JPH0859990A - Heat-resistant resin composition, insulated electric wire and coating base material - Google Patents
Heat-resistant resin composition, insulated electric wire and coating base materialInfo
- Publication number
- JPH0859990A JPH0859990A JP6194475A JP19447594A JPH0859990A JP H0859990 A JPH0859990 A JP H0859990A JP 6194475 A JP6194475 A JP 6194475A JP 19447594 A JP19447594 A JP 19447594A JP H0859990 A JPH0859990 A JP H0859990A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- heat
- resistant resin
- alcohol
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 20
- 239000000463 material Substances 0.000 title claims abstract description 8
- 229920006015 heat resistant resin Polymers 0.000 title claims description 18
- 239000011248 coating agent Substances 0.000 title abstract description 13
- 238000000576 coating method Methods 0.000 title abstract description 13
- -1 citric acid ester Chemical class 0.000 claims abstract description 24
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Natural products OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 239000004962 Polyamide-imide Substances 0.000 claims abstract description 14
- 229920002312 polyamide-imide Polymers 0.000 claims abstract description 14
- 239000004020 conductor Substances 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 10
- 238000005299 abrasion Methods 0.000 abstract description 4
- APVVRLGIFCYZHJ-UHFFFAOYSA-N trioctyl 2-hydroxypropane-1,2,3-tricarboxylate Chemical compound CCCCCCCCOC(=O)CC(O)(C(=O)OCCCCCCCC)CC(=O)OCCCCCCCC APVVRLGIFCYZHJ-UHFFFAOYSA-N 0.000 abstract description 4
- 125000000217 alkyl group Chemical group 0.000 abstract description 2
- 125000002947 alkylene group Chemical group 0.000 abstract description 2
- 125000003710 aryl alkyl group Chemical group 0.000 abstract description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 abstract 1
- 150000001875 compounds Chemical group 0.000 abstract 1
- 125000000753 cycloalkyl group Chemical group 0.000 abstract 1
- 235000019441 ethanol Nutrition 0.000 description 21
- 150000001298 alcohols Chemical class 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000003973 paint Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004135 Bone phosphate Substances 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- NOPFSRXAKWQILS-UHFFFAOYSA-N docosan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCCCCCO NOPFSRXAKWQILS-UHFFFAOYSA-N 0.000 description 2
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- ZWRUINPWMLAQRD-UHFFFAOYSA-N nonan-1-ol Chemical compound CCCCCCCCCO ZWRUINPWMLAQRD-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- HLZKNKRTKFSKGZ-UHFFFAOYSA-N tetradecan-1-ol Chemical compound CCCCCCCCCCCCCCO HLZKNKRTKFSKGZ-UHFFFAOYSA-N 0.000 description 2
- KJIOQYGWTQBHNH-UHFFFAOYSA-N undecanol Chemical compound CCCCCCCCCCCO KJIOQYGWTQBHNH-UHFFFAOYSA-N 0.000 description 2
- JXNPEDYJTDQORS-HZJYTTRNSA-N (9Z,12Z)-octadecadien-1-ol Chemical compound CCCCC\C=C/C\C=C/CCCCCCCCO JXNPEDYJTDQORS-HZJYTTRNSA-N 0.000 description 1
- IKYKEVDKGZYRMQ-PDBXOOCHSA-N (9Z,12Z,15Z)-octadecatrien-1-ol Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCCO IKYKEVDKGZYRMQ-PDBXOOCHSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- LEAQUNCACNBDEV-KHPPLWFESA-N (Z)-undec-1-en-1-ol Chemical compound CCCCCCCCC\C=C/O LEAQUNCACNBDEV-KHPPLWFESA-N 0.000 description 1
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 1
- XFRVVPUIAFSTFO-UHFFFAOYSA-N 1-Tridecanol Chemical compound CCCCCCCCCCCCCO XFRVVPUIAFSTFO-UHFFFAOYSA-N 0.000 description 1
- WAPNOHKVXSQRPX-UHFFFAOYSA-N 1-phenylethanol Chemical compound CC(O)C1=CC=CC=C1 WAPNOHKVXSQRPX-UHFFFAOYSA-N 0.000 description 1
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 1
- YFMPEMGQFRTYGJ-UHFFFAOYSA-N 2-hydroxy-4-octoxy-2-(2-octoxy-2-oxoethyl)-4-oxobutanoic acid Chemical compound CCCCCCCCOC(=O)CC(O)(C(O)=O)CC(=O)OCCCCCCCC YFMPEMGQFRTYGJ-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 229960000735 docosanol Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JXNPEDYJTDQORS-UHFFFAOYSA-N linoleyl alcohol Natural products CCCCCC=CCC=CCCCCCCCCO JXNPEDYJTDQORS-UHFFFAOYSA-N 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 229940043348 myristyl alcohol Drugs 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000005346 substituted cycloalkyl group Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229940087291 tridecyl alcohol Drugs 0.000 description 1
- XDBHOJZQCFTTME-UHFFFAOYSA-N tris[2-(2-butoxyethoxy)ethyl] 2-hydroxypropane-1,2,3-tricarboxylate Chemical compound CCCCOCCOCCOC(=O)CC(O)(C(=O)OCCOCCOCCCC)CC(=O)OCCOCCOCCCC XDBHOJZQCFTTME-UHFFFAOYSA-N 0.000 description 1
- 229940057402 undecyl alcohol Drugs 0.000 description 1
Landscapes
- Organic Insulating Materials (AREA)
- Insulated Conductors (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は耐熱性樹脂組成物に関
し、さらに詳しくは過酷な条件下でも耐摩耗性に優れる
耐熱性樹脂組成物およびこの組成物を用いた絶縁電線、
コーティング基材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-resistant resin composition, and more specifically to a heat-resistant resin composition having excellent abrasion resistance even under severe conditions, and an insulated wire using this composition,
It relates to a coating substrate.
【０００２】[0002]
【従来の技術】ポリアミドイミド樹脂を用いた塗料は、
その良好な耐熱性、耐溶剤性および耐薬品性から電気絶
縁用塗料や各種基材のコーティング材として広く用いら
れている。近年、コーティングされた各種基材について
は、使用される機械部品の使用条件が過酷化しており、
塗料の耐摩耗性の向上が要望されている。これに対応す
るためポリアミドイミド樹脂塗料に各種の滑材を添加し
てコーティング膜の滑り性および耐摩耗性を向上させる
方法がとられている。しかし、上記方法では、特に過酷
な条件で使用される場合にはまだ耐摩耗性が不充分であ
り、さらなる向上が求められている。2. Description of the Related Art Paints using polyamide-imide resin are
Due to its good heat resistance, solvent resistance and chemical resistance, it is widely used as a coating material for electrical insulating paints and various base materials. In recent years, with respect to various coated substrates, the usage conditions of the mechanical parts used have become severe,
There is a demand for improvement in the wear resistance of paints. In order to cope with this, a method of adding various lubricants to the polyamide-imide resin paint to improve the slipperiness and abrasion resistance of the coating film is taken. However, in the above method, the wear resistance is still insufficient especially when used under severe conditions, and further improvement is required.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、前記の従来
技術の問題を解決し、過酷な条件下でも耐摩耗性に優れ
たコーティング膜を形成することができる耐熱性樹脂組
成物、この組成物を用いた絶縁電線およびコーティング
基材を提供するものである。DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, and a heat-resistant resin composition capable of forming a coating film having excellent abrasion resistance even under severe conditions, and this composition. The present invention provides an insulated electric wire and a coating substrate using the product.
【０００４】[0004]
【課題を解決するための手段】本発明は、ポリアミドイ
ミド樹脂およびクエン酸エステルを含み、ポリアミドイ
ミド樹脂１００重量部に対してクエン酸エステルを１〜
３０重量部としてなる耐熱性樹脂組成物、この組成物を
導体上に直接または他の絶縁物を介して塗布、焼付けて
なる絶縁電線およびこの組成物を基材上に塗布、焼付け
てなるコーティング基材に関する。The present invention comprises a polyamide-imide resin and a citric acid ester, and 1 to 100 parts by weight of the polyamide-imide resin is added with 1 to 10 parts of the citric acid ester.
30 parts by weight of a heat resistant resin composition, an insulated wire obtained by applying the composition directly onto a conductor or through another insulating material, and baking, and a coating base obtained by applying the composition to a base material and baking the composition. Regarding materials
【０００５】本発明に用いられるポリアミドイミド樹脂
には、特に制限はないが、例えば（１）ジイソシアネー
トと三塩基酸無水物を反応させる方法、（２）ジアミン
と三塩基酸無水物を反応させる方法、（３）ジアミンと
三塩基酸無水物クロライドを反応させる方法などにより
得られるポリアミドイミド樹脂が挙げられる。該ポリア
ミドイミド樹脂の数平均分子量は、塗膜の特性および樹
脂溶液の粘度から１０，０００〜１００，０００の範囲
が好ましく、より好ましくは１３，０００〜５０，００
０の範囲である。The polyamide-imide resin used in the present invention is not particularly limited. For example, (1) a method of reacting a diisocyanate with a tribasic acid anhydride, and (2) a method of reacting a diamine with a tribasic acid anhydride. , (3) a polyamide-imide resin obtained by a method of reacting a diamine with a tribasic acid anhydride chloride. The number average molecular weight of the polyamide-imide resin is preferably in the range of 10,000 to 100,000, more preferably 13,000 to 50,000, from the characteristics of the coating film and the viscosity of the resin solution.
The range is 0.
【０００６】本発明に用いられるクエン酸エステルは、
クエン酸を１モルに対し、脂肪族アルコール、脂環族ア
ルコール及び芳香族アルコールから選ばれる１種又は２
種以上のアルコールを１〜３モルを無溶剤下又はベンゼ
ン、トルエン、キシレン等の非プロトン系有機溶剤中で
脱水縮合させることにより得られる。The citric acid ester used in the present invention is
One or two selected from aliphatic alcohols, alicyclic alcohols and aromatic alcohols per 1 mol of citric acid.
It can be obtained by dehydration condensation of 1 to 3 mol of at least one alcohol in the absence of a solvent or in an aprotic organic solvent such as benzene, toluene, xylene.
【０００７】脂肪族アルコールとしては、直鎖状又は分
岐鎖状の飽和若しくは不飽和のアルコールが例示され、
より具体的には、エチルアルコール、ブチルアルコー
ル、アミルアルコール、ヘキシルアルコール、ヘプチル
アルコール、オクチルアルコール、２−エチルヘキシル
アルコール、ノニルアルコール、デシルアルコール、ウ
ンデシルアルコール、ドデシルアルコール、トリデシル
アルコール、ミリスチルアルコール、セチルアルコー
ル、ステアリルアルコール、ベヘニルアルコール等の飽
和アルコール；オクテニルアルコール、ウンデセニルア
ルコール、ヘキサデセニルアルコール、オクタデセニル
アルコール、リノレイルアルコール、リノレニルアルコ
ール等の不飽和アルコール；これらのアルコールにエチ
レンオキサイドまたはプロピレンオキサイドを付加した
含エーテルアルコール等が例示される。脂環族アルコー
ルとしては、シクロヘキシルアルコール、メチルシクロ
ヘキシルアルコール、これらのアルコールにエチレンオ
キサイド又はプロピレンオキサイドを付加してなる含エ
ーテルアルコール等が例示される。芳香族アルコールと
しては、ベンジルアルコール、メチルベンジルアルコー
ル、ブチルベンジルアルコール；フェノール、クレゾー
ル、オクチルフェノール、ノニルフェノール等のフェノ
ール類にエチレンオキサイドまたはプロピレンオキサイ
ドを付加した含エーテルアルコール等が例示される。Examples of the aliphatic alcohol include linear or branched saturated or unsaturated alcohols,
More specifically, ethyl alcohol, butyl alcohol, amyl alcohol, hexyl alcohol, heptyl alcohol, octyl alcohol, 2-ethylhexyl alcohol, nonyl alcohol, decyl alcohol, undecyl alcohol, dodecyl alcohol, tridecyl alcohol, myristyl alcohol, cetyl. Saturated alcohols such as alcohol, stearyl alcohol, behenyl alcohol, etc .; Unsaturated alcohols such as octenyl alcohol, undecenyl alcohol, hexadecenyl alcohol, octadecenyl alcohol, linoleyl alcohol, linolenyl alcohol; these alcohols Examples include ether-containing alcohols to which ethylene oxide or propylene oxide is added. Examples of the alicyclic alcohol include cyclohexyl alcohol, methylcyclohexyl alcohol, and ether-containing alcohols obtained by adding ethylene oxide or propylene oxide to these alcohols. Examples of aromatic alcohols include benzyl alcohol, methylbenzyl alcohol, butylbenzyl alcohol; ether-containing alcohols obtained by adding ethylene oxide or propylene oxide to phenols such as phenol, cresol, octylphenol, and nonylphenol.
【０００８】クエン酸エステルとしては、次の一般式
（Ｉ）As the citric acid ester, the following general formula (I) is used.
【化１】 （ただし、式中Ｒ1、Ｒ2およびＲ3は、同一又は異な
り、水素原子、アルキル基、置換基を有してもよいシク
ロアルキル基、アリール基又はアラルキル基を示し、Ｒ
1、Ｒ2およびＲ3の全てが水素原子であることはなく、
Ａは炭素数２〜４のアルキレン基を示し、ｌ、ｍおよび
ｎは、それぞれ独立して０〜２０の整数を示す）で表さ
れる化合物が好ましい。Embedded image (Wherein R 1 , R 2 and R 3 are the same or different and represent a hydrogen atom, an alkyl group, an optionally substituted cycloalkyl group, an aryl group or an aralkyl group, and R 1
1 , R 2 and R 3 are not all hydrogen atoms,
A represents an alkylene group having 2 to 4 carbon atoms, and l, m and n each independently represent an integer of 0 to 20).
【０００９】クエン酸エステルの添加量は、ポリアミド
イミド樹脂１００重量部に対して１〜３０重量部、好ま
しくは３〜２０重量部の範囲である。クエン酸エステル
の添加量が１重量部未満では耐摩耗性向上の効果が低
く、３０重量部を超えると耐摩耗性が低下する。クエン
酸エステルの添加方法には特に制限はなく、通常はポリ
アミドイミド樹脂を含む組成物に直接添加して混合され
る。The amount of citric acid ester added is in the range of 1 to 30 parts by weight, preferably 3 to 20 parts by weight, based on 100 parts by weight of the polyamide-imide resin. If the amount of citrate added is less than 1 part by weight, the effect of improving wear resistance is low, and if it exceeds 30 parts by weight, wear resistance is reduced. There are no particular restrictions on the method of adding the citric acid ester, and it is usually added directly to the composition containing the polyamide-imide resin and mixed.
【００１０】本発明の耐熱性樹脂組成物は、Ｎ−メチル
−２−ピロリドン、Ｎ，Ｎ−ジメチルホルムアミド、Ｎ
−ジメチルアセトアミド等の有機溶剤またはその一部を
トルエン、キシレン等の芳香族炭化水素で置換した有機
溶剤を含む組成物として導体または基材上にコーティン
グしてもよいが、一般的な塗料に使用されるシリカ、炭
酸カルシウム、タルク、有機ベントナイト等のフィラー
類や消泡剤、レベリング剤、老化防止剤等の種々の添加
剤を混合または分散して用いてもよい。また耐摩耗性、
潤滑性および非粘着性を向上するためワックス、二硫化
モリブデン等の滑材を分散させて使用してもよい。The heat resistant resin composition of the present invention comprises N-methyl-2-pyrrolidone, N, N-dimethylformamide and N.
-A conductor or substrate may be coated as a composition containing an organic solvent such as dimethylacetamide or a part thereof substituted with an aromatic hydrocarbon such as toluene or xylene, but is used for general paints. Fillers such as silica, calcium carbonate, talc, and organic bentonite, and various additives such as defoaming agents, leveling agents, and antioxidants may be mixed or dispersed and used. Also wear resistance,
A lubricant such as wax or molybdenum disulfide may be dispersed and used in order to improve lubricity and non-adhesiveness.
【００１１】本発明の耐熱性樹脂組成物は、導体上に直
接またはポリウレタン樹脂、ホルマール樹脂、ポリエス
テル樹脂、ポリエステルイミド樹脂、ポリアミドイミド
樹脂等の他の絶縁物を介して塗布、焼付けて絶縁電線と
したり、アルミニウム、鉄、銅等の基材上に塗布、焼付
けて保護皮膜を形成させたコーティング基材とすること
ができる。The heat-resistant resin composition of the present invention is applied directly onto a conductor or through another insulating material such as polyurethane resin, formal resin, polyester resin, polyesterimide resin, polyamideimide resin, etc. and baked to obtain an insulated wire. Alternatively, it can be a coated substrate having a protective film formed by coating and baking on a substrate such as aluminum, iron, and copper.
【００１２】[0012]
【実施例】以下、本発明を実施例により説明するが、本
発明はこれらに限定されるものではない。 実施例１ ２リットルのセパラブルフラスコにポリアミドイミド樹
脂塗料ＨＰＣ−４０００−３０（日立化成工業社製、樹
脂の数平均分子量：約２４，０００、不揮発分３０重量
％、溶媒はＮ−メチル−２−ピロリドン８３重量部とキ
シレン１７重量部との混合物）を１kg仕込み、次いでク
エン酸トリｎ−オクチルを３０ｇ添加し、室温で約３０
分混合して耐熱性樹脂組成物を作製した。EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited thereto. Example 1 Polyamideimide resin paint HPC-4000-30 (manufactured by Hitachi Chemical Co., Ltd., number average molecular weight of resin: about 24,000, nonvolatile content 30% by weight, solvent: N-methyl-2) in a 2-liter separable flask. 1 kg of a mixture of 83 parts by weight of pyrrolidone and 17 parts by weight of xylene), and then 30 g of tri-n-octyl citrate were added, and the mixture was heated to about 30 at room temperature.
The components were mixed to prepare a heat resistant resin composition.
【００１３】実施例２ 実施例１でのクエン酸トリｎ−オクチルをクエン酸トリ
（ブトキシエトキシエチル）３０ｇに変えた以外は、実
施例１と同様の方法で耐熱性樹脂組成物を作製した。Example 2 A heat resistant resin composition was prepared in the same manner as in Example 1 except that the tri-n-octyl citrate in Example 1 was changed to 30 g of tri (butoxyethoxyethyl) citrate.
【００１４】実施例３ 実施例１でのＨＰＣ−４０００−３０をＨＰＣ−５０１
０−３４（日立化成工業製、樹脂の平均分子量：約１
６，５００、不揮発分３４重量％、溶媒はＮ−メチル−
２−ピロリドン８０重量部とＮ，Ｎ′−ジメチルホルム
アミド２０重量部との混合物）の１ｋｇに変え、クエン
酸トリｎ−オクチルをクエン酸ジオクチル（ノニルフェ
ノキシエチル）３０ｇに変えた以外は、実施例１と同様
の方法で耐熱性樹脂組成物を作製した。Example 3 The HPC-4000-30 used in Example 1 was replaced with the HPC-501.
0-34 (manufactured by Hitachi Chemical Co., Ltd., average molecular weight of resin: about 1)
6,500, non-volatile content 34% by weight, solvent is N-methyl-
Example except that the amount of 2-pyrrolidone (80 parts by weight) and N, N′-dimethylformamide (20 parts by weight) was changed to 1 kg and the tri-n-octyl citrate was changed to 30 g of dioctyl citrate (nonylphenoxyethyl). A heat resistant resin composition was produced in the same manner as in 1.
【００１５】比較例１ 実施例１で用いたＨＰＣ−４０００−３０をそのまま、
耐熱性樹脂組成物とした。 比較例２ 実施例３で用いたＨＰＣ−５０１０−３４をそのまま、
耐熱性樹脂組成物とした。 〈試験例〉実施例１、２および比較例１、２で作製した
耐熱性樹脂組成物または樹脂組成物を厚み１mmのアルミ
板に塗布し、１８０℃で４０分間または２２０℃で４０
分間それぞれオーブンで焼付けし、膜厚約５０μｍのコ
ーティング膜をそれぞれ作製した。得られたコーティン
グ膜の摩耗量を東洋精機製作所（株）製テーバー形アブ
レーザーで下記に示す評価条件により調べ、その結果を
表１に示した。 評価条件 荷重：２５０ｇ 研磨紙：＃４００ 回転数：２００回転Comparative Example 1 The HPC-4000-30 used in Example 1 was used as it was,
A heat resistant resin composition was prepared. Comparative Example 2 The HPC-5010-34 used in Example 3 was used as it was,
A heat resistant resin composition was prepared. <Test Example> The heat-resistant resin composition or the resin composition prepared in Examples 1 and 2 and Comparative Examples 1 and 2 was applied to an aluminum plate having a thickness of 1 mm, and the temperature was 180 ° C. for 40 minutes or 220 ° C. for 40 minutes.
Baking was performed for each minute in an oven to form a coating film having a thickness of about 50 μm. The amount of wear of the obtained coating film was examined with a Taber type ablaser manufactured by Toyo Seiki Seisaku-sho, Ltd. under the following evaluation conditions, and the results are shown in Table 1. Evaluation conditions Load: 250 g Abrasive paper: # 400 Rotation speed: 200 rotations
【００１６】[0016]
【表１】 表１から、本発明の実施例の耐熱性樹脂組成物は、比較
例と比較して耐摩耗性が向上することが示される。[Table 1] Table 1 shows that the heat resistant resin compositions of the examples of the present invention have improved wear resistance as compared with the comparative examples.
【００１７】[0017]
【発明の効果】本発明の耐熱性樹脂組成物によれば、過
酷な条件下でも耐摩耗性に優れた絶縁電線、コーティン
グ基材等を得ることができる。According to the heat-resistant resin composition of the present invention, it is possible to obtain an insulated wire, a coating substrate and the like having excellent wear resistance even under severe conditions.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｈ０１Ｂ 13/16 Ｂ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location // H01B 13/16 B
Claims (3)
ステルを含み、ポリアミドイミド樹脂１００重量部に対
してクエン酸エステルを１〜３０重量部としてなる耐熱
性樹脂組成物。1. A heat-resistant resin composition comprising a polyamideimide resin and a citric acid ester, wherein the citric acid ester is contained in an amount of 1 to 30 parts by weight based on 100 parts by weight of the polyamideimide resin.
上に直接または他の絶縁物を介して塗布、焼付けてなる
絶縁電線。2. An insulated electric wire obtained by applying and baking the heat-resistant resin composition according to claim 1 on a conductor directly or via another insulator.
上に塗布、焼付けてなるコーティング基材。3. A coated base material obtained by applying the heat resistant resin composition according to claim 1 on a base material and baking it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6194475A JPH0859990A (en) | 1994-08-19 | 1994-08-19 | Heat-resistant resin composition, insulated electric wire and coating base material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6194475A JPH0859990A (en) | 1994-08-19 | 1994-08-19 | Heat-resistant resin composition, insulated electric wire and coating base material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0859990A true JPH0859990A (en) | 1996-03-05 |
Family
ID=16325172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6194475A Pending JPH0859990A (en) | 1994-08-19 | 1994-08-19 | Heat-resistant resin composition, insulated electric wire and coating base material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0859990A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024218834A1 (en) * | 2023-04-17 | 2024-10-24 | 住友電気工業株式会社 | Resin composition, insulated wire, and method for producing insulated wire |
-
1994
- 1994-08-19 JP JP6194475A patent/JPH0859990A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024218834A1 (en) * | 2023-04-17 | 2024-10-24 | 住友電気工業株式会社 | Resin composition, insulated wire, and method for producing insulated wire |
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