JPH08262487A - Liquid crystal display device and its production - Google Patents

Abstract

PURPOSE: To make it possible to embody COG package having low-resistance wirings by executing packaging of a driving IC not on the AM substrate side disposed with active elements but on another CM substrate side. CONSTITUTION: The driving IC chip 121 is packaged not on the AM substrate 101 disposed with the TFTs but on the CM substrate 102 facing this substrate. In such a case, the control signals and display signals from outside are inputted via input wirings (or input electrodes) 31 to the driving IC 121 and the output signals from the driving IC 121 are transmitted from the output wirings (or output electrodes) 32 via an ACF (anisotropic conductive film) 33 to a leading electrodes 107 on the opposite AM substrate 101. The leading electrodes 107 are directly connected to the gates or sources of the TFTs on the AM substrate 101 and, therefore, the control signals and display signals are transmitted to the TFTs and liquid crystals are eventually controlled. As a result, the low- resistance input wirings necessary for the driving IC are freely embodied.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to improvements in the structure and manufacturing method of an active matrix type liquid crystal display device in which a driving IC is mounted on a substrate, and more particularly to driving an active element for controlling liquid crystal. The present invention relates to improvements in the structure and manufacturing method of a liquid crystal display device to which a COG (Chip On Glass) system in which a drive IC chip is directly mounted on a substrate surface is applied.

An active matrix type liquid crystal display device is a TFT (thin film transistor), a diode, an M
1 shows a liquid crystal display device having a structure in which an active element such as IM (metal insulator metal) is incorporated as an element for controlling the state of liquid crystal.

[0003]

2. Description of the Related Art The object of the present invention is a structure in which a drive IC for controlling active elements is mounted on a substrate of a display panel which constitutes an active matrix type liquid crystal display device. As the drive IC, an IC incorporated in a package (hereinafter referred to as a package IC) and an IC as a bare chip (hereinafter referred to as a drive IC chip)
Driver IC mounted on a substrate, including both
The latter is often the case.

Therefore, as a conventional technique, an active matrix type liquid crystal display device using a TFT and a COG mounting technique for mounting a driving IC chip will be described. 9 and 10 show a sectional view and a perspective view of a color liquid crystal display panel using TFTs, respectively.

In the sectional view of FIG. 9, a pair of substrates 10 is provided.
1, 102 are sealed by a peripheral sealing portion 103, and a liquid crystal 104 is sealed inside the sealing portion 103. On the inner surface of the substrate 101, the TFT provided for each pixel and the pixel electrode 1
06, an extraction electrode 107 for applying a control voltage to the TFT, and an alignment film 110 are formed. On the other hand, on the inner surface of the substrate 102, a red (R) green (G) blue (B) color filter 108, and a transparent common electrode 109 and an alignment film 110 that cover the entire surface thereof are provided. A black matrix BM for improving display contrast and color separation is arranged at the boundary of each color of the color filter, and the black matrix BM is usually formed of a thin film of Cr. The gap between the two substrates 101 and 102 thus configured is held by the spacer 105.

In FIG. 10, three cells corresponding to R, G, and B (the smallest unit for controlling the liquid crystal is called a cell) constitute one pixel (or pixel), and a TFT corresponding to three pixels is formed. -Shows a perspective view of the LCD panel. The R, G, and B color filters 108 are formed on one substrate 102 side corresponding to each cell, and the transparent pixel electrode 112 on the other substrate 101 side and the voltage applied to the pixel electrode are controlled. TFT 111 that operates is formed. Although a black matrix is formed at the boundary of each color of the color filter 108 as described with reference to FIG. 9, the illustration thereof is omitted here (this is clearly shown in FIG. 11 below). The gate and source of each TFT are connected to the gate bus electrode 114 and the source bus electrode 113, respectively, and these bus electrodes are connected to the extraction electrode (107 in FIG. 9) in the peripheral portion of the panel.

TFT-LCD constructed in this way
Polarizing plates (not shown) on the outer surfaces of the two substrates of the panel
Then, a white light source (not shown) is arranged on the back side of the panel, and a driving circuit (not shown) is further connected to the extraction electrode to form a TFT-LCD module.

Next, the shape and positional relationship of the element elements formed on the two substrates will be described with reference to FIG. TF
On a substrate on which T is formed (hereinafter referred to as AM substrate), as shown in FIG. 1B, a TFT 111 having a source S, a gate G, and a drain D, and a transparent TFT connected to the drain D. The pixel electrode 112 is provided. And
The source S and the gate G are respectively connected to the source bus electrode 113.
Is connected to the gate bus electrode 114 and controlled.

On the other hand, on the substrate (hereinafter referred to as CM substrate) on which the color filter and the common electrode are formed, R,
A black matrix BM is formed at the boundary between the G and B color filters 108 and the respective colors, as shown in FIG. The black matrix BM is an indispensable constituent element for increasing the display contrast and improving color separation. The shapes of the pixel electrode 112 on the AM substrate and the color filter 108 on the CM substrate are
Usually the same.

The plan views of FIGS. 11A and 11B are
Both show plan views viewed from the same direction (from above the CM substrate). Next, a mounting structure in which a driving IC for controlling the operation of the TFT is mounted on the substrate of the TFT liquid crystal display panel will be described.

The driver IC is mounted by a TAB (Tape Automated) in which a driver IC chip is connected to a flexible printed board.
There are TAB mounting in which a Bonding tape is connected to a panel terminal portion using an ACF (anisotropic conductive film) and COG mounting in which a driving IC chip is directly connected to a panel. Since the present invention relates to COG mounting, here, COG
A conventional technique regarding mounting will be described.

In the plan view of the liquid crystal display panel shown in FIG. 12B, the drive IC chip 121 is mounted on the AM substrate, and the output of the drive IC is connected to the extraction electrode 107 of the liquid crystal display panel to the drive IC. The input electrodes 122 of are individually led to the peripheral portion of the liquid crystal display panel. These input electrodes 122 are cross-sectional views of FIG.
The flexible printed board 127 is normally used as shown in FIG.
Wiring processing such as common connection is performed. In FIG. 12A, reference numeral 123 is a bump formed on the drive IC chip 121, and reference numeral 1
Reference numeral 24 denotes a connection resin for mounting and fixing the drive IC chip 121 on the AM substrate 101.

As described above, in the conventional COG mounting technique, the drive IC chip 121 is mounted on the AM substrate 101, and its input wiring is the AM substrate 10 of the liquid crystal display panel.
Flexible printed board 127 externally connected to 1
The processing such as common connection is performed in.

[0014]

In COG mounting, a drive IC chip is directly mounted on a substrate, and therefore it is desired to provide input / output wiring for this drive IC on the substrate.
However, when such COG mounting is applied to an active matrix type liquid crystal display panel, the following two problems occur.

(1) First, there is a problem that wiring that is considerably more complicated than that of a liquid crystal display panel such as TAB mounting must be performed on an AM substrate on which active elements are arranged.
This wiring is a power supply wiring for supplying a power supply voltage to the drive IC and a signal transmission wiring for supplying various input signals. In the case of TAB mounting (hereinafter, these wirings are referred to as “input wiring for driving IC”), this “input wiring for driving IC” is performed on the TAB substrate on which the driving IC is directly mounted. Therefore, it is not a problem, but in the case of COG mounting, there is a problem in that it needs to be performed on the AM substrate.

On the other hand, in the conventional COG mounting, as shown in FIG.
As shown by the symbol 126 in 2 (a), this "driving IC
Flexible printed circuit board with "input wiring for
Some of them are connected to the AM board from the outside for processing, but this has a mounting structure that is not much different from that of TAB, and can be said to impair the characteristics of COG mounting.

Therefore, when the "input wiring for the driving IC" is formed on the AM substrate, a wiring group is added on the same substrate as the TFT having a complicated structure.
This causes a problem of reducing the manufacturing yield of the entire AM substrate.

(2) Next, the "input wiring for the driving IC" is required to have an electrically low resistance. And
There is a problem that a specific process such as plating is required to reduce the resistance of the wiring.

Such a process is completely different from the process of forming an active matrix element such as a TFT. Therefore, in order to complete the elements / wirings on the AM substrate, the number of process steps such as plating is increased in addition to the active element manufacturing process steps, which further complicates the complicated active element forming substrate process steps. Become. As a result, there arises a problem that the manufacturing yield of the entire AM substrate is reduced.

In view of the above problems, the present invention does not add a complicated wiring on a substrate on which an active element such as a TFT is formed, and does not add a process different from the active element forming process. It is intended to provide a matrix type liquid crystal display panel.

[0021]

According to the present invention, in order to solve the above problems, a liquid crystal is sealed between two substrates whose peripheral portions are sealed, and an active element for controlling the liquid crystal is provided. The present invention provides a liquid crystal display device characterized in that a drive IC for controlling the active element is provided on one substrate and is mounted only on the other substrate.

The "active element" referred to here is a TF used in an active matrix type liquid crystal display panel.
The elements such as T, diode, and MIM are shown. Further, the “driving IC” mentioned here includes both the package IC and the driving IC chip.

[0023]

According to the present invention, the driving IC is mounted not on the substrate side (AM substrate side) on which the active elements are arranged, but on the other substrate side (CM substrate side). I
The input wiring for C can be arranged on the CM board side.
Therefore, it is possible to solve the conventional problem of wiring on the AM substrate side having a complicated structure.

Further, since the input wiring for the drive IC is formed on the side of the CM substrate which has a simpler process than that of the AM substrate, the film thickness can be increased by using plating or the like to easily reduce the resistance. . Therefore, the above-mentioned problem of further adding another process such as plating on the AM substrate side which uses a complicated process such as TFT formation does not occur.

[0025]

Embodiments of the present invention will be described below. [First Embodiment] An embodiment corresponding to the first aspect of the present invention will be described with reference to FIG. The figure shows a cross-sectional view of a liquid crystal display device to which the COG mounting of the present invention is applied. The driving IC chip 121 is an AM substrate 10 on which TFTs are arranged.
It is mounted on the CM board 102 opposed to the No. 1 board.

The drive IC chip 121 is mounted face down, but may be mounted face up. First, regarding a signal flow for driving the TFT, a control signal or a display signal from the outside is input to the drive IC 121 via the input wiring (or input electrode) 31, and an output signal from the drive IC is output wiring (or It is transmitted from the output electrode) 32 through the ACF (anisotropic conductive film) 33 to the extraction electrode 107 on the AM substrate 101 which faces the output electrode. The extraction electrode 107 is provided on the AM substrate 101.
Since it is directly connected to the gate or source of the upper TFT, the control signal and the display signal are transmitted to the TFT to control the liquid crystal. The content itself of this operation is the same as that of the conventional COG mounting shown in FIG.

On the other hand, FIG. 1 of the first embodiment and FIG. 12 of the prior art.
As is clear from comparison with (a), the configuration relating to the mounting of the drive IC is significantly different. That is, the drive IC conventionally mounted on the AM board side is mounted on the CM board side facing the AM board in the present invention. The first embodiment can improve the performance, manufacturing process, yield, etc. of the liquid crystal display device as follows, as compared with the conventional example.

In the conventional structure as shown in FIG. 12, in order to reduce the load on the TFT process, the input / output wiring for the driving IC has the same layer structure as the TFT portion. Therefore, the resistance of the wiring can be reduced and the wiring can be restricted. In particular, it is necessary to reduce the resistance of the input wiring, but this is difficult to achieve. Therefore, as indicated by reference numeral 126 in the figure, the flexible printed board is used for the input wiring, but this is not preferable because it impairs the characteristics of COG mounting.

Therefore, if the structure of the present invention shown in FIG. 1 is used, the AM substrate may simply have a structure in which the extraction electrodes 107 are arranged in parallel, the TFT process is the same as the conventional one, and there is a problem with the wiring resistance. Does not happen. On the other hand, C
Since the wiring on the M substrate side can be formed independently of the TFT process, the low resistance input wiring required for the driving IC can be freely realized.

To connect the extraction electrode 107 on the AM substrate to the wiring on the CM substrate, as shown in FIG.
Thermocompression bonding is performed using (anisotropic conductive film) 33. This ACF
By 33, the connection terminals on both substrates are individually connected. The ACF 33 is arranged outside the sealing portion 103 in FIG.
It is also possible to adopt a configuration in which it is arranged inside the unit 3.

As described above, according to the first embodiment shown in FIG. 1, since the input / output wiring of the driving IC can be formed irrespective of the TFT process, it is possible to easily realize the low resistance wiring necessary for the operation. Therefore, there is no fear of lowering the manufacturing yield of liquid crystal display devices.

[Second Embodiment] Referring to FIG. 2, a drive IC
A description will be given of an embodiment in which the input wirings for wiring are commonly connected to simplify the wiring structure. This corresponds to the invention of claim 2.

FIG. 2 shows a CM board on which a drive IC is mounted.
It is a top view of the mounting portion periphery. A symbol 121a shown by a broken line indicates a portion where the drive IC is mounted,
Specifically, the bumps of the drive IC are connected to the connection terminal portions 37a and 37b.

Here, the input signal to the input wiring (or input electrode) for the drive IC shown by the symbol 31 is normally supplied commonly to a plurality of drive ICs mounted on the substrate. ing. Therefore, the number of input terminals can be significantly reduced by providing the common connection portion indicated by the symbol 340 in FIG. 2 and using the common connection wiring indicated by the symbol 34. In the example of FIG. 2, the common connection wiring 34 is
It is configured to be connected to the connector 36 mounted on the board to simplify the device.

The reason why such wiring can be realized freely is that wiring can be performed not on the AM substrate but on the CM substrate. Since there is an active element such as a TFT on the AM substrate side, there is no such degree of freedom.

Here, one of the essential conditions for performance is that the common connection wiring 34 must be a low resistance wiring. This point will be described in the next third embodiment.

Although not directly related to the second embodiment,
In FIG. 2, the electrode portion indicated by the symbol 32d, that is, the portion of the output wiring corresponding to the symbol T indicates a connection terminal for connecting to the corresponding electrode on the opposing AM substrate.
This is related to the first embodiment, the sixth embodiment, and the seventh embodiment, and therefore the description is added.

[Third Embodiment] With reference to FIG.
An example corresponding to will be described. This makes it possible to reduce the wiring resistance by forming the input / output wiring for the driving IC and its common connection wiring as a multilayer film.

Particularly, the wiring that needs to have a low resistance is a common connection wiring, but since the input / output wiring for the drive IC can be formed on the same substrate in the same step, the input / output wiring portion is also completely low. It is shown in the form of resistance wiring, and description will be given using this figure.

On the CM substrate, Cr thin films 31a and 32a formed by sputtering or the like are patterned in the shape of input / output wiring, and Au (or Cu) thick films 31b and 32b are plated thereon. Then, the Cr film 51a is plated. Here, the thick film 31 of Au (or Cu)
By using b and 32b, the wiring resistance can be significantly reduced. The thick film can be formed because the wiring is on the CM substrate, not the AM substrate, as described above.

Here, the connection terminal portion of the input / output wiring is
In order to expose the thick films 31b and 32b of Au (or Cu), the upper Cr film is removed. The film denoted by reference numeral 51b is a protective film made of silicon nitride or the like.

[Modification of Third Embodiment] FIG. 5 shows a driving IC.
This is a modification of the third embodiment regarding the improvement of the terminal portion connected to the bump of the drive IC in the input / output wiring for use.

In the third embodiment of FIG. 4, the terminal portion connected to the bump of the driving IC is made of Au (or Cu) thick film and is opaque, but in the modification of FIG. Is a transparent electrode 52 such as an ITO (Indium Tin Oxide) film.
It is formed with. As described above, by making the connection terminal portion in the COG mounting transparent, it is easy to confirm the connection state and align the COG mounting, and it is possible to improve the mounting accuracy and simplify the process.

[Fourth Embodiment] With reference to FIG.
An example corresponding to will be described. C on which the drive IC is mounted
Since a color filter is also usually formed on the M substrate, by forming at least one layer of the wiring for the driving IC composed of a multilayer film by using the same material as the black matrix of the color filter, The process can be simplified.

In the projection type liquid crystal display device,
The black matrix is formed, but the color filter may not be provided. Also in this case, at least one layer of the wiring formed of the multilayer film is formed using the same material as the black matrix, as in the above case.

FIG. 6 is a cross-sectional view of a CM substrate on which color filters are formed, wirings for driving ICs are formed, and the driving ICs are mounted. (This figure is
6 is a cross-sectional view corresponding to the plan view of FIG. 6). As shown in FIG. 6, the lowermost films 31a, 32a, 3 of the wirings for the drive IC are shown.
4a is formed of Cr, which is the same material as the black matrix BM of the color filter.

Here, in the process of manufacturing the CM substrate having this structure, first, the black matrix and the multi-layer wiring for the driving IC are formed, and after the formation is completed, the colors shown by symbols 108 and 109 are formed. It is important to make the order of forming the filter portion. This is because the resin used for the color filter 108 and the common electrode 109 are deteriorated in the plating process particularly used for the multi-layer wiring for the drive IC,
This is because there is a risk of degrading the surface.

[Fifth Embodiment] An embodiment corresponding to claim 5 will be described with reference to FIGS. 2, 3 and 6. This example relates to an improvement of the extraction electrode structure of the common electrode.

In FIG. 6, the common electrode 109 formed on the color filter has the extraction electrode 3 at the outer peripheral portion thereof.
5a. And this extraction electrode 35a
Is a low resistance electrode having a multilayer film structure as described above.

As shown in the plan view of FIG. 2, the extraction electrode 35a is formed over the entire four sides of the peripheral portion of the common electrode (not shown) and is connected to the common electrode contact. FIG. 3 schematically shows this state over the entire substrate, and therefore the improvement content will be described with reference to this figure.

In FIG. 3, symbol 41 indicates a formation region of the drive IC input / output wiring, and symbol 42 indicates a formation region of the color filter. The symbol 35a is the extraction electrode of the common electrode described above, and is formed on all four sides. Since the extraction electrode 35a is a multi-layered low resistance electrode, it is possible to uniformly reduce the resistance of the entire common electrode.

On the other hand, the conventional common electrode is usually connected to the extraction electrodes only at points P1 to P4 at the four corners, is coupled to the opposing AM substrate, and the voltage is applied only to the four points. Therefore, the resistance and voltage distribution may become non-uniform in the entire common electrode, and improvement has been desired. This is due to the large surface resistance of the common electrode and the structure in which the voltage can be applied only to the four corners. The former cause cannot be excluded, but the latter cause can be solved by the following measures.

In the present embodiment, since the extraction electrode 35a is arranged so as to surround all four sides around the common electrode, and a multilayer film is used for the extraction electrode to have a low resistance, the above problem is solved. can do.

In the embodiments of FIGS. 2 and 6, the common electrode lead electrode is connected to the black matrix BM, but they may be separated.

[Sixth Embodiment] An embodiment corresponding to claim 6 will be described with reference to FIGS. 1 and 7. The present embodiment relates to a configuration for connecting a plurality of corresponding electrode terminals on an AM board and a CM board.

The connection between the corresponding electrodes on the two substrates is basically arranged such that the corresponding electrodes are aligned so as to face each other, and the individual electrodes can be electrically connected. .

As one configuration example, the connection can be made by using the ACF 33 as already described in the first embodiment with reference to FIG. The ACF 33 may be inside or outside the sealing portion 103. Moreover, this connection can be performed at the same time during the sealing step of forming the sealing portion 103.

In the sixth embodiment corresponding to claim 6, FIG.
As shown in FIG. 3, a sealing material containing conductive particles (the particles also include fillers) is used to form the sealing portion 300, thereby connecting the corresponding electrodes on the upper and lower substrates. be able to. According to this configuration, unlike the example of FIG. 1, a connection region dedicated to the ACF is not required, so that the space factor can be improved and the process can be shortened.

[Seventh Embodiment] The seventh embodiment will be described with reference to FIG.
An example corresponding to will be described. In this embodiment, in the liquid crystal display device of the present invention, the manufacturing method relating to measures against static electricity during the manufacturing process is improved.

Since active elements such as TFTs constituting an active matrix type liquid crystal display device are susceptible to damage such as local dielectric breakdown due to static electricity during the manufacturing process, various static electricity countermeasures have been taken. . One of the important measures among them is to use a peripheral connection electrode.

On the AM substrate 101 on the right side of FIG.
The extraction electrode 107 from the FT formation region 63 is connected to the peripheral connection electrode 61a via the inter-substrate connection terminals 107tx and 107ty and the peripheral connection coupling electrode 61b. The peripheral connection electrode 61a flows through each process in a state in which all are connected to the same potential until just before the liquid crystal display device is completed. Therefore, the structure is such that static electricity is not generated in the TFT element and its connecting electrode. Normally, the peripheral connection electrode 61a is cut along with the substrate along the scribe lines SC11 and SC12 after all the manufacturing steps before injecting the liquid crystal are completed.

In the conventional liquid crystal display device, this peripheral connection electrode 61a is provided only on the AM substrate 101 side, but in the liquid crystal display device of the present invention, the symbol 62a is also provided on the CM substrate side facing it. It must be arranged as shown. This means that after the peripheral connection electrode 61a is cut off, a process from liquid crystal injection to COG mounting is performed, but in order to protect the TFT from static electricity generated during that period, the peripheral connection electrode 62a on the CM substrate 102 side is This is because it becomes necessary.

Here, the entire FIG. 8 will be described. Center line C
The right side of L shows a partial plan view of the AM board 101 already described, and the left side shows a partial plan view of the CM board 102. In the CM substrate 102, a color filter is formed in a certain area of the black matrix BM, and the extraction electrode 35a of the common electrode is provided around the color filter. The input wiring 31 and the output wiring 3 are provided on the mounting portion 121a of the drive IC.
2 and further has drive IC connection terminals 32i and inter-substrate connection terminals 32tx, 32ty. Then, these two substrates are combined in a line-symmetrical manner with respect to the center line CL. The connection terminal between the two boards is the CM board 102.
The terminals with the symbols 32tx and 32ty above are combined so as to correspond to the symbols 107tx and 107ty on the AM board 101, respectively.

Here, the process for cutting the peripheral connection electrodes 62a and 62b according to this embodiment will be described. FIG.
After the two substrates as shown in (4) are completed, they are assembled and sealed, and at the same time, the connection between the inter-board connection terminals is performed. Next, scribe lines SC11 and SC on the AM substrate
Along the line 12, the peripheral connection electrode 61a is cut off together with the substrate.

Next, liquid crystal is injected, and after the injection is completed, the injection port (not shown) is sealed. Next, after passing through some steps such as an intermediate inspection step, the peripheral connection electrodes 62a on the CM substrate 102 are electrically cut off. In this case, the CM board 102 is not cut off. To achieve this,
The peripheral connection electrodes may be melted by laser along the melting lines ML21 and ML22. Then, the drive IC is COG mounted.

Here, the peripheral connection electrode 61 on the AM electrode is used.
It is important as a countermeasure against static electricity that the order of cutting a and the peripheral connection electrode 62a on the CM electrode is set as described above. It should be noted that performing the fusing treatment of the peripheral connection electrodes on the CM substrate before mounting the drive IC is due to the CO
This is for avoiding an adverse effect on the G mounting part.

Further, as a condition of the apparatus configuration, there is a difference that the former cuts the peripheral connection electrodes together with the substrate and the latter cuts only the peripheral connection electrodes on the substrate.

[0068]

As described above, according to the first to fourth aspects of the present invention, the structure and process on the substrate side (AM substrate side) on which the active elements are arranged are not affected, and A
COG mounting with low resistance wiring can be realized without adding a new structure and process to the M substrate side. As a result, the manufacturing yield on the AM substrate side is not reduced, and by sharing the film configuration with the color filter, the process on the other substrate side (CM substrate side) can be simplified.

According to the invention of claim 5, it is possible to realize a reduction in resistance and an improvement in uniformity of the entire common electrode. According to the invention of claim 6, the space factor can be improved and the process can be shortened.

Further, according to the invention of claim 7, it is possible to sufficiently take measures against static electricity during the manufacturing process.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment.

FIG. 2 is a diagram showing a second embodiment.

FIG. 3 is a diagram showing a fifth embodiment.

FIG. 4 is a diagram showing a third embodiment.

FIG. 5 is a diagram showing a modification of the third embodiment.

FIG. 6 is a diagram showing a fourth embodiment.

FIG. 7 is a diagram showing a sixth embodiment.

FIG. 8 is a diagram showing a seventh embodiment.

FIG. 9 is a sectional view of a color display liquid crystal panel.

FIG. 10 is a perspective view of a color display liquid crystal panel.

FIG. 11 is a partial plan view of a TFT substrate and a CF substrate.

FIG. 12 is a diagram showing a structure of COG mounting.

[Explanation of symbols]

31 input wiring for drive IC, input electrodes 31i, 37a connection terminal for drive IC (input wiring side) 32 output wiring for drive IC, output electrode 32d board-to-board connection terminal 32i, 37b drive IC connection terminal (output wiring side) ) 32tx, 32ty CM board-to-board connection terminal 33 ACF 34 common connection wiring 35a common electrode extraction electrode 35b 35a extraction electrode 36 connector 41 drive IC input / output wiring formation area 42 color filter formation area 52 transparent electrode 53 Protective Film 61a Peripheral Connection Electrode on AM Substrate 61b Coupling Electrode for Peripheral Connection Electrode 62a Peripheral Connection Electrode on CM Substrate 62b Peripheral Connection Electrode Coupling Electrode 101 Substrate, AM Substrate 102 Substrate, CM Substrate 103 Sealing Part 104 Liquid Crystal 105 Spacer 106 TFT and pixel electrode 107 Extraction electrode 107tx, 107ty Inter-substrate connection terminal on AM substrate 108 Color filter 109 Common electrode 110 Alignment film 111 TFT 112 Pixel electrode 113 Source bus electrode 114 Gate bus electrode 121 Drive IC, drive IC chip 122 Input electrode to drive IC 123 Bump 124 Connection resin 126 Common connection FPC 127 Flexible printed board, FPC board 128 Electrode on flexible printed board, FPC
Electrode 300 Sealing part 340 mixed with conductive particles 340 Common connection wiring part R Red color filter G Green color filter B Blue color filter BM Black matrix P1 to P4 Common electrode extraction electrode connection point SC11, SC12 AM substrate Scribe line ML21, ML22 CM substrate peripheral connection electrode fusing line

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tsutomu Ishida 650 Otsuka Noji, Yonago City, Yonago City, Tottori Prefecture Yonago Fujitsu Limited (72) Inventor Takayuki Katao 650 Otsuka Noji, Yonago City, Tottori Prefecture Yonago Fujitsu (72) Inventor Hiroyuki Kawai, Yonago Fujitsu Limited

Claims (7)

[Claims] 1. A pair of substrates in which liquid crystal is sealed in a gap whose peripheral portion is sealed, an active element disposed on one of the substrates for controlling the liquid crystal, and an active element for controlling the active element, A liquid crystal display device comprising: a drive IC mounted only on the other side of the substrate. 2. The liquid crystal display device according to claim 1, further comprising wirings commonly connected on the substrate as input wirings of the plurality of drive ICs mounted on the substrate. 3. The liquid crystal display according to claim 2, wherein the wiring is a multi-layered film including at least a part of two or more layers, and at least one layer of the multi-layered film is a film formed by plating. apparatus. 4. The liquid crystal display device according to claim 3, wherein at least one layer of the multilayer film is formed of the same material as a black matrix formed on the same substrate. 5. The other substrate has a common electrode for commonly applying a voltage to liquid crystal in a central region and a lead electrode made of the multilayer film in a peripheral region, the common electrode comprising: The liquid crystal display device according to claim 1, wherein an outer peripheral portion is connected to the extraction electrode. 6. The one substrate is provided with an extraction electrode from the active element, and the other substrate is provided with an output electrode from the drive IC. The electrodes of the two substrates are two substrates. Are connected by conductive particles mixed in a sealing portion to be sealed.
The described liquid crystal display device. 7. A peripheral connection electrode for commonly connecting lead electrodes of the active element is formed on one substrate on which the active element is provided, and an output electrode of the drive IC is provided on the other substrate on which the drive IC is mounted. After forming the peripheral connection electrodes commonly connected and assembling and sealing the two substrates, the peripheral connection electrodes of the one substrate are cut off together with the substrates, and the other substrate is mounted before mounting the drive IC. 2. The method for manufacturing a liquid crystal display device, wherein the peripheral connection electrode is cut off in an electrically disconnected state.