present invention is applied to the cooling of rotating equipment, it is considered that when the rotating equipment has a large weight, it is likely to be subjected to a large force due to vibration, and the influence of this on electronic components cannot be ignored. Further, since the heat generating portion and the heat radiating portion are close to each other, the ambient temperature around the electronic component becomes high, which may cause the cooling ability to deteriorate.

An object of the present invention is to provide a cooling structure for electronic components of rotating equipment, which has improved heat transfer performance and enhanced cooling capacity, and a manufacturing method thereof.

Another object of the present invention is to be light weight and resistant to vibration,
An object of the present invention is to provide a compact cooling structure for electronic components of rotating equipment and a manufacturing method thereof.

[0010]

The features of the present invention include an electric motor for driving a rotating machine, a control device for controlling the rotation of the electric motor, and a cooling means for cooling the heat-generating electronic components of the control device. In an electronic component cooling structure for a rotating device, the cooling means includes a liquid cooling heat sink having a flow path for circulating a body fluid of the refrigerant and an opening provided so as to face a part of the flow path,
A radiator having a heat conductive thin plate fixed to the liquid cooling heat sink via a sealing means so as to cover the opening, and a flow path connected to a flow path of the liquid cooling heat sink via a pump and a pipe. The heat-generating electronic component is fixed to the heat-conductive thin plate via an insulating substrate, and the heat of the heat-generating electronic component is transferred to the antifreeze liquid via the heat-conductive thin plate. is there.

Another feature of the present invention is that an inverter that converts electric power to be supplied to an electric motor, a control circuit that generates a signal to be applied to the inverter to control the electric motor, and a heating electronic component of the inverter is cooled. In an electronic component cooling structure for a rotating device including a cooling means, the cooling means, a liquid cooling heat sink having a flow passage for liquid refrigerant circulation and an opening provided facing a part of the flow passage, A heat conductive thin plate on which the heat-generating electronic component is mounted via an insulating substrate, and a radiator having a flow path connected to a flow path of the liquid cooling heat sink via a pump and a pipe, a liquid refrigerant Is an antifreeze liquid, and the heat conductive thin plate is fixed to the opening of the liquid cooling heat sink through a sealing means.

Another feature of the present invention comprises an electric motor for driving a rotating machine, a control device for controlling the rotation of the electric motor, and a cooling means for cooling the heat-generating electronic components of the control device with a liquid refrigerant. A method of manufacturing an electronic component cooling structure for a rotating device, wherein the substrate portion having the heat-generating electronic component mounted thereon is attached to the opening side of a cup-type liquid cooling heat sink through which a liquid refrigerant circulates, wherein the substrate portion is an insulating substrate. A thin plate-shaped member comprising a copper plate underlay provided on the lower side, a copper plate upholstery provided on the upper side of the insulating substrate, and the semiconductor heating element mounted on the upholstery, the insulating substrate The upper lining made of the copper plate and the lower lining made of the copper plate are simultaneously joined in an atmospheric furnace.

According to the present invention, since the heat conductive thin plate on which the heat-generating electronic components of the control device are mounted is directly attached to the opening of the liquid cooling heat sink through the secret means, the substrate portion holding the electronic components has a thin structure. Becomes Moreover, the heating element is directly fixed to the heat sink. Therefore, the thermal resistance can be greatly reduced as compared with the method using the thick heat diffusion plate, and the cooling effect for the heat-generating electronic component is increased. Further, since the liquid refrigerant for contacting the heat conductive thin plate and forcing heat to circulate the liquid refrigerant is provided, it is possible to provide an electronic component cooling structure for rotating equipment which is lighter in weight and superior in earthquake resistance as compared with the boiling cooling method. .

According to another feature of the present invention, since the heat conductive thin plate on which the heat-generating electronic components of the inverter are mounted is directly attached to the opening of the liquid cooling heat sink through the secret means, the inverter electronic is lightweight and compact. A cooling structure for the parts is obtained.

According to another feature of the present invention, it is possible to manufacture an electronic component cooling structure for a rotating machine, which greatly reduces thermal resistance and has a great cooling effect on heat-generating electronic components.

[0016]

1 shows an example of a control circuit of an electric vehicle to which the present invention is applied. The torque command device 1 for an electric vehicle receives a signal from a potentiometer that changes according to the amount of depression of the accelerator 2 and a signal from a rotation speed sensor 4 that detects the rotation speed of the electric motor 3, and calculates and outputs a torque command value. . The signal generator 5 outputs the PWM control signal so as to generate the torque of the command value, and the PW
The inverter 6 converts the DC power supplied from the battery 7 into AC by the M control signal and supplies the AC power to the electric motor 3.
The temperatures of the electric motor and the inverter are detected by the thermistors 8 and 9, and control such as stopping the inverter 6 is performed so that the temperature does not rise above a predetermined temperature.

In order to cool the electric motor 3 and the inverter 6, a liquid coolant, for example, an antifreezing liquid is circulated in the liquid cooling heat sink 12 of the electric motor 3 and the inverter 6 through the pipe 11 by the circulation pump 10, and a radiator 13 and a radiator as a radiator are provided. The cooling fan 14 radiates heat. 15 is a water temperature sensor,
When the temperature of the refrigerant rises, the rotation speed of the cooling fan 14 is increased,
Increase cooling capacity.

Next, enlarged views of the liquid cooling heat sink 12 provided in the inverter 6 are shown in FIGS. FIG. 2 is a top view of a liquid-cooled heat sink portion for only one phase among the three phases (U phase, V phase, W phase), and FIG. 3 is a longitudinal sectional view thereof. The liquid-cooled heat sink has a cup-shaped cross section, and the cup portion of the liquid-cooled heat sink 12 serves as a flow path for the antifreeze liquid. Further, the substrate 20 on which the electronic component 16 of the inverter is mounted is directly attached to the upper open end side of the liquid cooling heat sink 12 via an O-ring 18 which is a secret means. The antifreeze liquid is forcibly circulated and supplied by the pump 10 to the cup-type liquid-cooled heat sink to directly contact the bottom surface of the substrate 20 to remove the heat of the heat-generating electronic component 16 on the substrate and release the heat with the radiator 13. The electronic component 16 is cooled. The electronic component 16 includes a semiconductor switching element, a diode, a capacitor and the like. The radiator 13 is a heat-generating electronic component 1.
Since it is installed at a position away from the radiator 6, heat radiation from the radiator does not raise the ambient temperature of the electronic component 16.

The substrate 20 is a subbing 22 made of a thin copper plate, and an insulating substrate 2 made of alumina provided on the upper side thereof.
1 and a copper plate overlay 23 provided on the upper side of the insulating substrate 21, and the semiconductor electronic component 16 is mounted on the overlay 23.

The copper plate overlay 23 includes a plurality of blocks 2 corresponding to the bottom surface of the holding plate 24 for protecting the semiconductor electronic component (heating element) 16 and the mounting surface of the semiconductor heating element 16.
It is divided into 3A, 23B, 23C ... On the other hand, the copper plate underlayer 22 has the same planar shape as the insulating substrate 21.

The thickness of the underlayer 22 and the upper layer 23 made of a copper plate is preferably 0.3 to 0.5 mm. If it is too thin, the strength will be insufficient. On the other hand, when the thickness exceeds 0.5 mm, the amount of deformation due to the difference in thermal expansion from the insulating substrate made of alumina and the like becomes large, and it becomes difficult to fix the seal while holding it.

The thickness of the alumina substrate 20 is generally about 0.6 to 0.7 mm. Therefore, the total thickness of the substrate portion including the upper layer 23, the substrate 20, and the lower layer 22 is as thin as about 1.2 to 1.5. As described above, since the entire substrate portion is thin and lightweight, the semiconductor element 16 is hardly affected by the vibration accompanying the rotation of the electric motor 3.

A rubber sheet having a thickness of 0.1 to 0.2 mm is disposed between the bottom surface of the pressing plate 24 and the copper plate overlay 23. A rubber sheet having a thickness of 0.1 to 0.2 mm is also arranged between the copper plate underlayer 22 and the liquid cooling heat sink 12. This rubber sheet is for absorbing the difference in thermal expansion due to the difference in material between the substrate and the upper and lower layers.

FIG. 4 is a top view of the entire liquid-cooled heat sink, and FIG. 5 is a vertical sectional view taken along the line AA. The heat sink 12 is
There is an opening 121 corresponding to the U-phase, V-phase, and W-phase substrates, an O-ring groove 25 is provided around the opening 121, and a fastening portion 26 for fixing the holding plate 24 to the outside of the O-ring groove.
Is provided. Since the pressure of the antifreeze liquid is about 0.6 kg / cm, it is necessary to secure the airtightness to withstand this by the O-ring and the fastening portion 26.

As shown in FIG. 5, the liquid-cooled heat sink 12
Has a convex bottom surface 122, and the cooling water flowing from the inlet 123 toward the outlet 124 is given a velocity component in the direction of rising toward the opening 121. for that reason,
The flow of cooling water directly contacts the copper plate underlayer of the substrate 20 located above the opening 121, increasing the cooling effect.

Here, a method of manufacturing the substrate portion will be described.
First, the cup-type liquid cooling heat sink 12 is manufactured by die casting. Next, the insulating substrate 21 and the copper plate overlay 2
3 and the copper plate underlayer 22 are simultaneously joined in an atmosphere furnace.

Next, referring to FIG. 6, comparing the thermal resistance from the substrate portion of the present invention to the cooling water (antifreeze liquid) with the thermal resistance in the case of using the conventional heat diffusion plate, become that way. In the figure, (a) is a conventional example, and (b) is a schematic representation of the configuration of the present invention.

In the conventional substrate part, a heat diffusion plate having a thickness of about 3 mm is arranged under the substrate, and grease for reducing the contact thermal resistance is filled between the heat diffusion plate and the heat sink. . A cooling water channel is provided in the heat sink. The thermal resistance in such a configuration is R0 =
Rj-c + 2 (Rc-f + Rf-w) (composition ratio) (50%) (20%) (30%). However, Rj-c: Thermal resistance from the electronic component to the heat diffusion plate Rc-f: Thermal resistance from the heat diffusion plate to the heat sink (at the grease portion) Rf-w: Thermal resistance to the cooling water in the heat sink The thermal resistance of the substrate is R1 = Rj-c + 2Rd-w (constituent ratio) (50%) (10%). Apprxeq.0.6R0. However, Rj-c: thermal resistance from electronic component to heat sink Rd-w: thermal resistance to cooling water in heat sink According to the present invention, there is no grease part (Rc-f = 0),
Further, since the cooling water directly contacts the underlayer 22 of the substrate 20, the thermal resistance (Rd-w) of this portion is also extremely small.

As described above, according to the present invention, the thermal resistance from the substrate portion to the cooling water is about 0.6 of the conventional value, the heat transfer coefficient is improved, and the cooling effect is increased accordingly.

FIG. 7 is a top view of the entire liquid-cooled heat sink according to another embodiment of the present invention, and FIG. 8 is a vertical sectional view taken along line BB thereof. The heat sink 12 has openings 121 corresponding to the U-phase, V-phase, and W-phase substrates, and the bottom surface 122 is flat. The internal water channel is provided so as to avoid the fastening portion 26.
With this configuration, the height of the heat sink can be kept low.

FIG. 9 is a top view of the entire liquid-cooled heat sink according to another embodiment of the present invention, and FIG. 10 is a vertical sectional view taken along the line CC. In this embodiment, the fixing portion 126 divides the opening into two parts 121A and 121B. With this configuration, the central portion of the alumina insulating substrate 21 can be fixed to the fixing portion 126 with a screw, and good contact between the substrate 20 and the heat sink can be maintained.

When a fixing part such as a screw cannot be provided at the center of the insulating substrate 21 made of alumina, as shown in FIGS.
As shown in FIG. 3, when the central presser 27 interposed between the presser plate 24 and the presser plate 24 suppresses the heat, the contact state between the heat sink 12 and the substrate 20 can be kept good. Now, for this example,
The stress generated in the insulating substrate 21 is roughly estimated using the formula of the beam fixed at both ends. Assuming that the shorter distance between the fixed ends of the insulating substrate is l, the maximum bending moment at this time is M = pl2 / 12 (1) where p: pressure. The stress σ at this time is σ = M / Z (2) where Z is the section modulus, and Z = h2 / 6 (3) where h: plate thickness.

From equations (1), (2) and (3) Here, p = 1 [kgf / cm2] = 0.1 [MP
a], l = 62 [mm], h = 0.635 [mm], σ = 477 [MPa] (5) On the other hand, in order to prevent AlN from breaking, 250 [MPa]
The stress is too large because it needs to be below a certain level.

Therefore, considering the case where a support for suppressing the deflection is added on the center line of the substrate, l = 31 [mm], so σ = 119 [MPa] (6), which is less than the allowable stress.

Further, it is ideal that the pressing member 27 at the center is in contact with a pressing force of 0 before applying pressure, but this is difficult. At the time when the center presser 27 is set, the stress σ when the substrate is pushed in by δ is Here, E: Young's modulus of the substrate, h: thickness of the substrate, l = total width of the substrate.

E = 300000 [MPa], h = 0.6
Calculating with 35 [mm] and δ = 0.05 [mm], σ = 59 [MPa] (8) Therefore, the stress generated in the insulating substrate 21 is not more than the allowable value.

[0037]

According to the present invention, since the heat conductive thin plate on which the heat-generating electronic components of the control device are mounted is directly attached to the opening of the liquid-cooled heat sink through the secret means, the substrate portion holding the electronic components is It has a thin structure. Moreover, the heating element is directly fixed to the heat sink. Therefore,
As compared with the method using a thick heat diffusion plate, the thermal resistance can be greatly reduced, so that the cooling effect on the heat-generating electronic components is increased. In addition, since the liquid refrigerant that exchanges heat by contacting the heat conductive thin plate is forcedly circulated, the board part that holds electronic components is more compact than the boiling cooling method, and it is lightweight and has excellent earthquake resistance. An electronic component cooling structure for a device can be provided.

According to another feature of the present invention, since the heat conductive thin plate having the heat generating electronic components of the inverter mounted directly on the opening of the liquid cooling heat sink through the secret means, it is lightweight and compact. A cooling structure for inverter electronic components can be obtained.

Further, according to another feature of the present invention, it is possible to provide the manufacturing of the electronic component cooling structure of the rotating machine, which greatly reduces the thermal resistance and has a great cooling effect on the heat-generating electronic components.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of a control circuit of an electric vehicle to which the present invention is applied.

FIG. 2 is an enlarged top view of a liquid cooling heat sink portion according to an embodiment of the present invention.

FIG. 3 is a vertical sectional view of a kitchen 2.

FIG. 4 is a top view of the entire liquid-cooled heat sink according to an embodiment of the present invention.

5 is a vertical cross-sectional view taken along the line AA of FIG.

FIG. 6 is a diagram for explaining the thermal resistance near the substrate portion of the present invention in comparison with the thermal resistance of the conventional configuration.

FIG. 7 is a top view of the entire liquid-cooled heat sink according to another embodiment of the present invention.

8 is a vertical cross-sectional view taken along line BB of FIG.

FIG. 9 is a top view of the entire liquid-cooled heat sink according to another embodiment of the present invention.

10 shows a vertical cross-sectional view taken along the line CC of FIG.

FIG. 11 is a top view of the vicinity of a substrate unit according to another embodiment of the present invention.

FIG. 12 shows a vertical sectional view of FIG.

[Explanation of symbols]

6 ... Inverter, 7 ... Battery, 10 ... Circulation pump,
12 ... Liquid-cooled heat sink, 16 ... Inverter electronic parts, 21 ... Alumina insulating substrate, 22 ... Underlay, 23
… Upholstery, 121… Opening

Claims (15)

[Claims] 1. An electronic component cooling structure for a rotating device, comprising: an electric motor for driving a rotating device; a control device for controlling rotation of the electric device; and a cooling means for cooling heat-generating electronic components of the control device. The cooling means, a liquid cooling heat sink having a flow path for liquid refrigerant circulation and an opening provided facing a part of the flow path,
A radiator having a heat conductive thin plate fixed to the liquid cooling heat sink via a sealing means so as to cover the opening, and a flow path connected to a flow path of the liquid cooling heat sink via a pump and a pipe. And the heat-generating electronic component is fixed to the heat-conductive thin plate via an insulating substrate, and heat of the heat-generating electronic component is transferred to the liquid refrigerant via the heat-conductive thin plate. A cooling structure for electronic components of rotating equipment. 2. An inverter that converts electric power and supplies the electric motor to the electric motor, a control circuit that generates a signal applied to the inverter to control the electric motor, and a cooling unit that cools heat-generating electronic components of the inverter. In an electronic component cooling structure for rotating equipment, the cooling means includes a liquid cooling heat sink having a flow path for liquid refrigerant circulation and an opening provided facing a part of the flow path,
A heat conductive thin plate on which the heat-generating electronic component is mounted via an insulating substrate; and a radiator having a flow path connected to a flow path of the liquid cooling heat sink via a pump and a pipe. The electronic component cooling structure for a rotating device, wherein the refrigerant is an antifreezing liquid, and the heat conductive thin plate is fixed to the opening of the liquid cooling heat sink via a sealing means. 3. A copper plate lining is provided on the upper side of the insulating substrate, and a semiconductor element as the heat generating electronic component is mounted on the lining. Electronic component cooling structure for rotating equipment. 4. The copper plate overlay is divided into a plurality of blocks corresponding to a bottom surface of a holding plate for protecting the semiconductor element and a mounting surface of the semiconductor element, and the heat conductive thin plate is formed of The electronic component cooling structure for a rotating device according to claim 1 or 2, wherein the structure is a single plane along the insulating substrate. 5. The cooling structure for electronic parts of rotating equipment according to claim 3, wherein the thickness of the copper plate overlay and the heat conductive thin plate is 0.3 to 0.5 mm. . 6. The rubber sheet according to claim 3, further comprising a rubber sheet having a thickness of 0.1 to 0.2 mm arranged between the bottom surface of the holding plate and the copper plate overlay. Electronic component cooling structure for the rotating equipment described. 7. The rubber sheet according to claim 3, further comprising a rubber sheet having a thickness of 0.1 to 0.2 mm, which is disposed between the heat conductive thin plate and the liquid cooling heat sink. Electronic component cooling structure for rotating equipment. 8. The secret means is an O-ring, and the heat conductive thin plate is attached to the open end side of the liquid cooling heat sink via a holding plate. The electronic component cooling structure for rotating equipment according to [1]. 9. The liquid-cooled heat sink is manufactured by tie casting, an O-ring groove is provided around the open end of the heat sink, and a fastening portion for fixing the pressing plate is provided outside the O-ring groove. An electronic component cooling structure for rotating equipment according to any one of claims 3 to 4, wherein: 10. The rotating device according to claim 3, wherein the central portion of the alumina insulating substrate is suppressed by a central retainer interposed between the retaining plate and the alumina insulating substrate. Electronic component cooling structure. 11. A bottom surface of the liquid cooling heat sink has a convex shape at a portion corresponding to the opening, and the thermal conductivity of the liquid refrigerant fixed to the opening by the action of the convex portion. The electronic component cooling structure for a rotating device according to claim 3, wherein the electronic component cooling structure is configured to flow toward a thin plate. 12. An opening of the liquid cooling heat sink is divided into two by a fixing portion.
12. An electronic component cooling structure for a rotating device according to any one of 1 to 11. 13. An inverter for converting power from a battery power source to an AC power source and supplying it to an electric motor, and a signal to be applied to the inverter to control the electric motor based on an accelerator opening degree and a rotation speed of the electric motor. Control circuit,
In an electric vehicle including a cooling means for cooling the heat-generating electronic components of the inverter, the cooling means includes a liquid cooling heat sink having a flow path for circulating antifreeze liquid and an opening provided in a part of the flow path. A radiator having a flow passage connected to the flow passage of the liquid cooling heat sink via a pump and a pipe, and a substrate portion having the heat generating electronic component of the inverter mounted in the opening portion of the liquid cooling heat sink. An electronic component cooling structure for an electric vehicle, which is directly mounted through a secret means. 14. A cup in which a liquid refrigerant circulates, comprising an electric motor for driving a rotating device, a control device for controlling the rotation of the electric motor, and a cooling means for cooling the heat-generating electronic components of the control device with the liquid refrigerant. A method of manufacturing an electronic component cooling structure for a rotating device, wherein a substrate portion having the heat-generating electronic component mounted thereon is attached to an opening side of a mold liquid cooling heat sink, the substrate portion being a copper plate provided below an insulating substrate. Is a thin plate-like member consisting of a metal underlay, a copper plate upholstery provided on the upper side of the insulating substrate, and the semiconductor heating element mounted on the upholstery. A method of manufacturing an electronic component cooling structure for a rotating machine, characterized in that the upholstery and the copper plate underlay are simultaneously joined in an atmosphere furnace. 15. An opening side of a cup-type liquid-cooled heat sink, in which an inverter for converting electric power and supplying it to an electric motor and a control circuit for generating a signal to be applied to the inverter to control the electric motor are provided, and a liquid refrigerant circulates. In the method for manufacturing an electronic component cooling structure in an electric car, wherein the substrate portion on which the semiconductor heating element of the inverter is mounted is attached via a secret means, the substrate portion is an insulating substrate made of alumina, and A copper plate underlayer provided on the side, a copper plate overlay provided on the upper side of the insulating substrate, and a thin plate-shaped member composed of the semiconductor heating element mounted on the overlay, the insulating substrate, A method of manufacturing an electronic component cooling structure for an electric vehicle, comprising simultaneously bonding the copper plate overlay and the copper plate overlay under an atmosphere furnace.