JPH08253755A - Conductive pressure-sensitive adhesive composition and conductive pressure-sensitive adhesive tape - Google Patents
Conductive pressure-sensitive adhesive composition and conductive pressure-sensitive adhesive tapeInfo
- Publication number
- JPH08253755A JPH08253755A JP7057885A JP5788595A JPH08253755A JP H08253755 A JPH08253755 A JP H08253755A JP 7057885 A JP7057885 A JP 7057885A JP 5788595 A JP5788595 A JP 5788595A JP H08253755 A JPH08253755 A JP H08253755A
- Authority
- JP
- Japan
- Prior art keywords
- sensitive adhesive
- polyaniline
- pressure
- conductive
- adhesive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 97
- 239000000203 mixture Substances 0.000 title claims abstract description 96
- 229920000767 polyaniline Polymers 0.000 claims abstract description 78
- 239000002253 acid Substances 0.000 claims abstract description 24
- 239000003960 organic solvent Substances 0.000 claims abstract description 16
- 239000002019 doping agent Substances 0.000 claims abstract description 13
- MIOPJNTWMNEORI-GMSGAONNSA-N (S)-camphorsulfonic acid Chemical compound C1C[C@@]2(CS(O)(=O)=O)C(=O)C[C@@H]1C2(C)C MIOPJNTWMNEORI-GMSGAONNSA-N 0.000 claims abstract description 8
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 claims abstract description 6
- 150000003458 sulfonic acid derivatives Chemical class 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 4
- 239000003495 polar organic solvent Substances 0.000 abstract description 3
- 150000007513 acids Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 description 22
- -1 2-ethylhexyl Chemical group 0.000 description 21
- 229920001577 copolymer Polymers 0.000 description 20
- 230000015572 biosynthetic process Effects 0.000 description 18
- 238000003786 synthesis reaction Methods 0.000 description 18
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 230000005611 electricity Effects 0.000 description 13
- 238000006116 polymerization reaction Methods 0.000 description 13
- 230000003068 static effect Effects 0.000 description 13
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- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 10
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
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- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 4
- PTFIPECGHSYQNR-UHFFFAOYSA-N 3-Pentadecylphenol Chemical compound CCCCCCCCCCCCCCCC1=CC=CC(O)=C1 PTFIPECGHSYQNR-UHFFFAOYSA-N 0.000 description 4
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- 239000004593 Epoxy Chemical class 0.000 description 4
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- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
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- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 239000004570 mortar (masonry) Substances 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 238000010908 decantation Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- XFRVVPUIAFSTFO-UHFFFAOYSA-N 1-Tridecanol Chemical compound CCCCCCCCCCCCCO XFRVVPUIAFSTFO-UHFFFAOYSA-N 0.000 description 2
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 239000006230 acetylene black Substances 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 229910000410 antimony oxide Inorganic materials 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- DIKBFYAXUHHXCS-UHFFFAOYSA-N bromoform Chemical compound BrC(Br)Br DIKBFYAXUHHXCS-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
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- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- ZZAGLMPBQOKGGT-UHFFFAOYSA-N [4-[4-(4-prop-2-enoyloxybutoxy)benzoyl]oxyphenyl] 4-(4-prop-2-enoyloxybutoxy)benzoate Chemical class C1=CC(OCCCCOC(=O)C=C)=CC=C1C(=O)OC(C=C1)=CC=C1OC(=O)C1=CC=C(OCCCCOC(=O)C=C)C=C1 ZZAGLMPBQOKGGT-UHFFFAOYSA-N 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 125000004390 alkyl sulfonyl group Chemical group 0.000 description 1
- 125000004414 alkyl thio group Chemical group 0.000 description 1
- 125000005336 allyloxy group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 235000019395 ammonium persulphate Nutrition 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- MVIOINXPSFUJEN-UHFFFAOYSA-N benzenesulfonic acid;hydrate Chemical compound O.OS(=O)(=O)C1=CC=CC=C1 MVIOINXPSFUJEN-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 229950005228 bromoform Drugs 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229960000846 camphor Drugs 0.000 description 1
- 229930008380 camphor Natural products 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 229940114081 cinnamate Drugs 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 125000000332 coumarinyl group Chemical class O1C(=O)C(=CC2=CC=CC=C12)* 0.000 description 1
- 150000001924 cycloalkanes Chemical class 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical compound [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical compound CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 229960000735 docosanol Drugs 0.000 description 1
- KWKXNDCHNDYVRT-UHFFFAOYSA-N dodecylbenzene Chemical compound CCCCCCCCCCCCC1=CC=CC=C1 KWKXNDCHNDYVRT-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- CJMZLCRLBNZJQR-UHFFFAOYSA-N ethyl 2-amino-4-(4-fluorophenyl)thiophene-3-carboxylate Chemical compound CCOC(=O)C1=C(N)SC=C1C1=CC=C(F)C=C1 CJMZLCRLBNZJQR-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- SSILHZFTFWOUJR-UHFFFAOYSA-N hexadecane-1-sulfonic acid Chemical compound CCCCCCCCCCCCCCCCS(O)(=O)=O SSILHZFTFWOUJR-UHFFFAOYSA-N 0.000 description 1
- FYAQQULBLMNGAH-UHFFFAOYSA-N hexane-1-sulfonic acid Chemical compound CCCCCCS(O)(=O)=O FYAQQULBLMNGAH-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- VUQUOGPMUUJORT-UHFFFAOYSA-N methyl 4-methylbenzenesulfonate Chemical compound COS(=O)(=O)C1=CC=C(C)C=C1 VUQUOGPMUUJORT-UHFFFAOYSA-N 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- KDQQMEAEIKFPLQ-UHFFFAOYSA-N n-(1-cyanocyclohexyl)-2-fluorobenzamide Chemical compound FC1=CC=CC=C1C(=O)NC1(C#N)CCCCC1 KDQQMEAEIKFPLQ-UHFFFAOYSA-N 0.000 description 1
- WUOSYUHCXLQPQJ-UHFFFAOYSA-N n-(3-chlorophenyl)-n-methylacetamide Chemical compound CC(=O)N(C)C1=CC=CC(Cl)=C1 WUOSYUHCXLQPQJ-UHFFFAOYSA-N 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- 150000002828 nitro derivatives Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 150000002832 nitroso derivatives Chemical class 0.000 description 1
- ZCYXXKJEDCHMGH-UHFFFAOYSA-N nonane Chemical compound CCCC[CH]CCCC ZCYXXKJEDCHMGH-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- BKIMMITUMNQMOS-UHFFFAOYSA-N normal nonane Natural products CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- WLGDAKIJYPIYLR-UHFFFAOYSA-N octane-1-sulfonic acid Chemical compound CCCCCCCCS(O)(=O)=O WLGDAKIJYPIYLR-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229950011087 perflunafene Drugs 0.000 description 1
- UWEYRJFJVCLAGH-IJWZVTFUSA-N perfluorodecalin Chemical compound FC1(F)C(F)(F)C(F)(F)C(F)(F)[C@@]2(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)[C@@]21F UWEYRJFJVCLAGH-IJWZVTFUSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- AZIQALWHRUQPHV-UHFFFAOYSA-N prop-2-eneperoxoic acid Chemical compound OOC(=O)C=C AZIQALWHRUQPHV-UHFFFAOYSA-N 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- UFTFJSFQGQCHQW-UHFFFAOYSA-N triformin Chemical compound O=COCC(OC=O)COC=O UFTFJSFQGQCHQW-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- NLVXSWCKKBEXTG-UHFFFAOYSA-N vinylsulfonic acid Chemical compound OS(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-N 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００ｌ】[000l]
【産業上の利用分野】本発明は、導電性感圧粘着剤組成
物及びこれを用いた導電性感圧粘着テープに関する。TECHNICAL FIELD The present invention relates to a conductive pressure-sensitive adhesive composition and a conductive pressure-sensitive adhesive tape using the same.
【０００２】[0002]
【従来の技術】従来の感圧粘着テープは、半導体の表面
保護テープや半導体の自動実装用チップキャリアテープ
のカバーテープ等に使用すると、引き剥がし時に静電気
が発生し、半導体が静電破壊される場合があり、この静
電破壊を防止するために、カーボンフィラを添加する方
法、酸化アンチモンをドープした酸化すず等の透明性フ
ィラを添加する方法、静電気発生防止剤として界面活性
剤を添加する方法等があった。2. Description of the Related Art When a conventional pressure-sensitive adhesive tape is used as a surface protection tape for a semiconductor or a cover tape for a semiconductor chip carrier tape for automatic mounting, static electricity is generated at the time of peeling and the semiconductor is electrostatically destroyed. In some cases, in order to prevent this electrostatic breakdown, a method of adding a carbon filler, a method of adding a transparent filler such as tin oxide doped with antimony oxide, a method of adding a surfactant as an antistatic agent. Etc.
【０００３】しかし、カーボンフィラを添加する方法で
は、半導体の静電破壊防止に必要な１０4〜１０8Ω／□
程度の表面抵抗を得るために、感圧粘着剤組成物に多量
にカーボンを添加する必要があり、そのため、作業環境
の汚染、感圧粘着性能の低下、テープの透明性がない等
の問題点があった。また、酸化アンチモンをドープした
酸化すず等の透明性フィラを用いる方法では、テープの
透明性、作業環境の汚染性等は改善されるが、感圧粘着
剤組成物に多量に透明性フィラを添加するため、感圧粘
着性能が低下する等の問題点があった。また、静電気発
生防止剤として界面活性剤を添加する方法では、１０10
Ω／□以下の表面抵抗を得ることが困難であり、また、
湿度が高い場合においては、静電気発生防止性能を有す
るが、冬季の湿度が低い場合においては、静電気発生防
止性能が低下するという問題点があった。However, in the method of adding carbon filler, 10 4 to 10 8 Ω / □ required for preventing electrostatic breakdown of semiconductors.
In order to obtain a certain degree of surface resistance, it is necessary to add a large amount of carbon to the pressure-sensitive adhesive composition, which causes problems such as contamination of the work environment, deterioration of pressure-sensitive adhesive performance, and lack of transparency of the tape. was there. Further, in the method using a transparent filler such as tin oxide doped with antimony oxide, the transparency of the tape, the contamination of the working environment, etc. are improved, but a large amount of transparent filler is added to the pressure-sensitive adhesive composition. Therefore, there is a problem that the pressure-sensitive adhesive performance is deteriorated. In addition, in the method of adding a surfactant as an antistatic agent, 10 10
It is difficult to obtain a surface resistance of Ω / □ or less, and
When the humidity is high, the antistatic property is provided, but when the humidity in winter is low, the antistatic property is deteriorated.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、前記する従
来の問題点を解決し、カーボン等のフィラを使用しない
方法で感圧粘着剤組成物に静電気発生防止性能を与える
ことにより、作業環境を汚染せず、感圧粘着性能の低下
も引き起こさず、透明性があり、かつ静電気発生防止性
能を有する導電性感圧粘着剤組成物及びこれを用いた導
電性感圧粘着テープを提供するものである。DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned conventional problems and provides a pressure-sensitive adhesive composition with antistatic properties by a method that does not use a filler such as carbon, thereby providing a work environment. The present invention provides a conductive pressure-sensitive adhesive composition which is transparent and does not cause deterioration in pressure-sensitive adhesive performance, is transparent, and has static electricity generation prevention performance, and a conductive pressure-sensitive adhesive tape using the same. .
【０００５】[0005]
【課題を解決するための手段】本発明は、プロトン酸、
非極性又は極性が低い有機溶剤及びポリアニリンを含む
導電性ポリアニリン組成物と感圧粘着剤組成物とからな
る導電性感圧粘着剤組成物及びこれを用いた導電性感圧
粘着テープに関する。The present invention provides a protonic acid,
The present invention relates to a conductive pressure-sensitive adhesive composition comprising a conductive polyaniline composition containing a non-polar or low-polarity organic solvent and polyaniline and a pressure-sensitive adhesive composition, and a conductive pressure-sensitive adhesive tape using the same.
【０００６】本発明におけるプロトン酸とは、水素をカ
ウンターイオンとする酸であり、ドーパントとして機能
する。ここで、ドーパントとは、塩基性で絶縁性のポリ
アニリンに付加して生じた複合体に、導電性を与える効
果を持つ化合物をいう。本発明におけるプロトン酸は、
ポリアニリンに導電性を与えると同時に、ポリアニリン
を無極性又は極性が低い有機溶剤に可溶にする作用を有
する。また、このプロトン酸は、導電性ポリアニリン組
成物中でポリアニリンと複合体を形成している。以後、
ドーパントと複合体を形成していないポリアニリン及び
ポリアニリンとドーパントの複合体中のポリアニリンだ
けを指すときは、「ポリアニリン」と称する。The protonic acid in the present invention is an acid having hydrogen as a counter ion and functions as a dopant. Here, the dopant refers to a compound having an effect of giving conductivity to the complex formed by adding to the basic and insulating polyaniline. The protonic acid in the present invention is
At the same time as giving conductivity to the polyaniline, it has an action of making the polyaniline soluble in a nonpolar or low polar organic solvent. Also, this protonic acid forms a complex with polyaniline in the conductive polyaniline composition. After that,
When referring only to polyaniline that is not complexed to the dopant and to polyaniline in the complex of polyaniline and the dopant, the term "polyaniline" is used.
【０００７】本発明におけるプロトン酸としては、特に
制限なく公知のものを使用でき、例えば、ジフェニル水
素化リン酸、ビス（２−エチルヘキシル）水素化リン
酸、スルホン酸誘導体等が挙げられ、非極性又は極性が
低い有機溶剤への溶解性やポリアニリンへの導電性付与
性の点から、スルホン酸誘導体が好ましい。As the protonic acid in the present invention, known ones can be used without particular limitation, and examples thereof include diphenylhydrogenated phosphoric acid, bis (2-ethylhexyl) hydrogenated phosphoric acid, sulfonic acid derivatives and the like, which are nonpolar. Alternatively, a sulfonic acid derivative is preferable from the viewpoint of solubility in an organic solvent having low polarity and conductivity imparting property to polyaniline.
【０００８】スルホン酸誘導体としては、例えば、ｎ−
ヘキサンスルホン酸、ｎ−オクチルスルホン酸、ドデシ
ルスルホン酸、セチルスルホン酸、４−ドデシルベンゼ
ンスルホン酸、カンファースルホン酸、ポリ（ビニル）
スルホン酸、ジノニルナフタレンスルホン酸、ｐ−クロ
ロベンゼンスルホン酸、ハイドロキシベンゼンスルホン
酸、トリクロロベンゼンスルホン酸、４−ニトロトルエ
ン−２−スルホン酸、１−オクタンスルホン酸、スルホ
ン化ポリスチレン、スルホン化ポリエチレン、４−オク
チルベンゼンスルホン酸、２−メチル−５−イソプロピ
ルベンゼンスルホン酸が挙げられ、これらの内、ドデシ
ルベンゼンスルホン酸とカンファースルホン酸が好まし
い。As the sulfonic acid derivative, for example, n-
Hexanesulfonic acid, n-octylsulfonic acid, dodecylsulfonic acid, cetylsulfonic acid, 4-dodecylbenzenesulfonic acid, camphorsulfonic acid, poly (vinyl)
Sulfonic acid, dinonylnaphthalenesulfonic acid, p-chlorobenzenesulfonic acid, hydroxybenzenesulfonic acid, trichlorobenzenesulfonic acid, 4-nitrotoluene-2-sulfonic acid, 1-octanesulfonic acid, sulfonated polystyrene, sulfonated polyethylene, 4- Examples thereof include octylbenzenesulfonic acid and 2-methyl-5-isopropylbenzenesulfonic acid, and of these, dodecylbenzenesulfonic acid and camphorsulfonic acid are preferable.
【０００９】本発明におけるプロトン酸のポリアニリン
に対する添加量は、ポリアニリン中のアニリンの繰り返
し数１に対して０．５〜２．０であることが好ましく、
０．８から１．５であることがより好ましい。この添加
量が、０．５未満であると、非極性又は極性が低い有機
溶剤への溶解性が劣る傾向があり、２．０を超えると導
電性ポリアニリン組成物の酸性が強くなりすぎる傾向が
ある。なお、カンファースルホン酸をドーパントとして
ポリアニリンをｍ−クレゾールに溶解する場合において
は、実用的な溶解性が得られる点から、ポリアニリン中
のアニリン繰り返し数１に対してカンファースルホン酸
の添加量が０．５とすることが好ましい。In the present invention, the addition amount of the protonic acid to polyaniline is preferably 0.5 to 2.0 with respect to the repeating number of 1 of aniline in polyaniline,
More preferably, it is 0.8 to 1.5. If the amount added is less than 0.5, the solubility in non-polar or low-polarity organic solvents tends to be poor, and if it exceeds 2.0, the acidity of the conductive polyaniline composition tends to become too strong. is there. When polyaniline is dissolved in m-cresol with camphorsulfonic acid as a dopant, practical solubility can be obtained, so that the addition amount of camphorsulfonic acid is 0. It is preferably 5.
【００１０】本発明における非極性又は極性が低い有機
溶媒の誘電率は、２２以下であることが好ましい。この
誘電率が、２２を超えると、溶媒の持つ極性のために、
導電性ポリアニリン組成物から製膜した皮膜の導電率が
低下する傾向がある。The non-polar or low-polarity organic solvent in the present invention preferably has a dielectric constant of 22 or less. When this dielectric constant exceeds 22, the polarity of the solvent causes
The conductivity of the film formed from the conductive polyaniline composition tends to decrease.
【００１１】本発明において使用される非極性又は極性
が低い有機溶媒としては、例えば、置換もしくは非置換
の芳香族炭化水素、アルカン、アルケン、鉱油、ハロゲ
ン化アルカン、脂肪族アルコール、アルキルエーテル、
ケトン、ハロゲン化芳香族、シクロアルカン、シクロア
ルケン、ヘテロ環化合物等が挙げられ、これらの有機溶
媒のなかでも好ましく用いられる有機溶媒としては、例
えば、ベンゼン、トルエン、ｐ−キシレン、ｍ−キシレ
ン、ナフタレン、エチルベンゼン、スチレン、アニリ
ン、ペンタン、ヘキサン、ヘプタン、オクタン、ノナ
ン、デカン、デカハイドロナフタレン、クロロホルム、
ブロモホルム、ジクロロメタン、モノクロロメタン、ク
ロロベンゼン、ｏ−ジクロロベンゼン、ｍ−ジクロロベ
ンゼン、ｐ−ジクロロベンゼン、ｍ−クレゾール、クレ
ゾールの異性物混合体、ベンジルアルコール、２−ブタ
ノール、１−ブタノール、ヘキサノール、ペンタノー
ル、デカノール、２−メチル−１−プロパノール、ヘキ
サノン、ブタノン、ペンタノン、モルフォリン、パーフ
ルオロデカリン、パーフルオロベンゼン等が挙げられる
が、これらに限定されるものではない。また、これらの
有機溶媒は、単独で又は２種類以上を組み合わせて使用
される。また、これらの有機溶媒のなかでも、ポリアニ
リンとドーパントの複合体の溶解性の点から特に好まし
いものとしては、キシレン、トルエン、ｍ−クレゾー
ル、クレゾールの異性物混合体等が挙げられる。The non-polar or low-polarity organic solvent used in the present invention includes, for example, substituted or unsubstituted aromatic hydrocarbons, alkanes, alkenes, mineral oils, halogenated alkanes, aliphatic alcohols, alkyl ethers,
Examples include ketones, halogenated aromatics, cycloalkanes, cycloalkenes, heterocyclic compounds, and the like. Among these organic solvents, organic solvents preferably used include, for example, benzene, toluene, p-xylene, m-xylene, Naphthalene, ethylbenzene, styrene, aniline, pentane, hexane, heptane, octane, nonane, decane, decahydronaphthalene, chloroform,
Bromoform, dichloromethane, monochloromethane, chlorobenzene, o-dichlorobenzene, m-dichlorobenzene, p-dichlorobenzene, m-cresol, isomer mixture of cresol, benzyl alcohol, 2-butanol, 1-butanol, hexanol, pentanol. , Decanol, 2-methyl-1-propanol, hexanone, butanone, pentanone, morpholine, perfluorodecalin, perfluorobenzene and the like, but not limited thereto. Moreover, these organic solvents are used individually or in combination of 2 or more types. Among these organic solvents, xylene, toluene, m-cresol, isomer mixture of cresol and the like are particularly preferable from the viewpoint of solubility of the complex of polyaniline and the dopant.
【００１２】本発明におけるポリアニリンの重量平均分
子量は、１０，０００〜３００，０００とすることが好
ましく、５０，０００〜２００，０００とすることがよ
り好ましい。この重量平均分子量が、１０，０００未満
であると、フィルム形成性が劣る傾向があり、３００，
０００を超えると、非極性又は極性が低い有機溶剤への
溶解性が低下する傾向がある。The weight average molecular weight of the polyaniline in the present invention is preferably 10,000 to 300,000, more preferably 50,000 to 200,000. When the weight average molecular weight is less than 10,000, the film forming property tends to be poor, and
If it exceeds 000, the solubility in a non-polar or low-polarity organic solvent tends to decrease.
【００１３】本発明におけるポリアニリンの製造に用い
る重合用のアニリンモノマーとしては、一般式（Ｉ）The aniline monomer for polymerization used in the production of polyaniline in the present invention is represented by the general formula (I)
【化１】 （式中、Ｒは各々独立にアルキル基、アルケニル基、ア
ルコキシ基、シクロアルキル基、シクロアルケニル基、
アルカノイル基、アルキルチオ基、アリルチオアルキル
基、アリロキシ基、アルキルアリル基、アリルアルキル
基、アルコキシアルキル基、アルキルスルホニル基、ア
リル基、アリルチオ基又はアルコキシカルボニル基を示
し、ｍは１〜５の整数であり、ｎは０〜４の整数であ
り、ｍ＋ｎは５である）で表される化合物が挙げられ、
これらは、非極性又は極性が低い有機溶剤への溶解性等
の点で好ましく、なかでも置換基を有さないアニリンモ
ノマーが、安価等の点でより好ましい。Embedded image (In the formula, each R independently represents an alkyl group, an alkenyl group, an alkoxy group, a cycloalkyl group, a cycloalkenyl group,
An alkanoyl group, an alkylthio group, an allylthioalkyl group, an allyloxy group, an alkylallyl group, an allylalkyl group, an alkoxyalkyl group, an alkylsulfonyl group, an allyl group, an allylthio group or an alkoxycarbonyl group, and m is an integer of 1 to 5 And n is an integer of 0 to 4 and m + n is 5.),
These are preferable in terms of solubility in nonpolar or low-polarity organic solvents, and among them, aniline monomers having no substituent are more preferable in terms of low cost.
【００１４】本発明におけるポリアニリンの製造法とし
ては、電解酸化重合法、化学酸化重合法等公知の方法が
挙げられるが、工業的な観点からは、化学酸化重合法で
製造することが好ましい。化学酸化重合後のポリアニリ
ンは、粉末で得られ、この粉末を塩基で脱ドープしてか
ら乾燥し、塩基性ポリアニリンを得ることができる。こ
の場合、後の乾燥行程で塩基を完全に取り除くことがで
きるように、アンモニア、有機アミン等の揮発性の塩基
を用いることが好ましい。また、脱ドープしたポリアニ
リンの乾燥温度は、有機溶剤への溶解性、酸化による劣
化防止等の点から、真空中で５０℃以下で行うのが好ま
しい。As the method for producing polyaniline in the present invention, known methods such as electrolytic oxidative polymerization method and chemical oxidative polymerization method can be mentioned. From the industrial point of view, the chemical oxidative polymerization method is preferred. The polyaniline after the chemical oxidative polymerization is obtained as a powder, and the powder can be dedoped with a base and then dried to obtain a basic polyaniline. In this case, it is preferable to use a volatile base such as ammonia or an organic amine so that the base can be completely removed in the subsequent drying process. The drying temperature of the dedoped polyaniline is preferably 50 ° C. or lower in vacuum from the viewpoint of solubility in an organic solvent and prevention of deterioration due to oxidation.
【００１５】本発明における導電性ポリアニリン組成物
は、前記塩基性ポリアニリン粉末とプロトン酸であるド
ーパントとを混合し、非極性又は極性が低い有機溶剤に
溶解して得ることが好ましい。ポリアニリンとドーパン
トは、導電性ポリアニリン組成物中で複合体が形成され
ることから、この導電性ポリアニリン組成物により作成
された皮膜は、１０S/cm以上の高い導電率を示す傾向が
ある。The conductive polyaniline composition in the present invention is preferably obtained by mixing the basic polyaniline powder with a dopant which is a protonic acid and dissolving it in an organic solvent having a nonpolar or low polarity. Since the polyaniline and the dopant form a complex in the conductive polyaniline composition, the film formed by this conductive polyaniline composition tends to show a high conductivity of 10 S / cm or more.
【００１６】前記導電性ポリアニリン組成物の製造法
は、特表平６−５０８３９０号公報等に記載されてい
る。The method for producing the conductive polyaniline composition is described in Japanese Patent Publication No. 6-508390.
【００１７】本発明におけるポリアニリンの含有量は、
導電性ポリアニリン組成物中に、２０重量％以下とする
ことが好ましく、１２重量％以下とすることがより好ま
しい。このポリアニリンの含有量が、２０重量％を超え
ると、未溶解物が多くなり過ぎる傾向がある。The content of polyaniline in the present invention is
It is preferably 20% by weight or less, more preferably 12% by weight or less in the conductive polyaniline composition. When the content of this polyaniline exceeds 20% by weight, the amount of undissolved substances tends to increase too much.
【００１８】本発明における導電性ポリアニリン組成物
には、ポリアニリンとプロトン酸との複合体の溶解度を
向上させるために、界面活性剤を添加することができ
る。界面活性剤としては、特に制限はないが、例えば、
４−ヘキシルエチルフェノール、３−ペンタデシルフェ
ノール、ノニルフェノール、４−ドデシルレゾルシノー
ル、４−（tert−オクチル）フェノール、２、６−ジ−
tert−ブチル−４メチルフェノール、３、４−ジメチル
フェノール、２、６−ジメチルフェノール、メチルパラ
トルエンスルホネート、エチルパラトルエンスルホネー
ト、ｎ−ヘキシルパラトルエンスルホネート、ｎ−ヘキ
シルパラトルエンスルホネート、エチルドデシルベンゼ
ンスルホン酸、イソプロピルアミンアルキルアリルスル
ホネート、１−ドデカノール、１−トリデカノール、１
−ドコサノール、下記一般式（II）A surfactant may be added to the conductive polyaniline composition of the present invention in order to improve the solubility of the polyaniline / protonic acid complex. The surfactant is not particularly limited, for example,
4-hexylethylphenol, 3-pentadecylphenol, nonylphenol, 4-dodecylresorcinol, 4- (tert-octyl) phenol, 2,6-di-
tert-butyl-4 methylphenol, 3,4-dimethylphenol, 2,6-dimethylphenol, methylparatoluenesulfonate, ethylparatoluenesulfonate, n-hexylparatoluenesulfonate, n-hexylparatoluenesulfonate, ethyldodecylbenzenesulfone Acid, isopropylamine alkyl allyl sulfonate, 1-dodecanol, 1-tridecanol, 1
-Docosanol, the following general formula (II)
【化２】 （式中、ｘは６〜１４であり、ｙは１〜３である）で表
されるエトキシレイト等挙げられる。Embedded image (In the formula, x is 6 to 14 and y is 1 to 3) and the like.
【００１９】本発明における感圧粘着剤組成物の主成分
は、熱可塑性高分子や合成ゴムであり、必要に応じて粘
着付与剤（タッキファイヤ−）、架橋剤、充填材、可塑
剤等を含むことができる。The main component of the pressure-sensitive adhesive composition in the present invention is a thermoplastic polymer or synthetic rubber, and if necessary, a tackifier (tackifier), a crosslinking agent, a filler, a plasticizer, etc. Can be included.
【００２０】本発明における感圧粘着剤組成物中の熱可
塑性高分子や合成ゴムとしては、とくに制限は無く、例
えば、酢酸ビニル系樹脂、ポリビニルアルコール系樹
脂、ポリビニルアセタール系樹脂、塩化ビニル系樹脂、
アクリル系樹脂、メタクリル系樹脂、ポリアミド系樹
脂、ポリエチレン系樹脂、セルロース系樹脂、ポリイソ
ブチレン、ポリビニルエーテル、クロロプレン系ゴム、
ネオプレン系ゴム、ニトリル系ゴム、スチレン系ゴム、
ポリサルファイド系ゴム、ブチル系ゴム、シリコーン系
ゴム等が挙げられる。The thermoplastic polymer or synthetic rubber in the pressure-sensitive adhesive composition of the present invention is not particularly limited, and examples thereof include vinyl acetate resin, polyvinyl alcohol resin, polyvinyl acetal resin, vinyl chloride resin. ,
Acrylic resin, methacrylic resin, polyamide resin, polyethylene resin, cellulose resin, polyisobutylene, polyvinyl ether, chloroprene rubber,
Neoprene rubber, nitrile rubber, styrene rubber,
Examples thereof include polysulfide rubber, butyl rubber, silicone rubber and the like.
【００２１】本発明における感圧粘着剤組成物中に必要
に応じて使用される粘着付与剤（タッキファイヤ−）と
しては、特に制限は無く、例えば、ロジン系樹脂、テル
ペン系樹脂、炭素数が５〜９の石油系樹脂、キシレン系
樹脂、フェノール系樹脂、クマロン系樹脂等が挙げられ
る。There are no particular restrictions on the tackifier (tackifier) used in the pressure-sensitive adhesive composition of the present invention as required, and examples thereof include rosin-based resins, terpene-based resins, and carbon numbers. 5 to 9 petroleum-based resins, xylene-based resins, phenol-based resins, coumarone-based resins and the like.
【００２２】本発明における感圧粘着剤組成物中に必要
に応じて使用される架橋剤としては、特に制限は無く、
例えば、過酸化物、多官能性のイソシアネート、エポキ
シ化合物、メラミン系化合物、金属系化合物等で代表さ
れる熱で架橋する架橋剤や紫外線や電子線で架橋する成
分などが挙げられる。前記紫外線や電子線で架橋する成
分としては、不飽和オリゴマ成分や不飽和モノマ成分、
光硬化開始剤、増感剤等が挙げられる。さらに、必要に
応じて、感圧粘着剤組成物の老化防止剤としての作用も
持つ、禁止剤等を含んでもより。The crosslinking agent used in the pressure-sensitive adhesive composition of the present invention as necessary is not particularly limited,
For example, a crosslinking agent that is crosslinkable by heat, represented by peroxides, polyfunctional isocyanates, epoxy compounds, melamine-based compounds, metal-based compounds and the like, and a component that is crosslinked by ultraviolet rays or electron beams, etc. may be mentioned. As the component which is crosslinked by the ultraviolet ray or the electron beam, an unsaturated oligomer component or an unsaturated monomer component,
Examples include a photo-curing initiator and a sensitizer. Further, if necessary, it may further contain an inhibitor or the like, which also acts as an anti-aging agent for the pressure-sensitive adhesive composition.
【００２３】紫外線や電子線で硬化する成分中の不飽和
オリゴマ成分としては、特に制限は無く、例えば、不飽
和ポリアクリレート、不飽和ポリエステル、不飽和ウレ
タン化合物、不飽和エポキシオリゴマ、ポリビニルシン
ナメート、ポリエチレングリコールやポリプロピレング
リコールのジアクリル酸エステル、ポリエチレングリコ
ールやポリプロピレングリコールのジメタクリル酸エス
テル、ＳＭＡレジンのヒドロキシアクリレートとのエス
テル等が挙げられる。紫外線や電子線で硬化する成分中
の橋かけ剤やモノマ成分としては、特に制限は無く、例
えば、アルキッド樹脂アクリレート、エポキシアクリレ
ート、ウレタンアクリレート、モノ、ジ又はトリアクリ
ル酸エステル（ポリエチレングリコール、ポリプロピレ
ングリコール、トリメチロールプロパン等）、モノ、ジ
又はトリメタクリル酸エステル（ポリエチレングリコー
ル、ポリプロピレングリコール、トリメチロールプロパ
ン等）などが挙げられる。The unsaturated oligomer component in the component curable by ultraviolet rays or electron beams is not particularly limited, and examples thereof include unsaturated polyacrylate, unsaturated polyester, unsaturated urethane compound, unsaturated epoxy oligomer, polyvinyl cinnamate, Examples thereof include diacrylic acid esters of polyethylene glycol and polypropylene glycol, dimethacrylic acid esters of polyethylene glycol and polypropylene glycol, and esters of SMA resin with hydroxyacrylate. The crosslinking agent or monomer component in the component curable by ultraviolet rays or electron beams is not particularly limited, and examples thereof include alkyd resin acrylates, epoxy acrylates, urethane acrylates, mono-, di- or triacrylic acid esters (polyethylene glycol, polypropylene glycol, triglyceride). Methylol propane etc.), mono-, di- or trimethacrylic acid esters (polyethylene glycol, polypropylene glycol, trimethylol propane etc.) and the like.
【００２４】紫外線や電子線で硬化する成分中の、光又
は電子線硬化開始剤としては、特に制限は無く、例え
ば、各種光ルイス酸発生剤、過酸化ベンゾイル等の過酸
化物、ベンゾイン、ベンジル、ベンゾフェノン、アセト
フェノン、ミヒラーズケトン、ビスアジド化合物、モル
ホリノプロパン系化合物、重クロム酸塩、ジアゾニウム
塩、チオキサントン系化合物、クマリン系化合物、チタ
ノセン等が挙げられる。また、増感剤としては、各種ア
ミン類、色素等が挙げられる。また、禁止剤としては、
それ自身が安定なラジカルである化合物や重合系に存在
するラジカルと容易に反応して安定なラジカルに変わる
ような化合物が適しており、例えば、キノン類、ハイド
ロキノン類、ニトロ化合物、ニトロソ化合物、アミノ化
合物、ポリヒドロキシ化合物等が挙げられる。There are no particular restrictions on the light or electron beam curing initiator in the component that is cured by ultraviolet rays or electron beams, and examples thereof include various photo Lewis acid generators, peroxides such as benzoyl peroxide, benzoin and benzyl. , Benzophenone, acetophenone, Michler's ketone, bisazide compounds, morpholinopropane compounds, dichromates, diazonium salts, thioxanthone compounds, coumarin compounds, titanocene and the like. Examples of the sensitizer include various amines and dyes. Also, as the inhibitor,
Compounds that are stable radicals themselves or compounds that readily react with radicals present in the polymerization system to convert to stable radicals are suitable, such as quinones, hydroquinones, nitro compounds, nitroso compounds, amino Examples thereof include compounds and polyhydroxy compounds.
【００２５】本発明における感圧粘着剤組成物中の充填
剤としては、特に制限は無く、例えば、タルク、シリ
カ、アルミナ、ガラスフリット、チタニア、炭酸カルシ
ウム、カオリン、ガラスクロス等が挙げられる。The filler in the pressure-sensitive adhesive composition of the present invention is not particularly limited, and examples thereof include talc, silica, alumina, glass frit, titania, calcium carbonate, kaolin, glass cloth and the like.
【００２６】本発明における感圧粘着剤組成物中の可塑
剤としては、特に制限は無く、例えば、フタル酸ジエス
テル類やブタノールのジエステル、脂肪族二塩基酸エス
テル、リン酸エステル、エポキシ脂肪酸エステル、ショ
ウノウ等が挙げられる。また、これらの可塑剤は、同時
に軟化剤としての効果も示す。The plasticizer in the pressure-sensitive adhesive composition of the present invention is not particularly limited, and examples thereof include phthalic acid diesters and butanol diesters, aliphatic dibasic acid esters, phosphoric acid esters, epoxy fatty acid esters, Examples include camphor. In addition, these plasticizers also exhibit an effect as a softening agent.
【００２７】本発明における導電性感圧粘着剤組成物中
のポリアニリン複合体の含有量は、０．０５〜１０重量
％の範囲とすることが好ましく、０．１〜１０重量％の
範囲とすることがより好ましく、０．５〜７重量％の範
囲とすることが特に好ましい。このポリアニリン複合体
の含有量が、０．０５重量％未満であると、感圧粘着剤
組成物の表面抵抗が高くなり、静電気発生防止効果が低
下する傾向があり、１０重量％を超えると、粘着性が低
下する傾向にある。The content of the polyaniline composite in the conductive pressure-sensitive adhesive composition of the present invention is preferably in the range of 0.05 to 10% by weight, and preferably in the range of 0.1 to 10% by weight. Is more preferable, and the range of 0.5 to 7% by weight is particularly preferable. If the content of this polyaniline complex is less than 0.05% by weight, the surface resistance of the pressure-sensitive adhesive composition tends to be high, and the effect of preventing static electricity generation tends to decrease, and if it exceeds 10% by weight, The tackiness tends to decrease.
【００２８】本発明における導電性感圧粘着剤組成物の
表面抵抗は、１０3〜１０12Ω／□とすることが好まし
く、１０4〜１０9Ω／□とすることがより好ましく、１
０4〜１０7Ω／□とすることが特に好ましい。この表面
抵抗が、１０3Ω／□未満であると、人体等の帯電体か
らの静電気の放出の影響を受け易くなる傾向があり、１
０12Ω／□を超えると、静電気発生防止効果が低下する
傾向がある。The surface resistance of the conductive pressure-sensitive adhesive composition of the present invention is preferably 10 3 to 10 12 Ω / □, more preferably 10 4 to 10 9 Ω / □, and 1
It is particularly preferable that it is from 0 4 to 10 7 Ω / □. If the surface resistance is less than 10 3 Ω / □, it tends to be easily affected by the discharge of static electricity from a charged body such as a human body.
If it exceeds 0 12 Ω / □, the effect of preventing static electricity tends to decrease.
【００２９】本発明における導電性ポリアニリン組成物
と感圧粘着剤組成物の混合方法は、特に制限は無く、導
電性ポリアニリン組成物と感圧粘着剤組成物の有機溶剤
溶液を混合、加熱して溶剤を除去する方法、導電性ポリ
アニリン組成物に感圧粘着剤組成物の固形分を溶解、加
熱して溶剤を除去する方法等が挙げられる。The method for mixing the conductive polyaniline composition and the pressure-sensitive adhesive composition in the present invention is not particularly limited, and the conductive polyaniline composition and the pressure-sensitive adhesive composition are mixed in an organic solvent solution and heated. Examples thereof include a method of removing the solvent and a method of dissolving the solid content of the pressure-sensitive adhesive composition in the conductive polyaniline composition and heating to remove the solvent.
【００３０】本発明における導電性感圧粘着テープの支
持材料としては、特に制限は無く、例えば、ポリオレフ
ィン（ポリエチレン、ポリプロピレン等）、ポリエステ
ル（ポリエチレンテレフタレート等）、ナイロン、ポリ
フッ化エチレン、塩化ビニル、セロファン、アクリル、
ポリカーボネート、ポリビニルブチラール、ポリ塩化ビ
ニリデン、ポリイミド、ポリアミドイミド、ポリスチレ
ン、ポリフェニレンスルフィド、ポリテトラフルオロエ
チレン、紙、布などがある。The support material for the conductive pressure-sensitive adhesive tape of the present invention is not particularly limited, and examples thereof include polyolefin (polyethylene, polypropylene, etc.), polyester (polyethylene terephthalate, etc.), nylon, polyfluoroethylene, vinyl chloride, cellophane, acrylic,
Polycarbonate, polyvinyl butyral, polyvinylidene chloride, polyimide, polyamideimide, polystyrene, polyphenylene sulfide, polytetrafluoroethylene, paper, cloth, and the like.
【００３１】本発明における支持材料の厚さは、粘着剤
の塗布等の作業性の点で、５〜３００μｍとすることが
好ましく、１５〜２００μｍとすることがより好まし
く、２０〜１５０μｍとすることが特に好ましい。この
支持材料の厚さが、５μｍ未満であると、粘着剤塗工時
の支持材料の搬送性が低下する傾向があり、３００μｍ
を超えると、粘着剤塗工時の支持材料の搬送性が低下す
る傾向がある。The thickness of the support material in the present invention is preferably 5 to 300 μm, more preferably 15 to 200 μm, and more preferably 20 to 150 μm in view of workability such as application of an adhesive. Is particularly preferable. If the thickness of this support material is less than 5 μm, the transportability of the support material at the time of coating the pressure-sensitive adhesive tends to decrease, and it is 300 μm.
When it exceeds, the transportability of the support material at the time of coating the pressure-sensitive adhesive tends to decrease.
【００３２】本発明における支持材料は、テープ同士の
粘着を防ぐために、背面処理をすることができる。背面
処理剤としては、特に制限は無く、例えば、長鎖アルキ
ルアクリレート共重合体、長鎖アルキルビニルエステル
共重合体、長鎖アルキルビニルエーテル共重合体、長鎖
アルキルアクリルアマイド共重合体等の長鎖アルキル基
を含有するもの、シリコーン（ポリシロキサン）系、フ
ッ素樹脂系等が挙げられる。また、本発明における支持
材料は、本発明の導電性感圧粘着剤組成物との密着性を
向上するために、コロナ処理やプライマ処理をすること
ができる。The support material in the present invention may be back-treated in order to prevent the tapes from sticking to each other. The back treatment agent is not particularly limited, and examples thereof include long-chain alkyl acrylate copolymers, long-chain alkyl vinyl ester copolymers, long-chain alkyl vinyl ether copolymers, long-chain alkyl acrylate amide copolymers, and the like. Examples thereof include those containing an alkyl group, silicone (polysiloxane) type, fluororesin type and the like. Further, the support material in the present invention can be subjected to corona treatment or primer treatment in order to improve the adhesion with the conductive pressure-sensitive adhesive composition of the present invention.
【００３３】また、本発明における支持材料は、本発明
における導電性ポリアニリン組成物で表面処理されても
よく、この場合、処理層の厚みは、支持材料の表面抵抗
が１０3〜１０12Ω／□となるように形成するのが好ま
しい。このように、支持材料を導電化した場合には、感
圧粘着層の導電化処理を省略することもできる。The support material of the present invention may be surface-treated with the conductive polyaniline composition of the present invention. In this case, the thickness of the treatment layer is such that the surface resistance of the support material is 10 3 to 10 12 Ω / It is preferable to form it so that it becomes □. Thus, when the support material is made conductive, the conductive treatment of the pressure-sensitive adhesive layer can be omitted.
【００３４】本発明の導電性感圧粘着テープ中の、本発
明の導電性感圧粘着剤組成物の厚さは、３〜１００μｍ
とすることが好ましく、５〜３０μｍとすることがより
好ましく、５〜２０μｍとすることが特に好ましい。こ
の導電性感圧粘着剤組成物の厚さが、３μｍ未満である
と、塗布性が低下する傾向があり、１００μｍを超える
と、乾燥性が低下する傾向がある。粘着剤の支持材料へ
の塗布、乾燥、搬送方法は、従来から公知の方法で行う
ことができ、特に限定されるものではない。The thickness of the conductive pressure-sensitive adhesive composition of the present invention in the conductive pressure-sensitive adhesive tape of the present invention is 3 to 100 μm.
It is preferable that the thickness is 5 to 30 μm, more preferably 5 to 20 μm. If the thickness of the electrically conductive pressure-sensitive adhesive composition is less than 3 μm, the coating property tends to decrease, and if it exceeds 100 μm, the drying property tends to decrease. The method of applying the adhesive to the supporting material, drying, and carrying it can be carried out by a conventionally known method, and is not particularly limited.
【００３５】本発明において、上記したように少量のポ
リアニリンの添加によって、感圧粘着剤組成物の導電性
が著しく向上する理由としては、例えば、C.Y.YANG,Y.C
AO,PAUL SMITH,A.J.HEEGER,SYNTHETIC METALS,53(1993)
293に記載されているように、感圧粘着剤組成物中でポ
リアニリン複合体が特殊なモルホロジを呈すること等が
挙げられる。In the present invention, the reason why the conductivity of the pressure-sensitive adhesive composition is remarkably improved by adding a small amount of polyaniline as described above is, for example, CYYANG, YC.
AO, PAUL SMITH, AJHEEGER, SYNTHETIC METALS, 53 (1993)
As described in No. 293, the polyaniline complex exhibits a special morphology in the pressure-sensitive adhesive composition.
【００３６】本発明の導電性感圧粘着剤組成物は、静電
気発生防止が必要であるものの接着や引き剥がし時に静
電気発生防止が必要である粘着テープ材料及び粘着剤等
に好適に使用される。また、本発明による導電性感圧粘
着テープは、半導体を静電破壊から保護する分野等に特
に好適に使用され、例えば、シリコンウエファのバック
グラインド時の表面保護用粘着テープ、ＩＣの自動実装
時に使用されるチップキャリアテープ用の粘着テープ、
プリント基板等静電気の発生で破壊する恐れがある部品
を搭載した機器やプリント基板そのものの保護テープな
どに使用される。また、その他の用途でも、引き剥がし
時の静電気の発生が嫌われる用途であれば、特に制限無
く、好適に用いられ、例えば、テレビやコンピュータ等
の表示装置付きの電気機器や自動車用の保護テープ、机
や椅子も含めたオフィス用機器の保護テープなどとし
て、これまで保護テープが必要とされてきた様々な用途
に使用できる。The electrically conductive pressure-sensitive adhesive composition of the present invention is preferably used for an adhesive tape material and an adhesive which are required to prevent generation of static electricity but need to be prevented from generating static electricity at the time of adhesion or peeling. Further, the conductive pressure-sensitive adhesive tape according to the present invention is particularly suitable for use in the field of protecting semiconductors from electrostatic breakdown, and is used, for example, for surface protection adhesive tapes during back grinding of silicon wafers and for automatic mounting of ICs. Adhesive tape for chip carrier tape,
It is used as a protective tape for equipment that has parts that may be destroyed by the generation of static electricity such as printed circuit boards and the printed circuit boards themselves. In addition, also in other applications, if it is an application in which generation of static electricity at the time of peeling is disliked, it is suitably used without any limitation. For example, a protective tape for an electric device with a display device such as a television or a computer and an automobile. , As a protective tape for office equipment including desks and chairs, it can be used in various applications where protective tape has been required until now.
【００３７】以下、本発明を実施例を用いて説明する。The present invention will be described below with reference to examples.
【実施例】ポリアニリン及びポリアニリン組成物は、Y.
CAO,A.ANDERETTA,A.J.HEEGER,POLYMER,30(1989)2305及
び特表平６−５０８３９０号公報に基づいて作製した。EXAMPLES Polyaniline and polyaniline compositions are described in Y.
It was prepared based on CAO, A. ANDERETTA, AJHEEGER, POLYMER, 30 (1989) 2305 and Japanese Patent Publication No. 6-508390.
【００３８】合成例１ アニリン（和光純薬工業(株)、試薬）４０mlと３５％塩
酸（和光純薬工業(株)製、試薬）５０mlと蒸留水４００
mlを１リットルの三角フラスコに入れ、０℃に冷却し、
溶液Ａとした。ペルオキシ二硫酸アンモニウム（和光純
薬工業(株)製、試薬）４６ｇを蒸留水１００mlに溶解
し、溶液Ｂとした。溶液Ａを０℃に保った状態で、撹拌
しながら、溶液Ｂを２時間かけて添加し、添加終了後も
撹拌しながら０℃で３時間放置した。次いで、この溶液
をろ過し、蒸留水で充分に洗浄し、メタノール洗浄及び
エーテル洗浄を行った後、５０℃の真空乾燥器で乾燥
し、粉末状のポリアニリンを得た。次に、前記ポリアニ
リン１０ｇを、３％アンモニア水１０００mlに入れ、２
時間撹拌した。次いで、この溶液をろ過し、蒸留水で充
分に洗浄し、メタノール洗浄及びエーテル洗浄を行った
後、５０℃の真空乾燥器で乾燥し、粉末状の塩基性ポリ
アニリンを得た。得られた塩基性ポリアニリンの収率は
３６重量％であり、重量平均分子量は１００，０００
（ポリスチレン換算）であった。Synthesis Example 1 Aniline (Wako Pure Chemical Industries, Ltd., reagent) 40 ml, 35% hydrochloric acid (Wako Pure Chemical Industries, Ltd., reagent) 50 ml, and distilled water 400
Place ml in a 1 liter Erlenmeyer flask, cool to 0 ° C,
This was solution A. A solution B was prepared by dissolving 46 g of ammonium peroxydisulfate (a reagent manufactured by Wako Pure Chemical Industries, Ltd.) in 100 ml of distilled water. While keeping Solution A at 0 ° C., Solution B was added over 2 hours with stirring, and after completion of addition, the mixture was left at 0 ° C. for 3 hours with stirring. Next, this solution was filtered, thoroughly washed with distilled water, washed with methanol and washed with ether, and then dried in a vacuum dryer at 50 ° C. to obtain powdery polyaniline. Next, 10 g of the polyaniline was added to 1000 ml of 3% aqueous ammonia, and 2
Stirred for hours. Next, this solution was filtered, thoroughly washed with distilled water, washed with methanol and washed with ether, and then dried in a vacuum dryer at 50 ° C. to obtain a powdery basic polyaniline. The yield of the obtained basic polyaniline was 36% by weight, and the weight average molecular weight was 100,000.
(Polystyrene equivalent).
【００３９】合成例２ 合成例１で得られた塩基性ポリアニリン０．５ｇとドデ
シルベンゼンスルホン酸（東京化成工業(株)製、試薬）
１．８１ｇを窒素置換したグローブボックス内でよく混
合した。この混合物に、キシレン２０．８ｇを加え、超
音波洗浄器で４８時間撹拌した後、遠心分離器で不溶物
を分離させ、不溶物をデカンテーションで取り除き、導
電性ポリアニリン組成物の溶液（ドデシルベンゼンスル
ホン酸をドーパントにしたポリアニリンのキシレン溶
液）を得た。得られた溶液を溶液１（固形分＝１０重量
％）とする。この溶液１をポリエステルテープ上に塗布
し、１２０℃で６０分間乾燥し、皮膜を形成した後、ア
セトンで洗浄し、風乾した。得られた被膜を、デジタル
・マルチメータＴＲ６８４６（(株)アドバンテスト製）
で導電率を測定した結果、導電率は８０S/cmであった。Synthetic Example 2 0.5 g of the basic polyaniline obtained in Synthetic Example 1 and dodecylbenzenesulfonic acid (Reagent, Tokyo Chemical Industry Co., Ltd.)
1.81 g was mixed well in a glove box purged with nitrogen. 20.8 g of xylene was added to this mixture, and the mixture was stirred for 48 hours with an ultrasonic cleaner, the insoluble matter was separated by a centrifuge, the insoluble matter was removed by decantation, and a solution of a conductive polyaniline composition (dodecylbenzene) was added. A xylene solution of polyaniline having sulfonic acid as a dopant was obtained. The obtained solution is referred to as solution 1 (solid content = 10% by weight). This solution 1 was applied onto a polyester tape and dried at 120 ° C. for 60 minutes to form a film, which was then washed with acetone and air dried. The obtained coating is digital multimeter TR6846 (manufactured by Advantest Corporation)
As a result of measuring the electric conductivity with, the electric conductivity was 80 S / cm.
【００４０】合成例３ 合成例１で得られた塩基性ポリアニリン０．５ｇとカン
ファースルホン酸（関東化学(株)製、試薬）０．６５ｇ
を窒素置換したグローブボックス内でよく混合した。こ
の混合物に、ｍ−クレゾール１０．３５ｇを加え、超音
波洗浄器で４８時間撹拌した後、遠心分離器で不溶物を
分離させ、不溶物をデカンテーションで取り除き、導電
性ポリアニリン組成物の溶液（カンファースルホン酸を
ドーパントにしたポリアニリンのｍ−クレゾール溶液）
を得た。得られた溶液を溶液２（固形分＝１０重量％）
とする。得られた溶液２をガラス基板上に塗布し、１５
０℃で６０分間乾燥し、皮膜を形成した。得られた被膜
の導電率を測定した結果、導電率は１８０S/cmであっ
た。Synthesis Example 3 0.5 g of the basic polyaniline obtained in Synthesis Example 1 and 0.65 g of camphorsulfonic acid (Kanto Chemical Co., Inc., reagent)
Was thoroughly mixed in a glove box purged with nitrogen. To this mixture was added 10.35 g of m-cresol, and the mixture was stirred for 48 hours with an ultrasonic cleaner, the insoluble matter was separated by a centrifuge, the insoluble matter was removed by decantation, and a solution of the conductive polyaniline composition ( Polyaniline m-cresol solution with camphorsulfonic acid as a dopant)
I got The obtained solution is referred to as Solution 2 (solid content = 10% by weight).
And The resulting solution 2 is applied on a glass substrate,
It was dried at 0 ° C. for 60 minutes to form a film. As a result of measuring the electric conductivity of the obtained film, the electric conductivity was 180 S / cm.
【００４１】合成例４ 合成例１で得られた塩基性ポリアニリン０．５ｇとドデ
シルベンゼンスルホン酸０．９ｇと３−ペンタデシルフ
ェノール１．０５ｇとを窒素置換したグローブボックス
内でよく混合した。この混合物を、キシレン１２．６ｇ
に加え、超音波洗浄器で４８時間撹拌した後、遠心分離
器で不溶物を分離させ、不溶物をデカンテーションで取
り除き、導電性ポリアニリン組成物の溶液（ドデシルベ
ンゼンスルホン酸をドーパントにしたポリアニリンのキ
シレン溶液）を得た。得られた溶液を溶液３（固形分＝
１６重量％）とする。得られた溶液３を合成例２と同様
にして、皮膜を形成した後、アセトンで洗浄し、風乾し
た。得られた被膜の導電率を測定した結果、導電率は５
０S/cmであった。Synthesis Example 4 0.5 g of the basic polyaniline obtained in Synthesis Example 1, 0.9 g of dodecylbenzenesulfonic acid, and 1.05 g of 3-pentadecylphenol were thoroughly mixed in a nitrogen-substituted glove box. This mixture was mixed with 12.6 g of xylene.
In addition, after stirring for 48 hours with an ultrasonic cleaner, the insoluble matter is separated by a centrifuge, the insoluble matter is removed by decantation, and a solution of a conductive polyaniline composition (polyaniline containing dodecylbenzenesulfonic acid as a dopant) is added. Xylene solution) was obtained. The obtained solution was used as solution 3 (solid content =
16% by weight). The solution 3 thus obtained was treated in the same manner as in Synthesis Example 2 to form a film, which was then washed with acetone and air dried. As a result of measuring the conductivity of the obtained film, the conductivity was 5
It was 0 S / cm.
【００４２】合成例５ 合成例１で得られた塩基性ポリアニリン０．５ｇと硫酸
（和光純薬製工業(株)製、試薬）１．１ｇを窒素置換し
たグローブボックス内でよく混合した。この混合物を、
キシレン１２ｇに加え、超音波洗浄器で４８時間撹拌し
たが、全く溶解しなかった。Synthetic Example 5 0.5 g of the basic polyaniline obtained in Synthetic Example 1 and 1.1 g of sulfuric acid (manufactured by Wako Pure Chemical Industries, Ltd., reagent) were thoroughly mixed in a nitrogen-substituted glove box. This mixture
It was added to 12 g of xylene and stirred with an ultrasonic cleaner for 48 hours, but it did not dissolve at all.
【００４３】合成例６ 撹拌機、温度計、コンデンサ、滴下ロートを備えた四つ
口フラスコに、２−エチルヘキシルアクリレート１９０
重量部、酢酸ビニル（ホモポリマのガラス転移点３０
℃）１０重量部、アクリル酸６重量部、アゾビスイソブ
チロニトリル０．４重量部及び酢酸エチル５０重量部を
入れ、窒素置換した後、温度を６０℃にして重合が開始
したところで、温度を５５℃にして８時間重合を行っ
た。なお、重合の後半で、粘度の上昇に伴って５ml／１
０分の割合で酢酸エチルを滴下し、共重合体溶液（固形
分で４０重量％）を得た。この共重合体溶液をメタノー
ル中に投入し、共重合体を沈殿させた後、この沈殿物を
濾過し、１２０℃で１時間乾燥して、共重合体１を得
た。得られた共重合体１の重量平均分子量は、１２０
０，０００であった。次いで、２官能性イソシアネート
化合物（ジフェニルメタンジイソシアネート、日本ポリ
ウレタン(株)製商品名、ミリオネートＭＴ）３重量部を
キシレン５０重量部に混合した溶液に、前記共重合体１
１００重量部を混合して感圧粘着剤組成物１とした。Synthesis Example 6 2-Ethylhexyl acrylate 190 was placed in a four-necked flask equipped with a stirrer, a thermometer, a condenser and a dropping funnel.
Parts by weight, vinyl acetate (the homopolymer glass transition point 30
10 parts by weight, 6 parts by weight of acrylic acid, 0.4 parts by weight of azobisisobutyronitrile and 50 parts by weight of ethyl acetate were added, and after nitrogen substitution, the temperature was raised to 60 ° C. and the polymerization was started. At 55 ° C. and polymerization was carried out for 8 hours. In addition, in the latter half of the polymerization, as the viscosity increased, 5 ml / 1
Ethyl acetate was added dropwise at a rate of 0 minutes to obtain a copolymer solution (40% by weight of solid content). The copolymer solution was put into methanol to precipitate the copolymer, and then the precipitate was filtered and dried at 120 ° C. for 1 hour to obtain a copolymer 1. The weight average molecular weight of the obtained copolymer 1 was 120.
It was 10,000. Next, the copolymer 1 was added to a solution prepared by mixing 3 parts by weight of a bifunctional isocyanate compound (diphenylmethane diisocyanate, trade name of Nippon Polyurethane Co., Ltd., Millionate MT) with 50 parts by weight of xylene.
100 parts by weight were mixed to prepare a pressure sensitive adhesive composition 1.
【００４４】合成例７ 撹拌機、温度計、コンデンサ、滴下ロートを備えた四つ
口フラスコに、アクリル酸−２−エチルへキシル８４重
量部、アクリル酸エチル３６重量部、アクリル酸３重量
部、ベンゾイルパーオキシド０．４８重量部及び酢酸エ
チル２１６重量部を入れ、窒素置換した後。温度を６０
℃にして重合が開始したところで、温度を７０℃にして
８時間重合を行い、共重合体溶液を得た。この共重合体
溶液をメタノール中に投入し、共重合体を沈殿させた
後、この沈殿物を濾過し、１２０℃で１時間乾燥して共
重合体２を得た。得られた共重合体２の重量平均分子量
は、１１５０，０００であった。次いで、芳香族系テル
ペン炭化水素樹脂（軟化点１１０℃）４５重量部とイソ
シアネート化合物（ナフチレン−１，５−ジイソシアネ
ート、日槽ウレタン(株）製商品名、ＮＤＩ）１．２重
量部をｍ−クレゾール５０重量部に混合した溶液に、前
記共重合体２ １００重量部を混合して感圧粘着剤組成
物２とした。Synthesis Example 7 In a four-necked flask equipped with a stirrer, a thermometer, a condenser, and a dropping funnel, 84 parts by weight of 2-ethylhexyl acrylate, 36 parts by weight of ethyl acrylate, 3 parts by weight of acrylic acid, After adding 0.48 parts by weight of benzoyl peroxide and 216 parts by weight of ethyl acetate and purging with nitrogen. Temperature 60
When the polymerization was started at ℃, the temperature was adjusted to 70 ℃ and the polymerization was carried out for 8 hours to obtain a copolymer solution. The copolymer solution was put into methanol to precipitate the copolymer, and then the precipitate was filtered and dried at 120 ° C. for 1 hour to obtain a copolymer 2. The weight average molecular weight of the obtained copolymer 2 was 1,150,000. Then, 45 parts by weight of an aromatic terpene hydrocarbon resin (softening point 110 ° C.) and 1.2 parts by weight of an isocyanate compound (naphthylene-1,5-diisocyanate, product name of Nittan Urethane Co., Ltd., NDI) are m-. A pressure-sensitive adhesive composition 2 was prepared by mixing 100 parts by weight of the copolymer 2 with a solution mixed with 50 parts by weight of cresol.
【００４５】合成例８ 撹拌機、温度計、コンデンサ、滴下ロートを備えた四つ
口フラスコに、２−エチルヘキシルアクリレート９０重
量部、アクリル酸ブチル２０重量部、アクリル酸２エチ
ルへキシル３０重量部、アクリル酸４重量部、アゾビス
イソブチロニトリル０．１重量部及び酢酸エチル２１０
重量部を入れ、窒素置換した後、温度を６０℃にして重
合が開始したところで、温度を７０℃にして８時間重合
を行い、共重合体溶液を得た。この共重合体溶液をメタ
ノール中に投入し、共重合体を沈殿させた後、この沈殿
物を濾過し、１２０℃で１時間乾燥して共重合体３を得
た。得られた共重合体３の重量平均分子量は、１１０
０，０００であった。次いで、液状イソシアネート化合
物（トルイジンジイソシアネート、住友バイエル（株)
製商品名、スミジュールＴ−８０）３重量部に、前記共
重合体３ １００重量部を混合して感圧粘着剤組成物３
とした。Synthesis Example 8 In a four-necked flask equipped with a stirrer, a thermometer, a condenser and a dropping funnel, 90 parts by weight of 2-ethylhexyl acrylate, 20 parts by weight of butyl acrylate, 30 parts by weight of 2 ethylhexyl acrylate, Acrylic acid 4 parts by weight, azobisisobutyronitrile 0.1 parts by weight and ethyl acetate 210
After adding parts by weight and substituting with nitrogen, the temperature was set to 60 ° C. and the polymerization was started. Then, the temperature was set to 70 ° C. and polymerization was carried out for 8 hours to obtain a copolymer solution. This copolymer solution was put into methanol to precipitate the copolymer, and then the precipitate was filtered and dried at 120 ° C. for 1 hour to obtain a copolymer 3. The weight average molecular weight of the obtained copolymer 3 was 110.
It was 10,000. Next, liquid isocyanate compounds (toluidine diisocyanate, Sumitomo Bayer Co., Ltd.)
3 parts by weight of trade name, Sumidule T-80), and 100 parts by weight of the copolymer 3 are mixed to prepare a pressure-sensitive adhesive composition 3
And
【００４６】実施例１ 合成例６で得られた感圧粘着剤組成物１ １００ｇに、
合成例２で得られた溶液１ １３ｇを加え、乳鉢中でよ
く混合した。この溶液を、乾燥後の粘着剤層の厚みが１
０μｍになるように、厚み２５μｍのＰＥＴ（ポリエチ
レンテレフタレート）にアプリケータを使用して塗布し
た後、防爆型乾燥器で１２０℃で１時間乾燥し、導電性
感圧粘着剤組成物を塗布した導電性感圧粘着テープ１を
得た。得られた導電性感圧粘着テープ１のポリアニリン
の含有量は、０．４２重量％であった。また、得られた
導電性感圧粘着テープ１の表面抵抗、透過率及び接着力
を、下記の方法にて測定し、測定結果を表１に示した。 表面抵抗測定方法：導電性感圧粘着テープに、導電性感
圧粘着剤組成物の表面抵抗が測定可能な様に、１cm間隔
で２点の電極を金を蒸着して形成した後、マルチメータ
で表面抵抗を測定した。 透過率測定方法：導電性感圧粘着テープの５５０nmにお
ける透過率を、分光光度計（(株)日立製作所製、Ｕ−３
４１０日立自記分光光度計）で測定した。 接着力測定方法：導電性感圧粘着テープを、長さ１５０
mm、幅２０mmの粘着テープ片にし、表面が清浄で平滑な
被着体に、重さ２kgのゴムローラを１往復させる方式で
圧着し、３０分間放置後、接着力（１８０度ピール、引
っ張り速度３００mm／分）を測定した。なお、被着体に
テープを圧着するときの環境条件は、２０±１℃、６５
％ＲＨであった。また、被着体はステンレス板及びポリ
プロピレン板である。Example 1 To 100 g of the pressure sensitive adhesive composition 1 obtained in Synthesis Example 6,
13 g of Solution 1 obtained in Synthesis Example 2 was added and mixed well in a mortar. The thickness of the adhesive layer after drying this solution is 1
A 25 μm-thick PET (polyethylene terephthalate) with a thickness of 0 μm was applied using an applicator, and then dried in an explosion-proof dryer at 120 ° C. for 1 hour, and a conductive pressure-sensitive adhesive composition was applied. A pressure-sensitive adhesive tape 1 was obtained. The content of polyaniline in the obtained conductive pressure-sensitive adhesive tape 1 was 0.42% by weight. Further, the surface resistance, the transmittance and the adhesive strength of the obtained conductive pressure-sensitive adhesive tape 1 were measured by the following methods, and the measurement results are shown in Table 1. Surface resistance measuring method: Two points of electrodes are formed by vapor deposition of gold at 1 cm intervals on a conductive pressure-sensitive adhesive tape so that the surface resistance of the conductive pressure-sensitive adhesive composition can be measured, and then the surface is measured with a multimeter. The resistance was measured. Transmittance measurement method: The transmittance of the conductive pressure-sensitive adhesive tape at 550 nm was measured by a spectrophotometer (U-3, manufactured by Hitachi Ltd.).
410 Hitachi recording spectrophotometer). Adhesive force measurement method: Conductive pressure-sensitive adhesive tape, length 150
mm, width 20 mm, and apply pressure to the adherend with a clean and smooth surface by a method of reciprocating a rubber roller with a weight of 2 kg for 1 reciprocation, and after leaving it for 30 minutes, the adhesive strength (180 degree peel, pulling speed 300 mm / Min) was measured. The environmental conditions for pressure-bonding the tape to the adherend are 20 ± 1 ° C. and 65
% RH. The adherends are stainless steel plates and polypropylene plates.
【００４７】実施例２ 合成例７で得られた感圧粘着剤組成物２ １００ｇに、
合成例３で得られた溶液２ ６ｇを加え、乳鉢中で良く
混合した以外は、実施例１と同様の方法で感圧粘着剤組
成物を塗布した導電性感圧粘着テープ２を得た。得られ
た導電性感圧粘着テープ２のポリアニリンの含有量は、
０．３１重量％であった。また、得られた導電性感圧粘
着テープ２の表面抵抗、透過率及び接着力を、実施例１
と同様の方法で測定し、測定結果を表１に示した。Example 2 To 100 g of the pressure sensitive adhesive composition 2 obtained in Synthesis Example 7,
A conductive pressure-sensitive adhesive tape 2 coated with the pressure-sensitive adhesive composition was obtained in the same manner as in Example 1 except that 26 g of the solution 26 obtained in Synthesis Example 3 was added and mixed well in a mortar. The content of polyaniline in the obtained conductive pressure-sensitive adhesive tape 2 was
It was 0.31% by weight. In addition, the surface resistance, the transmittance, and the adhesive force of the obtained conductive pressure-sensitive adhesive tape 2 were measured as in Example 1.
The measurement results are shown in Table 1.
【００４８】実施例３ 合成例８で得られた感圧粘着剤組成物３ １００ｇに、
合成例４で得られた溶液３ ２０ｇとキシレン３５ｇを
加え、乳鉢中で良く混合した以外は、実施例１と同様の
方法で感圧粘着剤組成物を塗布した導電性感圧粘着テー
プ３を得た。得られた導電性感圧粘着テープ３のポリア
ニリンの含有量は、０．６４重量％であった。また、得
られた導電性感圧粘着テープ３の表面抵抗、透過率及び
接着力を、実施例１と同様の方法で測定し、測定結果を
表１に示した。Example 3 To 100 g of the pressure sensitive adhesive composition 3 obtained in Synthesis Example 8,
A conductive pressure-sensitive adhesive tape 3 coated with the pressure-sensitive adhesive composition was obtained in the same manner as in Example 1 except that 20 g of Solution 3 obtained in Synthesis Example 4 and 35 g of xylene were added and mixed well in a mortar. It was The content of polyaniline in the obtained conductive pressure-sensitive adhesive tape 3 was 0.64% by weight. Further, the surface resistance, the transmittance and the adhesive force of the obtained conductive pressure-sensitive adhesive tape 3 were measured by the same methods as in Example 1, and the measurement results are shown in Table 1.
【００４９】比較例１ 合成例６で得られた感圧粘着剤組成物１ １００ｇに、
アセチレンブラック（比重１.８２、多孔度１３.９％）
２０ｇを加え、乳鉢中で良く混合した以外は、実施例１
と同様の方法で、感圧粘着剤組成物を塗布した感圧粘着
テープ４を得た。なお、混合作業中、アセチレンブラッ
クが周囲に飛散し、作業環境を著しく汚染した。また、
得られた感圧粘着テープ４の表面抵抗、透過率及び接着
力を、実施例１と同様の方法で測定し、測定結果を表１
に示した。Comparative Example 1 To 100 g of the pressure sensitive adhesive composition 1 obtained in Synthesis Example 6,
Acetylene black (specific gravity 1.82, porosity 13.9%)
Example 1 except 20 g was added and well mixed in a mortar
The pressure-sensitive adhesive tape 4 coated with the pressure-sensitive adhesive composition was obtained in the same manner as in (1). During the mixing work, acetylene black was scattered around and significantly contaminated the work environment. Also,
The surface resistance, the transmittance and the adhesive force of the obtained pressure-sensitive adhesive tape 4 were measured by the same method as in Example 1, and the measurement results are shown in Table 1.
It was shown to.
【００５０】比較例２ 合成例７で得られた感圧粘着剤組成物２ １００ｇに、
膨張黒鉛（比重１.９５、多孔度６９.３％）１０ｇを加
え、８０℃に熱したライカイ機中で良く混合した以外
は、実施例１と同様の方法で、感圧粘着剤組成物を塗布
した感圧粘着テープ５を得た。なお、混合作業中、膨張
黒鉛が周囲に飛散し、作業環境を著しく汚染した。ま
た、得られた感圧粘着テープ５の表面抵抗、透過率及び
接着力を、実施例１と同様の方法で測定し、測定結果を
表１に示した。Comparative Example 2 To 100 g of the pressure sensitive adhesive composition 2 obtained in Synthesis Example 7,
A pressure-sensitive adhesive composition was prepared in the same manner as in Example 1 except that 10 g of expanded graphite (specific gravity: 1.95, porosity: 69.3%) was added and mixed well in a Raiki machine heated to 80 ° C. The coated pressure-sensitive adhesive tape 5 was obtained. During the mixing work, the expanded graphite was scattered around, significantly contaminating the work environment. Further, the surface resistance, the transmittance and the adhesive force of the obtained pressure sensitive adhesive tape 5 were measured by the same methods as in Example 1, and the measurement results are shown in Table 1.
【００５１】比較例３ 合成例８で得られた感圧粘着剤組成物３ １００ｇに、
膨張黒鉛（比重１.９５、多孔度６９.３％）３ｇを加
え、８０℃に熱したライカイ機中で良く混合した以外
は、実施例１と同様の方法で、感圧粘着剤組成物を塗布
した感圧粘着テープ６を得た。なお、混合作業中、膨張
黒鉛が周囲に飛散し、作業環境を著しく汚染した。ま
た、得られた感圧粘着テープ６の表面抵抗、透過率及び
接着力を、実施例１と同様の方法で測定し、測定結果を
表１に示した。Comparative Example 3 To 100 g of the pressure sensitive adhesive composition 3 obtained in Synthesis Example 8,
A pressure-sensitive adhesive composition was prepared in the same manner as in Example 1 except that 3 g of expanded graphite (specific gravity: 1.95, porosity: 69.3%) was added and well mixed in a Lykai machine heated to 80 ° C. The coated pressure sensitive adhesive tape 6 was obtained. During the mixing work, the expanded graphite was scattered around, significantly contaminating the work environment. Further, the surface resistance, the transmittance and the adhesive force of the obtained pressure sensitive adhesive tape 6 were measured in the same manner as in Example 1, and the measurement results are shown in Table 1.
【００５２】[0052]
【表１】 [Table 1]
【００５３】表１から、実施例１、実施例２及び実施例
３の導電性感圧粘着テープは、比較例１、比較例２及び
比較例３の感圧粘着テープに比べ、優れた接着力、透明
性、表面抵抗が得られる。From Table 1, the conductive pressure-sensitive adhesive tapes of Examples 1, 2 and 3 have superior adhesive strength to the pressure-sensitive adhesive tapes of Comparative Example 1, Comparative Example 2 and Comparative Example 3, Provides transparency and surface resistance.
【００５４】[0054]
【発明の効果】請求項１、２又は３記載の導電性感圧粘
着剤組成物は、優れた静電気発生防止能と優れた接着力
をもち、作業環境の汚染性もなく、テープ化したときの
透明性が優れる。請求項４記載の導電性感圧粘着剤組成
物は、請求項１記載の導電性感圧粘着剤組成物の効果を
奏し、さらに、導電性ポリアニリン組成物と感圧粘着剤
組成物の混合を容易にし、少量のポリアニリン複合体の
添加で感圧粘着剤組成物に静電気発生防止に必要な導電
性をもたせることができ、テープ化したときの透明性も
より優れる。請求項５又は６記載の導電性感圧粘着剤組
成物は、請求項４の効果を奏し、さらに導電性ポリアニ
リン組成物と感圧粘着剤組成物の混合をより容易にし、
ポリアニリン複合体の導電率もより向上させ、少量のポ
リアニリン複合体の添加で感圧粘着剤組成物に静電気発
生防止に必要なより大きい導電性をもたせることがで
き、これをテープ化したときのテープの透明性がより大
幅に優れる。請求項７記載の導電性感圧粘着テープは、
優れた接着力をもち、作業環境の汚染性もなく、高い静
電気発生防止能を有し、テープの透明性も優れる。The conductive pressure-sensitive adhesive composition according to claim 1, 2 or 3 has an excellent ability to prevent static electricity generation and an excellent adhesive force, does not pollute the working environment, and is formed into a tape. Excellent transparency. The conductive pressure-sensitive adhesive composition according to claim 4 exhibits the effect of the conductive pressure-sensitive adhesive composition according to claim 1, and further facilitates mixing of the conductive polyaniline composition and the pressure-sensitive adhesive composition. By adding a small amount of the polyaniline complex, the pressure-sensitive adhesive composition can have the conductivity necessary for preventing the generation of static electricity, and the transparency when formed into a tape is more excellent. The conductive pressure-sensitive adhesive composition according to claim 5 or 6 has the effect of claim 4, and further facilitates mixing of the conductive polyaniline composition and the pressure-sensitive adhesive composition,
The conductivity of the polyaniline composite can be further improved, and by adding a small amount of the polyaniline composite, the pressure-sensitive adhesive composition can be made to have a larger conductivity necessary for preventing static electricity generation. Is much more transparent. The conductive pressure-sensitive adhesive tape according to claim 7,
It has excellent adhesive strength, does not contaminate the work environment, has a high static electricity prevention capability, and has excellent tape transparency.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０９Ｊ 9/02 ＪＢＣ Ｃ０９Ｊ 9/02 ＪＢＣ // Ｃ０８Ｌ 79/00 ＬＱＺ Ｃ０８Ｌ 79/00 ＬＱＺ (72)発明者 加藤 松生 東京都新宿区西新宿二丁目１番１号 日立 化成工業株式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location C09J 9/02 JBC C09J 9/02 JBC // C08L 79/00 LQZ C08L 79/00 LQZ (72) Inventor Matsuo 2-1-1, Nishi-Shinjuku, Shinjuku-ku, Tokyo Inside Hitachi Chemical Co., Ltd.
Claims (7)
溶剤及びポリアニリンを含む導電性ポリアニリン組成物
と感圧粘着剤組成物とからなる導電性感圧粘着剤組成
物。1. A conductive pressure-sensitive adhesive composition comprising a conductive polyaniline composition containing a protonic acid, an organic solvent having a low polarity or a low polarity, and polyaniline, and a pressure-sensitive adhesive composition.
リンが、プロトン酸であるドーパントの作用によって導
電性とされ、かつ非極性又は極性が低い溶剤に可溶とさ
れたものである請求項１記載の導電性感圧粘着剤組成
物。2. The conductive polyaniline composition, wherein the polyaniline is made conductive by the action of a dopant that is a protonic acid, and is made soluble in a non-polar or low-polarity solvent. Conductive pressure-sensitive adhesive composition.
リンが、プロトン酸と複合体を形成している請求項１記
載の導電性感圧粘着剤組成物。3. The conductive pressure-sensitive adhesive composition according to claim 1, wherein the polyaniline in the conductive polyaniline composition forms a complex with a protonic acid.
求項１、２又は３記載の導電性感圧粘着剤組成物。4. The conductive pressure-sensitive adhesive composition according to claim 1, 2 or 3, wherein the protonic acid is a sulfonic acid derivative.
る請求項４記載の導電性感圧粘着剤組成物。5. The conductive pressure-sensitive adhesive composition according to claim 4, wherein the protonic acid is camphorsulfonic acid.
酸である請求項４記載の導電性感圧粘着剤組成物。6. The conductive pressure-sensitive adhesive composition according to claim 4, wherein the protonic acid is dodecylbenzenesulfonic acid.
導電性感圧粘着剤組成物を支持材料に塗布した導電性感
圧粘着テープ。7. A conductive pressure-sensitive adhesive tape, which is obtained by applying the conductive pressure-sensitive adhesive composition according to claim 1, 2, 3, 4, 5, or 6 to a support material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7057885A JPH08253755A (en) | 1995-03-17 | 1995-03-17 | Conductive pressure-sensitive adhesive composition and conductive pressure-sensitive adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7057885A JPH08253755A (en) | 1995-03-17 | 1995-03-17 | Conductive pressure-sensitive adhesive composition and conductive pressure-sensitive adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08253755A true JPH08253755A (en) | 1996-10-01 |
Family
ID=13068453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7057885A Pending JPH08253755A (en) | 1995-03-17 | 1995-03-17 | Conductive pressure-sensitive adhesive composition and conductive pressure-sensitive adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08253755A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11166170A (en) * | 1997-09-25 | 1999-06-22 | Brady Worldwide Inc | Static electricity dissipating label |
| US6045977A (en) * | 1998-02-19 | 2000-04-04 | Lucent Technologies Inc. | Process for patterning conductive polyaniline films |
| WO2003014243A1 (en) * | 2001-08-03 | 2003-02-20 | 3M Innovative Properties Company | Flexible carrier tape having high clarity and conductivity |
| JP2005338150A (en) * | 2004-05-24 | 2005-12-08 | Nitto Denko Corp | Optical film with surface protective film and image display apparatus |
| CN100393839C (en) * | 2004-11-26 | 2008-06-11 | 吉林正基科技开发有限责任公司 | Polyaniline conducting adhesive |
| EP1694793A4 (en) * | 2003-10-15 | 2009-03-04 | Kwang Suck Suh | Antistatic tapes and method for producing thereof |
| US20100316931A1 (en) * | 2009-06-10 | 2010-12-16 | Friedrich Wilhelm Wieland | Electrocatalyst, Fuel Cell Cathode and Fuel Cell |
| WO2012043025A1 (en) * | 2010-09-30 | 2012-04-05 | リンテック株式会社 | Conductive adhesive composition, electronic device, positive electrode laminate, and method for manufacturing electronic device |
| JP2017163147A (en) * | 2012-12-10 | 2017-09-14 | 日東電工株式会社 | Adhesive sheet integrating dicing tape, manufacturing method of semiconductor device, and semiconductor device |
-
1995
- 1995-03-17 JP JP7057885A patent/JPH08253755A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11166170A (en) * | 1997-09-25 | 1999-06-22 | Brady Worldwide Inc | Static electricity dissipating label |
| US6045977A (en) * | 1998-02-19 | 2000-04-04 | Lucent Technologies Inc. | Process for patterning conductive polyaniline films |
| WO2003014243A1 (en) * | 2001-08-03 | 2003-02-20 | 3M Innovative Properties Company | Flexible carrier tape having high clarity and conductivity |
| EP1694793A4 (en) * | 2003-10-15 | 2009-03-04 | Kwang Suck Suh | Antistatic tapes and method for producing thereof |
| JP2005338150A (en) * | 2004-05-24 | 2005-12-08 | Nitto Denko Corp | Optical film with surface protective film and image display apparatus |
| US7658992B2 (en) | 2004-05-24 | 2010-02-09 | Nitto Denko Corporation | Surface protection film-attached optical film and image display |
| CN100393839C (en) * | 2004-11-26 | 2008-06-11 | 吉林正基科技开发有限责任公司 | Polyaniline conducting adhesive |
| US20100316931A1 (en) * | 2009-06-10 | 2010-12-16 | Friedrich Wilhelm Wieland | Electrocatalyst, Fuel Cell Cathode and Fuel Cell |
| WO2012043025A1 (en) * | 2010-09-30 | 2012-04-05 | リンテック株式会社 | Conductive adhesive composition, electronic device, positive electrode laminate, and method for manufacturing electronic device |
| JP5690833B2 (en) * | 2010-09-30 | 2015-03-25 | リンテック株式会社 | Electronic device and method for manufacturing electronic device |
| US9159940B2 (en) | 2010-09-30 | 2015-10-13 | Lintec Corporation | Conductive adhesive composition, electronic device, positive electrode laminate, and method for manufacturing electronic device |
| JP2017163147A (en) * | 2012-12-10 | 2017-09-14 | 日東電工株式会社 | Adhesive sheet integrating dicing tape, manufacturing method of semiconductor device, and semiconductor device |
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