JPH08288036A - Bag packaging and assembly method therefor - Google Patents

Abstract

PURPOSE: To provide a BGA packaging socket capable of causing a semiconductor integrated circuit to stably function and ensuring freedom from th deformation of the solder pole of a BGA package in the characteristic test of the circuit operating at high speed. CONSTITUTION: A solder pole osculating contactor 20 for coming in contact with a solder pole is vertically inserted in an elastic insulation sheet 10 from one principal plane thereof at the time of the characteristic test of a BGA package. while an electrode contactor 30 for electrical connection to a test board is slantwise inserted from the other principal plane. According to this construction, pressure acting on the solder pole can be reduced and the pole can be protected against damages at the time of the test. Also, a BGA packaging socket capable of ensuring the stable function of a semiconductor integrated circuit during the characteristic test thereof under high-speed operation can be provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a BGA package socket for electrically connecting a BGA package and a test apparatus, and more particularly to a BGA package socket in which deformation of solder balls of the BGA package is prevented.

[0002]

2. Description of the Related Art In recent years, instead of a pin insertion type package in which a lead pin is inserted into an insertion hole for electrical connection, a ball grid which is soldered to an electrode on a substrate through a solder ball provided on the lower surface of the package. Array type (BGA)
The package is being developed. In order to perform the characteristic test of such a BGA package, a socket having a different structure from the socket for the pin insertion type package is required.

A conventional BGA package socket will be described below with reference to FIG. FIG. 21 shows the conventional B
It is sectional drawing which shows the state which attached the BGA package to the socket for GA packages. In FIG. 21, the guide frame 3 is provided on the test board 4, and the BG is provided inside the guide frame 3.
A BGA package socket 5 is configured by arranging an alignment block 2 (or plate) that aligns a plurality of contactors 21 with which the solder balls SB formed on the lower surface of the A package 1 come into contact.

Each contactor 2 of the alignment block 2
A pin 22 for electrical connection with a pin insertion hole formed in the test board 4 is connected to the pin 1. The pins 22 are inserted into the pin insertion holes formed in the test board 4 and soldered.

The BGA package 1 is placed so that the solder balls SB come into contact with the contactor 21, the lid 31 attached to the guide frame 3 is closed, and a fixing pawl 32 for fixing the lid 31 is engaged with the guide frame 3. Solder ball SB
Is pressed against the contactor 21 to ensure electrical contact.

[0006]

In the conventional BGA package socket 2, the length from the upper surface of the test board 4 after soldering the pins 22 to the solder ball SB is 2
It will be around 0 mm. Therefore, the inductance is 20 nH
Therefore, there is a problem that a voltage noise induced by the inductance is generated between the power supply and the GND due to the instantaneous transient current, and the functional operation of the semiconductor integrated circuit becomes unstable due to the voltage noise. This indicates that the conventional BGA package socket does not support high frequencies, that is, it does not support high-speed semiconductor integrated circuits.

Further, there is a problem that the solder ball SB is deformed by the pressure because the solder ball SB is pressed against the contactor 21 and brought into pressure contact therewith to obtain an electrical contact.

The present invention has been made in order to solve the above problems, and in a characteristic test of a semiconductor integrated circuit operating at a high speed, the semiconductor integrated circuit can function stably and the solder of a BGA package can be soldered. The purpose is to obtain a BGA package socket without ball deformation.

[0009]

According to a first aspect of the present invention, there is provided a socket for a BGA package according to claim 1, wherein a resilient insulating plate and a solder ball contactor whose one end face is in contact with a solder ball of the BGA package. And a contactor for contacting an electrode having one end surface of a substantially spherical shape that comes into contact with an electrode plate of the testing device for the BGA package, and the contactor for contacting the solder ball has one end surface of the insulating plate on the other end surface side. The contactor for electrode contact is vertically inserted in a plane, and the other end face side is obliquely inserted into the other main face of the insulating plate, and the side face thereof contacts the other end face of the contactor for solder ball contact. are doing.

According to a second aspect of the present invention, in the socket for a BGA package, the shape of the one end surface of the contactor for contacting the solder ball has a concave surface shape having a curvature substantially matching the curvature of the solder ball of the BGA package. The shape of the other end surface of the solder ball contacting contactor is substantially spherical, and the side surface of the electrode contacting contactor has a curvature of the other spherical end surface of the solder ball contacting contactor. And a fitting groove that fits in the other spherical end surface of the contactor for contacting the solder ball is provided along the axial direction.

According to a third aspect of the present invention, in the socket for a BGA package according to the present invention, the shape of the one end surface of the contactor for contacting the solder ball has a concave shape having a curvature substantially matching the curvature of the solder ball of the BGA package. The shape of the other end surface of the solder ball contacting contactor is a shape obtained by obliquely cutting a cylinder at a predetermined angle, and the side surface of the electrode contacting contactor includes the solder ball contacting contactor. Engagement that has a planar shape that matches the shape of the other end surface of the contactor for contacting solder balls and that has the same inclination angle as the predetermined angle so as to engage with the other end surface. A protruding engagement portion having a surface is provided.

According to a fourth aspect of the present invention, in the socket for a BGA package according to the present invention, the shape of the one end surface of the contactor for contacting the solder ball has a concave shape having a curvature substantially matching the curvature of the solder ball of the BGA package. The shape of the other end surface of the solder ball contacting contactor is a shape including a partially protruding protrusion, and the side surface of the electrode contacting contactor has a protruding portion of the solder ball contacting contactor. A fitting groove is provided along the axial direction, the fitting groove having a groove width that substantially matches the lateral width of the above, and that fits into the protruding portion of the solder ball contactor.

According to a fifth aspect of the present invention, in a socket for a BGA package, a solder ball contacting body with which a solder ball of the BGA package comes into contact with one end surface of the socket and an electrode hole of the BGA package testing device at one end thereof. So as to connect between the solder ball contact body and the contact pin, the contact pins are arranged in a ring shape at equal intervals from the other end surface of the solder ball contact body to the other end of the contact pin. And a plurality of elastic strut plates, the plural strut plates bend outward when the solder ball contact body is pressed, and otherwise restore to a substantially linear shape. It has a bending tendency.

A BGA package socket according to a sixth aspect of the present invention is provided with four of the support plates.

A BGA package socket according to a seventh aspect of the present invention is formed of an elastic conductor wire,
At the time of the test, the spring body spirally spreads while spiraling around the surface of the solder ball of the BGA package, and one end of the spring body is inserted into the electrode hole of the BGA package testing device and the other end of the spring body is inserted. And a contact pin to which the winding start portion of the central portion is connected.

According to the eighth aspect of the present invention, in a socket for a BGA package according to the present invention, a solder ball contacting body with which a solder ball of the BGA package comes into contact with one end face thereof, and an electrode of the BGA package testing device with one end face thereof. The other end surface of the solder ball contact body and the other end surface of the contact pin so as to electrically connect the contact pin having an insertion portion inserted into the hole and the solder ball contact body and the contact pin. A conductive spring interposed between the contact pin, the spring, and a hollow housing for housing the solder ball contact body,
The contact pin is fixedly arranged on one end side of the housing so that the insertion portion is exposed from the housing, and the solder ball contact body is exposed from the housing on the other end side of the housing. With
The solder ball contact body is arranged so as to move as the spring expands and contracts.

According to a ninth aspect of the present invention, there is provided a method of assembling a BGA package socket, comprising: (a) forming a first guide hole in a vertical direction at a predetermined position on one main surface of the insulating plate; (b) forming a second guide hole in a predetermined position on the other main surface of the insulating plate in an oblique direction, and (c) attaching the other end surface side of the contactor for contacting the solder ball to the first non-contact surface. And a step of (d) inserting the other end face side of the electrode contactor into the second non-through hole, the diameter of the first non-through hole being equal to the solder ball. The contactor contactor is formed to be smaller than the maximum size of the insertion portion, and the second unpenetrated hole is formed to have a diameter smaller than the maximum size of the insertion portion of the electrode contactor.

In a method of assembling a BGA package socket according to a tenth aspect of the present invention, the step (c) includes
A step of inserting the contactor into the first unpenetrated hole in a heated state, wherein the step (d) inserts the contactor into the second unpenetrated hole in a heated state; Is included.

[0019]

According to the socket for BGA package according to claim 1 of the present invention, the other end surface of the contactor for contacting the solder ball is vertically inserted into one main surface of the insulating plate, and the contactor for contacting the electrode comprises: The other end face side is inserted diagonally into the other main face of the insulating plate, and the side face is in contact with the other end face of the solder ball contactor, so the vertical pressure applied to the solder ball contactor. Is dispersed horizontally through the contactor for electrode contact, and the other end surface of the contactor for contacting the solder ball slides on the side surface of the contactor for contacting the solder ball, so that the contactor for contacting the solder ball sinks in the vertical direction. The pressure applied to will be diminished. Further, since the length of the contactor for contacting the solder ball and the contactor for contacting the electrode are short, the inductance can be reduced.

According to a second aspect of the BGA package socket of the present invention, the shape of one end surface of the contactor for contacting the solder ball is a concave shape having a curvature substantially matching the curvature of the solder ball of the BGA package. Therefore, the contact area of the solder ball will increase, and when vertical pressure is applied to the contactor for solder ball contact,
The pressure is prevented from concentrating on one point of the solder ball.
Also, by fitting the other end face of the substantially spherical shape of the solder ball contacting contactor into the fitting groove, the electrical connection between the solder ball contacting contactor and the electrode contacting contactor becomes good and mechanically Is also firmly joined, preventing easy disconnection.

According to the third aspect of the BGA package socket of the present invention, the shape of one end surface of the contactor for contacting the solder ball is a concave shape having a curvature substantially matching the curvature of the solder ball of the BGA package. Therefore, the contact area of the solder ball will increase, and when vertical pressure is applied to the contactor for solder ball contact,
The pressure is prevented from concentrating on one point of the solder ball.
In addition, the other end surface of the shape of the solder ball contacting contactor that is cut out diagonally is engaged with the engaging portion protruding from the side surface of the electrode contacting contactor, so that the solder ball contacting contactor and the electrode contacting contactor are contacted. The electrical connection with the device becomes good, and the device is mechanically firmly joined to prevent the connection from being easily broken.

According to the BGA package socket of the fourth aspect of the present invention, the shape of one end surface of the contactor for contacting the solder ball is a concave shape having a curvature substantially matching the curvature of the solder ball of the BGA package. Therefore, the contact area of the solder ball will increase, and when vertical pressure is applied to the contactor for solder ball contact,
The pressure is prevented from concentrating on one point of the solder ball.
Also, by fitting the protruding portion of the other end surface of the solder ball contactor into the fitting groove of the electrode contactor,
The electrical connection between the contactor for contacting the solder ball and the contactor for contacting the electrode is improved, and the contactor is firmly mechanically joined to prevent the connection from being easily broken.

According to the fifth aspect of the BGA package socket of the present invention, the solder ball contact body and the contact pin are connected from the other end face of the solder ball contact body to the other end of the contact pin so as to connect the solder ball contact body and the contact pin. A plurality of elastic strut plates arranged in an annular pattern at equal intervals across the flexure plate bends outward when the solder ball contact body is pressed,
If not, since it has a bending tendency to restore and become a substantially linear shape, the vertical pressure applied to the solder ball contact body is absorbed by the bending of the strut plate and the pressure applied to the solder ball is reduced. Will be. Further, since a plurality of support plates are connected in parallel between the solder ball contact body and the contact pin, the inductance can be reduced.

According to the socket for BGA package according to the sixth aspect of the present invention, by using four support plates,
When viewed from the solder ball contact body side when the strut plate is bent, the plan view shape is a cross shape, and when it is rotated, it becomes an X shape. Therefore, by arranging the support plates in consideration of the bending direction, the adjacent BGA package sockets do not come into contact with each other, and the number per unit area can be increased.

According to the socket for BGA package according to the seventh aspect of the present invention, the spring body which spirally spreads while swirling is wound around the surface of the solder ball of the BGA package at the time of test to form a solder ball. Even if the solder balls are misaligned, the elasticity of the spring body causes the spring body to deform in the direction of the displacement, so that the contact with the surface of the solder ball SB can be maintained.

According to the socket for BGA package according to claim 8 of the present invention, one end of the housing is provided with:
The contact pin is fixedly arranged so that the insertion portion is exposed from the housing, and the solder ball contact body is exposed and exposed from the housing on the other end side of the housing.
Since the solder ball contact body is arranged to move as the spring expands and contracts, the vertical pressure applied to the contactor for contacting the solder ball is absorbed by the spring and the pressure applied to the solder ball is reduced. .

According to the method of assembling the socket for BGA package according to claim 9 of the present invention, the diameter of the first guide hole is formed smaller than the maximum size of the insertion portion of the contactor for contacting the solder ball, and the second By forming the diameter of the guide hole smaller than the maximum size of the insertion portion of the contactor for electrode contact, the contactor for contacting the solder ball inserted in step (c) and the contactor for contacting the electrode inserted in step (d) The contactor is fixed by the elasticity of the insulating plate.

According to the assembling method of the BGA package socket according to the tenth aspect of the present invention, the step (c)
Includes the step of inserting the contactor into the first unpenetrated hole in a heated state, and the step (d) includes the step of inserting the contactor into the second unpenetrated hole in a heated state. The inserted portions of the contactor for contacting the solder ball and the contactor for contacting the electrode are covered with an insulating plate melted by heat, and are cooled and solidified to be fixed to the insulating plate.

[0029]

【Example】

<A. First Example><A-1. BGA Package Socket 100> FIG. 1 is a partial sectional view of a BGA package socket 100 according to a first embodiment of the present invention. In FIG. 1, from one main surface side of the insulating sheet 10 having elasticity, B
A conductive contactor (hereinafter referred to as a "solder ball contactor") 20 that comes into contact with a solder ball during a characteristic test of a GA package is vertically inserted and electrically connected to a test board from the other main surface side. A conductive contactor (hereinafter referred to as an electrode contactor) 30 is obliquely inserted. Here, the contactors 20 for contacting the solder balls are arranged according to the number and arrangement of the solder balls of the BGA package. Note that, for convenience, in FIG. 1, a portion inserted into the seat 10 is also shown by a solid line.

In the solder ball contactor 20, one end of the main body 201 having a substantially cylindrical shape is a solder ball contact surface 202 in the characteristic test of the BGA package.
It has a concave shape, that is, a concave shape so as to have a curvature that is equal to or larger than the curvature of the solder ball by about 3 to 4%. Further, the other end inserted into the sheet 10 has a contact ball 203 with the contactor 30 for electrode contact.
And has a spherical shape.

On the other hand, the contactor 30 for electrode contact is a land contact in which both ends of a substantially cylindrical main body 301 are spherical and one end contacts a connection electrode (hereinafter referred to as "land") on the test board. The sphere 302 is the sphere 302, and the other end of the sphere 302 is a fall prevention ball 3 that prevents the contactor 30 for contacting the electrode from falling off
It is 03. Also, on the surface of the substantially cylindrical body 301,
A fitting groove 304 into which the contact ball 203 of the contactor 20 for contacting the solder ball is fitted is formed along the axial direction. The fitting groove 304 is formed so as to have a curvature that substantially matches the curvature of the contact ball 203 of the contactor 20 for contacting the solder ball.

Contact ball 203 and contactor 30 for contacting the electrode
With the fitting groove 304, the contact between the contactor 20 for contacting the solder ball and the contactor 30 for contacting the electrode becomes good, and the contact is made mechanically and firmly so that the connection is easily broken. It is prevented from dripping.

FIG. 2 shows a BGA package socket 100.
A cross-sectional view of a mounted state when the BGA package 1 is mounted and a characteristic test is performed is shown in FIG. In FIG. 2, the guide frame 50 is placed on the main surface of the test board 40. BG
The A package socket 100 is fitted into the guide frame 50 with the surface into which the electrode contactor 30 is inserted facing down. A plurality of lands 60 are formed on the surface of the test board 40 surrounded by the guide frame 50 according to the number and arrangement of the contactors 30 for electrode contact, and the BGA package socket 100 can be fitted into the guide frame 50. Then, the land contact sphere 302 of the contactor 30 for electrode contact
Will contact the land 60.

By placing the BGA package 1 on the BGA package socket 100, the solder balls SB
And the solder ball contact surface 202 of the contactor 20 for contacting the solder ball are in contact with each other, but since the contact is incomplete in this state, the lid 501 attached to the guide frame 50 is closed and the fixing pawl 502 for fixing the lid 501 is guided. By engaging with the frame 50, the solder ball SB is pressed against the solder ball contact surface 202, and electrical contact is surely obtained.

In the structure of the BGA package socket 100, the path length from the solder ball contact surface 202 of the solder ball contact contactor 20 to the land 60 of the test board 40 is substantially equal to the thickness of the sheet 10.
The thickness of 0 is determined by the dimensions of the solder ball contacting contactor 20 and the electrode contacting contactor 30, but the dimensions of the solder ball contacting contactor 20 and the electrode contacting contactor 30 are determined according to the dimensions of the solder ball SB. Therefore, if the solder ball SB having a general size is used, the thickness of the sheet 10 is about 3 to 5 mm, and the thickness uniformity is plus or minus 0.1 mm or less. The diameter of the solder ball contact surface 202 of the solder ball contactor 20 is 0.9 to 1.0 mm.

In the conventional BGA package 4, the length from the upper surface of the test board 1 after soldering the pins 22 to the solder ball SB is about 20 mm, which means that the length is reduced to about 1/4. . Therefore, the inductance also decreases in proportion, the occurrence of voltage noise induced by the instantaneous transient current is suppressed, and the functional operation of the semiconductor integrated circuit can be stably maintained.

Next, the prevention of deformation of the solder balls SB will be described. Solder ball contact surface 2 via solder ball SB
The vertical downward force applied to 02 is applied from the contact sphere 203 to the electrode contactor 30. In the electrode contactor 30 diagonally connected to the solder ball contactor 20, the force is horizontal. The contact balls 203 are slid downward in the fitting groove 304.
Since the sheet 10 has elasticity, vertical and horizontal forces are absorbed, and the contactor 20 for contacting the solder ball slightly sinks as the contact ball 203 slides. Therefore, the pressure applied to the solder balls is reduced and the solder balls SB are prevented from being deformed.

<A-2. Socket 2 for BGA package
00> BGA package socket 100 described above
Is electrically connected to the contact ball 30 of the contactor 20 for contacting the solder ball and the fitting groove 304 of the contactor 30 for contacting the electrode, and is mechanically strong. It was joined to the BG to prevent the connection from being easily broken.
The A package socket 200 may have a configuration described below.

FIG. 3 shows a BGA package socket 200.
FIG. In FIG. 3, the solder ball contacting contactor 20A is vertically inserted from one main surface side of the elastic insulating sheet 10, and the electrode contacting contactor 30A is obliquely inserted from the other main surface side. There is.

In the solder ball contactor 20A, one end of the main body 201A having a substantially cylindrical shape is a solder ball contact surface 202A at the time of the characteristic test of the BGA package, which is equal to the curvature of the solder ball or 3 to 4%. A concavely curved shape with a large curvature,
That is, it has a concave shape. Further, the other end inserted into the sheet 10 is a contact end face 203A with the contactor 30A for electrode contact, and has a shape obtained by obliquely cutting a cylinder.

On the other hand, the contactor 30A for electrode contact has a substantially columnar main body 301A in which both ends are spherical.
One end is a land contact ball 302A, and the other end is a fall prevention ball 30 that prevents the contactor 30A for electrode contact from falling off.
3A is the same as that of the contactor 30 for electrode contact described using FIG.

An engaging portion 304A for engaging with the contact end surface 203A of the solder ball contacting contactor 20A is provided on the substantially columnar body 301A so as to project therefrom. In order that the contact end surface 203A, which is a shape obtained by obliquely cutting a cylinder, engages with the engaging portion 304A and both of them become mechanically strong, the same inclination as the inclination angle of the contact end surface 203A with respect to the engaging portion 304A. Planes with corners are required. In FIG. 3, that surface is shown as an engagement surface 305A. Engagement surface 3
05A is formed so as to match the shape of the contact end surface 203A. Therefore, the contactor 20 for contacting the solder ball
By inserting A and the contactor 30A for electrode contact into the sheet 10, the engagement surface 305A and the contact end surface 203
A and A are in close contact with each other, and the electrical connection between the solder ball contactor 20A and the electrode contactor 30A is improved.

Since the structure for the characteristic test of the BGA package 1 is almost the same as the structure for using the BGA package socket 100 shown in FIG. 2, duplicate description will be omitted. In the characteristic test of the BGA package 1, the vertically downward force applied to the solder ball contact surface 202A via the solder ball SB is applied so as to press the electrode contactor 30 downward, and thus the engagement surface 305A and the contact end surface 203A. Receives a vertical downward force and adheres more firmly. Since the seat 10 has elasticity, the vertically downward force is absorbed and the solder ball contactor 20A is slightly depressed. Therefore, the pressure applied to the solder balls is reduced and the solder balls SB are prevented from being deformed.

The contactor 20A for contacting the solder ball
The path length from the solder ball contact surface 202A to the land 60 of the test board 40 is shortened to about a quarter of the length from the upper surface of the test board 1 of the conventional BGA package 4 to the solder ball SB. Is similar to the case of the BGA package socket 100.

<A-3. Socket for BGA package 3
00> The configuration of the BGA package socket 300 will be described below. FIG. 4 shows a partial cross-sectional view of the BGA package socket 300. In FIG. 4, the solder ball contacting contactor 20B is vertically inserted from one main surface side of the elastic insulating sheet 10, and the electrode contacting contactor 30B is obliquely inserted from the other main surface side. There is.

In the solder ball contactor 20B, one end of the main body 201B having a substantially cylindrical shape serves as a solder ball contact surface 202B in the characteristic test of the BGA package, and is substantially the same as the curvature of the solder ball, or 3 to 4. It has a concavely curved shape with a curvature of about a large percentage. Further, the other end inserted into the sheet 10 has a protrusion 2 for contact with the contactor 30B for electrode contact.
03B, which has a shape in which almost the center of the end face is projected.

On the other hand, in the contactor 30B for electrode contact, both ends of a substantially cylindrical main body 301B are spherical,
One end is a land contact ball 302B, and the other end is a fall prevention ball 30 that prevents the contactor 30B for electrode contact from falling off.
3B is similar to the contactor 30 for electrode contact described with reference to FIG.

A fitting groove 304B into which the protrusion 203B of the contactor 20B for contacting the solder ball is fitted is formed on the surface of the main body 301B having a substantially cylindrical shape along the axial direction. The fitting groove 304B is used for the contactor 2 for contacting the solder ball.
It is formed to have a groove width that substantially matches the lateral width of the protruding portion 203B of 0B. In addition, the protruding length of the protruding portion 203B is the same as that of the contactor 30B for contacting electrodes which is obliquely arranged.
The length is set to sufficiently reach the fitting groove 304B.

Contactor 3 for contacting the protrusion 203B and the electrode
By fitting with the fitting groove 304B of 0B, the contactor 20B for contacting the solder ball and the contactor 30B for contacting the electrode are electrically connected, and also mechanically and firmly joined, and the connection is easily broken. It is prevented from dripping.

The structure for the characteristic test of the BGA package 1 is almost the same as the case of using the BGA package socket 100 shown in FIG. In the characteristic test of the BGA package 1, the solder ball contact surface 202B via the solder ball SB
The vertical downward force applied to the electrode contactor 30B is applied to the electrode contactor 30B from the protrusion 203B. However, in the electrode contactor 30B obliquely connected to the solder ball contactor 20B, the force is applied horizontally. Also, the protrusions 203B slide downward in the fitting groove 304B. Since the seat 10 has elasticity, the vertical and horizontal forces are absorbed, and the contactor 20B for contacting the solder ball slightly sinks as the protrusion 203B slides. Therefore, the deformation of the solder ball SB is prevented.

The contactor 20B for contacting the solder ball
The path length from the solder ball contact surface 202B to the land 60 of the test board 40 is shortened to about a quarter of the length from the upper surface of the test board 1 of the conventional BGA package 4 to the solder ball SB. Is similar to the case of the BGA package socket 100.

In the BGA package sockets 100 to 300 described above, the contactor 30 for electrode contact,
Although the caps 30A and 30B are provided with drop-prevention balls 303, 303A, and 303B for preventing the caps from falling off, the caps 303, 303A, and 303 are not necessarily removed.
It is not necessary to provide B.

<A-4. Method for Manufacturing Socket for BGA Package According to Present Invention> BG According to Present Invention Described Above
Each of the A package sockets 100 to 300 is formed as follows. 5 and 6 are cross-sectional views showing the manufacturing process of the BGA package socket 100 as an example.

In the step shown in FIG. 5, the sheet 10 is prepared, and guide holes H1 and H2 for inserting the contactors 20 for contacting the solder balls and the contactors 30 for contacting the electrodes are formed at predetermined positions. Although only one guide hole H1 and H2 is shown in FIG. 5, as described above, the solder ball contactor 20 and the electrode contactor 30 have the same number and arrangement of the solder balls SB of the BGA package 1. Since they are also formed, the guide holes H1 and H2 are also formed according to the number of solder balls SB. The predetermined positions for forming the guide holes H1 and H2 are set according to the arrangement of the solder balls SB. The arrangement pitch of the contactors 20 for contacting the solder balls and the contactors 30 for contacting the electrodes is 1 mm.
There are types such as 1.27 mm, 1.50 mm, and 2.57 mm, and the diameters of the main bodies 201 and 301 of the contactor 20 for contacting the solder ball and the contactor 30 for contacting the electrode corresponding to these arrangement pitches are 0.8 mm or less. .

The shape of the guide holes H1 and H2 does not need to match the shapes of the solder ball contacting contactor 20 and the electrode contacting contactor 30, and may be a simple hole shape, but the hole diameter is at least 1 greater than the maximum width of each contactor. It is necessary to make the size small. At this time, the guide hole H1 penetrates the guide hole H2, but the guide hole H2 does not penetrate the sheet 10.

Next, in the step shown in FIG. 6, the sheet 10
The contactor 20 for contacting the solder ball and the contactor 30 for contacting the electrode, which have been heated to such a temperature that they melt, are inserted into the guide holes H1 and H2, respectively. Contactor 20 for contacting a heated solder ball and contactor 30 for contacting an electrode
Moves while melting the wall surfaces of the guide holes H1 and H2 that are formed to be smaller, and stops the insertion when reaching a preset predetermined position. Here, the predetermined position set in advance means the contact ball 203 of the contactor 20 for contacting the solder ball.
Is a position to be fitted into the fitting groove 304 of the contactor 30 for electrode contact. Here, the sheet 10 is formed of a material whose physical properties do not deteriorate at a temperature of at least 175 ° C. so as to be applicable to the burn-in test.

The portion of the sheet 10 melted by heat is cooled and solidified while covering the inserted solder ball contactor 20 and electrode contactor 30. Therefore, the contactor 20 for contacting the solder ball and the contactor 30 for contacting the electrode are fixed to the sheet 10 and prevented from falling off. The contact ball 203 and the fitting groove 304
The fitting with and is performed again so as to break the sheet 10 melted by heat after cooling. The same applies to the BGA package sockets 200 and 300.

By repeating the above steps a plurality of times, the BGA package socket 10 having a plurality of solder ball contacting contactors 20 and electrode contacting contactors 30.
0 is completed.

Incidentally, the BGA package socket 100
Since the contactor 20 for contacting the solder ball and the contactor 30 for contacting the electrode are relatively simple in shape, etc., they may be inserted into the guide holes H1 and H2 without being heated.

<B. Second Example><B-1. BGA Package Socket 400> FIG. 7 is a perspective view of a BGA package socket 400 according to a second embodiment of the present invention. In FIG. 7, a BGA package socket 400 has a conical solder ball contact body 70 that comes into contact with a solder ball during a BGA package characteristic test, and four pillar plates 80 are provided on top of the solder ball contact body 70. Connected at equal intervals. Also, 4
One end of the pillar plate 80 of the book is connected to the bottom surface of the conical contact pin 90 connected to the test board at equal intervals to form a BGA package socket 400.

The bottom surface of the solder ball contact body 70 is a solder ball contact surface 701 that comes into contact with the solder ball, and has a concavely curved shape that matches the curvature of the solder ball or has a curvature larger by about 3 to 4%, that is, It has a concave shape.

The support plate 80 is formed of a conductive plate having a spring property and normally maintains a substantially linear shape. However, when a force is applied from the direction of the solder ball contact surface 701 of the solder ball contact body 70, the support plate 80 is exposed to the outside. It has a bending tendency to bend toward. It should be noted that FIG. 7 shows a state in which the strut plate 80 is bent by applying a force.

FIG. 8 shows a BGA package socket 400.
A sectional view of a mounted state when a characteristic test of the BGA package 1 is performed by using is shown. In FIG. 8, the test board 4
The guide frame 50 is placed on the main surface of 0A, and the contact pin 90 of the BGA package socket 400 is inserted into the pin insertion hole PH formed in the test board 40A.
The position is fixed while electrical contact with the test board 40A is obtained by soldering. Here, the pin insertion hole PH is the number and arrangement of the BGA package sockets 400, that is, the solder balls S of the BGA package 1.
It is formed according to the number and arrangement of B.

When the BGA package 1 is placed on the plurality of arranged BGA package sockets 400, the solder balls SB and the solder ball contact surface 701 of the solder ball contact body 70 come into contact with each other, but in this state. Since the contact is incomplete, the lid 501 attached to the guide frame 50 is closed, and the lid 5
When the fixing claw 502 for fixing 01 is engaged with the guide frame 50, the solder ball SB moves to the solder ball contact surface 7
It is pressed against 01 to ensure electrical contact.

In the structure of the BGA package socket 400, the solder ball contact surface 7 of the solder ball contact body 70 is
The path length from 01 to the pin insertion hole PH of the test board 40A is substantially equal to the length of the support plate 80, and the length is 3
In the conventional BGA package 4, the length from the upper surface of the test board 1 after soldering the pins 22 to the solder ball SB was about 20 mm, which was reduced to about 1/4. become. Further, since the four strut plates 80 are connected in parallel between the solder ball contact body 70 and the contact pins 90, the strut plates 80
In comparison with the case where there is only one, the inductance is 1/4. Therefore, comparing with the conventional BGA package 4,
The inductance is 1/16. By reducing the inductance, the generation of voltage noise induced by the instantaneous transient current is suppressed, and the functional operation of the semiconductor integrated circuit can be stably maintained.

When the lid 501 attached to the guide frame 50 is closed and the fixing pawl 502 for fixing the lid 501 is engaged with the guide frame 50, the solder ball SB is pressed against the solder ball contact surface 701. As described above, the four support plates 80 bend outward and the vertical force is dispersed in the horizontal direction. Therefore, the pressure applied to the solder balls is reduced and the solder balls SB are prevented from being deformed.

In the BGA package socket 400 described with reference to FIG. 7, the solder ball contact surface 701 of the solder ball contact body 70 substantially matches the curvature of the solder ball, or has a curvature larger by about 3 to 4%. Although it was concavely curved, it may be flat as shown in FIG.

Next, the BGA package socket 4 on the test board 40A will be described with reference to FIGS.
The arrangement state of 00 will be described. FIG. 10 shows a test board 40
BGA package socket 400 is placed on A,
FIG. 11 is a plan view of the BGA package 1 side when no pressure is applied, and FIG. 11 is a plan view of the BGA package 1 side when a pressure is applied to the BGA package socket 400.

As shown in FIG. 10, the BGA package sockets 400 are arranged in a grid pattern with equal vertical and horizontal intervals.
The pillar plates 80 are hidden by the solder ball contact body 70 and invisible when no pressure is applied. However, when the pillar plates 80 are bent outward due to pressure, the BGs arranged next to each other are arranged.
A Considering the bending direction of the strut plate 80 so that the strut plates of the package socket 400 do not contact each other B
The GA package sockets 400 are arranged. That is, as shown in FIG. 11, the support plates 80 are arranged so as to bend in the vertical and horizontal directions, that is, the support plates 80 are arranged so as to have a cross shape in plan view, and the support plates 80 are arranged so as to bend in the left and right diagonal directions. That is, the shape in plan view is X
Arrange them so that the ones arranged in the shape of a letter are alternated.

Here, in FIG. 11, the pitch between the centers of the BGA package socket 400 is L, and the spread length of the support plate 80 at the time of pressurization (the BGA package socket 4
If the length from the center of 00) is M, then at least

[0071]

[Equation 1]

Arrange so as to satisfy the relationship of.

By arranging as described above, adjacent BGs
It is possible to increase the number of BGA package sockets 400 per unit area without the A package sockets 400 contacting each other.

<B-2. Modification> The BGA package socket 400 described above has a configuration in which four support plates 80 are connected in parallel between the top of the solder ball contact body 70 and the bottom of the contact pin 90 at equal intervals. The number of support plates 80 may be three.

In FIG. 12, B composed of three support plates 80
The top view which looked at the state where pressure was applied to the socket 400A for GA packages from the BGA package 1 side is shown. If the pillar plates 80 are three, they can be arranged in a staggered manner as shown in FIG. 12, and the number of BGA package sockets per unit area can be further increased.

<C. Third Embodiment> FIG. 13 shows a BGA package socket 50 according to a third embodiment of the present invention.
0 shows a perspective view of 0. In FIG. 13, a BGA package socket 500 includes a spring body 110 that comes into contact with a solder ball in a BGA package characteristic test, and a contact pin 12 connected to one end of the spring body 110.
0.

The spring body 110 is formed of a conductive wire having a spring property, and has a shape that spreads in a spiral form from one end connected to the contact pin 120. The extent of the spread is such that the solder ball is in contact with the surface of the solder ball. It is set to cover the ball. FIG. 14 shows a plan view of the BGA package socket 500 viewed from the solder ball side. Also,
A cross-sectional view taken along the line AA 'in FIG. 14 is shown in FIG.

Next, the operation of the BGA package socket 500 will be described with reference to FIGS. 16 and 17. 16 and 17 show the solder ball SB with the spring body 11
It is a cross-sectional view schematically showing a state of being held in 0, the solder ball SB is shown as a mere sphere. FIG. 16 shows the solder balls SB when the solder balls SB are not displaced.
FIG. 17 shows the state of the spring body 110 holding the solder ball S. FIG. 17 shows the solder ball S when the position of the solder ball SB is displaced.
The state of the spring body 110 holding B is shown.
As shown in FIG. 16, when the solder balls SB are not displaced, the spring body 110 comes into contact with the surface of the solder balls SB and a good conductive state is obtained. On the other hand, even if the solder balls SB are displaced as shown in FIG. 17, the elasticity of the spring bodies 110 deforms the spring bodies 110 in the direction of displacement, so that contact with the surface of the solder balls SB is maintained. A good conduction state can be obtained. The positional deviation of the solder ball SB occurs due to the positional deviation of the solder when the BGA package 1 is manufactured. Further, the displacement of the solder balls SB occurs in the front-back, left-right, and up-down directions, and the BGA package socket 500 can be dealt with by the deformation of the spring body 110 in any case.

In the structure of the BGA package socket 500, the inductance of the spring body 110 is determined by the length of the portion which is not in contact with the solder ball SB, but most of the spring body 110 is in contact with the solder ball SB, Since the length of the portion which is not in contact is small, the inductance is small. By reducing the inductance, the generation of voltage noise induced by the instantaneous transient current is suppressed, and the functional operation of the semiconductor integrated circuit can be stably maintained.

FIG. 18 shows a BGA package socket 50.
2 is a cross-sectional view of a mounted state when a characteristic test of the BGA package 1 is performed using 0. In FIG. 18, the guide frame 50 is placed on the main surface of the test board 40A, the contact pins 120 of the BGA package socket 500 are inserted into the pin insertion holes PH formed in the test board 40B, and the test is performed by soldering. It makes electrical contact with the board 40B and is fixed in position. here,
The pin insertion holes PH are formed according to the number and arrangement of the BGA package sockets 500, that is, the number and arrangement of the solder balls SB of the BGA package 1.

By placing the BGA package 1 on the plurality of BGA package sockets 500 arranged, the solder balls SB and the spring body 110 come into contact with each other. The lid 501 attached to is closed, and the fixing pawl 502 for fixing the lid 501 is engaged with the guide frame 50, so that the solder ball SB is pressed against the spring body 110 and electric contact is surely obtained.

Here, a lid 501 attached to the guide frame 50
And the fixing pawl 502 for fixing the lid 501 is engaged with the guide frame 50 to press the solder ball SB against the spring body 110.
0 is compressed and the vertical force is absorbed. Therefore, the pressure applied to the solder balls is reduced and the solder balls SB are prevented from being deformed.

<D. Fourth Preferred Embodiment> FIG. 19 shows a BGA package socket 60 according to a fourth preferred embodiment of the present invention.
0 shows a partial sectional view of 0. In FIG. 19, a BGA package socket 600 includes a solder ball contact body 210 that contacts a solder ball and a contact pin 220 that is connected to a test board in a characteristic test of the BGA package.
And a conductive spring 230 inserted between the solder ball contact body 210 and the contact pin 220, and a hollow cylindrical conductive housing 240 that accommodates them.

The solder ball contact body 210 is used for the housing 2
40, a solder ball contact surface 211 that is in contact with a solder ball, a bottom portion 212 that is inside the housing 240 and is connected to one end of a spring 230, and a solder ball contact surface 21.
It is composed of a column portion 213 between 1 and the bottom portion 212. In addition, the solder ball contact surface 211 has a concave curved shape, that is, a concave shape so as to match the curvature of the solder ball or have a curvature larger by about 3 to 4%.

Further, the contact pin 220 is inserted into the pin insertion hole of the test board and fixed by soldering, and the spring 23 is provided in the housing 240.
And a bottom portion 222 to which one end of 0 is connected.

The shape of the housing 240 is a hollow cylinder having a lid 241 at one end, and an opening 242 is provided at the center of the lid. The opening 242 has a size that allows the insertion portion 221 of the contact pin 220 to pass therethrough, and the contact pin 220 is arranged so that the insertion portion 221 projects from the opening 242. The other end of the housing 240 has an opening 243 that is slightly smaller than the dimensions of the bottom 212 of the solder ball contact body 210, the spring 230, and the bottom 222 of the contact pin 220.

In the procedure for assembling the BGA package socket 600, the contact pin 220 is inserted into the housing 240 so that the insertion portion 221 passes through the opening 242. At this time, the spring 230 is previously connected to the bottom of the contact pin 220, and the solder ball contact body 210 is connected via the spring 230. Therefore, by inserting the contact pin 220, the spring 230 and the solder ball contact body 210 are continuously inserted. In addition,
Since the spring 230 is conductive, the contact pin 220 is electrically connected to the solder ball contact body 210 via the spring 230.

Here, the opening 243 of the housing 240.
The dimension of is slightly smaller than the dimensions of the bottom portion 212 and the spring 230 of the solder ball contact body 210 and the bottom portion 222 of the contact pin 220, but it means that it is smaller in units of microns. For example, when the size of the opening 243 is smaller than the size (diameter in the case of a cylindrical shape) of the bottom part 212 of the solder ball contact body 210 by about 10 to 20 μm, it is slightly stronger when the solder ball contact body 210 is inserted. When pushed in, the bottom portion 212 of the solder ball contact body 210 passes through the opening 243 and is inserted into the housing 240. This is the contact pin 220 and the spring 23.
The same applies to 0. Further, since the size (diameter in the case of a cylindrical shape) inside the housing 240 is formed larger than the size of the bottom portion 212, the solder ball contact body 210 can freely slide. Since the bottom portion 212 of the solder ball contact member 210 cannot pass through the opening 243 due to the elastic force of the spring 230, the solder ball contact member cannot be jumped out even if the test board on which the BGA package sockets 600 are arranged is tilted. 210 and spring 230 do not spring out of housing 240.

FIG. 20 shows a BGA package socket 60.
2 is a cross-sectional view of a mounted state when a characteristic test of the BGA package 1 is performed using 0. 20, the guide frame 50 is placed on the main surface of the test board 40C, and the insertion portion 221 of the contact pin 220 of the BGA package socket 500 is inserted into the pin insertion hole PH formed in the test board 40C. Test board 4 by soldering
It makes electrical contact with 0C and is fixed in position. Here, the pin insertion holes PH are formed according to the number and arrangement of the BGA package sockets 600, that is, the number and arrangement of the solder balls SB of the BGA package 1.

When the BGA package 1 is placed on the plurality of arranged BGA package sockets 600, the solder balls SB and the solder ball contact surface 211 of the solder ball contact body 210 come into contact with each other, but in this state. Since the contact is incomplete, the lid 501 attached to the guide frame 50 is closed, and the fixing pawl 502 for fixing the lid 501 is attached to the guide frame 50.
By engaging with the solder ball SB, the solder ball SB is pressed against the solder ball contact surface 211, and electrical contact is surely obtained.

The solder balls SB are the solder ball contact surfaces 211.
When pressed against, the spring 230 contracts and the vertical force is absorbed. Therefore, the pressure applied to the solder balls is reduced and the solder balls SB are prevented from being deformed.

Further, the length of the spring 230 is about 3 to 5 mm even in the extended state, and in the conventional BGA package 4, the length from the upper surface of the test board 1 after soldering the pins 22 to the solder ball SB is large. Since it was around 20 mm, it was shortened to about 1/4. Therefore, the inductance is reduced, the generation of voltage noise induced by the instantaneous transient current is suppressed, and the functional operation of the semiconductor integrated circuit can be stably maintained.

[0093]

According to the socket for BGA package according to claim 1 of the present invention, the vertical pressure applied to the contactor for contacting the solder ball is dispersed horizontally through the contactor for contacting the electrode, and Since the other end surface of the contactor for contacting the solder ball slides on the side surface of the contactor for contacting the electrode, the contactor for contacting the solder ball sinks vertically, the pressure applied to the solder ball is reduced, and the solder ball may be damaged during the test. To be prevented. Also,
Since the contactor for contacting the solder ball and the contactor for contacting the electrode are short in length after connection, the inductance can be reduced and the semiconductor integrated circuit can be stably operated in the characteristic test of the semiconductor integrated circuit operating at high speed.
A GA package socket is obtained.

According to the socket for BGA package according to claim 2 of the present invention, the pressure is prevented from concentrating on one point of the solder ball, so that the pressure applied to the solder ball is reduced and the solder ball is damaged during the test. Is prevented. Also, by fitting the other end face of the substantially spherical shape of the solder ball contacting contactor into the fitting groove, the electrical connection between the solder ball contacting contactor and the electrode contacting contactor becomes good and mechanically Since it is firmly joined and the connection is prevented from being easily broken, a durable BGA package socket can be obtained.

According to the socket for BGA package according to claim 3 of the present invention, the contact area of the solder ball is increased, and when the vertical pressure is applied to the contactor for contacting the solder ball, the solder ball is contacted. It is possible to prevent the pressure from concentrating on one point, prevent the solder ball from being damaged, and reduce the contact resistance with the solder ball to achieve good electrical connection. Further, the contact between the contactor for contacting the solder ball and the contactor for contacting the electrode is improved, and the contactor is firmly mechanically joined to prevent the connection from being easily broken. A BGA package socket is obtained.

According to the socket for BGA package according to the fourth aspect of the present invention, the contact area of the solder ball is increased, and when the vertical pressure is applied to the contactor for contacting the solder ball, the solder ball is contacted. It is possible to prevent the pressure from concentrating on one point, prevent the solder ball from being damaged, and reduce the contact resistance with the solder ball to achieve good electrical connection. Further, the contact between the contactor for contacting the solder ball and the contactor for contacting the electrode is improved, and the contactor is firmly mechanically joined to prevent the connection from being easily broken. A BGA package socket is obtained.

According to the socket for BGA package according to claim 5 of the present invention, the vertical pressure applied to the solder ball contact body is absorbed by the bending of the support plate, and the pressure applied to the solder ball is reduced. Damage to the solder balls is prevented. Further, since a plurality of support plates are connected in parallel between the solder ball contact body and the contact pin, the inductance can be reduced and the semiconductor integrated circuit can be stably operated in the characteristic test of the semiconductor integrated circuit operating at high speed. A socket for a BGA package that can be used is obtained.

According to the socket for BGA package according to the sixth aspect of the present invention, by arranging in consideration of the bending direction of the support plate, the adjacent sockets for BGA package do not come into contact with each other, and a unit area per unit area is reduced. Since the number of sockets can be increased, it is possible to support a BGA package having a large number of terminals.

According to the BGA package socket of the seventh aspect of the present invention, even if the solder ball is displaced, the elasticity of the spring body causes the spring body to deform in the direction of the displacement. The contact with the surface can be maintained, and the BGA package socket corresponding to the BGA package in which the position of the solder ball is displaced during manufacturing can be obtained.

According to the eighth aspect of the BGA package socket of the present invention, the vertical pressure applied to the solder ball contactor is absorbed by the spring and the pressure applied to the solder ball is reduced. A BGA package socket in which solder balls are prevented from being damaged during a test can be obtained.

According to the assembling method of the socket for BGA package according to claim 9 of the present invention, the contactor for contacting the solder ball inserted in step (c) and the contactor for contacting electrode inserted in step (d). Is fixed by the elasticity of the insulating plate, so that the BGA package socket according to claim 1 can be obtained by a simple process.

According to the method for assembling the BGA package socket of the tenth aspect of the present invention, the insertion portions of the solder ball contactor and the electrode contactor are covered with an insulating plate melted by heat and cooled. Since it is fixed to the insulating plate by solidifying, the contactor for contacting the solder ball and the contactor for contacting the electrode are surely fixed, and a socket for BGA package which does not fall off or change in position can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view illustrating a first embodiment of a BGA package socket according to the present invention.

FIG. 2 is a diagram showing a device configuration for a characteristic test using the first embodiment of the BGA package socket according to the present invention.

FIG. 3 is a perspective view illustrating a modified example of the first embodiment of the BGA package socket according to the present invention.

FIG. 4 is a perspective view illustrating a modified example of the first embodiment of the BGA package socket according to the present invention.

FIG. 5 is a process diagram illustrating a method for assembling the BGA package socket according to the present invention.

FIG. 6 is a process diagram illustrating a method for assembling a BGA package socket according to the present invention.

FIG. 7 is a perspective view illustrating a second embodiment of the BGA package socket according to the present invention.

FIG. 8 is a diagram showing a device configuration of a characteristic test using a second embodiment of the BGA package socket according to the present invention.

FIG. 9 is a perspective view illustrating a second embodiment of the BGA package socket according to the present invention.

FIG. 10 is a plan view showing an arrangement state of a second embodiment of the BGA package socket according to the present invention.

FIG. 11 is a plan view showing an arrangement state of a second embodiment of the BGA package socket according to the present invention.

FIG. 12 is a plan view showing an arrangement state of a modified example of the second embodiment of the BGA package socket according to the present invention.

FIG. 13 is a perspective view illustrating a third embodiment of the BGA package socket according to the present invention.

FIG. 14 is a plan view illustrating a third embodiment of the BGA package socket according to the present invention.

FIG. 15 is a sectional view illustrating a third embodiment of the BGA package socket according to the present invention.

FIG. 16 is a diagram for explaining the operation of the third embodiment of the BGA package socket according to the present invention.

FIG. 17 is a diagram for explaining the operation of the third embodiment of the BGA package socket according to the present invention.

FIG. 18 is a diagram showing a configuration of a characteristic test using a BGA package socket according to a third embodiment of the present invention.

FIG. 19 is a sectional view illustrating a fourth embodiment of the BGA package socket according to the present invention.

FIG. 20 is a diagram showing a configuration of a characteristic test using a BGA package socket according to a fourth embodiment of the present invention.

FIG. 21 is a diagram showing a device configuration of a characteristic test using a conventional BGA package socket.

[Explanation of symbols]

1 BGA package, 10 sheets, 20, 20A,
20B Solder ball contactor, 30, 30A,
30B Contactor for electrode contact, 40, 40A, 40
B, 40C test board, 50 guide frame, 60 land, 70 solder ball contact body, 80 support plate, 90
Contact pin, 110 spring body, 120 contact pin, 201, 201A, 201B body, 30
1, 301A, 301B main body, 202, 202A, 2
02B solder ball contact surface, 203A contact end surface, 20
3B Projection part, 203 Contact ball, 302, 302A Land contact ball, 304A Engagement part, 305A Engagement surface, 2
10 solder ball contact body, 211 solder ball contact surface,
212 bottom part, 213 column part, 220 contact pin, 221 insertion part, 222 bottom part, 230 spring, 2
40 housing, 241 lid, 242, 243 openings.

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Masahiko Hyosan 4-Chome, Mizuhara, Itami City, Hyogo Prefecture Mitsubishi Electric Corporation System LSI Development Laboratory (72) Inventor Hirotaka Kakiuchi Higashino Itami City, Hyogo Prefecture 4-61-5 Mitsubishi Electric Engineering Co., Ltd. LSI Design Center

Claims (10)

[Claims] 1. An elastic insulating plate, a solder ball contactor whose one end surface is in contact with a solder ball of a BGA package, and one end surface of which is substantially spherical, and an electrode plate of the BGA package testing device. And a contactor for contacting an electrode, wherein the contactor for contacting the solder ball is vertically inserted into one main surface of the insulating plate at the other end face side, and the contactor for contacting the electrode is the other end face. A BGA package socket characterized in that a side thereof is obliquely inserted into the other main surface of the insulating plate, and a side surface thereof is in contact with the other end surface of the solder ball contactor. 2. The shape of the one end surface of the solder ball contacting contactor is a concave shape having a curvature that substantially matches the curvature of the solder ball of the BGA package, and the other end surface of the solder ball contacting contactor is formed. The end surface has a substantially spherical shape, and a side surface of the contactor for contacting the electrode has a curvature that substantially matches the curvature of the other end surface of the contactor for contacting the solder ball, which has a substantially spherical shape. The socket for a BGA package according to claim 1, wherein a fitting groove that fits into the substantially spherical end surface of the contactor is provided along the axial direction. 3. The shape of the one end surface of the solder ball contacting contactor is a concave shape having a curvature that substantially matches the curvature of the solder ball of the BGA package, and the other end surface of the solder ball contacting contactor is the same. The shape of the end surface is a shape obtained by obliquely cutting a cylinder at a predetermined angle, and the side surface of the contactor for electrode contact is engaged with the other end surface of the contactor for solder ball contact,
A projecting engaging portion having an engaging surface formed so that its planar shape matches the shape of the other end surface of the contactor for contacting the solder ball and has an inclination angle equal to the predetermined angle is provided. The socket for BGA package according to claim 1. 4. The shape of the one end surface of the solder ball contacting contactor is a concave shape having a curvature that substantially matches the curvature of the solder ball of the BGA package, and the other end surface of the solder ball contacting contactor is formed. The shape of the end surface is a shape including a protruding portion that partially protrudes, and the side surface of the electrode contacting contactor has a groove width that substantially matches the lateral width of the protruding portion of the solder ball contacting contactor, The socket for a BGA package according to claim 1, wherein a fitting groove that fits into the protrusion of the contactor for contacting the solder ball is provided along the axial direction. 5. A solder ball contact body having a solder ball of a BGA package in contact with one end surface thereof, a contact pin having one end thereof inserted into an electrode hole of a testing device of the BGA package, and the solder ball contact body. To connect between the contact pins, a plurality of elastic strut plates arranged annularly at equal intervals from the other end surface of the solder ball contact body to the other end of the contact pin, The plurality of strut plates have a bending tendency so as to bend outward when the solder ball contact body is pressed, and restore to a substantially linear shape otherwise. Socket for BGA package. 6. The BGA package socket according to claim 5, comprising four said support plates. 7. A spring body formed of a conductive wire having elasticity and spirally expanding while swirling so as to be wound around the surface of a solder ball of a BGA package during a test, and one end of the BGA package is tested. A socket for a BGA package, comprising a contact pin which is inserted into an electrode hole of a device and which is connected at the other end to a winding start portion of a central portion of the spring body. 8. A solder ball contact body on one end surface of which a solder ball of a BGA package contacts, and a contact pin having an insertion portion inserted on one end surface thereof into an electrode hole of a testing device of the BGA package, A conductive spring interposed between the other end surface of the solder ball contact body and the other end surface of the contact pin so as to electrically connect the solder ball contact body and the contact pin. A hollow housing that houses the contact pin, the spring, and the solder ball contact body, and the contact pin is fixed to one end of the housing so that the insertion portion is exposed from the housing. The solder ball contact body is exposed from the housing on the other end side of the housing, and the solder ball contact body is exposed. There BGA package socket, characterized in that it is arranged so as to movable with the expansion and contraction of said spring. 9. A method for assembling a BGA package socket according to claim 1, wherein: (a) a step of vertically forming a first guide hole at a predetermined position on one main surface of the insulating plate; (b) a step of obliquely forming a second guide hole at a predetermined position on the other main surface of the insulating plate, and (c) setting the other end surface side of the contactor for contacting the solder ball to the first non-contact surface. And a step of (d) inserting the other end face side of the electrode contactor into the second non-through hole, the diameter of the first non-through hole being equal to the solder ball. A socket for a BGA package, which is formed to be smaller than a maximum dimension of an insertion portion of a contactor for contacting, and a diameter of the second non-through hole is formed to be smaller than a maximum dimension of an insertion portion of the contactor for electrode contacting. How to assemble. 10. The step (c) includes a step of inserting the contactor into the first unpenetrated hole in a heated state, and the step (d) includes a state in which the contactor is heated. The method for assembling a BGA package socket according to claim 9, further comprising the step of inserting the socket into the second non-through hole.