JPH08340174A - Forming method of solder electrode - Google Patents
Forming method of solder electrodeInfo
- Publication number
- JPH08340174A JPH08340174A JP7146016A JP14601695A JPH08340174A JP H08340174 A JPH08340174 A JP H08340174A JP 7146016 A JP7146016 A JP 7146016A JP 14601695 A JP14601695 A JP 14601695A JP H08340174 A JPH08340174 A JP H08340174A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- solder
- electrode
- solder balls
- solder ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半田ボールを用いた半
田電極の形成方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming solder electrodes using solder balls.
【０００２】[0002]
【従来の技術】基板やあるいはＢＧＡ（ボールグリッド
アレイ）などの電子部品に半田のプリコートを施すため
に、近年直径１ミリメートル以下の小径の半田ボールを
用いる工法が実施されるにいたっている。2. Description of the Related Art In recent years, a method of using a solder ball having a small diameter of 1 mm or less has been implemented in order to pre-solder a substrate or an electronic component such as a BGA (ball grid array).
【０００３】ところが、回路構成あるいは電子部品自体
の集積度が向上するに伴い、電極が緻密化し、半田ボー
ル自体の直径が小さくなる傾向にある。このように、半
田ボールが微少化するに伴って、次のような問題点が顕
著になってきている。However, as the circuit structure or the degree of integration of the electronic component itself is improved, the electrodes are densified and the diameter of the solder ball itself tends to be reduced. As described above, as the solder balls are miniaturized, the following problems have become remarkable.
【０００４】即ち、半田ボールを用いて半田のプリコー
トを施すに付いては、電極に半田ボールを移載する必要
がある。この移載の具体的方法として、吸着ヘッドに多
数の小さな穴をあけ、この穴に半田ボールを吸着して転
写する技術が一般的である。That is, in applying the solder precoat using the solder balls, it is necessary to transfer the solder balls to the electrodes. As a specific method for this transfer, a technique is generally used in which a large number of small holes are formed in the suction head and the solder balls are sucked and transferred into the holes.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、この技
術によると、上述したように、半田ボールが微少化する
につれ、吸着ヘッドにさらに細かな穴をあける加工が必
要になる。ここで、細かな穴をあける加工は、実際のと
ころ非常に難しく、最近この工法では、半田ボールの微
少化に対応できなくなっている。However, according to this technique, as described above, as the solder balls become finer, it becomes necessary to make a further fine hole in the suction head. Here, it is actually very difficult to form a fine hole, and recently, this method cannot cope with the miniaturization of solder balls.
【０００６】そこで本発明は、微少な半田ボールであっ
ても、円滑に電極に移載できる半田電極の形成方法を提
供することを目的とする。Therefore, it is an object of the present invention to provide a method of forming a solder electrode which can be smoothly transferred to an electrode even with a minute solder ball.
【０００７】[0007]
【課題を解決するための手段】本発明の半田電極の形成
方法は、電極に第１フラックスを塗布するステップと、
転写ツールの段差部に第１フラックスよりも低粘度の第
２フラックスを付けるステップと、第２フラックスを半
田ボールに接触させることにより、段差部に半田ボール
を付着させるステップと、段差部に付着した半田ボール
を第１フラックス上に転写するステップと、電極上へ転
写された半田ボールを溶融させた後固化させて電極に半
田プリコートを施すステップとを含む。A method of forming a solder electrode according to the present invention comprises a step of applying a first flux to the electrode,
The step of applying a second flux having a lower viscosity than the first flux to the step portion of the transfer tool, the step of attaching the solder ball to the step portion by contacting the second flux with the solder ball, and the step of attaching the solder ball to the step portion The method includes the steps of transferring the solder balls onto the first flux, and melting and then solidifying the solder balls transferred onto the electrodes to apply a solder precoat to the electrodes.
【０００８】[0008]
【作用】上記構成により、半田ボールは、転写ツールの
段差部に付着している第２フラックスに接触し、第２フ
ラックスにくっついた状態で、電極に転写される。この
電極上には第２フラックスよりも粘度が大きな第１フラ
ックスが塗布されている。したがって、転写ツールを半
田ボールから外す際に、転写ツールの段差部と半田ボー
ルとの間に介在する第２フラックスの粘着力よりも、電
極と半田ボールとの間に介在する第１フラックスの粘着
力の方が、強いので、半田ボールは段差部にではなく、
電極上に残存し、確実に転写を行うことができる。With the above structure, the solder ball comes into contact with the second flux adhering to the step portion of the transfer tool, and is transferred to the electrode while being stuck to the second flux. A first flux having a viscosity higher than that of the second flux is applied on this electrode. Therefore, when the transfer tool is detached from the solder ball, the adhesive force of the first flux interposed between the electrode and the solder ball is greater than the adhesive force of the second flux interposed between the step portion of the transfer tool and the solder ball. Since the force is stronger, the solder ball is not on the step,
It remains on the electrode and can be transferred reliably.
【０００９】しかも、この際、半田ボールが微少化して
も、段差部をそれに応じた形状に加工すればよく、穴あ
け加工のように、困難な加工を行う必要がない。In addition, at this time, even if the solder balls are miniaturized, it suffices to process the step portion into a shape corresponding thereto, and it is not necessary to perform difficult processing such as drilling.
【００１０】[0010]
【実施例】次に図面を参照しながら、本発明の実施例に
ついて説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１１】図１（ａ）〜（ｃ）及び図２は本発明の一
実施例における半田電極の形成方法の工程説明図であ
る。図１中、１は半田ボールが転写されるべき電極２が
表面に形成された基板であり、この電極２には、高粘度
の第１フラックス３が塗布されている。４は転写すべき
半田ボール６を位置決めする位置決め台であり、位置決
め台４の上には半田ボール６が挿入できる孔５ａを備え
たマスク５が重合されている。そして、半田ボール６は
マスク５の孔５ａ中に挿入されることにより、位置決め
されている。1 (a) to 1 (c) and FIG. 2 are process explanatory views of a method of forming a solder electrode in one embodiment of the present invention. In FIG. 1, reference numeral 1 is a substrate on the surface of which an electrode 2 to which a solder ball is to be transferred is formed, and a high-viscosity first flux 3 is applied to this electrode 2. Reference numeral 4 is a positioning table for positioning the solder balls 6 to be transferred, and a mask 5 having a hole 5a into which the solder balls 6 can be inserted is superposed on the positioning table 4. Then, the solder balls 6 are positioned by being inserted into the holes 5a of the mask 5.
【００１２】７は第１フラックス３よりも低粘度の第２
フラックス８をためてある容器である。９は下方にピン
上にのびる段差部９ａを備えた転写ツールであり、図１
（ａ）に示すように、段差部９ａの下端には、容器７内
の第２フラックス８を付着させておく。The second flux 7 has a lower viscosity than the first flux 3.
It is a container in which the flux 8 is stored. Reference numeral 9 is a transfer tool having a stepped portion 9a extending downward on the pin.
As shown in (a), the second flux 8 in the container 7 is attached to the lower end of the step portion 9a.
【００１３】次に図１（ｂ）に示すように、転写ツール
９を位置決め台４上に移動させ、段差部９ａに付着して
いる第２フラックス８を半田ボール６に接触させる。第
２フラックス８の粘着力によって半田ボール６は段差部
９ａに接着される。さらに図１（ｃ）に示すように、転
写ツール９を基板１側へ移動させ、段差部９ａにくっつ
いた半田ボール６を電極２上の第１フラックス３に付着
させる。そこで、転写ツール９を上昇させると、半田ボ
ール６と段差部９ａとの間の第２フラックス８よりも半
田ボール６と電極３との間の第１フラックス３の方が、
粘着力が大きいので、半田ボール６は図２（ａ）に示す
ように、電極２上に残存する。即ち、半田ボール６は、
段差部９ａから確実に外れるものである。Next, as shown in FIG. 1B, the transfer tool 9 is moved onto the positioning table 4 so that the second flux 8 adhering to the step portion 9a is brought into contact with the solder ball 6. The solder ball 6 is bonded to the step portion 9a by the adhesive force of the second flux 8. Further, as shown in FIG. 1C, the transfer tool 9 is moved to the substrate 1 side, and the solder balls 6 stuck to the step portion 9 a are attached to the first flux 3 on the electrode 2. Therefore, when the transfer tool 9 is raised, the first flux 3 between the solder ball 6 and the electrode 3 is more likely to be discharged than the second flux 8 between the solder ball 6 and the step portion 9a.
Since the adhesive force is great, the solder balls 6 remain on the electrodes 2 as shown in FIG. That is, the solder ball 6 is
It reliably comes off the stepped portion 9a.
【００１４】そして、図２（ｂ）に示すように、基板１
をリフロー装置などの加熱手段に入れ、半田の溶融温度
以上に一旦加熱した後冷却することにより、半田ボール
６を溶融させた後固化させることにより、電極２上に半
田プリコートを施すものである。なお、第１フラックス
３、第２フラックス８の塗布順序は、任意に定めて差し
支えない。Then, as shown in FIG. 2B, the substrate 1
Is placed in a heating means such as a reflow device, and once heated to a melting temperature of solder or higher and then cooled, the solder balls 6 are melted and then solidified to apply a solder precoat on the electrodes 2. The application order of the first flux 3 and the second flux 8 may be set arbitrarily.
【００１５】また第１フラックス３と第２フラックス８
は、たとえば１００倍程度の粘度の差を付けることが可
能であり、半田ボール６が電極２上に転写される際に、
誤って段差部９ａに半田ボール６が付着したまま電極２
から外れてしまわないようにすることができる。Further, the first flux 3 and the second flux 8
Can make a difference in viscosity of, for example, about 100 times, and when the solder ball 6 is transferred onto the electrode 2,
The solder ball 6 is accidentally attached to the step 9a
You can prevent it from getting out of the way.
【００１６】なお、図２（ａ）に示すように、転写が完
了した時点で、第１フラックス３と第２フラックス８が
分かれて存在していることもあるが、通常図２（ｂ）に
示すように、リフロー装置により加熱すると、第２フラ
ックス８が軟化して第１フラックス３と一体的になるの
で、半田ボール６の表面の酸化を十分防止できる。ただ
し、半田ボール６の表面の酸化防止がそれほど必要でな
いときには、第２フラックスとして揮発性のものを用い
て、加熱時に揮発させてしまってもよい。また、半田ボ
ールが微少化したときは、ピン状の段差部を細くするこ
とにより、簡単に対応することができる。As shown in FIG. 2A, the first flux 3 and the second flux 8 may exist separately when the transfer is completed. As shown, when heated by the reflow device, the second flux 8 is softened and integrated with the first flux 3, so that the surface of the solder ball 6 can be sufficiently prevented from being oxidized. However, when it is not necessary to prevent the surface of the solder ball 6 from being oxidized, a volatile second flux may be used to volatilize it during heating. Further, when the solder balls are miniaturized, it is possible to easily cope with it by making the pin-shaped step portion thin.
【００１７】図３（ａ），（ｂ）は、本発明の他の実施
例における半田電極の形成方法を示す工程説明図であ
る。この実施例では、半田ボール６を孔５ａに位置決め
しておき、転写ツール１０の平坦な下面に低粘度の第２
フラックス８を付けておく。そして、図３（ａ）に示す
ように、転写ツール１０を下降させ、第２フラックス８
を半田ボール６の上部に接触させ、転写ツール１０を上
昇させる。すると、半田ボール６は、第２フラックス８
の粘着力によって転写ツール１０側に接着する。FIGS. 3A and 3B are process explanatory views showing a method of forming a solder electrode in another embodiment of the present invention. In this embodiment, the solder ball 6 is positioned in the hole 5a, and the second lower-viscosity second layer is formed on the flat lower surface of the transfer tool 10.
Add the flux 8. Then, as shown in FIG. 3A, the transfer tool 10 is lowered to move the second flux 8
Is brought into contact with the upper part of the solder ball 6, and the transfer tool 10 is raised. Then, the solder ball 6 becomes the second flux 8
Adhesive force is applied to the transfer tool 10 side.
【００１８】そして図３（ｂ）に示すように、転写ツー
ル１０を基板１上へ移動し、転写ツール１０を下降させ
ることにより、半田ボール６の下部を電極２上に塗布さ
れた高粘度の第１フラックス３に接触させる。次に転写
ツール１０を上昇させると、第１フラックス３の粘着力
は第２フラックス８よりも強いので、半田ボール６は転
写ツール１０と共に上昇するのではなく、電極２上に残
存し、結局半田ボール６が電極２上に移載される。その
他の工程は、上述の実施例と同様である。Then, as shown in FIG. 3B, the transfer tool 10 is moved onto the substrate 1, and the transfer tool 10 is lowered, so that the lower part of the solder ball 6 is applied onto the electrode 2 and has a high viscosity. It contacts the first flux 3. Next, when the transfer tool 10 is raised, the adhesive force of the first flux 3 is stronger than that of the second flux 8. Therefore, the solder ball 6 does not rise together with the transfer tool 10, but remains on the electrode 2 and eventually the solder ball 6 The ball 6 is transferred onto the electrode 2. The other steps are the same as those in the above-mentioned embodiment.
【００１９】[0019]
【発明の効果】本発明の半田電極の形成方法は、電極に
第１フラックスを塗布するステップと、転写ツールの段
差部に第１フラックスよりも低粘度の第２フラックスを
付けるステップと、第２フラックスを半田ボールに接触
させることにより、段差部に半田ボールを付着させるス
テップと、段差部に付着した半田ボールを第１フラック
ス上に転写するステップと、電極上へ転写された半田ボ
ールを溶融させた後固化させて電極に半田プリコートを
施すステップとを含むので、半田ボールが微少化して
も、柔軟に対応できる。According to the method of forming a solder electrode of the present invention, a step of applying a first flux to the electrode, a step of applying a second flux having a lower viscosity than the first flux to the step portion of the transfer tool, and a second step By bringing the flux into contact with the solder ball, the step of attaching the solder ball to the step portion, the step of transferring the solder ball attached to the step portion onto the first flux, and the step of melting the solder ball transferred onto the electrode After that, the step of solidifying and then pre-coating the electrodes with solder is included, so that even if the solder balls are miniaturized, they can be flexibly dealt with.
【図１】（ａ）本発明の一実施例における半田電極の形
成方法の工程説明図 （ｂ）本発明の一実施例における半田電極の形成方法の
工程説明図 （ｃ）本発明の一実施例における半田電極の形成方法の
工程説明図FIG. 1A is a process explanatory diagram of a solder electrode forming method according to an embodiment of the present invention. FIG. 1B is a process explanatory diagram of a solder electrode forming method according to an embodiment of the present invention. Process explanatory drawing of solder electrode formation method in example
【図２】（ａ）本発明の一実施例における半田電極の形
成方法の工程説明図 （ｂ）本発明の一実施例における半田電極の形成方法の
工程説明図2A is a process explanatory diagram of a solder electrode forming method according to an embodiment of the present invention. FIG. 2B is a process explanatory diagram of a solder electrode forming method according to an embodiment of the present invention.
【図３】（ａ）本発明の他の実施例における半田電極の
形成方法を示す工程説明図 （ｂ）本発明の他の実施例における半田電極の形成方法
を示す工程説明図3A is a process explanatory view showing a method of forming a solder electrode according to another embodiment of the present invention. FIG. 3B is a process explanatory view showing a method of forming a solder electrode according to another embodiment of the present invention.
２ 電極 ３ 第１フラックス ６ 半田ボール ８ 第２フラックス ９ 転写ツール ９ａ 段差部 2 electrode 3 first flux 6 solder ball 8 second flux 9 transfer tool 9a stepped portion
Claims (2)
と、転写ツールの段差部に前記第１フラックスよりも低
粘度の第２フラックスを付けるステップと、前記第２フ
ラックスを半田ボールに接触させることにより、前記段
差部に半田ボールを付着させるステップと、前記段差部
に付着した半田ボールを前記第１フラックス上に転写す
るステップと、前記電極上へ転写された半田ボールを溶
融させた後固化させて前記電極に半田プリコートを施す
ステップとを含むことを特徴とする半田電極の形成方
法。1. A step of applying a first flux to an electrode, a step of applying a second flux having a viscosity lower than that of the first flux to a step portion of a transfer tool, and a step of bringing the second flux into contact with a solder ball. The step of attaching the solder balls to the step portion, the step of transferring the solder balls attached to the step portion onto the first flux, and the step of melting the solder balls transferred onto the electrodes to solidify And applying a solder precoat to the electrodes.
と、転写ツールの下面に前記第１フラックスよりも低粘
度の第２フラックスを付けるステップと、前記第２フラ
ックスを半田ボールに接触させることにより、前記下面
に半田ボールを付着させるステップと、前記下面に付着
した半田ボールを前記第１フラックス上に転写するステ
ップと、前記電極上へ転写された半田ボールを溶融させ
た後固化させて前記電極に半田プリコートを施すステッ
プとを含むことを特徴とする半田電極の形成方法。2. A step of applying a first flux to an electrode, a step of applying a second flux having a viscosity lower than that of the first flux to a lower surface of a transfer tool, and a step of bringing the second flux into contact with a solder ball. A step of attaching solder balls to the lower surface, a step of transferring the solder balls attached to the lower surface onto the first flux, and a step of melting and then solidifying the solder balls transferred onto the electrode to form the electrode And a step of applying a solder precoat to the step of forming a solder electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7146016A JPH08340174A (en) | 1995-06-13 | 1995-06-13 | Forming method of solder electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7146016A JPH08340174A (en) | 1995-06-13 | 1995-06-13 | Forming method of solder electrode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08340174A true JPH08340174A (en) | 1996-12-24 |
Family
ID=15398194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7146016A Pending JPH08340174A (en) | 1995-06-13 | 1995-06-13 | Forming method of solder electrode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08340174A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002368044A (en) * | 2001-06-13 | 2002-12-20 | Matsushita Electric Ind Co Ltd | Method for assembling electronic component with solder ball and electronic component |
| WO2013153616A1 (en) * | 2012-04-10 | 2013-10-17 | 富士機械製造株式会社 | Ball mounting method and substrate-working machine |
| JP2016146453A (en) * | 2015-02-06 | 2016-08-12 | ピーエスケー・インコーポレーテッド | Device packaging facility using phthalate and its method, and device processing apparatus |
| US9824998B2 (en) | 2015-02-06 | 2017-11-21 | Semigear, Inc. | Device packaging facility and method, and device processing apparatus utilizing DEHT |
| US9821397B2 (en) | 2004-12-20 | 2017-11-21 | Senju Metal Industry Co., Ltd. | Solder precoating method and workpiece for electronic equipment |
| US20230087608A1 (en) * | 2020-03-27 | 2023-03-23 | S.S.P. Inc. | Flux tool using elastic pad |
-
1995
- 1995-06-13 JP JP7146016A patent/JPH08340174A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002368044A (en) * | 2001-06-13 | 2002-12-20 | Matsushita Electric Ind Co Ltd | Method for assembling electronic component with solder ball and electronic component |
| JP4590783B2 (en) * | 2001-06-13 | 2010-12-01 | パナソニック株式会社 | Method for forming solder balls |
| US9821397B2 (en) | 2004-12-20 | 2017-11-21 | Senju Metal Industry Co., Ltd. | Solder precoating method and workpiece for electronic equipment |
| US9763335B2 (en) | 2012-04-10 | 2017-09-12 | Fuji Machine Mfg. Co., Ltd. | Ball mounting method and working machine for board |
| EP2838328A4 (en) * | 2012-04-10 | 2015-05-20 | Fuji Machine Mfg | Ball mounting method and substrate-working machine |
| CN104206033A (en) * | 2012-04-10 | 2014-12-10 | 富士机械制造株式会社 | Ball mounting method and substrate-working machine |
| WO2013153616A1 (en) * | 2012-04-10 | 2013-10-17 | 富士機械製造株式会社 | Ball mounting method and substrate-working machine |
| JP2016146453A (en) * | 2015-02-06 | 2016-08-12 | ピーエスケー・インコーポレーテッド | Device packaging facility using phthalate and its method, and device processing apparatus |
| US9472531B2 (en) | 2015-02-06 | 2016-10-18 | Semigear, Inc. | Device packaging facility and method, and device processing apparatus utilizing phthalate |
| US9741683B2 (en) | 2015-02-06 | 2017-08-22 | Semigear, Inc. | Device packaging facility and method, and device processing apparatus utilizing phthalate |
| US9824998B2 (en) | 2015-02-06 | 2017-11-21 | Semigear, Inc. | Device packaging facility and method, and device processing apparatus utilizing DEHT |
| US10283481B2 (en) | 2015-02-06 | 2019-05-07 | Semigear, Inc. | Device packaging facility and method, and device processing apparatus utilizing DEHT |
| CN107665835A (en) * | 2016-07-27 | 2018-02-06 | Psk有限公司 | Device packaging facility and method and the device processing apparatus using DEHT |
| US10937757B2 (en) | 2016-07-27 | 2021-03-02 | Semigear, Inc. | Device packaging facility and method, and device processing apparatus utilizing DEHT |
| US20230087608A1 (en) * | 2020-03-27 | 2023-03-23 | S.S.P. Inc. | Flux tool using elastic pad |
| US11850683B2 (en) * | 2020-03-27 | 2023-12-26 | S.S.P. Inc. | Flux tool using elastic pad |
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